We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for substrate.
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substrate Product List and Ranking from 576 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Jul 22, 2026～Aug 18, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jul 22, 2026～Aug 18, 2026
This ranking is based on the number of page views on our site.

  1. スクリーンプロセス Kanagawa//others
  2. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  3. 共立エレックス Saga//Ceramics
  4. 4 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  5. 5 アイン 本社工場 Nagano//Electronic Components and Semiconductors
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substrate Product ranking

Last Updated： Aggregation Period:Jul 22, 2026～Aug 18, 2026
This ranking is based on the number of page views on our site.

  1. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  2. Ceramic substrate for firing setters 共立エレックス
  3. Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  4. 4 PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
  5. 5 Wrist Frequency Correction Vibration Acceleration Effective Value Measuring Instrument 'TVHP-001' 吉川電機製作所

substrate Product List

751～780 item / All 1969 items

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[Example of Printed Circuit Board Manufacturing] Build-up Board

[Example of Printed Circuit Board Manufacturing] Build-up Board

Favorable for thin, compact, and narrow-pitch substrates! Introducing examples of build-up substrate manufacturing.

We would like to introduce an example of our "build-up substrate" manufacturing. By using non-through vias connected by laser, it is advantageous for achieving thinner, smaller, and narrower pitch substrates. Please feel free to contact us when you need assistance. 【Overview】 ■ 3-layer build-up (full stack) ■ Any layer (core via file) *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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[Example of Printed Circuit Board Manufacturing] Heat Dissipation Countermeasure Board

[Example of Printed Circuit Board Manufacturing] Heat Dissipation Countermeasure Board

A circuit board that addresses heat issues! Introducing examples of heat dissipation circuit boards manufactured by Matsuwa Sangyo Co., Ltd.

We would like to introduce examples of our "heat dissipation countermeasure boards." These are boards designed to address thermal issues, such as copper inlays and conductive paste resin filled boards (φ0.6). Please feel free to contact us when you need assistance. 【Overview】 ■ Copper Inlay ■ Conductive Paste Resin Filled Board (φ0.6) *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Through-hole resin embedded substrate

Through-hole resin embedded substrate

The number of layers ranges from 2 to 20, and there is a proven track record of resin filling up to a thickness of 3.2mm!

We would like to introduce the "Through Resin Filled Circuit Board" handled by Matsuwa Sangyo Co., Ltd. This printed circuit board is mainly used for boards that mount narrow pitch BGA components (such as 0.5 to 0.3 mm pitch) and for the purpose of filling through holes (TH). After filling the holes (primary TH) that need to be resin-filled with a permanent hole-filling ink (epoxy resin), through holes (secondary TH) are formed, and it is also possible to create a cover plating on the primary TH section that has been resin-filled. 【Example of Manufacturing Specifications for Through Resin Filled Circuit Board】 ■ 12-layer through resin filled circuit board with 0.4 mm pitch BGA - Board thickness: t1.6 mm - BGA pad diameter: φ0.32 mm - Resist opening: φ0.25 mm - Resin filled TH drill: φ0.2 mm *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • substrate

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IVH substrate

IVH substrate

We can manufacture various products such as BVH and COH by sequentially laminating the conductor layer onto the core material!

We would like to introduce the "IVH substrate" handled by Matsuwa Sangyo Co., Ltd. This is a multilayer printed circuit board that connects only the necessary interlayers (non-through vias) instead of using through vias. Unlike build-up substrates, it does not use laser vias and features the use of NC drills for all interlayer connections. By connecting multiple non-through holes in a multilayer board, it achieves greater freedom in wiring and increased wiring density. 【Example of IVH substrate manufacturing specifications】 ■ 0.4mm pitch BGA mounted 8-layer 6-stage continuous IVH substrate ・ IVH specifications: L1-2/1-3/1-4/1-5/1-6/1-7 IVH + L1-8 through ・ BGA pad diameter: φ0.3mm ・ Hole wall pattern spacing: 0.175mm ・ IVH drill diameter: L1-2/L1-3 = φ0.1mm, L1-4 to L1-7 = φ0.15mm * For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Any-layer substrate

Any-layer substrate

Adopted in many products such as communication devices! Printed circuit boards that enable thinner substrates.

