Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.
391～405 item / All 673 items
This substrate is laminated and bonded with an insulating sheet of high thermal conductivity between an aluminum plate and copper foil.
Using this substrate is suitable for applications of printed circuit boards that require heat dissipation due to high current handling and the heat generated by electronic components.
Achieving lighter weight and higher heat dissipation! Lightweight conductor high heat dissipation substrate using aluminum.
The "L&H Board (Light body and high Heat radiation Board)" is a substrate that achieves lightweight and high heat dissipation by using aluminum. By employing metal conductors, direct soldering for component mounting is possible. It is suitable for applications such as high-brightness LED mounting substrates, automotive substrates (HCV/EV vehicle power substrates), high-current power substrates, various inverter substrates, high-frequency substrates, and solar power generation substrates. 【Features】 - Ensures strong adhesion through proprietary technology - Thickness of core aluminum material and surface aluminum material can be changed - Insulation layers can use both epoxy resin and special resin - Custom manufacturing available according to your needs For more details, please contact us or download the catalog.
It is possible to form thick film patterns by screen printing on ceramic substrates and thin film patterns using photolithography.
As the main methods of metallization processing, we can accommodate thick film pattern formation through screen printing, and thin film pattern formation through vacuum deposition, plating, photolithography, and etching. In addition to pattern formation, we can also accommodate VIA filling, resistor formation, and through-hole formation. We will propose the optimal metallization processing to achieve the desired functions and performance. <Processing Specification Examples> - Thin Film Metallization Processing Accuracy: Line/Space = 30μm/30μm Processing Method: Vacuum deposition (sputtering or evaporation) + plating + photolithography (resist formation, exposure, development) + etching Other Processing: Through-hole formation (Φ0.1mm and above) / resistor formation - Thick Film Metallization Processing Accuracy: Line/Space = 100μm/100μm Processing Method: Screen printing Other Processing: VIA filling / resistor formation *For more details, please refer to the catalog or website, or feel free to contact us.
Support for a variety of flexible substrates from prototyping to mass production using the REEL to REEL method.
● Mass production of RtoR flexible substrates is possible. ● All processing equipment is installed in a Class 1,000 cleanroom. ● A coverlay method is adopted for surface protection of flexible substrates. ● We have electroplating equipment for Ni (nickel)/Au (gold) and can provide specifications tailored to customer needs. ● Inner lead structures can be formed for connection points. ● All products are quality assured through automatic visual inspection and electrical testing. ● We possess a variety of analytical equipment for quality verification and measurement/length measurement at each process. ● We provide flexible substrates compliant with RoHS directives and made from flame-retardant materials equivalent to 94VTM-0.
We manufacture, sell, and support medical devices for basic research. FPC
- Research and development in the field of biomedical engineering - Design and manufacturing of customized products for research - Design and manufacturing of wearable sensor components for clothing (monopolar electrodes/ECoG electrodes/EEG electrodes) - Formation of various metal thin film circuits - Parylene coating We design and manufacture sensors and electrodes necessary for physiological experiments on experimental animals, such as ECoG electrodes (for research use). We develop medical devices required in clinical research core hospitals and laboratories. FPC
![[PCB Design and Product Design] FPC and Flexible Circuit Boards](https://image.mono.ipros.com/public/product/image/51a/2000509961/IPROS88069959853256374559.jpeg?w=280&h=280)
We will provide design proposals that consider product requirements and mass production processes from the prototype stage! FPC
- Software design and embedded software development - Hardware development and electronic circuit design - Printed circuit board pattern design (digital/analog/high frequency) - 3D CG design, design creation, resin, metal cutting - Product graphic design - Mechanical design (enclosures/jigs/demo units) FPC
It is a flexible substrate that allows for a highly reliable connection.
By partially removing the base film, it is possible to form a conductor. By narrowing the pattern width, reliable connections to the opposing circuit or device can be achieved, similar to wire bonding. It is used in areas that require high density and high reliability, such as probes.
This is a flexible substrate, FPC, and flexible board that is effective for wiring related to large-scale devices. FPC.
Adopted as an alternative to cables, we propose a reduction in assembly costs (improved wiring efficiency). It is used in display devices and industrial robots. FPC.
Ultra-thin, high transmittance, very transparent quartz glass optical substrate.
Quartz glass optical substrate Wafer: Maximum 6 Inch diameter 300mm, thickness: 0.5mm and above Square: Within 300*300mm, thickness: 0.5mm and above Flatness: 0.01mm We will challenge at a low cost.
Galaepo substrate and composite are standard. Other special materials such as BT resin are also always in stock.
We standardly use FR-4 (glass epoxy substrate) and CEM-3 (composite), but we also keep special materials such as BT resin in stock. We offer a wide range of thicknesses from 0.06 mm to 3.2 mm. We can ship in as little as 1 business day. For more details, please contact us or refer to our catalog.
