We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for substrate.
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substrate Product List and Ranking from 562 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  4. 4 JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  5. 5 共栄電資 Tokyo//Electronic Components and Semiconductors
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substrate Product ranking

Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. [Exhibition Report] We exhibited at NEPCON Japan 2026! 太洋テクノレックス 本社　和歌山
  2. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社　和歌山
  3. [Notice_26.2] Regarding the Publication of Our Articles - Related to Space Business - 太洋テクノレックス 本社　和歌山
  4. 4 High-strength alumina substrate for thin films JAPAN FINE CERAMICS CO., LTD. （JFC） Tokyo Sales Office
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrate Product List

781～810 item / All 1904 items

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[Demo Unit Rental] Control Panel 'Membrane Display'

[Demo Unit Rental] Control Panel 'Membrane Display'

Introducing an ultra-thin control panel that integrates everything: 7SEG LED, CPU, sensors, LCD, and more!

The "Membrane Display" we handle is a product that integrates original components into a thin panel of around 4mm. It supports multilayer circuit boards that allow for a slim design, as components can be mounted on both sides. Additionally, the thin 7-segment display allows for flexible size selection. Height adjustment of the mounted components is unnecessary, and the surface embossing and tact switches provide a clear operational feel and high durability. 【Features】 ■ Ultra-thin (standard 3.6mm, minimum 2.0mm) ■ Excellent switch with no uneven click sensation ■ High reliability (switch durability of 3 million cycles) ■ Waterproof specification equivalent to IP64, customers can "just stick it on" ■ No height adjustment needed for mounted components ■ Components can be mounted on both sides *【Demo units available for loan!】Please contact us through "Inquiries" if you would like to request one. *For more details, feel free to contact us.

  • Touch Panel
  • substrate

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High-frequency fluororesin FPC substrate

High-frequency fluororesin FPC substrate

Effective in millimeter wave bands such as 5G communication! Products with low transmission loss, low dielectric constant, and high flexibility.

The "High-Frequency Fluororesin FPC Substrate" manufactured by Sumitomo Electric Industries enables low-loss data transmission of high-frequency signals ranging from 20GHz to 100GHz. As a type of flexible substrate, it allows for wiring in tight spaces, contributing to the miniaturization and lightweight design of devices. When used with millimeter-wave planar antennas, it can achieve either antenna miniaturization or enhanced performance per antenna size. 【Features】 ■ Low Transmission Loss: Can be utilized as a wiring material that achieves low transmission loss in high-frequency signal transmission. ■ Thinness and Narrow Pitch: Achieves both thinness and narrow pitch, while offering high design flexibility, contributing to airflow within enclosures and high-density designs. ■ Excellent Gain: By routing antenna circuits on a fluororesin substrate, it can be utilized as an antenna with efficient space usage and excellent gain. *For more details, please download the PDF or feel free to contact us.

  • 高周波用フッ素樹脂製FPC基板2.jpg
  • Printed Circuit Board
  • substrate

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Cyclone-type soldering iron cleaner "Senpujin"

Cyclone-type soldering iron cleaner "Senpujin"

Usable without selecting the tip shape. Reduces deterioration of the tip without contact.

"Wash Wind Rapid" is a cyclone-type soldering iron cleaner that generates a vortex airflow through air blows from multiple directions, allowing for non-contact removal of dirt from the soldering tip. Even with repeated use, it consistently delivers stable cleaning power. It is maintenance-free with no consumable parts like cleaning brushes, and cleaning simply involves removing the accumulated solder debris from the drawer. 【Features】 ■ Non-contact design reduces deterioration of the soldering tip ■ Maintains cleanliness on-site and the shine of the soldering tip ■ Maintenance-free with no consumables like cleaning brushes ■ Extends the lifespan of the soldering tip ■ Minimal temperature variation of the soldering tip allows for quick transition to work ■ Reduces cleaning time *For more details, please download the PDF or feel free to contact us.

  • Solder
  • substrate

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Support for high-density build-up structures

Support for high-density build-up structures

We can accommodate high-density build-up structures, such as 4-layer full-stack prototypes!

