We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
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Substrate Product List and Ranking from 560 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Dec 31, 2025～Jan 27, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Dec 31, 2025～Jan 27, 2026
This ranking is based on the number of page views on our site.

  1. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  2. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  3. グロース Kanagawa//Electronic Components and Semiconductors
  4. 4 スクリーンプロセス Kanagawa//others
  5. 5 プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
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Substrate Product ranking

Last Updated： Aggregation Period:Dec 31, 2025～Jan 27, 2026
This ranking is based on the number of page views on our site.

  1. Handbook for Circuit Board Noise Countermeasures グロース
  2. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  3. Integrated in-house support for shaping, processing, and firing! Contract processing of ceramics. マルワイ矢野製陶所
  4. Understand in 3 minutes! A substrate that dissipates heat faster [Materials available]. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
  5. 4 Difficult-to-weld areas! Even when you're out and about! | High-strength adhesive for metals スリーエム ジャパン

Substrate Product List

1651～1665 item / All 1899 items

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[Introduction to the Fair Process] Manufacturing/Assembly/Inspection/Packaging

[Introduction to the Fair Process] Manufacturing/Assembly/Inspection/Packaging

The product, along with the instruction manual, is placed in a dedicated individual box and shipped directly to the customer's specified factory! Electrical testing can also be performed.

At Fair Co., Ltd., we perform harness processing, sheet metal assembly, and circuit board installation, among other tasks. We can also program and conduct electrical inspections, and in cases of high production volume, we create dedicated jigs to enhance production efficiency. Additionally, we handle projects that involve placing instruction manuals in dedicated packaging boxes along with the products and shipping them directly to the customer's specified factory. 【Other Process Examples (Excerpt)】 ■ Product Planning ■ CPU Firmware Design ■ Circuit Board Pattern Design ■ Component Procurement ■ Component Mounting *For more details, please refer to the related links or feel free to contact us.

  • Other contract services
  • Substrate

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Printed circuit board design high-frequency board

Printed circuit board design high-frequency board

We accept artwork design for various types of boards, including high-frequency impedance control boards and power supply boards.

We specialize in the design of impedance control PCBs, with proven experience in high-frequency boards ranging from 10GHz to 40GHz and high-speed transmission boards from 40Gbps to 100Gbps. Additionally, we consider various aspects from PCB manufacturing to component mounting and propose the optimal layout.

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  • Substrate

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Rigid flex circuit impedance

Rigid flex circuit impedance

We also accept prototyping and small lot production of rigid-flex PCBs from AW design at our array.

By combining rigid substrates with bendable flexible substrates, various layouts become possible.

  • Prototype Services
  • others
  • Substrate

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Flexible printed circuit board (FPC) impedance control

Flexible printed circuit board (FPC) impedance control

Impedance control of flexible substrates and UL certification can be achieved with short lead times and small lot production.

We can respond to circuit board manufacturing and component assembly in just one working day at the shortest. Additionally, we manufacture high-performance flexible circuit boards with impedance control during the artwork design phase. We can also accommodate small lot production. Please feel free to consult with us.

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  • Prototype Services
  • Substrate

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Flexible printed circuit board (FPC) [Solving the issues in the prototype development of flexible printed circuit boards!]

Flexible printed circuit board (FPC) [Solving the issues in the prototype development of flexible printed circuit boards!]

Solving the issues of prototype development for flexible PCBs with many limitations! We manufacture high-performance flexible PCBs!

We can respond to circuit board manufacturing and component mounting in as little as one working day each. Additionally, we manufacture high-performance flexible circuit boards with impedance control during artwork design. We also accommodate small lot production. 【We can also support the following specifications】 ■ Component mounting FPC (double-sided mounting, lead-free mounting, mounter/reflow, bare chip mounting) ■ Bonding processing with other boards using ACF (FPC + FPC, FPC + PBC, FPC + glass substrate, etc.) ■ Multi-layer FPC (supports 3 to 6 layers; double-sided mounting is also possible) ■ Fine pitch FPC (single-sided board... minimum L/S 12/30μm; double-sided board... minimum L/S 25/50μm) *For details, please request materials or view the PDF data from the download.

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  • Substrate

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Tokaishin'e Electronics Industry Multi-layer Circuit Board

Tokaishin'e Electronics Industry Multi-layer Circuit Board

We have a variety of products available to meet the diverse needs of our customers.

It is a substrate with copper foil on both sides and inside of a glass epoxy insulating board.

  • Other services
  • Substrate

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Daichang Electronics Flex-Rigid Circuit Boards

Daichang Electronics Flex-Rigid Circuit Boards

We aim to be a company where everyone can thrive and enjoy their work.

The business environment surrounding our company has become characterized by significant changes akin to turbulence. In order to achieve sustainable development without being swayed by economic trends, we will take the initiative to lead change and proactively embrace challenges.

  • Other network tools
  • Substrate

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Daichang Electronics Build-Up Multilayer Circuit Board

Daichang Electronics Build-Up Multilayer Circuit Board

We aim to be a company where everyone can thrive and enjoy their work.

The business environment surrounding our company has become characterized by significant changes akin to turbulence. In order to achieve sustainable development without being swayed by economic trends, we will take the initiative to lead change and proactively embrace challenges.

  • Other network tools
  • Substrate

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Small lot for development! For automotive and power supply use. Thick copper substrate (high current substrate).

