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Substrate Product List and Ranking from 560 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Dec 31, 2025～Jan 27, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Dec 31, 2025～Jan 27, 2026
This ranking is based on the number of page views on our site.

  1. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  2. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  3. グロース Kanagawa//Electronic Components and Semiconductors
  4. 4 スクリーンプロセス Kanagawa//others
  5. 5 プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
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Substrate Product ranking

Last Updated： Aggregation Period:Dec 31, 2025～Jan 27, 2026
This ranking is based on the number of page views on our site.

  1. Handbook for Circuit Board Noise Countermeasures グロース
  2. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  3. Integrated in-house support for shaping, processing, and firing! Contract processing of ceramics. マルワイ矢野製陶所
  4. Understand in 3 minutes! A substrate that dissipates heat faster [Materials available]. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
  5. 4 Difficult-to-weld areas! Even when you're out and about! | High-strength adhesive for metals スリーエム ジャパン

Substrate Product List

1381～1395 item / All 1895 items

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Support for high-speed and large-capacity transmission.

Support for high-speed and large-capacity transmission.

For 5G/6G! We will realize products that support advanced high-speed transmission technology.

We would like to introduce our support for high-speed and large-capacity transmission. We have developed products that are compatible with advanced high-speed transmission technologies for 5G/6G. We provide support for solving challenges related to the development of advanced high-frequency application substrates. Additionally, our "high-frequency printed circuit boards" can be tailored to meet your needs through the adoption of new high-frequency materials, joint evaluations, and the use of LP foils and low-dielectric glass materials. 【Features of High-Frequency Printed Circuit Boards】 ■ Proposals tailored to your needs ■ Surface treatment transmission LOSS evaluation ■ Analysis, evaluation, and deployment of finished products *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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[Information] Introduction to Printed Circuit Boards for Space Use

[Information] Introduction to Printed Circuit Boards for Space Use

Acquisition of certification for all types of space-use printed circuit boards for the Japan Aerospace Exploration Agency! Various types are listed.

This document introduces the certification specifications for Annexes A, B, D, E, F, G, and H of the Japan Aerospace Exploration Agency (JAXA). It includes glass cloth substrate wiring boards, fine-pitch wiring boards, and flexible wiring boards. We provide detailed information on maximum layer counts, board thickness, conductor pressure, minimum drill diameters, and more, so please take a moment to read through it. 【Contents (partial)】 ■ Annex A: Glass cloth substrate wiring boards ■ Annex B: Fine-pitch wiring boards ■ Annex D: Flexible wiring boards ■ Annex E: Flex-rigid wiring boards ■ Annex F: Low thermal expansion wiring boards with CIC *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Support for high current, high voltage, and high heat dissipation specifications.

Support for high current, high voltage, and high heat dissipation specifications.

Multi-layer structure with conductor thickness of up to 500μm! We propose an optimal heat dissipation structure.

Our company solves issues related to high current, high voltage, and heat dissipation through a special structure. We are capable of conducting high current (up to 400A) tests and manufacturing metal (with AL2.5mm) products. Additionally, we propose multi-layer structures with conductor thicknesses of up to 500μm and suitable heat dissipation designs. We address concerns such as the labor-intensive assembly of busbars and issues caused by warping of printed circuit boards due to heat. [For such concerns] ■ I want to carry high current ■ The assembly of busbars is labor-intensive ■ Issues caused by warping of printed circuit boards due to heat ■ High heat density, making heat dissipation difficult *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Support for high-density build-up structures

Support for high-density build-up structures

High-density wiring is now possible, enhancing design flexibility! Compatible with various specifications.

We would like to introduce our support for high-density build-up structures. High-density wiring has become possible, enhancing design flexibility. With LVH connections, high-speed wiring without via stubs is achievable. We support specifications such as narrow pitch compatibility and high-frequency compatibility (application of low dielectric materials, application of VLP copper foil, characteristic impedance matching, and improved characteristics for high-frequency applications). 【Supported Specifications】 ■ Narrow pitch compatibility ■ High-frequency compatibility (application of low dielectric materials, application of VLP copper foil, characteristic impedance matching & improved characteristics) ■ Thick copper foil specifications ■ Mixed IVH & LVH *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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φ520mm - Large Printed Circuit Board Manufacturing Technology

φ520mm - Large Printed Circuit Board Manufacturing Technology

Achieving high multi-layer printed circuit boards exceeding 500mm size! The maximum product size is 558×643mm.

