ハイテック・システムズ List of Products and Services

Our company is engaged in the sale of equipment, primarily focusing on semiconductor and FPD manufacturing equipment. This time, we would like to introduce our proven services: "Sales of Used Parts" and "Refurbishment Engineering." 【Sales of Used Parts】 - We have a stock of approximately 80,000 parts (display devices, vacuum, drive, and control system parts, ancillary equipment, pumps, measuring instruments, etc.) - Same-day shipping is possible at the earliest - We can also provide discontinued and new parts - We can accommodate special orders from overseas 【Refurbishment Engineering】 - We handle the removal of byproducts, extending the life of equipment, overhauls, and cleanups - We can accept requests for multiple manufacturers in a one-stop manner - We achieve low prices and cost reductions <We will exhibit at SEMICON Japan 2023> Dates: December 13 (Wed) to December 15 (Fri), 10:00 AM to 5:00 PM Venue: Tokyo Big Sight Our Booth: Front-end Zone, East Hall 5 (Booth Number: 5147) *Please download the materials to view the details of our services.

• Other semiconductor manufacturing equipment

We provide a device for failure analysis adapted for the packaging of advanced IC and other devices. Our unique new plasma technology, MIP (Microwave Induced Plasma), uses O2 (oxygen) plasma to remove the packaging. Additionally, the device can automatically perform a series of processes including etching, cleaning, and drying within a single unit. 【Features】 ■ Microwave Induced Plasma ■ O2 Plasma ■ Atmospheric Pressure Process ■ Fully Automatic Process *For more details, please refer to the PDF document or feel free to contact us.

• Etching Equipment
• Ultrasonic Cleaner
• Drying Equipment

"Magma EFI HiRes" is a testing device for failure analysis. Equipped with a superconducting quantum interference device (SQUID), it can detect any static defects in various devices with extremely high sensitivity. It has software that allows for the identification of defect locations in three-dimensional structures by tracing the current path from the sample surface. 【Features】 ■ Equipped with a superconducting quantum interference device (SQUID), it can detect any static defects in various devices with extremely high sensitivity. ■ Includes software that enables the identification of defect locations in three-dimensional structures by tracing the current path from the sample surface. *For more details, please refer to the PDF document or feel free to contact us.

• Magnetic field analysis/electromagnetic wave analysis

"Ion Energy Spectroscopy (IES)" is an ion energy spectroscopic method. It provides a diagnostic tool for in-situ real-time process monitoring for PLD/PED systems. High-quality thin film and interface information can be obtained from the energy theory of lasers using a plasma plume. 【Features】 ■ It is possible to obtain high-quality thin film and interface information from the energy theory of lasers using a plasma plume. *For more details, please refer to the PDF document or feel free to contact us.

• Spectroscopic Analysis Equipment

"Low Angle X-ray Spectroscopy (LAXS)" is a low-angle X-ray spectroscopy method. It provides a diagnostic tool for in-situ real-time process monitoring for PLD/PED systems. It allows for real-time information on thin film composition as a complementary tool to RHEED. 【Features】 ■ It is possible to obtain real-time information on thin film composition as a complementary tool to RHEED. *For more details, please refer to the PDF document or feel free to contact us.

• X-ray fluorescence analyzer

"High-Pressure Reflection High-Energy Electron Diffraction (RHEED)" is high-pressure reflection high-energy electron diffraction. It provides a diagnostic tool for real-time in-situ process monitoring for PLD/PED systems. It adjusts thin film growth based on structural data from intensity and diffraction. 【Features】 ■ Adjusts thin film growth based on structural data from intensity and diffraction. *For more details, please refer to the PDF document or feel free to contact us.

