Sputtering Equipment Product List and Ranking from 50 Manufacturers, Suppliers and Companies

MiniLab-SA125A Multi-Target Sputtering System

High-performance multi-sputtering device 6-element multi-sputter (for Φ4 inch) 4-element multi-sputter (for Φ6, 8 inch)

Continuous multilayer film, simultaneous film formation (2-6 element simultaneous film formation: RF, DC can be freely switched from HMI) High-power RF, DC power supplies, and pulse DC power supplies can be flexibly configured with multi-cathodes using our unique 'Plasma Switching Relay' module, allowing for versatile applications. High-temperature substrate heating stage (double jacket water-cooled) options: -1) Max 600℃ (lamp heating) -2) Max 1000℃ (C/C composite) -3) Max 1000℃ (SIC coating) Reverse sputtering stage in load lock: -1) 300W, or -2) Soft-Etching (<30W) System main control: 'IntelliDep' control system Windows PC (or TP HMI) interface All operations are centrally managed from a single HMI screen.

Company：テルモセラ・ジャパン本社
Price：Other

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Sputtering device "MiniLab series"

Due to its modular embedded design, it is possible to flexibly assemble dedicated equipment according to the required film deposition method. A compact thin-film experimental device that can accommodate various research applications.

**Flexible System** The MiniLab thin film experimental device series allows for easy construction of a compact system without waste, even as a customized product, by incorporating suitable components (such as deposition sources and stages) and control modules according to the required deposition methods and materials from a wide range of options. By configuring the device with a modular control unit in a Plug&Play manner, the application range expands, enabling various thin film process experiments. The MiniLab series is a high-cost performance system that caters to a wide range of applications from research and development to small-scale production. **Small Footprint & Space-Saving** - Single Rack Type (MiniLab-026): 590(W) x 590(D)mm - Dual Rack Type (MiniLab-060): 1200(W) x 590(D)mm - Triple Rack Type (MiniLab-125): 1770(W) x 755(D)mm **Excellent Operability & Intuitive Operation Screen** Windows PC or 7” touch panel. Easy operation that does not require advanced skills, while ensuring maximum safety.

Company：テルモセラ・ジャパン本社
Price：Other

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Multi-functional Sputtering Device 【MiniLab-S060】

A compact multi-thin film device that incorporates sputtering, deposition, electron beam (EB), and annealing thin film modules in a 60-liter volume chamber, suitable for various applications.

4 cathodes with Φ2 inch mounted Simultaneous film formation: 3-component simultaneous film formation (RF 500W or DC 850W) + HiPIMS (Pulse DC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed from the HMI screen using the plasma relay switch MFC x 3 systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coat) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Plasma etching can be installed in either the main chamber or the load lock chamber. ● Mixed specifications such as resistance heating deposition, organic material deposition, EB deposition, and PECVD can also be configured.

Company：テルモセラ・ジャパン本社
Price：Other

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Ultra-compact Magnetron Sputtering Device MSP-mini

This is a metal coating device for optical microscope samples (transparent materials) or SEM samples. It is the smallest model in the industry. It is a super compact coating device.

The coating is done at a very low voltage using a magnetron electrode. A simple yet highly glossy metal film can be coated with just one touch. Set the sample. Set the timer according to the desired coating thickness. Once you press the start button, it automatically progresses from preliminary evacuation to coating. When the coating is complete, the RP stops and automatically air leaks.

Company：真空デバイス本社
Price：500,000 yen-1 million yen

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Magnetron Sputtering Device MSP-20UM

To apply a conductive film treatment to the sample for the electron microscope. Magnetron sputtering device.

The Magnetron Sputtering Device MSP-20UM is a device used for applying conductive film treatment to samples for electron microscopy. It employs a magnetron target to minimize sample damage. It is equipped with adjustment functions that allow it to accommodate various applications. It also has features for introducing and adjusting the pressure of argon gas and other gases, which contributes to improving film purity. For more details, please contact us or refer to the catalog.

Company：真空デバイス本社
Price：1 million yen-5 million yen

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Magnetron Sputtering Device MSP-1S

For SEM samples. It is a sample-friendly magnetron-type ion coater.

The Magnetron Sputtering Device MSP-1S allows for coating at low voltage and features a floating sample stage, ensuring no damage to the samples. It is a magnetron-type ion coater that is gentle on samples. Its compact size means it doesn't take up much space and can operate in a corner of your desk. For more details, please contact us or refer to the catalog.

Company：真空デバイス本社
Price：500,000 yen-1 million yen

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Magnetron Sputtering Device MSP-20TK

It is a coating device for tungsten thin films for electron microscopes.