Our company enables the mounting of narrow-pitch components through a high-density build-up structure. In the interlayer thick structure, the interlayer thickness is set to 100-120μm, achieving high insulation reliability. Additionally, we support mass production of three-tier full stacks and skip via structures. Please feel free to contact us when you need our services. 【Specifications Supported】 ■ Narrow pitch support ■ Thick copper foil specifications ■ Mixed IVH & LVH ■ High-frequency support An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Proposal for thermal management and fanless heat dissipation structure using copper coin printed circuit boards.

Proposal for thermal management and fanless heat dissipation structure using copper coin printed circuit boards.

Mass production of copper coin printed circuit boards is possible for high-speed, high-frequency applications and high multilayer substrates. The unique copper coin structure achieves high heat dissipation.

Our company is capable of providing copper coin (heat dissipation structure) wiring boards. With the advancement of high-performance 5G communication devices, managing the heat generated by high-speed, high-frequency components has become a challenge. Additionally, as devices become more compact, semiconductors and electronic components are mounted on substrates at high density, and a fanless structure that eliminates fans and heat sinks within the device is required for low power consumption. Copper coin printed circuit boards can achieve an advanced "heat dissipation structure" that efficiently dissipates the heat generated by electronic components within a limited area. *Copper coin: A material shaped into a cylindrical form, significantly improving the thermal conductivity of the substrate compared to thermal vias. 【Features】 <Development> - Realization of embedding copper coins directly beneath heat-generating components on high-layer-count substrates. - Ensuring high reliability by embedding cylindrical copper using a unique method that minimizes load. - Dramatic improvement in the thermal conductivity of the substrate due to the copper coin structure. - Independently developed equipment for embedding copper coins, flexibly adapting to various coin sizes. - Comprehensive support for thermal simulation, prototyping, and mass production. - Capability for fanless housing design to achieve space-saving and high-efficiency heat dissipation. - Significant improvement in heat dissipation when used in conjunction with thermal management components such as heat pipes and thermal conductive sheets.

  • Circuit board design and manufacturing
  • substrate

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Printed circuit boards (wiring boards) for space and defense equipment.

Printed circuit boards (wiring boards) for space and defense equipment.

We supply printed circuit boards for space and defense applications. The printed circuit boards that withstand harsh operating environments are a testament to the high reliability of our products.

OKI Circuit Technology Co., Ltd. is a manufacturer of printed circuit boards that primarily engages in the development, design, and manufacturing of printed wiring boards, electronic devices, and electronic components, and is part of the OKI Group (OKI Electric Industry Co., Ltd.). The company has obtained certification from the Ministry of Defense and the Japan Aerospace Exploration Agency (JAXA), achieving high quality and high reliability in printed circuit boards that can cater to the aerospace industry, earning a high reputation within the industry. Among the products created with our technology, the "flex-rigid board," which combines flexible printed circuits (FPC) with standard rigid boards, eliminates the need for connector space for connecting cables, achieving space-saving and lightweight designs. Furthermore, it provides high reliability by eliminating concerns about connector connections due to vibrations, contributing to the development of the aerospace industry. Please feel free to consult with us. Our article has been published in MONOist. [Reducing a cumulative 480 hours over three years: How we advanced smart manufacturing in a low-volume, high-mix factory] https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html

  • Printed Circuit Board
  • substrate

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Millimeter-wave radar compatible printed circuit board (substrate)

Millimeter-wave radar compatible printed circuit board (substrate)

We would like to propose a printed circuit board equipped with a millimeter-wave antenna!

Our company will realize products that support the millimeter wave frequency range of 30 to 300 GHz. Do you have any concerns such as "I would like to consider next-generation millimeter wave radar-equipped devices"? We will support you in solving challenges for product commercialization. We will make proposals tailored to your needs, such as the adoption of new high-frequency materials and joint evaluations. [We solve the following concerns] ■ I would like to consider substrates for millimeter wave radar applications. ■ I would like to consider substrates for next-generation high-frequency applications. ■ I want to reduce transmission loss and delay time. ■ I want to accurately match characteristic impedance. ■ I want to reduce the cost of high-speed, high-frequency compatible substrates. An article about our company has been published in MONOist. [How we advanced smart manufacturing in a small-lot, diverse-product factory to reduce cumulative hours by 480 over three years] https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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High-frequency compatible printed circuit board [Basic knowledge materials on printed circuit boards provided]

High-frequency compatible printed circuit board [Basic knowledge materials on printed circuit boards provided]

Supports high frequency and millimeter wave frequency bands from 30 to 300 GHz! "I want to consider high frequency printed circuit boards, but it's difficult." We will solve such problems!