We would like to introduce the "Any Layer PCB" handled by Matsuwa Sangyo Co., Ltd. It has a slightly different structure from build-up PCBs, utilizing laser vias even in the inner core section, enabling the thinning of the PCB through full-layer laser vias and filled via plating. The freedom of wiring has further increased, and it is adopted in many products such as IoT devices, wearable products, and communication equipment (5G). 【Any Layer PCB Manufacturing Specifications Example】 ■ 6-layer 2-2-2 build-up PCB with 0.3mm pitch BGA - Board thickness: t0.6mm - BGA pad diameter: φ0.24mm - Resist opening: φ0.17mm - Laser hole diameter: φ0.1mm *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Faradoflex compatible board

Faradoflex compatible board

Improvement of inductance, improvement of impedance, and reduction of noise are possible!

We would like to introduce the "Faradflex-compatible substrate" handled by Matsuwa Sangyo Co., Ltd. Unlike capacitor materials that are built into components, this substrate-integrated capacitor material does not require the creation of cavities within the substrate and is characterized by the ability to form patterned capacitor circuits using standard printed circuit board manufacturing processes. By reducing surface-mounted components, it enhances reliability through fewer connections and enables miniaturization of printed circuit boards. 【Features】 ■ Substrate-integrated capacitor material characterized by the formation of patterned capacitor circuits ■ Enhances reliability through fewer connections by reducing surface-mounted components and enables miniaturization of printed circuit boards ■ Mainly used for high-layer, high-performance routers, server equipment, supercomputers, and MEMS microphones and RF filters aimed at miniaturization *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • substrate

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MEGTRON6

MEGTRON6

Supports large-capacity, high-speed transmission for 5G and ICT infrastructure equipment! Quick delivery is possible.

We would like to introduce "MEGTRON6," handled by Matsuwa Sangyo Co., Ltd. This product is a low transmission loss material that supports high capacity and high-speed transmission for 5G and ICT infrastructure equipment, and it is kept in stock as a regular inventory. Even for sudden requests, we can respond with short lead times just like with our standard circuit boards. Please feel free to contact us when you need assistance. 【Features】 ■ Low transmission loss material that supports high capacity and high-speed transmission for 5G and ICT infrastructure equipment ■ Kept in stock as a regular inventory ■ Able to respond with short lead times even for sudden requests, just like with standard circuit boards *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Single-sided/Dual-sided flexible circuit board

Single-sided/Dual-sided flexible circuit board

By applying a reinforcement plate, component mounting is also possible! It is often used as a substitute for FFC.

We would like to introduce the "Single-Sided/Dual-Sided Flexible Printed Circuit Boards" handled by Matsuwa Sangyo Co., Ltd. The single-sided (1 layer) type is a common specification for flexible printed circuit boards and is often used as a substitute for FFC. There are types with and without an adhesive layer between the base material and copper foil, and we can accommodate both at our company. The dual-sided (2 layers) type allows for more flexible wiring by incorporating through-holes (TH) into the flexible printed circuit board. Please feel free to consult us about multilayer flexible printed circuit boards with three layers or more. 【Shortest Delivery Record Examples】 ■ 1 layer ⇒ Shortest 2 days (AM data ⇒ shipped the next day) ■ 2 layers ⇒ Shortest 2 days (8 AM data ⇒ shipped the next day) *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Aluminum base substrate

Aluminum base substrate

We have products with thermal conductivity of 3 W/m·K and 10 W/m·K in stock, and we can also respond flexibly to other materials!

We would like to introduce the "Aluminum Base Circuit Board" handled by Matsuwa Sangyo Co., Ltd. This printed circuit board has high thermal conductivity and excellent heat dissipation, making it suitable for components that require high heat dissipation, such as high-brightness LEDs and power devices. In recent years, the demand for high thermal conductivity materials has significantly increased due to the spread of LED lighting, and there has been a growing trend to adopt high-brightness LEDs for automotive headlights. 【Example Manufacturing Specifications for Aluminum Base Circuit Boards (Excerpt)】 ■ Maximum outer dimensions: 210×460mm ■ Copper foil thickness: 35μm ■ Insulation layer thickness: 80μm ■ Aluminum base thickness: 1.0mm, 1.5mm, 2.0mm ■ Thermal conductivity: 3W/m·K, 10W/m·K *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Thick-plated board with through holes (TH)

Thick-plated board with through holes (TH)

Recently, there has been an increasing demand for a certain thickness even outside of automotive applications!

