List of CAE products
- classification：CAE
541～600 item / All 3866 items
For those who have isolators. Achieving high chemical resistance and workability. Low cost and short delivery times are also possible for glove box and isolator gloves.
- Work gloves
Notice of participation in 'INTERPHEX Week Tokyo' from May 20 (Wednesday) to May 22 (Friday), 2026.
Ito Corporation will be exhibiting at "INTERPHEX Week Tokyo" held at Makuhari Messe. This exhibition is the largest in Japan, showcasing a wide range of products and services related to the research and manufacturing of pharmaceuticals, cosmetics, and regenerative medicine from 25 countries and regions around the world. Pharmaceutical and cosmetic manufacturers, as well as regenerative medicine companies, will be attending from all over the globe. We will be showcasing "Gloves for Glove Boxes/Isolators" manufactured by Tron Power. We look forward to your visit.
30 years of supported computational power - High-speed circuit simulator for power electronics, Scideam.
- simulator
【Exhibition Information】Exhibiting at Automotive World 2026! We will introduce products that utilize AI for model-based development, including in-car display reproduction, and cover everything from motor design for car electronics to practical operation simulations.
We will be showcasing solutions for automotive electronics. In addition to model-based development (MBD), simulation, and measurement/testing environments based on the power electronics solutions we have cultivated over many years, we will introduce innovative items essential for next-generation automotive electronics. This time, we have prepared a "3D motion capture" experience for you. Please be sure to try it out.
It is also possible to display various maps of each phase! Analysis is based on the information of the crystal structure possessed by the sample.
- Contract Analysis
Example of analysis of compounds at the SAC solder and Ni pad interface.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.
Appearance inspection, electrical inspection, and internal observation using X-rays conducted! Introduction of analysis cases.
- Contract Analysis
Analysis case of faulty switch contacts
Since a malfunction was suspected in the switch section of the appliance that would not power on, we will introduce a case study along with the work flow. First, we check for any shape changes such as swelling, cracking, or discoloration through visual observation. In the electrical check, we confirm whether the malfunction can be reproduced and whether it is an open or short circuit. An internal observation using X-rays revealed that the contact terminals inside the switch had melted, scattered, and disappeared, resulting in an open failure. Ultimately, we will submit a report that includes the consideration of the cause. We also accept inquiries for analysis consultations after non-destructive testing, so please feel free to contact us.
Observation of the sensor chip surface, creating a cross-section through mechanical polishing in the mounted state, and conducting structural observation of the device!
- Analysis Services
- Analytical Equipment and Devices
Observation of tracking camera cross-section by mechanical grinding.
I would like to introduce "Cross-sectional observation of tracking camera using mechanical polishing." Regarding the structure of the tracking camera components, when viewed from above, the lens can be identified. Although it cannot be clearly seen in the X-ray image, the lens is incorporated into the convex part. Additionally, the cross-sectional structure is similar to that of an RGB sensor, featuring a back-illuminated CMOS structure. However, since color information is not necessary for the tracking camera, there is no color filter layer. A jagged uneven shape was observed on the surface of the photodiode.
Measure the change state with a 3D shape measuring device! Visually confirm the indented shape and amount due to pressure.
- Analysis Services
- Analytical Equipment and Devices
Observation of thermal deformation using a 3D shape measuring machine (VR-6200)
This is a measuring device that can non-contact measure surface shapes such as concavities, undulations, and surface roughness. We will introduce "heating deformation observation" using a 3D shape measuring machine. First, we acquire a 3D texture image at room temperature, and then we acquire a 3D texture image in the heated state. By overlaying the texture images before and after heating and checking the differential texture image and cross-sectional profile, it can be seen that the substrate in the heated state has higher ends and a lower center compared to the room temperature state.
By adding a special reagent to the sample and heating it, it becomes possible to detect substances that are usually difficult to detect!
- Analysis Services
- Contract Analysis
Chemical Analysis Concierge Service
We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.
We will suggest appropriate analysis methods based on the condition of polymer materials and samples!
- Contract Analysis
- Analysis Services
- Contract Analysis
Chemical Analysis Concierge Service
We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.
Distinguish and identify compounds with similar structures! You can obtain information such as the number of protons and structural characteristics.