Our company will realize products that support high-frequency and millimeter-wave frequency bands from 30 to 300 GHz. Do you have any concerns such as "I want to consider next-generation high-frequency printed circuit boards, but it's difficult to realize"? We will support you in solving challenges towards product commercialization. We will provide proposals tailored to your needs, such as adopting new high-frequency materials, evaluating frequency characteristics, and assessing environmental resistance together. [We solve the following concerns] ■ I want to consider next-generation high-frequency application substrates ■ I want to consider millimeter-wave radar application substrates ■ I want to reduce transmission loss and delay time ■ I want to accurately match characteristic impedance ■ I want to keep costs down for high-speed high-frequency compatible substrates ■ I want to know about printed circuit boards for the fifth-generation mobile communication system (5G) ■ I want to learn about the latest lamination technology and pattern design ■ I want to know about selecting suitable printed circuit board materials, etc. *For more details, please refer to the PDF document, or feel free to contact us if you wish to have a technical consultation.

  • Circuit board design and manufacturing
  • substrate

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Things You Can't Ask Now! Basic Knowledge of Printed Circuit Boards

Things You Can't Ask Now! Basic Knowledge of Printed Circuit Boards

OKI, which handles various printed circuit boards, provides a thorough explanation of the basics of printed circuit boards (wiring boards)! [Free handbook available now]

OKI, which handles custom specifications of printed circuit boards (PCBs) with various functions such as high multi-layering, heat dissipation, and high-frequency compatibility, will explain the basics of printed circuit boards. From the basics like "What is a printed circuit board?" to accommodating high current, high voltage, and high heat dissipation specifications, as well as supporting high-speed and large-capacity transmission, this guidebook is filled with valuable knowledge that we encourage you to read. [Contents (partial)] ■ What is a printed circuit board? ■ Types of printed circuit boards ■ Support for high-speed and large-capacity transmission ■ Support for high-density build-up structures, etc. *For more details, please download the PDF or contact us.

  • Circuit board design and manufacturing
  • substrate

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Simulation case study

Simulation case study

Applied simulation to third-party designed boards! We redesigned it from a three-layer to a one-layer build-up.

We would like to introduce a case where we achieved cost reduction and shortened delivery time by converting a 3-layer build-up to a single layer. By applying simulation to a competitor's designed circuit board, we redesigned it in-house from a 3-layer to a single-layer build-up without compromising electrical and noise characteristics. Additionally, in a case where we utilized our small-diameter drilling technology to reduce crosstalk, the BGA extraction via section experienced reduced crosstalk. We proposed in advance that the coupling in the Z-axis direction between vias, which occurs in high-thickness boards, could be reduced through small-diameter φ0.15 drilling. [Case Studies] ■ Cost reduction and shortened delivery time by converting a 3-layer build-up to a single layer ■ Utilization of our small-diameter drilling technology to reduce crosstalk *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Simulation-based substrate design

Simulation-based substrate design

If you provide the required specifications, we will propose suitable board specifications and designs.

We will solve various issues related to printed circuit boards through simulation. We provide one-stop solutions for printed circuit boards that balance performance and cost. If you provide us with your required specifications, we can propose suitable board specifications and designs, leveraging our extensive background data and manufacturing technology unique to PCB manufacturers to suggest optimal characteristics. [Issues] - Non-functional, distorted waveforms, do not meet standards - Unstable operation under high load - Time-consuming cause investigation and countermeasures - Do not meet EMC standards *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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High board thickness and narrow pitch printed circuit board manufacturing technology.