• Other energy equipment

The "Pioneer 180 PED System" is a PED (Pulsed Electron Deposition) device that, like PLD, enables the formation of thin films with complex physical properties for various devices using the pulsed electron deposition method. With a high-energy pulsed electron beam (pulse width of 80-100 ns, <1000A, 15kV), it is capable of rapidly evaporating the target material, allowing for the deposition of all solid materials. The substrate size can accommodate diameters from 10mm to 2 inches, and the substrate can be heated up to 850°C using radiant heating. 【Features】 ■ The pulsed electron deposition method allows for the formation of thin films with complex physical properties for various devices, similar to PLD. ■ The high-energy pulsed electron beam (pulse width of 80-100 ns, <1000A, 15kV) enables rapid evaporation of the target material, allowing for the deposition of all solid materials. *For more details, please refer to the PDF document or feel free to contact us.

• Heating device

The "Pioneer 120 PLD System" is a PLD (Pulsed Laser Deposition) device. It is a standard device that supports substrate sizes of 1 inch and 2 inches in diameter, and it can heat substrates up to 950°C using a conductive heater. Additionally, it can quickly evaporate the desired material using a pulsed laser (with a pulse width of less than 20 ns), allowing for the formation of thin films while maintaining their composition. 【Features】 ■ PLD (Pulsed Laser Deposition) - Capable of forming versatile thin films through pulsed laser deposition. ■ Pulsed Laser (with a pulse width of less than 20 ns) - Quickly evaporates the desired material, enabling the formation of thin films while maintaining their composition. *For more details, please refer to the PDF document or feel free to contact us.

• Heating device

The "EVAD Series" is a CVD and PECVD horizontal furnace device capable of synthesizing and forming films from gas, vapor, liquid, and solid raw materials. It controls temperature distribution through single-zone and multi-zone configurations, and allows for high-temperature CVD/PECVD processing of powders using a high-quality stainless steel chamber with a rotation mechanism. The PLASMICON control system supports fully automated processes and data storage. 【Features】 ■ Equipped with the FLOCON series flow management system ■ Capable of incorporating the ICP plasma source from the PLUME series ■ Capable of synthesizing and forming films from gas, vapor, liquid, and solid raw materials ■ Temperature distribution control through single-zone and multi-zone configurations *For more details, please refer to the PDF document or feel free to contact us.

• CVD Equipment

We handle "CVD and MOCVD customized equipment" designed for research and development as well as small-scale batch production. CVD, MOCVD, and ALD equipment can be customized, and a variety of plasma sources from the PLUM, FLARION, and MIRENIQUE series can be installed. Additionally, it is equipped with the FLOCON series flow management system. 【Features】 ■ Equipment for research and development or small-scale batch production ■ Customized design for CVD, MOCVD, and ALD equipment ■ Variety of plasma sources from the PLUM, FLARION, and MIRENIQUE series can be installed ■ Equipped with the FLOCON series flow management system *For more details, please refer to the PDF document or feel free to contact us.

• CVD Equipment

The "PUPION series" is a plasma ion implantation device. It is used for shallow depth doping in nanoelectronics and photonics, as well as for medical-grade radioactive isotopes in beta radiation therapy. It minimizes radioactive contamination during the injection of radioactive isotopes and allows for the proposal of plasma excitation technologies tailored to specific applications. 【Features】 ■ Shallow depth doping in nanoelectronics and photonics, and beta radiation therapy ■ Medical-grade radioactive isotopes ■ Minimizes radioactive contamination during the injection of radioactive isotopes ■ Capable of proposing plasma excitation technologies according to application needs *For more details, please refer to the PDF document or feel free to contact us.

• Ion implantation equipment

The "GLAZE Series" is a state-of-the-art pulsed laser deposition system for thin film formation. It enables high-efficiency and high-quality film deposition through a hybrid process. It allows for substrate heating above 800°C and reactive film deposition, and it can also be equipped with a magnetron cathode. 【Features】 ■ State-of-the-art pulsed laser deposition system for thin film formation ■ High-efficiency and high-quality film deposition through a hybrid process ■ Substrate heating above 800°C and reactive film deposition possible ■ Magnetron cathode can also be installed *For more details, please refer to the PDF document or feel free to contact us.