- Contract Analysis
- Analysis Services
- Contract Analysis
NMR analysis of liquid crystal compounds
At Aites Co., Ltd., we conduct "NMR analysis of liquid crystal compounds." NMR is an analytical method that reveals the connections between atoms that make up a molecule, and it is used alongside mass spectrometry and infrared spectroscopy for determining the structure of compounds. In the downloadable materials, we highlight the 1H NMR, 13C NMR, and DEPT measurements of 4-butoxy-4'-cyanobiphenyl (CAS number 52709-87-2), which is used as a liquid crystal component, and introduce the information obtained from NMR. Please feel free to download and take a look.
It is possible to analyze resin materials and evaluate the characteristics that affect product performance!
- Contract Analysis
- Analysis Services
- Contract Analysis
For transparent materials such as glass and ITO! Measurement and evaluation of various transparent resins before and after UV exposure are also possible.
- Analysis Services
- Other contract services
- Contract measurement
Optical film light transmission characteristics
At Aites Co., Ltd., we conduct "optical film analysis." Optical films used in smartphones and other devices have various functions depending on their structure and materials. We measured the light transmittance of privacy protection films at different angles and combined cross-sectional observation with Raman analysis to investigate the mechanism of function manifestation. By investigating the transmittance characteristics of privacy protection films using angle-variable spectrophotometry, we were able to analyze the mechanism of function manifestation through cross-sectional observation and Raman analysis. At Aites, we provide consistent evaluation and analysis from material properties to the mechanisms of function manifestation.
Detect and analyze the absorption wavelengths of organic molecular groups (functional groups)!
- Contract Analysis
- Contract Analysis
- Analysis Services
Chemical Analysis Concierge Service
We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.
Rich equipment and expertise! We will elucidate the molecular structures of materials in general through chemical instrument analysis!
- Analytical Equipment and Devices
- Contract Analysis
- Contract Analysis
NMR analysis of liquid crystal compounds
At Aites Co., Ltd., we conduct "NMR analysis of liquid crystal compounds." NMR is an analytical method that reveals the connections between atoms that make up a molecule, and it is used alongside mass spectrometry and infrared spectroscopy for determining the structure of compounds. In the downloadable materials, we highlight the 1H NMR, 13C NMR, and DEPT measurements of 4-butoxy-4'-cyanobiphenyl (CAS number 52709-87-2), which is used as a liquid crystal component, and introduce the information obtained from NMR. Please feel free to download and take a look.
![[Data] Measurement of resin molecul...](https://image.mono.ipros.com/public/product/image/aa5/2000728689/IPROS41773405641582805253.png?w=280&h=280){kind=small}
The analysis device also supports the analysis and evaluation of polymers! Information on the configuration and principles of high-temperature SEC equipment is provided!
- Contract measurement
- Contract Analysis
- Other analyses
Poisson's ratio measurement
At Aites Co., Ltd., we conduct "Poisson's ratio measurement." Poisson's ratio is the ratio of longitudinal to lateral strain that occurs when a load is applied to an object, and it is necessary for strength calculations of materials. In the downloadable materials, we introduce the results of attaching strain gauges to test specimens, applying tensile loads using a universal testing machine, and examining the longitudinal and lateral strains obtained from the strain gauges. Please feel free to download and take a look.
GC-MS is used for qualitative and quantitative analysis of low molecular organic substances! Data was obtained and compared using incense and sandalwood!
- Analytical Equipment and Devices
- Contract Analysis
- Other contract services
Chemical Analysis Concierge Service
We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.
Depending on the panel size, it is possible to analyze using different ICP-AES/MS devices!
- Analysis Services
Chemical Analysis Concierge Service
We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.
![[Data] Cross-sectional observation ...](https://image.mono.ipros.com/public/product/image/cc1/2000561879/IPROS02201267418243097889.png?w=280&h=280){kind=small}
We have published cross-sectional observations of the fracture surface and elemental maps of the fracture area!
- Contract Analysis
- Contract Inspection
- Contract Analysis
Distinguish compounds with similar molecular structures through NMR analysis, elucidating the binding positions of side chains and substituents, as well as branching structures!