The Magnetron Sputtering Device MSP-20-TK is a tungsten coating device for applying conductive treatment to electron microscope samples. By adopting a magnetron target, it minimizes sample damage. For more details, please contact us or refer to the catalog.

Company：真空デバイス本社
Price：1 million yen-5 million yen

Plasma surface treatment equipment
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Multi-film deposition device VES-10

Complete integration of hydrophilic treatment, deposition equipment, and ion sputtering functions.

The multi-film deposition device VES-10 is a compact tabletop unit that fully integrates hydrophilic treatment, deposition, and ion sputtering functions. It deposits replacement leads for mechanical pencils. It uses a magnetron target for low-damage sputtering. The operations for ion sputtering and hydrophilic treatment are fully automated, allowing for automatic execution from the start of evacuation to the end of coating. Function switching is easy with just one button. For more details, please contact us or refer to the catalog.

Company：真空デバイス本社
Price：1 million yen-5 million yen

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IONIX® Magnetron Sputter Source

The unique cooling water pathway allows the entire magnetron to be cooled at a constant temperature at all times.

We handle the rectangular type 'IONIX® Magnetron Sputter Source'. It can be installed both internally and externally. Thanks to its unique cooling water pathway, the entire magnetron can be cooled to a constant temperature at all times. Additionally, it supports KF, ISO, and CF connections, and with its unique magnetic pole arrangement, it is compatible with the UMBS configuration. 【Features】 ■ Constant temperature cooling for the entire unit ■ Installable both internally and externally ■ Supports KF, ISO, and CF connections ■ Compatible with UMBS configuration due to unique magnetic pole arrangement ■ Cooling structure that does not put stress on the target, preventing deformation of the target *For more details, please refer to the PDF document or feel free to contact us.

Company：フォーユー
Price：Other

Cooling system
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Three-Element Magnetron Sputtering Device 'NS-023'

Development of new thin films using simultaneous three-source sputtering! Customizable according to experimental content and budget.

The NS-023 is a ternary magnetron sputtering device capable of simultaneously depositing three types of targets. In addition to multi-target simultaneous sputtering, it supports various applications by adopting a platinum heater for high-temperature activation of the substrate (heater temperature: 950°C) and reactive sputtering. Additionally, it can accommodate assist plasma sources (ECR, ICP, etc.). 【Features】 ■ Capable of simultaneously depositing three types of targets ■ Supports various applications beyond multi-target simultaneous sputtering ■ Customizable according to experimental content and budget ■ Compatible with assist plasma sources *For more details, please refer to the PDF document or feel free to contact us.

Company：片桐エンジニアリング
Price：Other

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Experimental small-scale sputtering device

Three types of targets can be installed! The substrate is automatically transported in a vacuum!

It automatically performs everything from vacuum pumping to substrate transport and sputtering. With its compact design, it is optimal as an experimental device without taking up much space. ~Features~ - The main pump uses a turbo molecular pump. - The sputtering chamber, where the film is deposited, is separated from the chamber where the film is retrieved by a gate valve. After setting the substrate, it is automatically transported in a vacuum. - Up to three types of targets can be installed. - The substrate moves under the targets in the order set, using an automatic rotation mechanism for film deposition.

Company：富士アールアンドディー
Price：Other

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Multi-film deposition device for development: "PVD for R&D"

Magnetron sputtering, thermal evaporation, and EB compatible! A composite film deposition device for the development of IoT and automotive devices.

The "PVD for R&D" is a multi-layer deposition device designed for development purposes. It supports magnetron sputtering, thermal evaporation, and E-Beam. It boasts a delivery record of over 400 units worldwide. With a modular design, combinations can be customized according to your needs. 【Features】 ■ Development-focused deposition device specialized for R&D ■ Over 400 units delivered to renowned research institutes, universities, and companies ■ Combinations of magnetron sputtering, thermal evaporation, and E-Beam are possible (Combinations can also be changed through modifications) *For more details, please refer to the PDF document or feel free to contact us.

Company：日立ハイテク
Price：Other

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In-Line Sputtering System

Equipment for coating a thin film on a flat glass substrate.

The In-Line Sputter System is equipment for coating thin films on flat glass substrates, making it highly competitive for continuous mass production.

Company：ＳＵＫＷＯＮ
Price：Other

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Coater
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Batch Type Sputtering System

A method of production that mounts a substrate in a single chamber.

The Batch Type Sputtering System is a method that mounts substrates in a single chamber, allowing for significant cost reductions.