• Laser marker

We handle carbon nanotube synthesis equipment and catalyst deposition. The hybrid reactor configuration supports PVD and PECVD processes. Without exposing to the atmosphere, we achieve all steps of CNT and graphene synthesis, including substrate surface cleaning, buffer layer deposition, and catalyst layer synthesis. 【Features】 ■ The MAGNION series magnetron equipment can be equipped with the PLUME series plasma source. ■ The hybrid reactor configuration supports PVD and PECVD processes. *For more details, please refer to the PDF document or feel free to contact us.

• tube

The "MIRENIQUE series" is a microwave plasma source. It is suitable for PECVD, diamond, DLC, CNT, and plasma-assisted polymerization, with reactors and plasma sources ideal for MWPECVD R&D equipment. MW-SURFATRONS can operate at atmospheric pressure or reduced pressure. 【Features】 ■ Suitable for PECVD, diamond, DLC, CNT, and plasma-assisted polymerization ■ Reactors and plasma sources suitable for MWPECVD R&D equipment ■ MW-SURFATRONS can operate at atmospheric pressure or reduced pressure *For more details, please refer to the PDF materials or feel free to contact us.

• Plasma surface treatment equipment

The "ATMOS-R2R Series" is a roll-to-roll device. It performs surface treatment and film formation on various types of flexible films, reducing cross-contamination through multi-zone configuration within the same chamber. Various deposition sources and treatment sources can be installed in the same chamber, providing high compatibility through the integration of the FLOCON series gas, vapor, and liquid control systems. 【Features】 ■ Surface treatment and film formation on various types of flexible films ■ Reduction of cross-contamination through multi-zone configuration within the same chamber *For more details, please refer to the PDF document or feel free to contact us.

• Other surface treatment equipment

The "FLARION series" is a plasma deposition and etching device. It enables plasma-assisted reactive deposition using the seamless ICP of the PLUM series. Additionally, it can be equipped with a substrate rotation mechanism, bias mechanism, and program-controlled axis motion mechanism, accommodating options for customization and integration. 【Features】 ■ Plasma-assisted reactive deposition possible with the seamless ICP of the PLUM series ■ Capable of being equipped with substrate rotation mechanism, bias mechanism, and program-controlled axis motion mechanism ■ Options available for customization and integration *For more details, please refer to the PDF materials or feel free to contact us.

• Plasma surface treatment equipment

The "MAGNION, FLARION, EVAD series" are tabletop thin film deposition and plasma devices. The magnetron sputtering PVD device supports single and multi-cathode configurations. The thermal evaporation device is equipped with evaporation boats, small Knudsen cells (K-cells) for organic and inorganic materials, and can also be integrated with a glove box. 【Features】 ■ Magnetron sputtering PVD device: Single and multi-cathode ■ Thermal evaporation device: Evaporation boats, small Knudsen cells (K-cells) for organic and inorganic materials ■ Integration with glove boxes is also possible *For more details, please refer to the PDF materials or feel free to contact us.

• Plasma surface treatment equipment

We would like to introduce the 'PLUME Series' that we handle. It is suitable for powder and inline treatment, remote plasma source / immersed plasma source. Please feel free to consult us when you need assistance. 【Features】 ■ ICP, neutral atom, and ion sources that can accommodate multiple purposes ■ For powder and inline treatment ■ Remote plasma source / immersed plasma source * For more details, please refer to the PDF document or feel free to contact us.

• others

We would like to introduce the "EVAD Series" that we handle. This product is a thermal evaporation device for organic molecular film deposition using a low-temperature evaporation cell with PID temperature control. It also allows for the deposition of metals, dielectrics, and organic films using electron beams and various resistance heating methods. Please feel free to consult us when needed. 【Features】 ■ Deposition of metals, dielectrics, and organic films using electron beams and various resistance heating methods ■ Organic molecular film deposition using a low-temperature evaporation cell with PID temperature control * For more details, please refer to the PDF materials or feel free to contact us.