High board thickness and narrow pitch printed circuit board manufacturing technology.

Applicable to semiconductor tester substrates! Achieving narrow pitch printed circuit boards in even higher multilayer and thicker board areas.

Based on the FITT (Fine pitch Through via Technology) method, we are promoting high-precision technology to achieve narrow pitch printed circuit boards in even higher multilayer and thicker board areas. With a board thickness of 7.65mm and a φ0.20 drill through processing, we can accommodate 0.50mm pitch BGA. This technology can be applied to semiconductor tester boards such as load boards, socket boards, and probe cards. 【Features】 ■ Accommodates 0.50mm pitch BGA with a board thickness of 7.65mm and φ0.20 drill through processing - Up to 76 layers ■ Accommodates 0.25mm pitch BGA with ultra-small diameter φ0.10 drill processing - Up to 26 layers with sequential structure possible ■ Achieves narrow pitch BGA compatible boards in even higher multilayer and thicker board areas *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Flex-rigid printed circuit board

Flex-rigid printed circuit board

Contributing to miniaturization and high density! No mold costs → We can respond at a low cost through router processing.

You can eliminate wiring constraints with OKI's flex-rigid printed circuit boards. We solve customer issues such as "I can't find space for connectors to connect cables" and "I want to eliminate variations in contact resistance due to connectors." Our products can be used for miniaturization and high density without connectors, as well as for reducing cable connection errors and wiring labor. 【Features】 ■ Proposal for flex-rigid printed circuit boards ■ Suggestion to adopt rigid structure into the inner layer of flexible material ■ No mold costs required → Supported by router processing (cost-effective) ■ Proposal for multilayer structure of flexible layers *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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High current, high voltage, and high heat dissipation compatible printed circuit board.

High current, high voltage, and high heat dissipation compatible printed circuit board.

For thick copper foil circuit boards, metal core circuit boards, and metal base circuit boards! Pre-shipment inspection possible with dielectric strength testing.

This is an introduction to printed circuit boards designed to solve issues related to high current, high voltage, and heat dissipation. They can be used for thick copper foil boards, metal core boards, and metal base boards. We can conduct high current (up to 400A) conduction tests in-house. 【Features】 ■ Pre-shipment inspection possible with dielectric strength testing ■ Multi-layer formation with conductor thickness up to 500μm ■ Production of products with 2.5mm metal is possible ■ In-house high current (up to 400A) conduction testing available *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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High-end EMS "Advanced M&EMS" *Exhibited at Nepcon

High-end EMS "Advanced M&EMS" *Exhibited at Nepcon

Presentation of Case Studies for Problem Solving: One-stop support from design to maintenance! We respond to various needs such as entering new markets and multilayering of circuit boards.

Our company offers a design and production outsourcing service called 'Advanced M&EMS' for information and communication equipment, medical devices, industrial equipment, and measuring instruments. We can support everything from design to procurement, implementation, prototyping, equipment assembly, and maintenance. We can meet various needs, including entry into the medical device market, small-batch production of diverse products, and miniaturization of multilayer ceramic capacitors. ★ We will be exhibiting at the "36th NEPCON Japan" held from January 19, 2022! 【Overview of the "36th NEPCON Japan"】 Dates: January 19 (Wednesday) to 21 (Friday), 2022 Venue: Tokyo Big Sight Booth Number: East Hall 1, 9-22 We will showcase many examples of our technology and applications that contribute to solving manufacturing challenges. Please feel free to visit our booth. *We are currently offering a collection of case studies on problem-solving. For more details, please check the "PDF Download."

  • others
  • substrate

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DSP Multi-Modem Board

DSP Multi-Modem Board

Leave the development of the modem to us! We will develop products that comply with international standards and recommendations.

Features of the DSP Multi-Modem Board This is a modulation and demodulation board for data transmission using dedicated voice bandwidth lines. The modulation methods comply with the following four types: - International Standard Recommendation ITU T V.29 9600bps, 7200bps, 4800bps - International Standard Recommendation ITU T V.27bis 4800bps, 2400bps - International Standard Recommendation ITU T V.26, V.26bis 2400bps, 1200bps - International Standard Recommendation ITU T V.23 1200bps, 600bps *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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OKI-EMS provides comprehensive manufacturing services in the high-end sector.

