Single crystal super high thermal conductivity diamond substrate
Highest grade thermal conductivity
High-output electronic devices, laser systems, heat dissipation management, etc.
- Company：Semi Next 本社、三重事業所
- Price：Other
Substrate Product List and Ranking from 561 Manufacturers, Suppliers and Companies
Last Updated： Aggregation Period:Dec 31, 2025～Jan 27, 2026
This ranking is based on the number of page views on our site.
Substrate Manufacturer, Suppliers and Company Rankings
Last Updated： Aggregation Period:Dec 31, 2025～Jan 27, 2026
This ranking is based on the number of page views on our site.
- 山下マテリアル Kanagawa//Electronic Components and Semiconductors
- 太洋テクノレックス 本社 和歌山 Wakayama//Electronic Components and Semiconductors
- グロース Kanagawa//Electronic Components and Semiconductors
- 4 スクリーンプロセス Kanagawa//others
- 5 プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
Substrate Product ranking
Last Updated： Aggregation Period:Dec 31, 2025～Jan 27, 2026
This ranking is based on the number of page views on our site.
- Handbook for Circuit Board Noise Countermeasures グロース
- <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
- Integrated in-house support for shaping, processing, and firing! Contract processing of ceramics. マルワイ矢野製陶所
- Understand in 3 minutes! A substrate that dissipates heat faster [Materials available]. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
- 4 Difficult-to-weld areas! Even when you're out and about! | High-strength adhesive for metals スリーエム ジャパン
Substrate Product List
1576～1590 item / All 1900 items
Displayed results
Substrate manufacturing
Select and propose suitable manufacturers for the project! Procurement is possible not only from domestic but also from overseas PCB manufacturers.
At Tokai Corporation, we can manufacture from a single printed circuit board. We support a variety of boards, including "rigid boards (single-sided to high multilayer)," "IVH and BVH boards," "build-up boards," and "special boards (such as Teflon, aluminum, glass, etc.)." We will select and propose the most suitable manufacturers based on specifications, quality, and cost for each project. Additionally, we can procure from domestic as well as overseas board manufacturers, so please feel free to consult us when needed. 【Supported Boards (partial)】 ■ Rigid boards (single-sided to high multilayer) ■ IVH and BVH boards ■ Build-up boards ■ Flexible boards (single-sided to multilayer) ■ Rigid-flex boards *For more details, please refer to the PDF document or feel free to contact us.
- Company：東海
- Price：Other
Printed circuit board for electronic component evaluation
We respond to the various needs for printed circuit boards required in the development of electronic components and the production process!
We would like to introduce our "Printed Circuit Boards for Electronic Component Evaluation." We can offer various printed circuit boards required at each stage of the engineering chain and value chain for electronic component manufacturers. We provide a seamless service for all tasks related to printed circuit board development. With the LDI process, both patterns and solder resist (SR) can be finished with high precision. 【Benefits for Customers】 ■ We can provide a seamless service for all tasks related to printed circuit board development. ■ The LDI (Laser Direct Imaging) process allows for high-precision finishing of both patterns and solder resist (SR). ■ There is no concept of end-of-life (EOL) due to the absence of original artwork, film plates, and screen plates, allowing for orders to be placed at any time. *For more details, please download the PDF or feel free to contact us.
- Company：リョーサン ソリューション事業本部/システムソリューション部
- Price：Other
OKI Circuit Technology Pattern Design
Achieving short delivery times! Smooth flow from pattern design to circuit board manufacturing to assembly.
Our company offers pattern design focused on the manufacturing of printed circuit boards. We achieve short delivery times through simultaneous parallel design. We have approximately 10,000 design achievements ranging from communication and measurement equipment to space and defense products. Furthermore, all designers hold first and second-class qualifications as printed circuit board manufacturing technicians and can propose analyses through various simulations. 【Features】 ■ Short delivery times ■ Abundant track record ■ Pattern design considering board quality and assembly quality ■ Design quality check system through the introduction of proprietary verification tools ■ All designers hold qualifications as printed circuit board manufacturing technicians An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.
- Company：沖電気工業 産業営業本部 産業営業統括室
- Price：Other
Printed Circuit Board: Various Custom Printed Circuit Board Catalogs
Printed Circuit Board: Introducing OKI Circuit Technology's custom printed circuit boards.
