We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
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Substrate Product List and Ranking from 561 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Dec 31, 2025～Jan 27, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Dec 31, 2025～Jan 27, 2026
This ranking is based on the number of page views on our site.

  1. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  2. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  3. グロース Kanagawa//Electronic Components and Semiconductors
  4. 4 スクリーンプロセス Kanagawa//others
  5. 5 プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
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Substrate Product ranking

Last Updated： Aggregation Period:Dec 31, 2025～Jan 27, 2026
This ranking is based on the number of page views on our site.

  1. Handbook for Circuit Board Noise Countermeasures グロース
  2. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  3. Integrated in-house support for shaping, processing, and firing! Contract processing of ceramics. マルワイ矢野製陶所
  4. Understand in 3 minutes! A substrate that dissipates heat faster [Materials available]. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
  5. 4 Difficult-to-weld areas! Even when you're out and about! | High-strength adhesive for metals スリーエム ジャパン

Substrate Product List

1261～1275 item / All 1901 items

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Motor Driver Board 'V1.0X'

Motor Driver Board 'V1.0X'

Motor drive control can be performed by receiving PWM signals from external sources such as microcontrollers.

The "V1.0X" is a circuit board that performs motor drive control by receiving PWM signals from external sources such as microcontrollers. The power supply voltage is 10-45V. The output current is 3A at peak and approximately 1.5A on average. The board size is 41×60×21(mm). 【Specifications】 ■ Power Supply Voltage (VIN): 10-45V ■ Mounted FET: TB6568KQ (Toshiba Bi-CMOS Integrated Circuit) ■ PWM Signal Voltage: 0-5V ■ Output Current (peak): 3A ■ Output Current (average): ~1.5A ■ Board Size: 41×60×21(mm) ■ Mounting Hole Size: M3 screw compatible, hole pitch 34×50(mm) *For more details, please refer to the PDF document or feel free to contact us.

  • Other machine elements
  • Substrate

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Shield board "I2C_4SENSOR board"

Shield board "I2C_4SENSOR board"

You can save I/O pins! Up to 4 VL53L0X laser distance sensors can be connected.

The "I2C_4SENSOR board" is a shield board that connects to the Arduino Uno (R3) to read values from the VL53L0X laser distance sensor. Since the VL53L0X laser distance sensor communicates via I2C, it allows for saving I/O pins. Up to four VL53L0X laser distance sensors can be connected. 【Features】 ■ Connects to Arduino Uno to read values from the VL53L0X laser distance sensor ■ Saves I/O pins ■ Up to four VL53L0X laser distance sensors can be connected *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Substrate

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Supercapacitor DMT/DMF family

Supercapacitor DMT/DMF family

Murata Supercapacitors Now From CAP-XX !!

The lineup of CAP-XX, which holds unique patented technology for electric double-layer capacitors, has been expanded to include the DMT/DMF family transferred from Murata. The specifications are as follows: for the 4.2V/-40-85℃ products, there are 220mF/300mohm and 470mF/130mohm; for the 5.5V/-40-70℃ products, there are 470mF/45mohm and 1000mF/40mohm. All products come in a thin laminated package with a thickness ranging from 2.2mm to 3.7mm.

  • Capacitor
  • Substrate

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Daishin Machinery Co., Ltd. Business Introduction

Daishin Machinery Co., Ltd. Business Introduction

Leave the assembly from precision machining to Oshin Kiko.

Daishin Kiko Co., Ltd. has been engaged in the overhaul of various machine tools in the machine tool sector since its establishment. Currently, we utilize our technology to meet the more advanced needs of our valued customers, working on automation solutions for machine tools, including auto loaders, conveyor systems, and extraction and stock devices for industrial machinery. As we enter the 21st century, Daishin Kiko, driven by a spirit of further challenge, is committed to maximizing the know-how accumulated to date through research and development, and has created a new rotary powder molding machine to introduce to the world. We are dedicated to enhancing our technical capabilities to ensure customer satisfaction and to meet their needs. For more details, please contact us or download our catalog.

  • Mechanical Design
  • Contract manufacturing
  • Other machine tools
  • Substrate

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Thin Film on Substrate: A-Z

Thin Film on Substrate: A-Z

We deliver high-quality and affordable crystals and materials from MTI Corporation in the United States.

We offer high-quality and affordable crystals and materials from MTI Corporation, a top-class company in the industry. You can purchase from as little as one piece. MTI's stock items can be delivered in as little as 1 to 2 weeks. For more details, please visit our website.