We would like to introduce our "φ520mm - Large Printed Circuit Board Manufacturing Technology." We have achieved high multilayer printed circuit boards exceeding the 500mm size. Our high-precision lamination technology allows for narrow pitch specifications with a 0.5mm pitch. Main applications include semiconductor tester boards, load boards, probe cards, etc. Please feel free to contact us if you have any inquiries. 【Features】 ■ Maximum product size: 558×643mm ■ Maximum board thickness: 7.6mm (up to 96 layers with sequential structure possible) ■ High-precision lamination technology enables narrow pitch specifications with a 0.5mm pitch *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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[In Development] BLE Authentication System "T-ioT"

[In Development] BLE Authentication System "T-ioT"

We are developing a circuit board that can support various solutions using smartphones as authentication devices!

This is a system that can support multiple solutions on the same substrate, allowing for unlocking and sharing of operation permissions or usage restrictions via an app by touching the smartphone equipped with NFC to authenticate Bluetooth to the main unit. It is being developed as a security enhancement for locker locks, focusing on the concept of "unlocking with a smartphone." However, we also aim to provide only the substrate, envisioning solutions such as the following: - Adding a function to unlock via an app by connecting "T-ioT" to existing electric lock systems like keypad or card readers. We are working towards enabling temporary key sharing as "one-time unlock" or "time-limited unlock." - A solution that activates authentication at the next point by authenticating the smartphone in a predetermined order. We believe this will be effective for patrol duties, roll calls, and confirming presence. *Please note that since this is a product under development, specifications may change. If you have any requests or interest, please feel free to contact us.*

  • locker
  • Substrate

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Utilization of fluororesin as a next-generation communication infrastructure.

Utilization of fluororesin as a next-generation communication infrastructure.

I will also explain the contributions and challenges related to 5G and 6G, as well as the challenges in the use of fluororesins!

Communication devices include various items such as smartphones, tablets, and computers. One of the components that operates inside all these devices is the circuit board, which is an essential and important part for the functioning of all components. Moreover, with the advent of 5G and the move towards post-5G, communication is becoming more advanced, and just like various components, circuit boards are also required to evolve. One material that is expected to contribute to the performance improvement of communication circuit boards is "fluororesin." Here, we will briefly introduce why fluororesin is considered necessary as a next-generation communication circuit board, along with its reasons and technical challenges. *For detailed content of the article, please refer to the PDF. For more information, feel free to contact us.*

  • Other electronic parts
  • Substrate

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Introduction to the production flow for manufacturing various types of circuit boards in a short delivery time.

Introduction to the production flow for manufacturing various types of circuit boards in a short delivery time.

By coordinating the substrate manufacturing and assembly processes, we have achieved faster delivery!

Our company supports product development from the design of printed circuit boards to prototype implementation. We perform high-efficiency pattern design that reflects the high technical skills and know-how accumulated as a printed circuit board assembly manufacturer, producing various types of boards, from single-sided boards to multilayer and high-density boards, in a short delivery time. By coordinating the board manufacturing and assembly processes, we achieve faster delivery. We can flexibly respond to requests from any stage of the process. 【Production Flow】 ■ Specification Meeting ■ Pattern Design ■ Board Manufacturing ■ Component Procurement ■ Metal Mask Production ■ Board Assembly ■ Inspection ■ Delivery *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Other electronic parts
  • Substrate

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Mold base

Mold base

The fixed mold and movable mold are all finished with PL surface grinding!

The "Mold Base" from JAPAN MOLD TRADE Co., Ltd. is a base with all fixed and movable molds finished with PL surface grinding. 【Features】 ■ Processed according to your specifications for items such as ejector plates, die blocks, and supports ■ All components except bolts, movable inserts, fixed inserts, and cores are processed ■ All parts are delivered in an assembled state *For more details, please download the PDF or feel free to contact us.

  • Other molds
  • Circuit board processing machine
  • Substrate

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Introduction to Asia Electronics Co., Ltd. "Total Support for Product Development and Manufacturing"

Introduction to Asia Electronics Co., Ltd. "Total Support for Product Development and Manufacturing"

Comprehensive support from design, manufacturing, inspection to shipping! We respond to user needs with advanced technology.