Company：ＳＵＫＷＯＮ
Price：Other

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Heating Sample Stage Unit 'TP-HEA-1'

The sample part is vacuumed for insulation! Heating stage unit for transmission measurement.

The "TP-HEA-1" is a heating stage unit for transmission measurements that can be mounted on the terahertz spectrometer "TeraProspector." The sample section is used under vacuum for insulation. The vacuum is manually created after the sample is set, and the unit, sealed under vacuum, is placed in the sample chamber for measurement. The temperature is monitored at the metal part that contacts the sample and controlled by an electric heater. A chiller is used for heat dissipation, circulating cooling water. 【Features】 ■ The sample section is used under vacuum for insulation. ■ The temperature is monitored at the metal part that contacts the sample. ■ A chiller and circulating cooling water are used for heat dissipation. *For more details, please refer to the PDF document or feel free to contact us.

Company：日邦プレシジョン
Price：Other

Spectroscopic Analysis Equipment
Testing Equipment and Devices
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Polarization Measurement Sample Stage UNIT 'TP-POL-1'

Can be mounted on a terahertz spectrometer! A stage for measuring the effects of polarization due to the sample.

The "TP-POL-1" is a stage designed to measure the effects of polarization by samples that can be mounted on the terahertz spectrometer "TeraProspector." It consists of a polarizer that cuts off components of the incident and detected signals other than the horizontal polarization component, and a sample holder that allows for the rotation of the inserted sample. 【Specifications】 ■ Model: TP-POL-1 ■ Sample rotation angle: 360° (can be set to any angle manually) ■ Extinction ratio: <10^-4 *For more details, please refer to the PDF document or feel free to contact us.

Company：日邦プレシジョン
Price：Other

Spectroscopic Analysis Equipment
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Magnetron Sputtering Device "LA-S2020"

Magnetron sputtering equipment that can also be made as a film thickness electrode for various devices and sensors.

Labotech Co., Ltd.'s "LA-S2020" is a 2-inch magnetron DC sputtering device with a counter-parallel disk type. It allows for metal (Au/Pt, etc.) coating when observing non-conductive samples using a scanning electron microscope (SEM). This sputtering device can produce thin film electrodes (below 50nm) for various devices and sensors. It achieves efficient glow discharge with simple operations in a short time, enabling the production of sputtered films with excellent granularity. 【Features】 ■ Easy operation ■ High efficiency ■ Low cost *For more details, please contact us or download the catalog.

Company：ラボテック
Price：500,000 yen-1 million yen

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Small sputtering device

The compatible substrate can be processed up to a maximum of φ1 inch! Equipment equipped with a dual gas nozzle.

The "Compact Sputtering Device" is a laboratory high-vacuum thin film deposition system equipped with a 1.3-inch magnetron sputter cathode. It is equipped with an RF power supply with a matching unit for discharge. It features a dual gas nozzle capable of supporting oxidation reaction sputtering. Additionally, it can process substrates up to a maximum diameter of 1 inch. 【Features】 ■ Equipped with a 1.3-inch magnetron sputter cathode ■ Comes with an RF power supply with a matching unit for discharge ■ Features a dual gas nozzle capable of supporting oxidation reaction sputtering ■ Can process substrates up to a maximum diameter of 1 inch *For more details, please refer to the external link page or feel free to contact us.

Company：和泉テック
Price：Other

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Osmium coater

Can coat osmium with low damage!

We handle the "Osmium Coater," a device that coats high magnification SEM samples, delicate organic materials, and samples with complex surface structures with low-resistance osmium metal (amorphous & fine particles) for conductive treatment. It adopts the "low-voltage discharge CVD method using a hollow cathode sample stage." High-density plasma is generated throughout the entire hollow cathode cylinder, allowing for uniform coating, making it recommended for those concerned about sample size or height. 【Lineup】 ■HPC-1SW 　・CH size: Inner diameter 120mm × Height 90mm 　・Sample size: φ95mm, Height 40mm ■HPC-20 　・CH size: Inner diameter 120mm × Height 77mm 　・Sample size: φ95mm, Height 45mm *For more details, please download the PDF or feel free to contact us.

Company：ユニオン
Price：Other

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2-inch 2-yuan sputtering device 'HMS2-300'

The flat heater can heat up to a maximum of 600°C! A sputtering device compatible with film formation under vacuum and gas replacement atmospheres!