- Contract Analysis
- Analysis Services
- Contract Analysis
Chemical Analysis Concierge Service
We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.
We will introduce an analysis example confirming that the welded area has a large distribution of grain crystals.
- Analysis Services
- Contract Analysis
Example of analysis of compounds at the SAC solder and Ni pad interface.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.
It will lead to the determination of development direction and acceleration! We will respond with abundant technology, knowledge, and equipment.
- Analysis Services
- Other contract services
Chemical Analysis Concierge Service
We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.
Even with larger-sized implementation boards, resin embedding is possible without cutting before embedding! We will introduce cases with and without heat generation prevention treatment.
- Analysis Services
- Other contract services
About the curing temperature of epoxy resin free from hazardous substances.
We conducted measurements to reconfirm the temperature of heat generation during curing, following the change to a non-toxic epoxy resin. When using a large amount of resin, we apply heat generation prevention treatment for resin embedding. Without this treatment, the temperature can rise up to 138°C during curing. However, by applying the heat generation prevention treatment even with a large amount of resin, we were able to keep the heat generation during curing within 30°C.
![[Example of analysis using EBSD] Si...](https://image.mono.ipros.com/public/product/image/44d/2000626240/IPROS81393204949009402708.png?w=280&h=280){kind=small}
The measured silicon wafer is single crystal! The IPF map, pole figure, and inverse pole figure resulted in relatively simple outcomes.
- Analytical Equipment and Devices
- Analysis Services
Example of analysis of compounds at the SAC solder and Ni pad interface.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.
![[Data] Analysis of Additive Defects...](https://image.mono.ipros.com/public/product/image/ba3/2000703555/IPROS34281187413896193073.jpeg?w=280&h=280){kind=small}
It is possible to analyze with good sensitivity using thermal desorption GC-MS analysis! We propose methods tailored to the symptoms of issues and objectives.
- Other analyses
- Contract Analysis
- Analysis Services
Chemical Analysis Concierge Service
We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.
Introducing the advantages and disadvantages of 3D construction using X-ray CT and FIB slice cross-sections, as well as the 3D construction method using mechanical polishing!
- Structural Analysis
Mechanical grinding allows for a wide range of processing and observation! We will propose appropriate processing and observation methods or combinations.
- Analysis Services
- Other contract services
About the curing temperature of epoxy resin free from hazardous substances.
We conducted measurements to reconfirm the temperature of heat generation during curing, following the change to a non-toxic epoxy resin. When using a large amount of resin, we apply heat generation prevention treatment for resin embedding. Without this treatment, the temperature can rise up to 138°C during curing. However, by applying the heat generation prevention treatment even with a large amount of resin, we were able to keep the heat generation during curing within 30°C.
The aldol reaction progresses under the influence of temperature, humidity, and light! Example of impurity analysis in ethanol and acetone.
- Analytical Equipment and Devices
- Contract Analysis
- Other contract services
Chemical Analysis Concierge Service
We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.
If any issues arise, detailed analysis will also be provided! A simplified analysis for customers considering the introduction of overseas LCDs.
- Analysis Services
Observation of Conductive Particle Shape in COG Implementation
We will introduce the observation of the shape of conductive particles in COG implementation. ICs and liquid crystal panels are implemented using the COG method with ACF (anisotropic conductive film). A resin ball is used as the core, and a metal layer (such as nickel or gold) for conductivity is deposited on its surface. During connection, the particles deform appropriately to electrically connect the IC and the panel. To confirm the degree of particle deformation and connection status, cross-sectional observations were conducted, revealing that the particle deformation was at a "medium" level, indicating an appropriate degree of deformation. By examining the deformation of conductive particles from both the planar and cross-sectional directions, we can explore the correlation with display defects. Please feel free to contact us for any inquiries regarding panel-related defects.
We conduct environmental testing, as well as non-destructive observation and electrical property measurements.
- Analytical Equipment and Devices
- Analysis Services
Appearance observation and measurement services
We would like to introduce our "Appearance Observation and Measurement Service." We are equipped with a variety of devices to meet your needs, including appearance observation before and after reliability testing, solder joint observation, as well as dimensional measurements and surface roughness measurements of various components. You can also leave the pre-observation processing to us. Our company has IPC-certified IPC specialists on staff. We provide assistance with observations, consultations, and solutions to various observation-related concerns in accordance with international standards.