• Evaporation Equipment

The "MC-100/MC-200" is a DLI-CVD/DLI-ALD system with a stainless steel chamber. It supports substrates up to 200mm in diameter, with a maximum of 8 mass flow controllers for the "MC-100" and 6 for the "MC-200," and it can be equipped with a turbo pump. Please feel free to consult us when you need assistance. 【Features】 ■ Supports substrates up to 200mm in diameter ■ Maximum film deposition temperature: 800℃ ■ Capable of accommodating up to 4x DLI evaporators ■ Mass flow controllers: up to 8 ■ Stainless steel chamber *For more details, please refer to the PDF document or feel free to contact us.

• CVD Equipment

The MC-050 is a DLI-CVD/DLI-ALD system compatible with substrates up to 50mm in diameter. The maximum film formation temperature is 1100°C (lamp heating method), and it can accommodate up to 6 DLI evaporators. Additionally, it can have a maximum of 8 mass flow controllers and is equipped with a turbo pump. Please feel free to contact us for inquiries. 【Features】 ■ Compatible with substrates up to 50mm in diameter ■ Maximum film formation temperature: 1100°C (lamp heating method) ■ Can accommodate up to 6 DLI evaporators ■ Mass flow controllers: up to 8 ■ Quartz tube-type chamber *For more details, please refer to the PDF document or feel free to contact us.

• Annealing furnace

The "AS-Master 200" is an RTP device with a rapid cooling mechanism after annealing. It supports substrates with a maximum diameter of 200mm (lamp heating from above the substrate) and can be equipped with vacuum or atmospheric transport systems and load locks. Additionally, it is compatible with processes under atmospheric and vacuum conditions and can be equipped with a turbo pump. Please feel free to consult us when needed. 【Features】 ■ Supports substrates with a maximum diameter of 200mm (lamp heating from above the substrate) ■ Low temperature (1100°C) / high temperature (1300°C) pyrometer ■ Rapid cooling mechanism after annealing ■ Compatible with atmospheric and vacuum processes ■ Turbo pump can be installed *For more details, please refer to the PDF document or feel free to contact us.

• Annealing furnace

The "AS-Premium" is an RTP device that supports processes under atmospheric and vacuum conditions. It features a rapid cooling mechanism after annealing (only for upper lamp heating) and is equipped with low temperature (1100°C) and high temperature (1300°C) pyrometers. Please feel free to consult us when you need assistance. 【Features】 ■ Supports substrates up to 156mm x 156mm ■ Low temperature (1100°C) / high temperature (1300°C) pyrometers ■ Rapid cooling mechanism after annealing (only for upper lamp heating) ■ Compatible with atmospheric and vacuum processes ■ Turbo pump can be installed *For more details, please refer to the PDF document or feel free to contact us.

• Annealing furnace

The "AS-One 100/150" is an RTP device compatible with atmospheric and vacuum processes. It can be equipped with a turbo pump, and the mass flow controller can be up to 5. Please feel free to consult us when you need assistance. 【Features】 ■ Rapid cooling mechanism after annealing ■ Compatible with atmospheric and vacuum processes ■ Turbo pump can be installed ■ Mass flow controller: up to 5 *For more details, please refer to the PDF document or feel free to contact us.

• Annealing furnace

The "3ICP + 2 cassette module" is a cluster tool capable of accommodating various modules. It can be equipped with the ICPRIE module "SI 500-1M," the RIE module "SI 500 RIE-1M," the PECVD module "SI 500 PPD-1M," and the ALD module "SI ALD-1M," among others. Please feel free to consult us when you need assistance. 【Compatible Modules】 ■ SI 500-1M: ICPRIE Module ■ SI 500 D-1M: ICPECVD Module ■ SI 500 RIE-1M: RIE Module ■ SI 500 PPD-1M: PECVD Module ■ SI ALD-1M: ALD Module *For more details, please refer to the PDF document or feel free to contact us.