The "HMS2-300" is a 2-inch dual-target sputtering device capable of heating up to 600°C through flat heater heating, allowing for film formation at high temperatures. It supports film formation under vacuum and gas replacement atmospheres. It is equipped with a 2-inch magnetron sputter cathode and can be expanded to a maximum of three targets. Options include an L/L chamber, a movable film thickness gauge, and a bias mechanism. 【Features】 ■ Capable of heating up to 600°C through flat heater heating ■ Supports film formation under vacuum and gas replacement atmospheres ■ Equipped with a 2-inch magnetron sputter cathode (expandable to a maximum of three targets) ■ Options for L/L chamber, movable film thickness gauge, and bias mechanism ■ Compact installation space of W535×D1000×H1800mm *For more details, please refer to the PDF document or feel free to contact us.

Company：ハイブリッジ東京営業所
Price：Other

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Solve the challenges of conventional sputtering technology with "RAM Force"!

Reduce damage to the substrate by over 60%! Improve film formation speed while maintaining low damage characteristics.

"RAM Force" is a roll-to-roll sputtering device that can perform multilayer film deposition of optical films and metals on plastic films. Not only can it evaluate the performance of RAM cathodes (low-damage cathodes), but it also allows you to test your applications under lab conditions and transition from pilot lines to mass production lines. 【Features】 ■ Patent obtained ■ Reduces damage to substrates by over 60% * Comparison between conventional planar sputtering and RAM cathodes ■ Increases deposition speed by more than three times * Comparison between conventional opposing sputtering and RAM cathodes ■ Unique technology from Keihin Lamtech * For more details, please refer to the PDF materials or feel free to contact us.

Company：京浜ラムテック
Price：Other

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RAM Cathode Principle

Solved the conventional issues! Significantly improved the film formation speed while maintaining low damage characteristics.

In conventional planar sputtering, significant damage was inflicted on the substrate, and in opposing sputtering, the film deposition rate was slow, posing practical challenges. Our "RAM Cathode" successfully generates dense plasma near the target surface by surrounding the target on all sides. By having argon ions collide with great force against the target, we have resolved the issues that existed until now. 【Features】 ■ Reduces damage to the substrate by over 60% compared to conventional planar cathodes ■ Achieves a film deposition rate more than three times that of conventional opposing cathodes *For more details, please refer to the PDF document or feel free to contact us.

Company：京浜ラムテック
Price：Other

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Powder sputtering device

We also support contract film formation and on-site experiments based on customer-requested samples!

The "Powder Sputtering Device" is a machine that coats thin films on the surface of powders with a diameter of a few micrometers using vacuum and plasma. It has a stirring mechanism based on a barrel swing motion, allowing for film formation using RF or DC sputtering methods. Applications are expected in preventing the deterioration of powder materials, controlling the electrical conductivity of powder surfaces, and resource conservation through thin film formation of rare materials. 【Features】 ■ Uniform film formation with the stirring mechanism ■ No chemical reactions required ■ High purity and strong adhesion of the film *For more details, please download the PDF or feel free to contact us.

Company：エイ・エス・ディ技術研究所
Price：Other

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Parallel Moving 3D RF Sputtering Device 'MSS600-3'

Control of sputter pressure is possible with gas introduction and pressure control valves!

The "MSS600-3" is a three-dimensional RF sputtering device using a rectangular cathode measuring W100 x H500mm. The substrate size is W200 x H300mm, and it is deposited while being transported in the X direction. Additionally, the substrate can be set to any time between 30 seconds and 15 hours, allowing for film thickness adjustment and various types of heterogeneous layered film deposition. 【Features】 ■ Automatic sputtering function enables labor-saving long-duration sputtering work. ■ Uses a rectangular cathode manufactured by GenCore, allowing for uniform sputter gas introduction near the target. ■ The process chamber is divided into three rooms with rotating shutters to prevent sputter contamination diffusion. ■ Sputtering is possible while moving the substrate at a constant speed, among other features. *For more details, please download the PDF or feel free to contact us.

Company：愛知真空
Price：Other

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Sputtering device 'Star.500-EOSS(R)'

Developed for the purpose of achieving high uniformity and excellent reproducibility in the deposition of optical multilayer films!

We handle the 'Star.500-EOSS(R)' from the German company FHR. The 'Star.500-EOSS(R)' is a magnetron sputtering system designed for optical filter film deposition. To minimize particles during film deposition, a sputter-up method is employed. It accommodates flat and curved substrates up to 200mm in diameter, and a substrate heating mechanism can also be integrated. 【Features and Benefits】 ■ Outstanding reproducibility of optical multilayer films ■ Excellent film thickness uniformity ■ Improvement in film quality and defect-free deposition achieved through the combination of a cylindrical sputter cathode and sputter-up ■ Long target life and minimized variations in deposition rate due to cylindrical targets ■ Fully automated process control *For more details, please download the PDF or contact us.