OKI-EMS provides comprehensive manufacturing services in the high-end sector.

From design and development to manufacturing, evaluation, and certification, we support our customers' challenges with OKI-EMS's "Comprehensive Manufacturing Services."

We provide design and production contract services in high-end fields such as medical devices, aerospace, information and communication, industry, and measurement under the name 'Advanced M&EMS'. We will be exhibiting at the "22nd Printed Circuit Board EXPO" held from January 20 (Wednesday) to 22 (Friday), 2021! 【Overview of the "22nd Printed Circuit Board EXPO"】 Date: January 20 (Wednesday) to 22 (Friday), 2021 Venue: Tokyo Big Sight, West Hall 3 (4th floor of the West Exhibition Building), Booth No. W22-38 * A virtual (online) booth will also be prepared. We will showcase many examples of our technology and applications that contribute to solving manufacturing challenges. Please feel free to visit our booth.

  • EMS
  • substrate

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Introduction to printed circuit boards.

Introduction to printed circuit boards.

We propose highly reliable and high-performance circuit boards that support a wide range of fields, including information communication and industry!

A "printed circuit board" refers to a substrate on which a pattern (electronic circuit) called a pattern is printed on the surface of an insulating board. Our company proposes high-reliability and high-performance substrates tailored to customer requirements, supporting a wide range of fields such as "information and communication," "semiconductor-related," "aerospace," and "industrial." We offer a rich lineup of products, including flexible substrates that achieve space-saving through the reduction of supporting materials, such as "self-supporting sliding FPC," "high-flex FPC," and "high-speed transmission FPC," as well as innovative products with self-supporting and high-flex capabilities. 【Features】 - Lamination, plating, and patterning technologies that support the manufacturing of characteristic impedance-controlled substrates - In-house developed order management systems and design/manufacturing tools that accommodate single prototype and development needs, as well as small to medium volume production of various types - Highly flexible and sliding flexible substrates *For more details, please refer to the external link page or feel free to contact us.

  • Wiring materials
  • substrate

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Industrial control equipment

Industrial control equipment

I can talk and listen as much as you want. It's okay if you don't have knowledge of electronic circuits.

Our company is engaged in the design, manufacturing, and sales of industrial control equipment. We respond to customer needs with services such as control circuit board design, component procurement, assembly, and wiring of control devices. By maintaining open communication, we align closely with our customers' wishes. We never compromise and are characterized by our perseverance in our efforts. Additionally, we will inquire about the specifications of the desired product and provide better proposals by balancing cost considerations. Please feel free to consult us regarding short delivery times. 【Features】 ■ Thorough listening and collaborative creation ■ Hassle-free with consistent manufacturing ■ Exceptionally low defect rate *For more details, please download the PDF or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Sales of calcium (Ca) thin films, film formation services.

Sales of calcium (Ca) thin films, film formation services.

Using calcium thin film substrates, evaluate the barrier performance of flexible substrates and adhesives, as well as the outgassing of dam and fill materials.

Our company manufactures and sells calcium (Ca) thin film substrates that can evaluate barrier (sealing) performance. These Ca thin film substrates are suitable as substrates for evaluating water vapor transmission rate (WVTR, calcium corrosion method) as specified by JIS and other standards. WVTR can be calculated by determining the area of the oxidatively degraded (translucent) region of the Ca thin film with precisely defined thickness, estimating the amount of oxygen and moisture that reacted with calcium from the remaining film thickness and Ca density. This value allows for accurate comparative (quantitative) evaluation between samples. The thickness of the Ca film on the substrate is strictly managed by regularly checking the deposition and film formation conditions. Additionally, during Ca film thickness measurement, aluminum with good coverage and reproducibility is deposited on the thin film to prevent swelling of the Ca film, allowing for accurate thickness measurement and calculation of deposition conditions. 【Features】 ■ Highly reactive to moisture and oxygen, with good sensitivity ■ Much more cost-effective than using devices like organic EL as sensors ■ Changes before and after oxidation (from metallic luster to translucency) are visually easy to understand ■ Safer than other metals and easy to handle after use *For more details, please download the PDF or feel free to contact us.