This document is a catalog of "various custom printed circuit boards" handled by OKI Circuit Technology Co., Ltd., which develops, designs, and manufactures printed circuit boards. We introduce various custom printed circuit boards, including "copper coin (heat dissipation structure) printed circuit boards" embedded with copper coins for efficient heat dissipation from heat-generating parts, "high current, high voltage, and high heat dissipation compatible printed circuit boards" for applications requiring high current and voltage, and "high-speed, large-capacity transmission compatible printed circuit boards" supporting high-speed transmission of 25 to 400 Gbps. [Contents] ■ Copper coin (heat dissipation structure) printed circuit boards ■ High current, high voltage, high heat dissipation specification printed circuit boards ■ High-speed, large-capacity transmission printed circuit boards ■ High-density component compatible printed circuit boards ■ High-density build-up printed circuit boards ■ Flex-rigid printed circuit boards ■ Composite board thickness printed circuit boards (T-SEC-Board) An article from our company has been published in MONOist. [How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing cumulative hours by 480 over three years] https://monoist.atmarkit.co. *For more details, please download the PDF or feel free to contact us.
- Company：沖電気工業 産業営業本部 産業営業統括室
- Price：Other
Support for flex-rigid structures
Achieving miniaturization, high density, and high reliability through flex-rigid integration!
Our company creates many benefits through integrated flex-rigid technology. We solve issues such as "high initial costs preventing prototype development" and "wanting to ensure high reliability." We contribute to miniaturization and high density through connector-less designs, as well as reducing cable connection errors and wiring labor. 【Features】 ■ Support available from a single unit ■ Data receipt to shipment: possible in as little as 5 days ■ Cost reduction of mold expenses through router processing ■ Possible multilayer structure for flex layers ■ Use of liquid crystal polymer materials for flex layers Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.
- Company：沖電気工業 産業営業本部 産業営業統括室
- Price：Other
Support for high-density components
High-density component mounting such as narrow pitch CSP is possible! We will propose specifications according to your application.
Our company enables high-density component mounting such as narrow-pitch CSP. We offer specifications tailored to applications, including measures to prevent solder blowout during the mounting of via-in-pad structures. Please feel free to contact us when you need assistance. 【Specification Proposals】 ■ Increased wiring density for inner and outer layers → Build-up, IVH structure ■ Measures to prevent solder blowout during the mounting of via-in-pad structures → Pad-on-hole structure ■ High-density CSP mounting with a pitch of 0.65mm or less → Build-up, pad-on-hole structure An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, multi-product factory, reducing cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.
- Company：沖電気工業 産業営業本部 産業営業統括室
- Price：Other
Integrated design and manufacturing solution services
All of our printed circuit boards, including special products, can be accommodated for assembly!
Our company provides a consistent solution service for design and manufacturing. We offer services utilizing OKI-EMS's comprehensive capabilities, including circuit design, firmware development, mechanical design, and AW design. Additionally, all of our printed circuit boards, including special products, are capable of implementation. 【Features】 ■ FPGA IP (image, audio, communication, embedded systems) ■ DSP platform ■ Wireless EtherCAT analog support ■ Enclosure and mechatronics design An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.
- Company：沖電気工業 産業営業本部 産業営業統括室
- Price：Other
Composite board thick wiring board "T-SEC-Board"
Increase the number of layers to match the pin count of the mounted components! We can accommodate thick multilayer printed circuit boards.
Introducing the PCI-Express compatible wiring board "T-SEC-Board." In addition to increasing the freedom of characteristic impedance wiring width, the use of inner layer metals (copper, aluminum) is possible. This is a high-function wiring board equipped with multi-pin BGA, which allows for partial control of the board thickness at the terminal connector section. 【Features】 ■ Layer count can be increased according to the number of pins of the mounted components ■ Increased freedom of characteristic impedance wiring width ■ Inner layer copper foil thickness can be increased for heat dissipation purposes ■ Adoption of inner layer metals is possible (improving strength and heat dissipation, etc.) Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.
- Company：沖電気工業 産業営業本部 産業営業統括室
- Price：Other
Custom and special purpose circuit boards
Developed with proven technology over many years! Pre-verification of characteristics through simulation is possible.
We provide printed circuit boards that combine functional materials tailored to various characteristic requirements. We can accommodate industrial applications and small quantities, and pre-validation of characteristics through simulation is possible. Developed with proven technology over many years, we guarantee long-term reliability. 【Features】 ■ Aluminum-based substrate - Achieves high heat dissipation and lightweight design ■ Edge shielded substrate - Suppresses radiated noise by shielding the edges - Adopts the ED method to accommodate special shapes ■ Millimeter-wave substrate - Hybrid structure of low-loss material and FR4 - High-precision patterning *For more details, please refer to the PDF document or feel free to contact us.