  • Secondary Cells/Batteries
  • Other metal materials
  • Substrate

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Electronic equipment development and production

Electronic equipment development and production

One-stop support for multiple projects! Stable supply to domestic and overseas locations at low prices is possible.

At Yumex, we handle everything from development to mass production using both our Japan and Philippines locations. Development is conducted in Japan, while procurement, prototyping, and mass production can be flexibly and quickly managed in the Philippines. If you have concerns such as "Managing multiple projects is cumbersome, so I want to entrust everything to one company" or "I'm relying on outsourcing in China and domestically, but I'm worried about the future," please feel free to contact us first. 【Features】 ■ We guarantee high quality based on years of manufacturing experience. ■ We have a wide range of applicators and can deliver in a short time frame due to domestic production. ■ We can quickly respond to small lot orders starting from just one piece. ■ We own overseas factories, allowing for stable supply to domestic and overseas locations at low prices. *For more details, please feel free to contact us.

  • Other electronic parts
  • Substrate

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[Processing Material Example] Alumina Substrate ver

[Processing Material Example] Alumina Substrate ver

Excellent surface condition with smoothness and flatness! Widely used as IC substrates and semiconductor package elements.

"Alumina substrate" is a substrate made from alumina-based ceramics, which excels in mechanical strength, electrical insulation, corrosion resistance, heat resistance, and thermal conductivity. Its physical and chemical properties remain stable even in high-temperature environments. There is minimal variation in dimensions such as outer shape, thickness, slit pitch, and slit depth, resulting in low warping, bending, and waviness. It can be used for chip resistor substrates, HIC substrates, thin-film circuit substrates, and more. 【Features】 ■ A surface condition with few pores due to fine particles, excellent smoothness and flatness ■ Excellent adhesion to thick-film and thin-film materials ■ Stable physical and chemical properties even in high-temperature environments ■ A thermal expansion coefficient close to silicon, with high thermal conductivity ■ High-strength substrates with increased strength are also available *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

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Precision Granite Technology "Porous Chuck RB31"

Precision Granite Technology "Porous Chuck RB31"

Significant improvement in work efficiency! A porous chuck that allows for easy and reliable vacuum suction fixation.

The "RB31" is a porous chuck that securely holds the workpiece using a vacuum suction method created by negative pressure through a porous material. Not only can it easily and reliably fix extremely small, thin, and long workpieces, but it also accommodates non-magnetic materials, making it highly effective for grinding various materials. Customization of size and shape according to the workpiece is possible, as well as connecting multiple units. The ease of attaching and detaching the workpiece, as well as adjustments, significantly improves work efficiency. 【Features】 ■ Customizable ■ Easy to clear clogging ■ Grinding of the suction surface itself is possible ■ Compatible with various workpieces ■ No deformation due to processing heat For more details, please refer to the catalog or feel free to contact us.

  • Other processing machines
  • Chuck
  • Substrate

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Fightronics Co., Ltd. Business Introduction

Fightronics Co., Ltd. Business Introduction

We are a concierge for electronics.

Fightronics Co., Ltd. has been engaged in the planning, development, and manufacturing of electronics equipment, primarily in the industrial machinery sector, since its establishment in 1991. Our company offers "contract manufacturing services" that provide assembly technology for mechanical and electronic devices, as well as "contract development services" and "in-house product development services." We sincerely address all customer concerns and requests, providing a one-stop solution to problems. 【Business Activities】 ■ Printed Circuit Boards ■ Electronic Circuit Design Contracting ■ Computer Software Development ■ Equipment Control Software Development ■ Design and Manufacturing of Various Microprocessor-Based Devices, etc. *For more details, please refer to our catalog or feel free to contact us.

  • Other Consulting Services
  • Other contract services
  • Substrate

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Japan Micron Co., Ltd. Business Introduction

Japan Micron Co., Ltd. Business Introduction

For the design, development, and manufacturing of printed circuit boards and electronic circuit boards, choose Japan Micron Co., Ltd.

As the core of electronics, ICs continue to grow in high-density multifunctionality. Japan Micron Corporation, as a technology development-oriented company, is always striving for technological innovation, establishing original technology development and high-density, high-precision processing techniques. We have provided reliable printed circuit boards and IC package substrates, as well as various micro-package substrates. Under the philosophy that "Electronics brings dreams and a bright future to all people, realizing a rich environment and a peaceful society," we will continue to challenge cutting-edge technologies to further enhance the development of new products and processing techniques. For more details, please contact us or download the catalog.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Other electronic parts
  • Substrate

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PWB for CSP/module

PWB for CSP/module

Chip size packages for various components used in mobile phones and other small devices.