We would like to introduce the "Through-Hole (TH) Thick Plated Board" handled by Matsuwa Sangyo Co., Ltd. The typical copper plating thickness required for Through-Holes (TH) is generally around 15 to 20 μm. However, to enhance reliability, there has been an increasing demand for a certain thickness (TH plating ≧ 25 μm) even for applications outside of automotive use. Please feel free to contact us when you need assistance. 【Manufacturing Specifications Example for Through-Hole (TH) Thick Plated Board】 ■ TH plating thickness: Capable of supporting TH thickness ≧ 25 μm *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • substrate

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End face through-hole substrate

End face through-hole substrate

The hole diameter is ≥Φ0.5mm, the land diameter is ≥0.8mm, and the hole pitch is ≥1.0mm!

We would like to introduce the "End Face Through Hole Circuit Board" handled by Matsuwa Sangyo Co., Ltd. This product accommodates hole diameters of ≧Φ0.5mm, land diameters of ≧0.8mm, and hole pitches of ≧1.0mm. The slit through hole circuit board can accommodate a slit width of 1.0mm and a maximum slit length of 30mm (with connections added every 30mm). 【End Face Through Hole Circuit Board Manufacturing Specifications Example】 ■TH Diameter: φ0.5mm ■Land Diameter: φ0.8mm ■Hole Pitch: 1.0mm *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Flash conductor substrate

Flash conductor substrate

It is possible to embed resist or insulating resin between patterns (between conductors) to smooth the surface of the substrate!

We would like to introduce the "Flash Conductor Substrate" handled by Matsuwa Sangyo Co., Ltd. By embedding resist or insulating resin between the patterns (conductors), the surface of the substrate can be smoothed. Please feel free to contact us when you need assistance. 【Structure of Flash Conductor (Resist Specification)】 ■ Copper foil ■ Copper plating ■ Resist ■ Base material *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • substrate

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[COMNEXT2024 Exhibition] FPC and Rigid FPC with ultra-short delivery times

[COMNEXT2024 Exhibition] FPC and Rigid FPC with ultra-short delivery times

[COMNEXT2024 Exhibition] "Want it now when you need it" Matsuwa Sangyo offers astonishingly short delivery times for FPC and rigid FPC!

A leading domestic manufacturer in short delivery times for printed circuit board production, Matsuwa Sangyo offers astonishingly short delivery times for FPC boards and rigid FPC boards as well. 1-layer and 2-layer boards ⇒ as fast as 2 days Multilayer and rigid FPC boards ⇒ as fast as 5 days *Delivery times may vary depending on quantity, reinforcement locations, and specifications. "When you want it, you want it right away" and "When you're in trouble, you want it right away." Please feel free to reach out to us. ★Confirmed participation in COMNEXT2024 (June 24-28 at Tokyo Big Sight, South Exhibition Hall) We look forward to seeing you at booth number '13-31' in the 5G/6G Material World!

  • Printed Circuit Board
  • substrate

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【Ultra-Short Delivery Time & High Quality】Examples of Printed Circuit Board Manufacturing by Matsuwa Industries

【Ultra-Short Delivery Time & High Quality】Examples of Printed Circuit Board Manufacturing by Matsuwa Industries

We present materials on examples of printed circuit board manufacturing! We introduce examples of non-through vias that achieve thin, compact, and narrow pitch designs, as well as boards that address various thermal issues.

Our company can provide various printed circuit boards with extremely short lead times due to our in-house integrated equipment available 24/7. We have the latest equipment in place, ensuring reliability in inspection and quality. Our track record of over 2,000 transactions is proof of this. 【Examples of Printed Circuit Board Manufacturing】 ◆ Build-up Boards By using non-through vias connected by laser vias, we can achieve thinner, smaller, and narrower pitch boards. ◆ Rigid-Flexible Boards These boards integrate rigid and flexible substrates. They are effective for use in very small spaces, such as in compact modules, or when component placement is limited. ◆ Heat Dissipation Boards These boards address thermal issues, featuring copper inlays and conductive paste resin-filled holes (φ0.6). ★ We are currently offering materials showcasing our printed circuit board manufacturing examples. Please take a look via the "PDF Download" link below.

  • Printed Circuit Board
  • substrate

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Release the heat - Matsuwa's heat dissipation board

Release the heat - Matsuwa's heat dissipation board

Hot summer. Matsuwa's circuit boards are super COOL! Thick copper, metal, copper inlay boards, etc. For heat dissipation boards, please consult Matsuwa Industries.