Introducing the perspectives from which analysis and analytical techniques should be advanced!
- Other analyses
Strain measurement of power module package resin.
We would like to present the results of strain measurements conducted by attaching strain gauges and thermometers to the surfaces of power modules, both in the mounted state on a circuit board and in the unmounted state. In the mounted module, a slight delay in temperature change was observed, and correspondingly, the change in strain also appeared to be delayed. This is believed to be due to the slower transfer of heat to the module when it is mounted. At Aites, we conduct temperature cycle tests and temperature-humidity cycle tests, during which we can simultaneously measure the strain occurring in the mounted components. Please feel free to consult with us.
![[Data] Examples of Defects and Anal...](https://image.mono.ipros.com/public/product/image/8ac/2000477851/IPROS65825463468471618599.png?w=280&h=280){kind=small}
We are presenting examples of defect analysis and investigation conducted through various approaches!
- Other analyses
![[Information] Liquid Crystal Materi...](https://image.mono.ipros.com/public/product/image/ac4/2000509240/IPROS73402578756747878876.png?w=280&h=280){kind=small}
Easily explain the technical capabilities of Aites by analyzing molecular structures with diagrams and tables!
- Analysis Services
- Structural Analysis
Analysis of trace metal elements in liquid crystals
We will introduce a case where ICP measurement was conducted using panels before and after reliability testing, along with quantification. The liquid crystal molecules in an LCD are oriented within the panel, and the display is controlled by changes in the orientation state of the liquid crystal due to voltage. When ionic substances, such as metal elements, are present inside the panel, the liquid crystal may not drive correctly, leading to display defects. It is known that ionic substances can increase due to contamination during manufacturing or long-term use, making it important to quantify and understand them as part of panel quality. Metal ions can be quantitatively analyzed using ICP analysis, and depending on the differences in pretreatment methods and detection sensitivity, ICP-AES and ICP-MS are used selectively. [Analysis Content] ■ Comparison of metal element content using ICP-AES analysis ■ Comparison of metal element content using ICP-MS analysis For more details, please refer to the related products and catalog below.
![[Example of Analysis by EBSD] Screw](https://image.mono.ipros.com/public/product/image/d61/2000533368/IPROS90868083247351914914.png?w=280&h=280){kind=small}
We will introduce an example of analysis using EBSD for screws (Cu2Zn).
- Analytical Equipment and Devices
- Analysis Services
Example of analysis of compounds at the SAC solder and Ni pad interface.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.
Visualize the features that appear in the graph! You can check the distribution of crystal sizes and the orientation of crystal directions.
- Analytical Equipment and Devices
- Analysis Services
Example of analysis of compounds at the SAC solder and Ni pad interface.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.
The EBSD method allows for the estimation of crystal states and residual stresses! Here is an example of BGA analysis.
- Analytical Equipment and Devices
- Analysis Services
Example of analysis of compounds at the SAC solder and Ni pad interface.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.
We will introduce an example of crystal analysis of intermetallic compounds at solder joints.
- Analytical Equipment and Devices
- Analysis Services
Example of analysis of compounds at the SAC solder and Ni pad interface.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.
Observe the changes before and after compression on the copper plate! You can compare the half-life of the crystal grain size before and after compression.
- Analytical Equipment and Devices
- Analysis Services
Example of analysis of compounds at the SAC solder and Ni pad interface.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.
We will introduce an example of the analysis of EBSD patterns (Kikuchi patterns) at gold wire bond joints.
- Analytical Equipment and Devices
- Analysis Services
Example of analysis of compounds at the SAC solder and Ni pad interface.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.
By combining various methods suitable for failure modes, we can consistently address everything from the identification of defective nodes to physical analysis.
- Other analyses
- Contract Analysis
- Analysis Services
Pre-processing of SiC devices → Identification of leakage points → Physical analysis/component analysis handled seamlessly!