• CVD Equipment

The "SLI 670" is an endpoint monitor for plasma devices with wavelengths of 670/980nm. A laser beam is emitted from the window at the top of the plasma device, measuring the reflected light from the sample to determine the film thickness. Please feel free to consult us when you need assistance. 【Features】 ■ Wavelength: 670/980nm ■ Spot size: 100μm ■ Motor-driven stage ■ Reflectivity, interference mode *For more details, please refer to the PDF document or feel free to contact us.

• Coating thickness gauge

The "SI 500 D" is an ICPECVD that controls ion density using ICP power. With a high plasma density of 10^12 [ions/cm3] achieved by the unique PTSA200ICP source, it enables low-temperature film deposition, low damage, and high conformality. Please feel free to consult us when you need assistance. 【Features】 ■ Control of ion density using ICP power ■ Control of ion energy with optional bias power ■ Optimization of the process through reactor pressure, separated gas supply lines, and adjustment of the spacing between the ICP source and substrate electrode *For more details, please refer to the PDF materials or feel free to contact us.

• CVD Equipment

The "SI 500" is an ICP-RIE that controls ion density through ICP power. It achieves a high etch rate with a high plasma density of 10^12 [ions/cm3] using the unique PTSA200ICP source. Additionally, it features low-damage etching through control of ion energy via bias power. 【Features】 ■ Control of ion density through ICP power ■ Control of ion energy through bias power ■ Optimization of radical supply by adjusting the distance between the ICP source and the substrate electrode ■ Low-damage etching ■ High selectivity etching *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

The "Firebird" is a thermal ALD device of the cluster tool type for large-scale mass production. It is equipped with Veeco's proven automation system, ensuring batch transport with minimal impact on the substrates. Please feel free to consult us when you need assistance. 【Features】 ■ Top-class throughput ■ Low ownership cost ■ Proven Veeco automation system ■ Flexible modular design ■ Batch transport with minimal impact on substrates ■ Veeco's global sales, service, and support *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

The "Phoenix G2" is a thermal ALD system suitable for medium-scale production. It features a reactor design proven to provide excellent process flexibility, making it easy to use for various applications. Additionally, it supports semi-auto loaders or vacuum load locks and has an appropriate chamber size (less than 370mm x 470mm). 【Features】 ■ Reactor design proven to provide excellent process flexibility ■ Easy to use for various applications ■ Many safety measures required for mass production ■ Compatible with semi-auto loaders or vacuum load locks ■ Appropriate chamber size: less than 370mm x 470mm *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

The "Fiji G2" is a research and development ALD system that utilizes thermal and plasma methods. It employs an ICP remote plasma source and features a vacuum load lock for substrate transport, designed to produce high-quality ALD films of oxide, nitride, and metal layers. Additionally, it comes standard with a simple exhaust unit, the ALD Shield Vapor Trap, and can accommodate up to 6 plasma gas lines. 【Features】 ■ 500°C wafer stage ■ Remote ICP source with no plasma damage ■ Mode supporting ultra-high aspect ratios (<2000:1) (thermal) ■ Plasma gas lines: up to 6 lines ■ Precursor lines: up to 6 lines *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

The "Savannah G2" is a flexible thermal ALD device that is simple and easy to use, capable of supporting everything from research and development to small-scale mass production. It achieves high film deposition performance with a simple system, and configurations can be selected according to applications and budgets. Please feel free to contact us if you have any inquiries. 【Features】 ■ Achieves high film deposition performance with a simple system ■ Ultra-high aspect ratio (less than 2000:1) compatible mode ■ Configuration selection based on applications and budgets ■ Precursor lines: up to 6 lines ■ Simple exhaust unit: ALD Shield Vapor Trap standard equipped * For more details, please refer to the PDF materials or feel free to contact us.

