3D solder paste inspection device 'TR7007 SII Plus'
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The "TR7007 SII Plus" boasts an inspection speed of 200 cm²/second, making it an ideal SPI device that can accommodate any production line. It has a resolution capability of 10μm or 15μm. It performs full 3D inspections and maintains high inspection accuracy with high precision and reliable linear motor drive. Key features of the device include closed-loop functionality, enhanced 2D image processing capabilities, automatic warpage compensation, and fringe pattern technology. 【Features】 ■ Industry-leading inspection speed of up to 200 cm²/second (15μm) ■ Shadow-free fringe pattern lighting technology ■ High resolution of 10μm and 15μm ■ High precision linear motor X-Y table ■ Advanced SPC functions for tracing and checking production quality *For more details, please refer to the PDF document or feel free to contact us.
- Company:ティアールアイ ジャパン 日本支社
- Price:Other