- Analysis Services
- Contract Analysis
Announcement of the introduction of Talos F200E
Our company will introduce the FEI "Talos F200E" transmission electron microscope system. Compared to conventional models, the resolution for TEM and STEM has improved, and performance has been significantly enhanced, allowing for EDS analysis with four detectors. Additionally, it is equipped with features such as drift-corrected frame integration (DCFI), which accumulates multiple frames while correcting for drift.
Even with SiC power devices, we can provide consistent support for cross-section preparation of specific areas, observation of diffusion layer shapes, as well as wiring structure and crystal structure...
- Analysis Services
- Contract Analysis
Check the quality status of LCD components and products! We will analyze the structures of the LCD panels using our analytical methods and expertise!
- Analysis Services
- Contract Analysis
Observation of Conductive Particle Shape in COG Implementation
We will introduce the observation of the shape of conductive particles in COG implementation. ICs and liquid crystal panels are implemented using the COG method with ACF (anisotropic conductive film). A resin ball is used as the core, and a metal layer (such as nickel or gold) for conductivity is deposited on its surface. During connection, the particles deform appropriately to electrically connect the IC and the panel. To confirm the degree of particle deformation and connection status, cross-sectional observations were conducted, revealing that the particle deformation was at a "medium" level, indicating an appropriate degree of deformation. By examining the deformation of conductive particles from both the planar and cross-sectional directions, we can explore the correlation with display defects. Please feel free to contact us for any inquiries regarding panel-related defects.
We will handle everything from the evaluation of the diffusion layer to physical analysis/chemical analysis regarding the malfunctioning part!
- Analysis Services
- Contract Analysis
- Semiconductor inspection/test equipment
Announcement of the introduction of Talos F200E
Our company will introduce the FEI "Talos F200E" transmission electron microscope system. Compared to conventional models, the resolution for TEM and STEM has improved, and performance has been significantly enhanced, allowing for EDS analysis with four detectors. Additionally, it is equipped with features such as drift-corrected frame integration (DCFI), which accumulates multiple frames while correcting for drift.
![[Data] Research Institute of Chemic...](https://image.mono.ipros.com/public/product/image/3b2/2000541783/IPROS94910342422717202563.png?w=280&h=280){kind=small}
Clear publication of analysis results using polyamide imide materials and IR devices, as well as data analysis!
- Analysis Services
Chemical Analysis Concierge Service
We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.
Analysis of inorganic compounds such as metal oxides is also possible!
- Analysis Services
- Contract Analysis
Chemical Analysis Concierge Service
We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.
Examples of analysis using EBSD, such as 'Observation/Elemental Analysis' and 'Analysis by EBSD'!
- Contract Analysis
- Analysis Services
Applying advanced sample preparation techniques and failure analysis equipment for semiconductors! Investigating the causes of non-lighting and brightness degradation.
- Contract Analysis
- Analysis Services
Examples of semiconductor observation using mechanical polishing.
In the methods for cross-section preparation in semiconductor structure observation and defect analysis, CP, FIB, and mechanical polishing are mentioned, each having its own advantages and disadvantages, making it necessary to consider which method to use. In recent years, CP and FIB have become more common, and it seems that the use of mechanically polished methods, which require technical skill, is decreasing. However, it is still not something to be dismissed. While there are merits and demerits, it is possible to achieve cross-section preparation with mechanical polishing that is on par with FIB and CP. At our company, based on years of accumulated know-how, we propose the most appropriate processing method according to the observation purpose, sample composition, and structure.
Back grinding is possible with various types of semiconductors! You can observe the elements and the condition of defects.
- Analysis Services
- Semiconductor inspection/test equipment
![[Data] Whisker Analysis by EBSD](https://image.mono.ipros.com/public/product/image/dcb/2000552755/IPROS61764853026228393387.png?w=280&h=280){kind=small}
Introducing a case study analyzing whiskers that occurred on the lead terminals of an IC package!
- Other contract services
- Contract Analysis
- Analysis Services
Example of analysis of compounds at the SAC solder and Ni pad interface.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.
At Omron's Yasu facility, which has a maximum 8-inch MEMS line, we respond to various customer requests from prototype to mass production in the wafer process!
- Analysis Services
- Contract Analysis
With our advanced technology, we can also create cross-sections of highly challenging samples!