• Other semiconductor manufacturing equipment

The "scia Cube 300/450/750" is a microwave PECVD/etching device compatible with substrates of 300×300mm, 450×450mm, and 750×750mm. The processes include microwave PECVD and reactive ion etching (RIE). Please feel free to consult us when you need assistance. 【Features】 ■ Compatible with substrates of 300×300mm, 450×450mm, and 750×750mm ■ Substrate bias mechanism ■ Substrate cooling and heating mechanism (-10 to 850℃) *For more details, please refer to the PDF materials or feel free to contact us.

• Etching Equipment

The "scia Coat 200/500" is a product compatible with a maximum of 200mm wafer substrates or 300mm x 500mm substrates. The processes include Ion Beam Sputtering (IBS), Ion Beam Etching (IBE), and Dual Ion Beam Sputtering (DIBS). Please feel free to consult us when needed. 【Features】 ■ Compatible with a maximum of 200mm wafer substrates or 300mm x 500mm substrates ■ Can accommodate up to 5 (220mm diameter) or 4 (300mm diameter) targets ■ RF source (120mm to 350mm) ■ Linear Microwave ECR source (2 x 380mm long) *For more details, please refer to the PDF materials or feel free to contact us.

• Sputtering Equipment

The "scia Magna 200" is a magnetron sputtering device with a rotating single magnetron. Applications include temperature compensation films (SiO2) for TC-SAW, piezoelectric films such as AlN, high and low refractive index films for optics, and insulating films (Si3N4, SiO2, Al2O3). Additionally, the process is magnetron sputtering. Please feel free to consult us when needed. 【Features】 ■ Maximum substrate diameter of 200mm ■ Rotating single magnetron (maximum diameter of 300mm) ■ Confocal 4 magnetron ■ Double ring magnetron (Fraunhofer FEP) *For more details, please refer to the PDF document or feel free to contact us.

• Sputtering Equipment

The "scia Trim 200" is an ion beam trimming device that controls film thickness etching with high precision and high throughput. It supports wafer substrates up to 200mm, improving yield. Additionally, the process is ion beam trimming (IBT). Please feel free to consult us when needed. 【Features】 ■ Supports wafer substrates up to 200mm ■ Yield improvement ■ Film thickness etching control with high precision and high throughput ■ Compatible with mechanical clamps or electrostatic chucks ■ Sub-nanometer etching mechanism *For more details, please refer to the PDF document or feel free to contact us.

• Etching Equipment

The "scia Mill 150/200" is an ion beam milling device with a microwave ECR source (218mm diameter). The processes include ion beam etching/milling (IBE/IBM), reactive ion beam etching (RIBE), and chemical assist ion beam etching (CAIBE). Please feel free to consult us when needed. 【Features】 ■ Compatible with maximum 150 or 200mm wafer substrates ■ Microwave ECR source (218mm diameter) ■ RF type source (350mm diameter) ■ Etching angle and stage tilt/rotation mechanism *For more details, please refer to the PDF materials or feel free to contact us.

• Etching Equipment

Do you have any of these troubles?" "I want to repair broken equipment, but the production of parts has ended." "I can't obtain parts, and the delivery of products is delayed." Our company holds over 100,000 various parts and auxiliary equipment, including used, discontinued, and new items, and can provide them quickly according to your needs. We can ship as soon as the same day. We also handle special orders from overseas, contributing to resolving sudden equipment or delivery troubles. 【Products We Handle (Excerpt)】 ◎ Display Equipment: Monitors, Touch Panels ◎ Vacuum Parts: Gate Valves, Solenoid Valves, Vacuum Gauges ◎ Drive System Parts: Pendants, Robots, Linear Motion ◎ Control System Parts: PLCs, Inverters, Power Supplies ◎ Auxiliary Equipment: Compressors, Chillers, Blowers ◎ Various Pumps: Dry, Turbo, Cryo, Oil ◎ Measurement Instruments: Microscopes, Speed Meters, Flow Meters We also have many motors, drivers, and general-purpose FA items available. ★ We are currently accepting purchase assessments. Even if the equipment has no value, we will assess parts and valuable materials. You can view a list of handled parts and more from the "PDF Download.

