We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
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Substrate Product List and Ranking from 42 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Sep 24, 2025~Oct 21, 2025
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Sep 24, 2025~Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社 和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. null/null
  4. 4 アイン 本社工場 Nagano//Electronic Components and Semiconductors
  5. 5 JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale

Substrate Product ranking

Last Updated: Aggregation Period:Sep 24, 2025~Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
  2. Handbook for Circuit Board Noise Countermeasures グロース
  3. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  4. 4 FPC - "Technical Information" - Updated September 2025 太洋テクノレックス 本社 和歌山
  5. 4 Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社

Substrate Product List

1651~1665 item / All 1839 items

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Technical Introduction: "Improvement of V-Cut Position Accuracy (High-Density and Precision Processing Technology)"

Introducing technology for improving V-cut position accuracy! High-precision V-cut method using CCD.

At Sato-Sen Co., Ltd., we have achieved a positional accuracy of ±50μm through improvements in V-cut and pattern positioning. The pattern formation is made possible by the LDI (Laser Direct Imaging) method, and the V-cut is achieved using a high-precision V-cut method with CCD. We enhance hole position accuracy with ultra-high-speed micro-diameter drill machines, form high-density circuits (L/S = 30/30) with LDI, and provide high-density multilayer printed circuit boards with stable quality using X-ray reference drilling equipment and X-ray measuring machines. 【Features】 ○ We offer multilayer printed circuit boards → High density, IVH, BVH, and build-up with design flexibility ○ Flat plugs (pad-on-via) allow for mounting on through-holes ○ Landless through-holes enable compatibility with narrow pitch patterns ○ Ultra-fine printing is possible (1 character: vertical 0.28 × horizontal 0.15 mm) Please contact us for more details.

  • Printed Circuit Board

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Technical Introduction: "Zaguri (COB Technology)"

Introducing the boring technique! It is possible to perform boring to lower the height of the LSI.

Sato-sen Co., Ltd.'s router machines are equipped with Z-axis sensors that measure the thickness of the board and perform machining from the top surface, enabling high-precision counterboring. This allows for the embedding of LSI through cavity processing for die bonding. 【COB Technology Features】 ○ Providing reliable and stable COBs → Strict quality control by experienced engineers from a company that has emerged from the plating industry ○ Proven track record from COB development to mass production ○ Even when leads cannot be drawn due to gold plating for electro-bonding in design, unique lead-free electro-bonding gold plating is possible ○ Equipped with bonding machines and pull-cut testers in-house, ensuring a quality assurance system through various chemical analyses, SEM, etc. For more details, please contact us.

  • Printed Circuit Board

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Technical Introduction: "LED Brightness (High Brightness and Heat Dissipation Technology)"

Introducing LED brightness enhancement technology! It enables improved reflectivity and reduced junction temperature.

At Sato-Sen Co., Ltd., we have methods to improve the brightness of LEDs. One method involves enhancing the reflectivity, which can be achieved through the substrate, plating, and solder resist. Another method is to lower the junction temperature of the LED, which can be accomplished through pattern design, selection of heat dissipation materials, and setting conductor thickness. Additionally, it is also possible to improve brightness with our unique substrate shape. 【Features】 - Outer shape processing can be done through V-cut, routing, and press processing. - Thermal vias filled with copper paste allow for heat dissipation through through-holes. - Heat dissipation can also be achieved with heat sink pins inserted into through-holes. For more details, please contact us.

  • Printed Circuit Board

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Technical Introduction: "Implementation Technology"

Introducing the implementation technology of printed circuit boards! Measures against poor solder wetting during assembly.

At Sato-Sen Co., Ltd., we are implementing pattern designs that are easy to assemble at the design stage as a measure to improve yield in general printed circuit board assembly. Additionally, to enhance yield in flip chip assembly, we are forming dams using film solder resist, which is effective in preventing solder shorts at C4 and ensuring package parallelism. [Factors Contributing to Poor Solder Wetting] - The increase in alloy layers with lead-free solder, and the presence of black pads due to the nickel layer in flash gold plating are considered potential causes. ⇒ In lead-free solder, managing the composition and temperature of the solder bath is crucial. ⇒ For flash gold plating, proper management of the pre-treatment and nickel bath solution is essential. For more details, please contact us.

  • Printed Circuit Board

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Integrated in-house support for shaping, processing, and firing! Contract processing of ceramics.

