substrate Product List and Ranking from 31 Manufacturers, Suppliers and Companies

Last Updated：Aug 20, 2025 Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated：Aug 20, 2025 Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.

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三和電子サーキット Osaka//Electronic Components and Semiconductors
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5 松和産業 Mie//Electronic Components and Semiconductors 本社

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substrate Product ranking

Last Updated：Aug 20, 2025 Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.

substrate Product List

406～420 item / All 673 items

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Printed Circuit Board Manufacturing - Multilayer Through-Hole Board

Supports layers from 4 to 24. Also compatible with special substrates such as through-hole resin filling.

We can accommodate from 4 layers to 24 layers. Additionally, we can handle special substrates such as impedance control and through-hole resin filling. We operate three vacuum press machines, allowing for quick turnaround even in mass production. We can ship in as little as 2 working days. For more details, please contact us or refer to our catalog.

Company：ケイツー
Price：Other

Printed Circuit Board

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Printed circuit board manufacturing - single-sided flexible board

By using thin materials, it is possible to create a flexible substrate with a total thickness of 50μ that is the thinnest.

Single-sided flexible printed circuit boards are available in various material thicknesses. By using thin materials, we can achieve flexible printed circuit boards with a total thickness of just 50μ. We can also provide fine pattern substrates using thin copper foil materials, and we can accommodate halogen-free options as well. For more details, please contact us or refer to our catalog.

Company：ケイツー
Price：Other

Printed Circuit Board

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Printed circuit board manufacturing - multilayer flexible circuit board

Manufacturing is possible from 3 layers to 8 layers. Thin materials and thin copper foil are used to ensure bendability.

We can manufacture from 3 layers to 8 layers. Typically, with multilayer flexible circuits, the more layers there are, the thicker the board becomes, which compromises the bendability that is a characteristic of flexible substrates. However, by using thin materials and thin copper foil, we ensure bendability. For more details, please contact us or refer to our catalog.

Company：ケイツー
Price：Other

Printed Circuit Board

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Printed Circuit Board Manufacturing - Rigid-Flex Boards

Production is possible from 2 layers to 8 layers. Prototyping of rigid-flex PCBs is available with short lead times and low prices.

We can produce from 2 to 8 layers. When it comes to rigid-flex PCBs, it often requires creating molds, which can be very expensive even for prototypes, and the production time can be significantly long. At K2 Corporation, we combine our experience as a rigid PCB manufacturer with our experience as a flexible PCB manufacturer to offer quick turnaround and low-cost prototypes of rigid-flex PCBs. We can flexibly accommodate complex shapes and special layer configurations, so please feel free to consult with us. For more details, please contact us or refer to our catalog.

Company：ケイツー
Price：Other

Printed Circuit Board

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Special printed circuit board manufacturing IVH boards

A substrate that connects only the necessary layers without penetrating the holes in a multilayer substrate.

This is a substrate that connects only the necessary layers without penetrating the holes in a multilayer board. As the number of layers in printed circuit boards has increased, the demand for this has also grown. It can be manufactured using either blind via holes that connect the outer layers to the inner layers or inner vias that embed through holes in the inner layers. Additionally, it is compatible not only with standard multilayer boards but also with multilayer flexible boards and rigid-flex boards. For more details, please contact us or refer to the catalog.

Company：ケイツー
Price：Other

Printed Circuit Board

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A lineup of "Rework Systems" that covers everything from large substrates to extremely small components.

【Parts Repair/Repair/Reimplementation】Rework System "Covers all SMT components with one machine," "Supports large PCBs," "Easy setup," and other diverse features.

For rework systems, choose Denon equipment. Our company offers a range of "rework systems" for SMT components such as BGA, CSP, QFN, connectors, and sockets. We have a variety of models equipped with diverse functions that can cover all SMT components with a single unit, products that support ultra-small components (0402/0603 size), and products that can heat evenly from both the top and bottom with high-efficiency heaters. We support QFN, CSP, BGA, SMT, and 0402! We are currently offering a free product catalog for rework equipment. 【Product Lineup】 ■ "RD-500V" that covers various SMT components with one unit ■ "RD-500SV" that allows advanced profile settings with just one click ■ "RD-500 III" that supports large boards of 500×600mm ■ "RD-500S III" that uses a high-efficiency high-power heater 【Applications】 - Tablets - Computer boards - Mobile phones - Smartphones - Wearables - BGA, CSP, POP, QFN, etc. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

Company：デンオン機器
Price：Other

Circuit board processing machine
Other processing machines

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Current waveform detection board

The current waveform detection board is a board that converts three-phase current waveforms into voltage waveforms.

You can convert a maximum current waveform of 15A (RMS) into a voltage waveform and monitor it using an oscilloscope or similar device. It can be used as a simple alternative to a current probe. It is ideal for measuring motor current waveforms.

Company：テクノロジーサービス
Price：10,000 yen-100,000 yen

oscilloscope
Testing Equipment and Devices
Converters and Transducers

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Package printed circuit board (PCB) / Chip-on-Board (COB)

We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology.

At Sato-sen Co., Ltd., we offer optimal heat dissipation technology through our extensive experience in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology. Regarding high brightness, the use of LED-specific white substrates and solder resist improves reflectivity and reduces discoloration caused by thermal degradation during assembly and use. We have a lineup that includes "COB for optical communication," "package printed circuit boards," and "ultra-thin multilayer printed circuit boards." *For more details, please contact us or download the catalog.*

Company：サトーセン
Price：Other

Printed Circuit Board

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Package printed circuit board

We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology.

At Sato-Sen Co., Ltd., we propose optimal heat dissipation technologies through our extensive experience in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology. 【Necessary Technical Elements】 ○ Selection of package materials that reduce warping ○ High-density circuit formation technology with L/S = 25/25μm ○ Surface treatment technology with high connection reliability ○ Film solder resist method to improve yield in C4 mounting * Detailed information such as "specifications" is available in the catalog. * For more details, please contact us or download the catalog.

Company：サトーセン
Price：Other

Printed Circuit Board

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High thermal conductivity printed circuit board

We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating techniques.

At Sato-Sen Co., Ltd., we offer optimal heat dissipation technology through our extensive expertise in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating techniques. A "high heat dissipation printed circuit board" is a board characterized by its ability to dissipate heat when mounted with components that generate significant amounts of heat. 【Necessary Technical Elements】 ○ Proposals for material selection and circuit design suitable for heat dissipation ○ Proposals for heat dissipation structures applicable to a wide variety of uses * Detailed information such as "specifications" is available in our catalog. * For more information, please contact us or download the catalog.

Company：サトーセン
Price：Other

Printed Circuit Board

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Paper substrate *Circuit formed with silver paste

Using high heat-resistant paper, a foldable/flexible paper substrate! Suitable for applications such as disposable uses!

We would like to introduce the "Paper Substrate" handled by Sato-Sen Co., Ltd. It uses a special paper with high heat resistance and can be bent/folded. The line spacing is 200/200, and circuits are formed using silver paste. It offers good cost performance and is suitable for disposable applications. Please feel free to contact us when you need it. 【Features】 - Uses a special paper with high heat resistance - Can be bent/folded - Line spacing is 200/200 - Circuits are formed using silver paste - Good cost performance *For more details, please refer to the PDF document or feel free to contact us.