The "CSP/module PWB" is a chip size package that further miniaturizes standard BGA. Using our unique technology, we manufacture packages with a three-dimensional cavity structure. By adopting electroless gold plating, it eliminates the need for plated leads, allowing for high-density wiring. The sheet structure can accommodate various forms of assembly substrates, including dicing cut method, hanging method, and push-back method. 【Features】 ■ Selection of materials with high rigidity, low dielectric constant, high heat resistance, and halogen-free options ■ High-density wiring capability ■ Sheet structure allows for various forms of assembly substrates *For more details, please refer to the catalog or feel free to contact us.

  • Printed Circuit Board
  • Other electronic parts
  • Circuit board design and manufacturing
  • Substrate

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COB for PWB

COB for PWB

Directly mounting bear chips on the substrate! A high-density substrate that achieves miniaturization and thinness of devices.

"COB-compatible PWB" is a high-density substrate that directly mounts bare chips onto the board, achieving miniaturization and thinness of devices. It supports both electrolytic gold plating and electroless gold plating, providing stable bonding properties. By combining this with our unique cavity formation technology, it becomes possible to mount chips within the cavity, further reducing the thickness and size of the product. Additionally, for the sealing process after chip mounting, it is also possible to form a high sealing dam on the substrate that cannot be achieved with conventional printing inks. 【Features】 ■ Chips mounted within the cavity ■ Achieves miniaturization and thinness of devices ■ Supports electrolytic gold plating and electroless gold plating ■ Stable bonding properties ■ Unique mold design reduces dust generation from the edges after exterior pressing *For more details, please refer to the catalog or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Substrate

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Build-up PWB

Build-up PWB

Significantly improved circuit density! A substrate that enables more three-dimensional and high-density configurations.

"Build-Up PWB" mounts components on the connection via pads. Due to fewer restrictions on through holes, it significantly increases circuit density. By combining our unique machining technology, we have achieved a more three-dimensional and high-density configuration. Filled vias with copper plating are also available (subject to separate consultation). 【Features】 ■ Components mounted on connection via pads ■ Fewer restrictions on through holes ■ Significantly increases circuit density ■ Three-dimensional and high-density configuration *For more details, please refer to the catalog or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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PWB for LED

PWB for LED

Manufacturing high-brightness, high-heat-dissipation PWB for LEDs by combining high-precision processing technology with substrates and plating!

Our company manufactures high-brightness, high-heat-dissipation "PWB for LEDs" by combining high-precision processing technology with substrates, resist, plating, and more. We are capable of high-precision slit processing using routers, as well as slit processing with special presses and reflector-shaped hole processing. Additionally, by tenting one side of the through-hole with solder resist or copper foil, we prevent mold resin from flowing onto the backside during bulk molding after assembly. We create substrates with high heat dissipation structures by attaching thick copper foil or copper plates, or by processing copper plates using our high-precision machining technology. 【Features】 - Compatible with 0.1mm thick substrates and thin materials of 50 microns thickness - Gold plating, silver plating, and dual-color gold-silver plating available - Prevents mold resin overflow - Processes copper plates with high-precision cavity formation technology - High heat dissipation structure *For more details, please refer to our catalog or feel free to contact us.

  • LED Module
  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Double-sided multi-layer PWB

Double-sided multi-layer PWB

High-density and high-reliability multilayer boards can be manufactured!

"Double-sided and multilayer PWB" is a double-sided and multilayer substrate required in various fields. By adopting our unique technology, we can manufacture high-density and highly reliable substrates. By filling through-holes with resin and applying a cover plating on top, it is possible to form pads on the through-holes as well. It is also possible to create semi-cut through-holes in the product outline, enabling miniaturization of the product. Additionally, our unique pin insertion technology allows for the insertion and fixation of lead pins into the substrate. 【Features】 ■ High density and high reliability ■ Pads can be formed on through-holes ■ Enables miniaturization of products ■ Selection of materials with high rigidity, low dielectric, high heat resistance, and halogen-free options ■ Allows for the insertion and fixation of lead pins into the substrate *For more details, please refer to the catalog or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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