At Asia Electronics Co., Ltd., we provide total support for product development and manufacturing. Based on your inquiries, we offer proposals and provide consistent support from design, manufacturing, inspection, to shipping, aiming to improve product quality and achieve short delivery times. Additionally, we excel in high-density circuit board development, BGA, CSP rework, reballing, press-fit, and small-lot production of various types and assemblies. We invite you to try our reliable technology. [Development (Excerpt)] ■Hardware ■Software ■Mechanical Development ■Design of single-sided and multilayer boards *For more details, please refer to the PDF materials or feel free to contact us.

  • Contract manufacturing
  • Other contract services
  • Other electronic parts
  • Substrate

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Introduction to Takeda Manufacturing Co., Ltd.

Introduction to Takeda Manufacturing Co., Ltd.

We will manufacture tools in a short delivery time to match the testers you have!

Takeda Manufacturing Co., Ltd. is engaged in the development, manufacturing, and sales of boards for LSI testers and various electronic devices. We have a wealth of experience in cable harnesses, checkers, machined products, resin products, sheet metal products (including painting), and other electronic device prototypes. We strive to create safe tools that can be used for a long time, taking the operating environment into full consideration, so please feel free to contact us with your requests. 【Industry】 ■ Development, manufacturing, and sales of boards for LSI testers and various electronic devices. *For more details, please download the PDF or contact us.

  • Evaluation Board
  • Circuit board design and manufacturing
  • Substrate

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Business Introduction: PB (Private Brand)

Business Introduction: PB (Private Brand)

We complete the process until product completion in-house! We bring our customers' desired images and ideas to life.

Excel Corporation offers products designed and manufactured in-house. Our job is to realize the images and ideas desired by our customers. We conduct simulations of product images to ensure they align with current trends and bring them closer to completion. As a "monozukuri" (manufacturing) company, we leverage our years of know-how in design, manufacturing, and quality to propose completed products. 【Features】 ■ Product installation plans ■ Electrical and optical design ■ Enclosure and structural design ■ Illuminance simulation ■ Product specifications *For more details, please refer to the PDF materials or feel free to contact us.

  • Contract manufacturing
  • Processing Contract
  • Substrate

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Ceramic tube protective pipe, insulating pipe, thin tube.

Ceramic tube protective pipe, insulating pipe, thin tube.

Excellent electrical insulation and low dielectric constant! Suitable for use in high-temperature transport rollers and more.

The "Ceramic Tube Protective Pipe, Insulation Pipe, and Fine Tube" excels in heat resistance, thermal shock resistance, corrosion resistance, creep resistance, and electrical insulation properties. We offer a variety of materials and shapes, including alumina, which can be used at a constant temperature of up to 1,850°C, as well as mullite and zirconia with excellent corrosion resistance, and magnesia, making it suitable for a wide range of applications. 【Features】 ■ Excellent heat resistance, capable of withstanding required high temperatures, and superior airtightness ■ High-temperature strength and strong impact resistance ■ Excellent creep resistance with minimal changes at high temperatures ■ Scientifically stable and excellent corrosion resistance ■ Low dielectric constant and superior electrical insulation properties *For more details, please refer to the PDF document or feel free to contact us.

  • Ceramics
  • Substrate

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Used circuit board for hole-opening machine LANISA board

Used circuit board for hole-opening machine LANISA board

【Production Stopped Recycled Products】 ■If you are having trouble with the circuit board of the hole punch machine being out of production, please contact us.

【Production Halted Recycled Products】 ■If you are having trouble with the circuit board of the hole punch machine being out of production, please contact us. ■If necessary, we can also carry out replacement work.

  • Printed Circuit Board
  • Substrate

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Used PCNT4 board for hole-opening machine

Used PCNT4 board for hole-opening machine

[Production Halted Recycled Products] ■If you are having trouble due to the production halt of the circuit board for the hole punch machine, please contact us.

【Production Halted Recycled Products】 ■ Please contact us if you are having trouble with the circuit board of the hole punch machine being out of production. ■ If necessary, we can also carry out replacement work.

  • Printed Circuit Board
  • Substrate

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