Matsuwa Industries, renowned for its top-notch short delivery times in domestic printed circuit board manufacturing, offers a variety of heat dissipation boards with quick turnaround times. We pride ourselves on our flexibility, with a minimum order quantity starting from just one piece. If you have any issues related to heat dissipation boards, please feel free to consult us. 【Examples of Heat Dissipation Board Manufacturing】 - Thick copper boards (maximum copper thickness of 500µm) - Aluminum and copper base boards - Copper core boards - Copper inlay boards - Conductive paste resin-filled boards - High thermal conductivity materials - Ceramic boards - Thick copper FPC 【Examples of Short Delivery Manufacturing】 - Aluminum base boards: as fast as 2 days (standard 4 days and up) *For detailed services, please refer to the catalog available for download below.

  • Printed Circuit Board
  • substrate

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DDR 4GB/8GB/16GB Various PC memory modules

DDR 4GB/8GB/16GB Various PC memory modules

We sell various types of PC memory boards. There are many options available in terms of capacity. Please contact us. The products are imported from China.

Currently, we are in an environment where there is a shortage of semiconductors, but we provide products from safe and reliable factories in China. The production facility is a company that has been a long-term business partner of ours. We will prioritize the preferences of our buyers regarding the selling price. We sincerely hope you will consider adopting our products.

  • Other electronic parts
  • substrate

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Silicone flexible printed circuit board (Si FPC)

Silicone flexible printed circuit board (Si FPC)

Let's expand the application of products using "Si FPC" in fields that require excellent flexibility and weather resistance, such as IoT, medical devices, smart textiles, and industrial sectors.

FPC has six main features: 1) High-elasticity silver paste that can be printed with silicone 2) Flexible and foldable 3) Excellent weather resistance 4) Excellent electrical insulation 5) High chemical resistance 6) Biocompatibility Additionally, it has passed ROHS, ISO9000, and IECQ080000 certifications.

  • Printed Circuit Board
  • substrate

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Prototype and mass production of printed circuit boards.

Prototype and mass production of printed circuit boards.

We specialize in prototype manufacturing and small-scale production of printed circuit boards, primarily focusing on single-sided, double-sided, four-layer, and six-layer boards. In addition to FR-4 material, we can also accommodate aluminum and iron materials.

Manufacturing of high-layer-count multilayer substrates, IVH substrates, build-up substrates, and back-drill substrates with eight or more layers is possible in collaboration with partner companies. We can also accommodate substrate manufacturing using "low dielectric materials" MEGTRON 6 and MEGTRON 7, as well as "FR-4" halogen-free materials. In addition to printed circuit board manufacturing, we also perform the following tasks: - We collaborate with partner companies that have first and second-class qualifications in printed wiring board manufacturing to conduct artwork design and simulation analysis. - We also handle component mounting for prototype projects.

  • Circuit board design and manufacturing
  • Prototype Services
  • Other FA equipment
  • substrate

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Nitto Denso Co., Ltd. Yata Manufacturing Plant Business Introduction

Nitto Denso Co., Ltd. Yata Manufacturing Plant Business Introduction

We aim to be a company that actively and accurately understands social trends and customer intentions, contributing to society in the spirit of compliance.

Our company handles all processes in-house, including circuit design, PCB design, software development, component procurement, component assembly, unit wiring, coating, and electrical testing, allowing us to manufacture both mass-produced and prototype products. We also strive to provide excellent products and services that satisfy our customers. ■Main Products Control Boards ■Major Business Partners Satoru Electric Co., Ltd. (Yamabiko Corporation) Mitsubishi Mahindra Agricultural Machinery Co., Ltd.

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  • Contract manufacturing
  • substrate

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High-precision multilayer flexible printed circuit board (MFS Technology)

High-precision multilayer flexible printed circuit board (MFS Technology)

We handle products from MFS Technology, which has many actual deliveries in mobile and automotive displays!

MFS Technology was founded in 1989 and is headquartered in Singapore, being an FPC manufacturer with a significant track record of deliveries for mobile and automotive displays. Additionally, it is a PCB manufacturer primarily focused on heavy copper. *You can download the English version of the catalog. *For more details, please refer to the PDF materials or feel free to contact us.

  • Other electronic parts
  • substrate

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Substrate manufacturing

Substrate manufacturing

We offer a wide variety of high-performance FR-4 BT resins and materials such as Rogers!

We propose various substrate materials and suitable substrate manufacturing and assembly methods according to the substrate specifications and production quantities. We have experience with high multilayer, IVH, and BVH, so we can accommodate various specifications for internal vias upon consultation. If you have any questions about other materials or manufacturing specifications, please feel free to contact us. 【Handling Materials (Partial)】 ■ FR-4 CEM3 High Thermal Conductivity CEM3 ■ R-5775 (MEGTRON6) ■ FR-5 Equivalent (High Heat Resistance / High Elasticity / Low Thermal Expansion) ■ Hybrid Configuration ■ Ultra-thin / Flexible Multilayer *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Bead method internal molding foam "Air Block"

Bead method internal molding foam "Air Block"

The expansion ratio is approximately 60 times! It uses a new material that combines excellent rigidity and cushioning properties.