• Other electronic parts
• Other machine elements
• Other semiconductors

We provide engineering technology that connects advanced overseas systems with customer needs. We prioritize nurturing engineers who can supply highly regarded thin film-related equipment from Western countries to domestic customers. In addition to importing and selling equipment, we also offer performance evaluations using demo units, after-sales support post-installation, and modifications to improve productivity. This is the advanced systems business of High-Tech Systems. 【Features】 ◆ Comprehensive film deposition services ◆ Robust support system ◆ Abundant Japanese engineers 【Products】 ◆ Veeco/CNT (U.S.A.) ◆ scia Systems (Germany) ◆ ANNEALSYS (France), etc. *For more details, please download the catalog or feel free to contact us.

• Other industrial robots

High-Tech Systems, as a leading company in renovation technology, successfully guides the introduction of used equipment with high technical capabilities. Centered around two pillars: the provision of renovation technology and advanced thin-film systems, we propose a new era for the semiconductor and FPD industries. Numerous electronic devices are used in the home appliances, mobile phones, medical devices, and industrial equipment surrounding us, and they continue to evolve daily. In the process of this evolution, manufacturing factories must overcome the challenge of producing new devices while utilizing existing lines. The regeneration and introduction of used equipment in the semiconductor and FPD industries require a wide range of technologies and know-how, including "diagnosis and assessment," "cleaning and decontamination," "dismantling and restoration," "logistics," "line construction," "modification and regeneration," and "precision adjustment." High-Tech Systems provides the comprehensive technology necessary for the utilization of these used devices, known as "renovation technology." 【Business Activities】 ◆ Reuse Business ◆ Engineering Business ◆ Advanced Systems Business *For more details, please download our catalog or feel free to contact us.

• Other industrial robots

Scia Systems GmbH was established by key staff who developed the software and hard wafers for the ion beam trimming (trimming processing, IBF) equipment IonScan from Roth&Rau AG and MicroSystems GmbH. Scia Systems develops unique and proprietary cutting-edge ion beam and plasma technologies, handling equipment from research and development to mass production.

• Other processing machines

Scia Systems GmbH was established by key staff who developed the software and hard wafers for the ion beam trimming (trimming processing, IBF) device IonScan from Roth&Rau AG and MicroSystems GmbH. Scia Systems develops unique and proprietary cutting-edge ion beam and plasma technologies, handling equipment from research and development to mass production.

• Other processing machines

Scia Systems GmbH was established by key staff who developed the software and hard wafers for the IonScan device, an ion beam trimming (trimming processing, IBF) equipment from Roth&Rau AG and MicroSystems GmbH. Scia Systems develops unique and proprietary cutting-edge ion beam and plasma technologies, handling equipment from research and development to mass production.

• Other processing machines

Scia Systems GmbH was established by key staff who developed the software and hard wafers for the ion beam trimming (trimming processing, IBF) device IonScan from Roth&Rau AG and MicroSystems GmbH. Scia Systems develops unique and proprietary cutting-edge ion beam and plasma technologies, handling equipment from research and development to mass production.

• Other processing machines

High-Tech Systems is the sales agent for Veeco/CNT, a global leading company in Atomic Layer Deposition (ALD) equipment. Veeco/CNT is the ALD division of the American company Veeco, which develops advanced ALD technology and is the manufacturer of the most widely used development and pilot production ALD equipment in research institutions, universities, and companies around the world. They also have a proven track record in the market for production ALD equipment and large-area substrate ALD equipment, and they respond to customer requests.

• Other processing machines