Pre-sintering processing is also possible! We have a proven track record in a variety of ceramic processing, including alumina, zirconia, and 99.8% high-purity fused silica molded products.

Our company offers "ceramics contract processing," where we handle molding, processing, and firing in-house. We can process various ceramics such as alumina, zirconia, and magnesia. In addition to post-firing processing, we also perform pre-firing processing, which helps prevent cracking and chipping due to thermal expansion and post-molding processing. Currently, we are offering a comprehensive catalog of ceramic products! It includes a wide range of ceramic products, starting from dense products like alumina and zirconia to 99.8% high-purity fused silica molded items. Furthermore, the catalog provides information on the types of ceramics, purity, and characteristics based on molding methods, making it useful for property comparison and selection! 【Points for Choosing Maruwai】 ◆ All contract molding, processing, and firing are handled in-house ◆ High purity with excellent heat resistance and thermal shock resistance ◆ Superior durability ◆ Capable of accommodating various shapes from large to small ◆ Wide-ranging support for pressing, CIP, casting, extrusion molding, and machining ◆ We also develop raw materials in-house, allowing us to propose suitable materials based on applications and needs *Please view the Maruwai Ceramics Comprehensive Catalog PDF available for download.

  • Ceramics

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Face's Wisdom Bag: "Points to Note When Releasing Materials (3)"

We will propose points of caution and countermeasures from the perspective of the manufacturing site regarding material shipment.

This item introduces precautions for parts shipping (parts packaging) and examples that may lead to manufacturing defects. *For more details, please refer to the PDF document or feel free to contact us.

  • EMS

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BeagleBone Black PoE/PSE board

You will be able to use PoE devices such as network cameras in a solar/battery environment.

Texas Instruments Linux/ARM system: By using the BeagleBone Black board in conjunction with the battery charger circuit board OELBBBPWR01, it becomes possible to utilize PoE devices such as network cameras in solar/battery environments. This device (OELBBBPoE01) provides the functionality of PSE (Power Sourcing Equipment) for PoE (Power over Ethernet).

  • Embedded Board Computers

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Solar/Battery Charger Board for BeagleBone Black

The BeagleBone Black can be used in indoor and outdoor areas without power supply. It is convenient when used in conjunction with a mobile router.

This product is a battery charger circuit board for operating the Texas Instruments Linux/ARM system: BeagleBone Black board with battery/solar power. It is convenient to use this product (OELBBBPWR01) in conjunction with a mobile router and LAN hub. It enables a cable-free operation of the BeagleBone Black without the need for power lines or communication lines, allowing for use in areas without electricity. By combining this product with the BeagleBone Black, various IoT devices can be easily and inexpensively realized. Please mount this product (OELBBBPWR01) on the 46-pin expansion connector of the BeagleBone Black board. Additionally, you can charge a mobile phone from this product via the Micro USB connector (5V). By using this product, you can charge a mobile phone from a battery or solar panel during a disaster.

  • Embedded Board Computers
  • Other embedded systems (software and hardware)
  • Other environmental analysis equipment

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High-strength alumina substrate for thin films

Ideal for thin film circuit formation! JFC's unique alumina substrate with high strength, high purity, and excellent planar smoothness.

The high-strength alumina substrates for thin films manufactured by our company feature a dense and smooth surface achieved through the use of fine and uniform raw powder, making them suitable for the formation of fine thin film circuits. Due to their high purity and bending strength, they are resistant to cracking even when the substrates are made thin, and they excel in handling, contributing to the miniaturization and thinning of the substrates. They are increasingly being adopted for temperature sensors and chip resistors.

  • High frequency/microwave parts
  • Fine Ceramics

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I2C_4SENSOR board (VL53L0X shield)

This is an introduction to the shield board that reads values from the VL53L0X laser distance sensor.

The "I2C_4SENSOR board (VL53L0X shield)" is a shield board that connects to the Arduino Uno (R3) and reads values from the VL53L0X laser distance sensor. Since it communicates via I2C, it saves I/O pins, and up to four VL53L0X laser distance sensors can be connected. We have connection records for the "VL53L0X Time-of-Flight distance sensor module" and "Pololu VL53L0X Time-of-Flight distance sensor module" sold by SWITCHSCIENCE. 【Features】 ■ Saves I/O pins due to I2C communication ■ Up to four VL53L0X laser distance sensors can be connected *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts

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Attention fuel cell manufacturers! A specialized manufacturer of high-performance ceramic substrates.