  • Circuit board design and manufacturing
  • Evaluation Board
  • substrate

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IoT sensor solution

IoT sensor solution

Easy and simple! You can build an IoT sensor environment immediately without any development needed.

We would like to introduce Kaga FEI Corporation's IoT sensor solution, "Sensing Evaluate Solution." This product combines a "BLE evaluation kit/board" with commercially available sensors, allowing you to use it without any development needed. It provides "three types of firmware" that transmit sensor values via beacon and a smartphone app, enabling you to quickly establish an IoT sensor environment. Please feel free to contact us if you have any inquiries. 【3 Steps to Build an IoT Sensor】 Step 1. Connect the board Step 2. Write the software Step 3. Communicate with the smartphone app *For more details, please refer to the PDF document or feel free to contact us.

  • Other machine elements
  • substrate

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Printed circuit board

Printed circuit board

Reliable, high processing capability, unique processing technology. We continue to challenge new manufacturing technologies.

We handle various prototypes, manufacturing, and mass production of printed circuit boards. With reliable and high-capacity processing, and unique processing technologies, we specialize in flexible circuit boards, acrylic and copper plates, router processing, laser processing, press processing, V-cut processing, and various other services. We strive for reliable and fast processing, so please feel free to contact us for inquiries and quotes, especially if you are in a hurry. 【Business Contents】 ■ Prototyping and manufacturing of flexible circuit boards ■ Processing of special materials such as acrylic and copper plates ■ Creation of molds specifically for aluminum substrates ■ Support for various plating on printed circuit boards ■ Production of dip jigs for soldering, etc. *For more details, please download the PDF or feel free to contact us.

  • Processing Contract
  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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Automotive LED light/power supply board

Automotive LED light/power supply board

This is a circuit board for car light lamps, so materials with good heat dissipation are required. Therefore, it is designed as a double-sided board with an aluminum base.

Stratum 2L (with single layer metal board) Board thickness 1.8 mm Base material FR-4 + MCPCB (aluminum base) Copper thickness 2 Oz Surface treatment OSP

  • Other electronic parts
  • substrate

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Overheated steam (facial device)

Overheated steam (facial device)

Production of control circuit boards for beauty devices.

We have manufactured a control board for a facial device that uses superheated steam.

  • Other process controls
  • substrate

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Home appliance circuit board regeneration service (parts replacement, circuit board cleaning, etc.)

Home appliance circuit board regeneration service (parts replacement, circuit board cleaning, etc.)

We contribute to extending the life of products and reducing waste through our substrate recycling business.

Our company offers a "PCB Reclamation Service" centered around home appliances, based on the technology and know-how cultivated through many years in the circuit board business. By providing services such as the replacement of faulty components and cleaning, we contribute to extending the life of products, reducing waste, and lowering environmental impact. For more details, please visit our website. "PCB Reclamation Service for Home Appliances" https://www.johnan.com/dms/mounting/pcb/ If you have any concerns regarding our PCB reclamation service for home appliances, please feel free to contact us. Through our manufacturing services, we will continue to contribute to solving various challenges for our customers.

  • Calibration and repair
  • substrate

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Appearance Inspection Table "Built-in Transmitted Light Illumination" PE Porous Chuck

Appearance Inspection Table "Built-in Transmitted Light Illumination" PE Porous Chuck

A porous chuck that can softly hold large workpieces of 500×500mm! Compatible with transparent light AOI (Automatic Optical Inspection)!

The "Embedded Type Transparent Light Illumination PE Porous Chuck" uses soft polyethylene porous material to gently chuck FPCs, wafers, LF, glass substrates, etc., and performs AOI with embedded transparent light illumination. 【Features】 ■ Uses translucent ultra-high molecular weight polyethylene for the porous material ■ Reduces introduction costs and equipment weight compared to ceramic and metal materials ■ When clogging occurs in the porous material, it can be replaced at a low cost ■ When using porous material with an average air pore diameter of less than 5μm, partial adsorption is possible *For more details, please download the PDF materials from <Download Catalog>.