Company：ティー・ケイ・エス
Price：Other

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Magnetron sputtering device for high-precision optical filter film deposition

The "FHR.Star.600-EOSS" is a high-performance magnetron sputtering device developed for precise optical filter film deposition.

We will demonstrate our capabilities in the stable production of high-performance optical filters that require multilayering and high reproducibility, such as LiDAR applications, which are expected to see significant demand in the future. - Film formation that eliminates the effects of film quality changes due to target wear using a cylindrical cathode - Stable film formation of oxide films using a reactive ion source - Film formation of a wide range of multilayer films with up to four cathodes This is a device specialized for high-quality optical thin film deposition. Features: ■ Outstanding reproducibility of optical multilayer films ■ Excellent film thickness uniformity ■ Improvement of film quality and defect-free deposition through the combination of cylindrical cathodes and sputter-up ■ Continuous monitoring of the film formation state through in-situ monitoring ■ Fully automated process control *For more details, please refer to the PDF document or feel free to contact us.

Company：ティー・ケイ・エス
Price：Other

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Sputtering device FHR.Star100-Tetra-Co

FHR Star.100-Tetra Co is a very compact sputtering device designed for MEMS and high-performance optical products.

This system is equipped with three sputtering sources and a pre-cleaning etcher, all arranged in a confocal shape, and it is also possible to add a load lock and a transport chamber to enhance productivity. The sputtering sources are equipped with a 100mm diameter shutter, which allows for film deposition control by managing this shutter. Additionally, the distance between the source and the substrate can also be controlled. These controls are optimized for film deposition through auto-control via programming. Main applications: Manufacturing of MEMS products and high-performance optical products Dimensions (L×W×H): 2.3 m × 1.3 m × 2.1 m Weight (with load lock): 1,700 - 2,000 kg Maximum substrate size: Diameter 150 mm Maximum substrate carrier: Diameter 220 mm Compatible process gases: Argon, oxygen, and others For more details, please contact us.

Company：ティー・ケイ・エス
Price：Other

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Remote plasma ion beam sputtering device

We achieve film formation by freely controlling reactive sputtering and alloy sputtering.

Independent current control is performed for the ion source, target, and substrate. With independent control, not only the sputter rate but also various reactive sputtering processes such as oxide and nitride films can be freely controlled. This device strongly supports advanced material research and process development, enabling the deposition of difficult-to-deposit materials such as ferromagnetic films, Co-sputtering of metal and ceramic targets, and dielectric/insulating films from metal targets. Independent control of ion supply and sputter rate → Control of sputter rate, film quality, and crystal structure → Control of ionization rate of target materials High-directionality film deposition → High-directionality film deposition characteristic of ion beam sputtering Multi-target mechanism → Wide-ranging multilayer film deposition Independent control of multiple targets → Co-sputtering alloy deposition by controlling the sputter rate of each target → Multilayer deposition by switching targets Conformal film deposition through bias application control to the substrate → Conformal film deposition even under adverse conditions such as deep trenches and overhangs.

Company：ティー・ケイ・エス
Price：Other

Sputtering Equipment
Plasma Generator
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Production Remote Plasma Ion Beam Sputtering Device

Optimal solution for high-rate reactive film deposition production equipment.

By using a helicon plasma source as the ion source, this groundbreaking method accelerates high-density ions obtained from it by applying a bias voltage to the target, achieving high-rate and highly directional film deposition. Independent current control for the ion source, target, and substrate allows for precise control of not only the sputtering rate but also various reactive sputtering processes such as oxide and nitride films. It enables high-rate film deposition of materials that are difficult to deposit with conventional equipment, such as ferromagnetic materials and dielectric/insulating films from metal targets. <Features> ■ High-speed, high-efficiency ion beam sputtering Optimal solution for dielectric and ferromagnetic targets ■ Helicon plasma ion source and target application Achieves both high-speed sputtering and low contamination Reduces running costs by improving target utilization efficiency Low maintenance due to gridless structure Sputtering while keeping the substrate at low temperatures through remote plasma configuration ■ Single wafer processing Improved step coverage Composite film deposition using cluster tools ■ Excellent directionality High-directionality ion beams enable uniform film thickness deposition, resulting in excellent step coverage in film formation.

Company：ティー・ケイ・エス
Price：Other

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Sputtering Equipment Product List and Ranking from 50 Manufacturers, Suppliers and Companies | IPROS GMS

Sputtering Equipment Manufacturer, Suppliers and Company Rankings

Sputtering Equipment Product ranking