- Analysis Services
- Contract Analysis
Observation of tracking camera cross-section by mechanical grinding.
I would like to introduce "Cross-sectional observation of tracking camera using mechanical polishing." Regarding the structure of the tracking camera components, when viewed from above, the lens can be identified. Although it cannot be clearly seen in the X-ray image, the lens is incorporated into the convex part. Additionally, the cross-sectional structure is similar to that of an RGB sensor, featuring a back-illuminated CMOS structure. However, since color information is not necessary for the tracking camera, there is no color filter layer. A jagged uneven shape was observed on the surface of the photodiode.
![[Analysis Example by EBSD] Kanikan](https://image.mono.ipros.com/public/product/image/ada/2000560445/IPROS24200233374735850115.jpeg?w=280&h=280){kind=small}
Here is an example of analysis regarding the broken part of a crab claw that was damaged due to long-term use!
- Analysis Services
- Contract Analysis
Example of analysis of compounds at the SAC solder and Ni pad interface.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.
Solid samples can leach ionic components into pure water! Trace ionic components in the aqueous solution can be detected with high sensitivity.
- Analysis Services
- Other contract services
Chemical Analysis Concierge Service
We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.
Accurately grasping defects! It is possible to conduct extensive bulk observations as well as partial magnifications, accommodating various types of observations.
- Analysis Services
- Other contract services
We undertake contract processing and manufacturing of cross-sections of various parts and materials.
- Analytical Equipment and Devices
- Analysis Services
Cryogenic ion milling cross-section processing example (rubber products)
We will introduce a case where cross-sections were created and observed by method regarding the adhesive parts of the tires of pull-back cars. When conducting SEM observations of the created cross-sections, fillers present inside the rubber were confirmed. It was found that the dispersion state of the fillers and the condition of the adhesive interface were not clear with fracture by liquid nitrogen or mechanical polishing. In contrast, the cross-sections created by cryo ion milling allow for clear observation of the dispersion state of the fillers contained within the rubber and the condition of the adhesive interface with the plastic substrate.
We conduct surface analysis, foreign substance analysis, and organic composition analysis.
- Analytical Equipment and Devices
- Analysis Services
Analysis of organic-inorganic composite materials using FT-IR and EDX.
We will introduce an example of analyzing organic-inorganic composite materials using FT-IR and SEM-EDX. FT-IR measurements were conducted on the glossy and non-glossy areas of a PET bottle label, and the IR spectra differed between the glossy and non-glossy areas. Since the non-glossy area resembles the spectrum of acrylic resin, it is considered that the main component is acrylic resin. Additionally, SEM-EDX measurements were performed on both the glossy and non-glossy areas, and EDX spectra and backscattered electron images were obtained, revealing that the non-glossy area contained sulfur (S) and barium (Ba), which were not detected in the glossy area.
Transitional thermal measurement possible power cycle testing, with a customized luminescence/OBIRCH analysis device, where a skilled team thoroughly evaluates and analyzes power devices!
- Analytical Equipment and Devices
- Analysis Services
Rubber heat aging test
Our company conducts "rubber thermal aging tests" that help evaluate the properties of materials in actual usage environments. Using a method compliant with JIS K6257 (Method for determining thermal aging characteristics of vulcanized rubber and thermoplastic rubber), rubber test pieces are suspended in a gear oven to create specimens with varying heat treatment times. Additionally, tensile tests are performed on heated natural rubber (NR) to investigate changes in mechanical properties, while hardness is measured simultaneously. Changes in the characteristics of the rubber are also examined, confirming that rubber elasticity is lost and the material becomes harder with heating.
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I will introduce an example of analysis using EBSD where orientation was observed in the Al wiring.
- Analytical Equipment and Devices
- Analysis Services
Example of analysis of compounds at the SAC solder and Ni pad interface.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.
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I will introduce an example of analysis using EBSD for pipes (austenitic).
- Analytical Equipment and Devices
- Analysis Services
Example of analysis of compounds at the SAC solder and Ni pad interface.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.
The EBSD method allows for the estimation of crystal size distribution and residual stress.
- Analytical Equipment and Devices
- Analysis Services
Example of analysis of compounds at the SAC solder and Ni pad interface.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.