Small lot for development! For automotive and power supply use. Thick copper substrate (high current substrate).

With a maximum copper thickness of 400μm, it is suitable for heat dissipation measures and power supply for power devices! It can also be formed on substrates such as transformers and motors.

Meito Electric's "Thick Copper Substrate (High Current Substrate)" is suitable for heat dissipation and current supply in heating devices used in automotive and power supply applications. By increasing the conductor (copper) thickness compared to the conventional 35μm, power circuits and control circuits can be formed on the same substrate. The creation of thick copper coil patterns allows for the construction of transformer circuits and motor circuits on the substrate. 【Substrate Specifications】 ■ Outer layer copper foil thickness: 70μm to 200μm ■ Inner layer copper foil thickness: 70μm to 400μm ■ High thermal conductivity resin: up to 8W/mK ■ Bonding: High thermal conductivity resin and copper, etc. ■ Number of layers: Proven from 2 layers to 10 layers (specifications to be discussed) ■ Copper plate: C1020 (oxygen-free) or C1100 (tough pitch) *For detailed information, please download the PDF or feel free to contact us.

  • Contract manufacturing
  • Substrate

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Thin film circuit board for medical devices

Thin film circuit board for medical devices

Thin film circuit boards that contribute to the miniaturization of medical devices.

In the medical device industry, there is a demand for miniaturization and high-precision components. In particular, miniaturizing parts is a crucial challenge in order to pack many functions into limited space. Our thin-film circuit boards contribute to solving this challenge in the design of medical devices that require small, precise, and high-accuracy components. 【Application Scenes】 - Endoscopes - Portable diagnostic devices - Biometric sensors 【Benefits of Implementation】 - Miniaturization of devices - High-density mounting - High reliability

  • Circuit board design and manufacturing
  • Substrate

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Thin Film Circuit Board for Aerospace Applications

Thin Film Circuit Board for Aerospace Applications

Thin film circuit boards that achieve weight reduction and high performance.

In the aerospace industry, reducing the weight of aircraft is essential for improving fuel efficiency and performance. Particularly for electronic devices used in outer space or harsh environments, there is a demand for high reliability and durability while being compact and lightweight. Thin-film circuit boards have been developed to meet these requirements. 【Application Scenarios】 - Electronic devices for aircraft and spacecraft - Satellite-mounted equipment - Drones 【Benefits of Implementation】 - Improved fuel efficiency through weight reduction - Effective use of space through miniaturization - Increased longevity of devices due to high reliability

  • Circuit board design and manufacturing
  • Substrate

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Thin film circuit board for wearables

Thin film circuit board for wearables

Thin film circuit boards that achieve high-density implementation. Contributes to miniaturization and high performance.

In the wearable device industry, there is a demand for both miniaturization and high performance. In particular, high-density implementation technology is essential to pack many functions into a limited space. Thin-film circuit boards have been developed to address this challenge. Our thin-film circuit boards achieve high-density implementation through high-precision fine circuit pattern formation technology, contributing to the miniaturization and high performance of wearable devices. [Use Cases] - Smartwatches - VR/AR devices - Healthcare devices [Benefits of Implementation] - Miniaturization of devices - Enhanced performance - Improved reliability

  • Circuit board design and manufacturing
  • Substrate

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Thin film circuit board for energy efficiency.

Thin film circuit board for energy efficiency.

Contributing to energy efficiency with film formation technology and thin film processing technology!

In the energy industry, energy conservation and efficient power supply are required. In particular, high-performance electronic components are essential in fields such as solar power generation and energy storage systems. Thin-film circuit boards contribute to the miniaturization and high performance of devices in these systems, supporting improvements in energy efficiency. 【Usage Scenarios】 - Solar power generation systems - Energy storage systems - Power converters 【Benefits of Implementation】 - Enhanced device performance - Miniaturization of systems - Improved energy efficiency

  • Circuit board design and manufacturing
  • Substrate

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Thin Film Circuit Board for Measuring Instruments

Thin Film Circuit Board for Measuring Instruments

Thin film circuit board contributing to the performance improvement of high-frequency measuring instruments.

In the high-frequency measurement instrument industry, accurate signal transmission and noise suppression are essential. Particularly in measurements within the high-frequency range, the dielectric properties of substrate materials and the precision of circuit patterns significantly influence the reliability of measurement results. Inadequate substrate or pattern design can lead to signal attenuation and reflection, hindering accurate measurements. Our thin-film circuit substrates contribute to the performance enhancement of high-frequency measurement instruments by using materials with high-precision fine circuit patterns and excellent thermal conductivity. 【Application Scenarios】 - High-frequency signal measurement - Testing of wireless communication devices - Development of radar systems - Evaluation of various sensors 【Benefits of Implementation】 - Improvement of high-frequency characteristics - Reduction of signal transmission loss - Enhanced noise resistance - Increased measurement accuracy

  • Circuit board design and manufacturing
  • Substrate

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ATE substrate

ATE substrate

Leave the semiconductor inspection device substrate (ATE substrate) to Cygnus.

We manufacture ATE boards at a top-tier overseas manufacturer. We have numerous achievements in probe cards, performance boards, burn-in boards, and more. AW design support (domestic) is also available.

  • Printed Circuit Board
  • Substrate

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