"Air Block" is a bead-type molded foam that features anti-static properties and achieves weight reduction. It uses a new material made by combining polypropylene and polyethylene, which possesses the excellent rigidity of polypropylene and the excellent cushioning properties of polyethylene. The standard sizes are 40t, 50t, and 60t × 1000 × 1200mm, and it can be processed through slicing, cutting, punching, and laminating. [Features] - Composite of polypropylene and polyethylene - New material with excellent rigidity and cushioning properties - Foam expansion ratio equivalent to approximately 60 times - Achieves weight reduction - Anti-static function *For more details, please refer to the PDF document or feel free to contact us.

  • Cushioning material
  • plastic
  • Other polymer materials
  • substrate

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Mountaineer "MY300"

Mountaineer "MY300"

Implement further solutions with space-saving! Achieve maximum versatility and utilization efficiency from valuable floor space.

The "MY300" is a mounter that can implement more substrates in the same space. It achieves complete traceability with uncompromising production quality, a wide range of component mounting, inventory accuracy, and individual substrate ID management. We provide a new level of precision and flexibility faster, smaller, and smarter. 【Features】 ■ Set more feeders with the same line length ■ Speed up substrate transport and tool exchange ■ More compact installation area ■ Future-proof component range ■ User-friendly design * For more details, please refer to the PDF materials or feel free to contact us. * You can download the English version of the catalog.

  • Mounter
  • Other mounting machines
  • Circuit board processing machine
  • substrate

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[Blog] What is a Capacitor?

[Blog] What is a Capacitor?

What is the difference between a capacitor and a condenser? Introducing the original meaning of a capacitor and its types!

In the context of batteries and energy storage devices, terms like "capacitor" and "condenser" are often used, but many people may not understand their meanings or differences. In this blog, we will introduce the original meaning of a capacitor and its types. For more details, please refer to the related links. [Contents] ■ What is a capacitor? ■ Difference between a capacitor and a condenser ■ Types of capacitors ■ Summary about capacitors *You can view the detailed content of the blog through the related links. For more information, please feel free to contact us.

  • Lithium-ion battery
  • UPS/Uninterruptible Power Supply
  • substrate

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[Blog] The Relationship Between Capacitor Voltage and Energy Amount: A Discussion on Units

[Blog] The Relationship Between Capacitor Voltage and Energy Amount: A Discussion on Units

A discussion about units related to capacitors! I will explain the meaning of the units and their relationships.

As units representing the characteristics of capacitors, F (farads), Ah (ampere-hours), and Wh (watt-hours) are often used, but many people may not understand their meanings. In this blog, we will explain the meanings of these units and their relationships. For more details, please see the related links. [Contents] ■ What is F (farad)? ■ The relationship between F, Ah, and Wh ■ The energy capacity of lithium-ion capacitors ■ Summary *You can view the detailed content of the blog through the related links. For more information, please feel free to contact us.*

  • Lithium-ion battery
  • UPS/Uninterruptible Power Supply
  • substrate

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Low thermal expansion zero alloy material LEX ZERO.

Low thermal expansion zero alloy material LEX ZERO.

A variety of low thermal expansion materials, including the ultimate "zero thermal expansion alloy Rex Zero," high-strength cast steel, and new vibration-damping steel, are available.

【Low Thermal Expansion Material】 - Ultimate Zero Thermal Expansion (LEX ZERO) - OK down to minus 50°C (LEX ZERO NEXT) - Space-Compatible (LEX-STAR) - High Rigidity Plus Low Thermal Expansion (LEX-35E+) 【High Strength Cast Steel Material】 (TNCM-α) 【New Vibration-Damping Cast Steel】 (ETA-BF1) Compatible with cast and forged products. Capable of manufacturing from small to super large items (from 10 grams to 15 tons), with quick response using block material in stock (400X400X150 mm), and can be cut to your desired size. Supports complex shapes, with high near-net shape capability for sand molds and lost-wax cast products. Test pieces for trial use are available upon request, please inquire. Surface treatments: Electroless Ni plating, black electroless Ni plating, black chrome plating, etc. It also features good machinability (ease of cutting) compared to super alloys.

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  • alloy
  • substrate

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