- Company：沖電気工業 産業営業本部 産業営業統括室
- Price：Other
Substrate lineup
Supports specific functional materials such as capacitors and heat dissipation! Balances performance and cost.
We provide printed circuit boards that combine functional materials tailored to various characteristic requirements. By using a hybrid structure of functional materials such as low-loss materials and capacitor materials along with general materials, we achieve a balance between performance and cost. Additionally, we accommodate low-loss materials both domestically and internationally. 【Application Example】 <Embedded Capacitor> ■ Number of Layers: 20 layers ■ Base Material: Faradflex + Megtron6 ■ Application Example: Networks, semiconductor testing *For more details, please refer to the PDF document or feel free to contact us.
- Company：沖電気工業 産業営業本部 産業営業統括室
- Price：Other
Copper coin embedded printed circuit board
Improving thermal conductivity by embedding copper coins! Introducing printed circuit boards that efficiently dissipate heat.
To efficiently utilize the thermal conductivity of copper (390 W/m·K) for heat dissipation, we introduce a printed circuit board embedded with copper coins in the heat-generating area. In conventional methods, heat dissipation vias were arranged as much as possible, but due to the inability to increase the cross-sectional area of copper, there were limitations in heat dissipation. In the developed product, the thermal conductivity has been improved by embedding copper coins. 【Comparison of Conductor Cross-sectional Area】 ■ Through Hole (25μm) - φ3.0mm 1 hole: 0.23 mm² - φ8mm area: 1.41 mm² (φ0.4mm TH, 1.0mm pitch, 48 holes) ■ Copper Coin - φ3.0mm 1 hole: 7.07 mm² (approximately 30 times) - φ8mm area: 50.24 mm² (1 hole of φ8mm copper coin) (approximately 35 times) *For more details, please refer to the PDF document or feel free to contact us.
- Company：沖電気工業 産業営業本部 産業営業統括室
- Price：Other
High-reliability build-up wiring board
High board thickness specifications, low dielectric material specifications, stack via specifications, etc.! We can accommodate various specifications.
We offer build-up wiring boards that support high density and high reliability. We can accommodate various specifications, including 0.4mm pitch, high board thickness, low dielectric material, stacked via specifications, and large interlayer thickness (100-120um). We deliver printed circuit boards with specific functions added for each application, from pattern design to manufacturing in a consistent system. Please feel free to consult us when you need assistance. *For more details, please refer to the PDF materials or feel free to contact us.
- Company：沖電気工業 産業営業本部 産業営業統括室
- Price：Other
High-speed high-frequency compatible printed circuit board
For those who want to use materials suitable for their products. We propose optimal materials (low dielectric, tangent materials) based on measured data!
In high-speed, high-frequency compatible printed circuit boards, we will assist in the development of printed circuit boards aimed at 25Gbps to 100Gbps. We solve customer issues such as "I want to reduce transmission loss and delay time" and "I want to use materials suitable for the product." We will propose suitable materials (low dielectric, low loss tangent) based on measured data. 【Features】 ■ Proposal of suitable materials (low dielectric, low loss tangent) based on measured data ■ Support from the design stage with pre-simulation (single-ended, differential) ■ Proposals based on measured values of material transmission characteristics (loss, delay) ■ Proposal of composite structure circuit boards using high-frequency materials and FR-4 *For more details, please refer to the PDF document or feel free to contact us.
- Company：沖電気工業 産業営業本部 産業営業統括室
- Price：Other
High-density compatible printed circuit board
We can propose specifications tailored to your needs! We provide printed circuit boards with structures customized for your applications.
We provide printed circuit boards with structures tailored to your applications. Increased wiring density for inner and outer layers → Build-up printed circuit boards Implementation of blind vias to prevent solder blowout → Pad-on-hole structure printed circuit boards Pitch of 0.65mm or less → Build-up or pad-on-hole structure printed circuit boards We can propose specifications according to your needs. Please feel free to consult us. 【Usage Scenarios】 ■ By Product / Minimum Through-Hole Pitch - Probe Card: 0.65mm - CSP Main Image: 0.40mm - Performance Board: 0.50mm - Burn-in Board: 0.40mm *For more details, please refer to the PDF document or feel free to contact us.
- Company：沖電気工業 産業営業本部 産業営業統括室
- Price：Other