  • Other lighting equipment
  • substrate

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Connector for board-to-board (FPC) connections | FB35C series

Connector for board-to-board (FPC) connections | FB35C series

Connector with a height of 0.7mm, 0.35mm pitch, compact, low profile, and narrow pitch.

The FB35C series connector is designed for connecting PCBs to FPCs with a 0.35mm pitch, a mating height of 0.7mm, and a depth of 1.9mm. It adopts a metal cap method with a metal part integrally molded at the plug end, enhancing strength against damage in case of misalignment, resulting in a robust structure. 【Features】 ■ The adoption of the metal cap method achieves a robust structure. ■ The tabs can carry current up to 3A as power contacts, allowing for a reduction in the number of contact pins and contributing to space-saving. ■ It features a highly reliable two-point contact structure. ■ A recess is provided in the plug contact to improve the click feel and extraction force during insertion. *For more details, please refer to the PDF materials or feel free to contact us.

  • Automotive Connectors
  • substrate

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Connector for board-to-board (FPC) connection | FB35K series

Connector for board-to-board (FPC) connection | FB35K series

Connector with a height of 0.6mm, 0.35mm pitch, compact, low profile, and narrow pitch.

The FB35K series connector is designed for board-to-FPC connections with a 0.35mm pitch, a mating height of 0.6mm, and a depth of 1.8mm. It adopts a metal cap method where the metal is integrally molded at the plug end, enhancing strength against damage in case of misalignment, resulting in a robust structure. 【Features】 ■ The adoption of the metal cap method achieves a robust structure. ■ The tabs can carry up to 3A as power contacts, allowing for a reduction in the number of contact pins and contributing to space-saving. ■ It features a highly reliable two-point contact structure. ■ A recess is provided in the plug contact to improve the click feel and extraction force during insertion. *For more details, please refer to the PDF materials or feel free to contact us.

  • Automotive Connectors
  • substrate

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Connector for board-to-board (FPC) connection | FB35L series

Connector for board-to-board (FPC) connection | FB35L series

Connector with a height of 0.7mm, 0.35mm pitch, compact, low profile, and narrow pitch.

The FB35L series connector is designed for board-to-FPC connections with a 0.35mm pitch, a mating height of 0.7mm, and a depth of 1.9mm. It employs a metal cap method where the metal is integrally molded at the plug end, enhancing strength against damage in case of misalignment, resulting in a robust structure. Additionally, metal is placed in the center of the receptacle connector to further improve strength. 【Features】 - The adoption of the metal cap method achieves a robust structure. - The tabs can carry up to 3A as power contacts, allowing for a reduction in the number of contact pins and contributing to space-saving. - It features a highly reliable two-point contact structure. - A recess is provided in the plug contact to improve the click feel and extraction force during insertion. *For more details, please refer to the PDF document or feel free to contact us.*

  • Automotive Connectors
  • substrate

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Connector for board-to-board (FPC) connection | FB35S series

Connector for board-to-board (FPC) connection | FB35S series

Connector with a height of 0.7mm, 0.35mm pitch, compact, low profile, and narrow pitch.

The FB35S series connector is a connector for connecting a board to an FPC, with a short length of 2.1mm, which is 0.2mm shorter than the FB35 receptacle connector, a pitch of 0.35mm, and a mating height of 0.7mm. Like the FB35 series connector, it features power contacts capable of carrying a current of 4A through the tabs, contributing to the miniaturization and slimness of devices. 【Features】 ■ Receptacle connector short length (tail to tail) 2.1mm ■ The tabs can carry up to 4A as power contacts. When carrying high current, space-saving can be achieved by reducing the number of contact pins. ■ The receptacle tabs have an insert structure that surrounds the outer circumference, reducing damage during misalignment insertion of the connector. ■ A recessed structure has been added to the plug contacts to improve the click feel during insertion and the extraction force. *For more details, please refer to the PDF document or feel free to contact us.

  • Automotive Connectors
  • substrate

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