We will manufacture zirconia ceramic substrates with toughness and ionic conductivity in a thin form.

Utilizing the toughness of "bendable ceramic substrates," we offer them as "next-generation ceramic substrates," enhancing their value as components. Bendable zirconia Ultra-thin zirconia ceramic substrate Zirconia possesses strong toughness (characteristics). By combining it with the manufacturing technology of ultra-thin ceramic substrates from a specialized high-performance ceramic substrate manufacturer, we can achieve bendability while maintaining its ceramic nature. The ultra-thin ceramic substrate (thickness: 50μm) also has transparency, offering possibilities such as achieving thinner substrate layers.

  • Fine Ceramics

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Business Introduction: Printed Circuit Board Manufacturing

In-house integrated production of printed circuit boards is possible! Introducing the features of the boards, such as the number of layers and maximum size!

We would like to introduce our "Printed Circuit Board Manufacturing." The characteristics of the boards include a thick electroplated gold finish of 0.5 to 1.0 μm, layer counts from single-sided to 30 layers, a maximum size of 670×590 mm, board thickness ranging from 0.1 to 5.0 mm, and a minimum hole diameter of Φ0.1. Additionally, we have manufacturing equipment that allows for in-house integrated production of printed wiring boards. 【Board Characteristics】 ■ Thick electroplated gold finish: 0.5 to 1.0 μm ■ Layer count: single-sided to 30 layers ■ Maximum size: 670×590 mm ■ Board thickness: 0.1 to 5.0 mm ■ Minimum hole diameter: Φ0.1 ■ UL certified substrate ■ Special boards ・IVH boards, blind hole boards ・Controlled characteristic impedance boards *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing

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【Exhibition Participation】Unique technology that enables fine processing of printed circuit boards.

We will propose solutions tailored to your technical needs! We will respond with our unique technology for fine and thin plate processing, as well as hole processing.

【Exhibition Overview】 38th Nepcon Japan - Electronics Development and Implementation Exhibition - Exhibition Name: 24th Printed Circuit Board EXPO Dates: January 24, 2024 [Wed] to January 26, 2024 [Fri] 10:00 AM to 5:00 PM Venue: Tokyo Big Sight Booth Number: E27-37 At our booth, we will showcase cavity substrates suitable for various sensor devices, ultra-thin high-density substrates with a thickness of 0.0mm, via diameter of Φ0.04mm, and positional accuracy of ±0.025mm that enhance the performance of advanced electronic devices, as well as MSAP high-density substrates with a pattern width of 0.01mm and pattern spacing of 0.025mm achieved through selective plating methods. 【Exhibited Products】 ■ Thin high-density substrate processing technology ■ Cavity substrates ■ MSAP method We will be available for consultations at the technology, quality, and procurement booth. Please feel free to stop by. *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

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High board thickness and narrow pitch printed circuit board manufacturing technology.

High-precision FiTT method! Achieving further high multilayer and high board thickness areas for narrow pitch BGA compatible boards.

We would like to introduce our "High Board Thickness and Narrow Pitch Printed Circuit Board Manufacturing Technology." Based on the FiTT method, we promote high-precision technology to achieve narrow pitch printed circuit boards in the realm of high multilayer and high board thickness. Main applications include semiconductor tester boards, load boards, socket boards, and probe cards. 【Features】 ■ High-precision FiTT method enables narrow pitch BGA compatible boards in high multilayer and high board thickness areas. ■ Supports 0.50mm pitch BGA with a board thickness of 7.65mm and φ0.20 drill through processing. ■ Supports 0.25mm pitch BGA with ultra-small diameter φ0.10 drill processing. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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High-frequency compatible printed circuit board

A printed circuit board that balances performance and cost! Correlated high-precision transmission line modeling.

We support the development of high-frequency substrates from materials, processes, and design. High-precision transmission line modeling correlated with in-house manufactured substrates. We can provide materials, treatments, and processes tailored to your applications. We offer printed circuit boards that balance performance and cost in a one-stop solution, so please feel free to contact us with your requests. 【Features】 ■ Manufacturing process compatible with high frequency - We propose suitable materials from the perspective of performance and cost - Improvement of characteristics through high-precision back drilling - 20% reduction in loss at 14GHz with changes to solder resist only ■ Support for chemically bonded surface treatments *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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