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Sputtering Equipment Product List and Ranking from 43 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Sep 24, 2025~Oct 21, 2025
This ranking is based on the number of page views on our site.

Sputtering Equipment Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Sep 24, 2025~Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. テルモセラ・ジャパン 本社 Tokyo//Industrial Electrical Equipment
  2. 神港精機 東京支店 Tokyo//Industrial Machinery
  3. サンユー電子 Tokyo//Testing, Analysis and Measurement
  4. 4 Bühler K.K. Kanagawa//Food Machinery
  5. 5 ジャパンクリエイト Saitama//Testing, Analysis and Measurement

Sputtering Equipment Product ranking

Last Updated: Aggregation Period:Sep 24, 2025~Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. 【nanoPVD-S10A】Magnetron Sputtering Device テルモセラ・ジャパン 本社
  2. Desktop RF Sputtering Device 'SVC-700RFIII' サンユー電子
  3. HELIOS Sputtering Device for Optical Thin Films Bühler K.K.
  4. 4 Semi-automatic grinding device for steel samples SAB-2-200 ハルツォク・ジャパン
  5. 5 Supports multiple metals! It is an ultra-compact coater in the smallest class in the industry. サンユー電子

Sputtering Equipment Product List

16~30 item / All 136 items

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Multi-target sputtering device

Achieving a substrate temperature of 900℃! Equipped with a 3-axis mechanism on the substrate stage to realize a uniform film thickness distribution.

The "Multi-Target Sputtering System" is equipped with up to four sputter cathodes, enabling the deposition of layered films such as metal films and oxide films. It is also compatible with combinations of CVD chambers, evaporation chambers, plasma cleaning chambers, etc. Additionally, it features a three-axis mechanism (elevation, revolution, rotation) on the substrate stage to achieve a uniform film thickness distribution. 【Features】 ■ Equipped with our proprietary sputter cathodes ■ Incorporates our unique rapid elevation and heating mechanism for substrates, achieving substrate temperatures of 900°C ■ Capable of mounting up to four sputter cathodes for the deposition of layered films such as metal films and oxide films ■ Supports tray transport ■ Compatible with combinations of CVD chambers, evaporation chambers, plasma cleaning chambers, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Sputtering Equipment

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Sputtering device for three-dimensional objects

Achieve high coverage in three-dimensional object film formation! Equipped with up to three sputter cathodes, it enables the layered deposition of metal films, oxide films, and more!

The "Sputtering Device for Three-Dimensional Objects" is equipped with our proprietary sputter cathode. It features a 4-axis mechanism (elevation, revolution, rotation, tilt) on the work stage, achieving high coverage in the deposition of three-dimensional objects. It also includes a heating mechanism and bias power supply, enabling reverse sputtering, high-temperature sputtering, and film stress control. It can accommodate up to three sputter cathodes, allowing for the layered deposition of metal films, oxide films, and more. 【Features】 - Equipped with our proprietary sputter cathode - 4-axis mechanism on the work stage achieves high coverage in the deposition of three-dimensional objects - Can accommodate up to three sputter cathodes for layered deposition of metal films, oxide films, etc. - Custom orders can also be manufactured - Sample processing is conducted using a demonstration machine *For more details, please refer to the PDF document or feel free to contact us.

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High-Rate Deposition. Piezoelectric Film Formation Sputtering Device

For semiconductors, MEMS, electronic components, etc.! High-speed and stable continuous film deposition is possible from single crystal epitaxial buffer layers to piezoelectric films!

The "Piezoelectric Film Formation Sputtering Device" is a product capable of detecting elements that contribute to the reduction of piezoelectric properties, thanks to the incorporation of a plasma emission monitor. It allows for continuous film formation from a single crystal epitaxial buffer layer to the piezoelectric film. Additionally, high-speed and stable reactive sputter deposition is possible through plasma analysis and feedback control using a luminescence analysis system. Equipped with our unique rapid temperature rise and fall substrate heating mechanism, it achieves a substrate temperature of 900°C. 【Features】 ■ Deposition structure that maximizes the axis length contributing to piezoelectricity ■ Equipped with our proprietary sputter cathode ■ Compatible with moving magnets, allowing for full-area erosion ■ Tray transport compatibility ■ Combinations with CVD chambers, deposition chambers, plasma cleaning chambers, etc., are also supported *For more details, please refer to the PDF document or feel free to contact us.

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Screw stirring type powder sputtering device

Space-saving and large capacity! Custom-made options are also available to meet various requests!

This product is a device that applies our specialized sputtering technology to form films on various three-dimensional shapes made of metal, ceramics, and resin. It can be used for applications such as cosmetics, electronic components, battery parts, and the development of high-performance materials. In addition, we can propose various devices for miniaturization/large-scale production, CVD/various plasma treatments, and barrel/drum types. 【Features】 ■ Space-saving ■ Large capacity ■ Equipped with a unique sputter cathode ■ Screw-type stirring mechanism *For more details, please refer to the PDF materials or feel free to contact us.

  • Sputtering Equipment

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Barrel/drum-type powder sputtering device

Powder agglomeration measures are possible! Custom-made solutions tailored to various requests can also be produced!

This product is a device that applies our specialized sputtering technology to form films on various three-dimensional shapes made of metal, ceramics, and resin. It can be used for applications such as cosmetics, electronic components, battery parts, and the development of high-functionality materials. In addition, we can propose various devices for miniaturization/large-scale production, CVD/various plasma treatments, barrel/drum types, and more. 【Features】 ■ Space-saving ■ Large capacity ■ Equipped with a unique sputter cathode ■ Stirring mechanism *For more details, please refer to the PDF materials or feel free to contact us.

  • Sputtering Equipment
  • Plasma surface treatment equipment
  • Other surface treatment equipment

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RF sputtering device "SP-3400"

Inverted sputtering is also possible! Equipped with a 500W high-frequency power supply, it can deposit metals, oxides, insulators, and more.

The "SP-3400" is an RF sputtering device equipped with three sources for 3-inch cathodes. It features a single 500W high-frequency power supply, enabling the deposition of metals, oxides, insulators, and more. By incorporating two automatic matching units, it allows for reverse sputtering through switching, and it also comes standard with a substrate rotation mechanism to improve the film thickness distribution during deposition. The device uses an operational touch screen, making it easy for beginners to perform automatic operation of the exhaust system, and it is equipped with safety circuits to prevent malfunctions. 【Features】 ■ Three sources for 3-inch cathodes ■ One 500W high-frequency power supply ■ Capable of depositing metals, oxides, insulators, etc. ■ Reverse sputtering is possible by switching with two automatic matching units ■ Standard substrate rotation mechanism to improve film thickness distribution during deposition ■ Operational touch screen for easy automatic operation of the exhaust system, even for beginners *For more details, please refer to the PDF document or feel free to contact us.

  • Sputtering Equipment

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Small sputtering device

Achieve space-saving with a compact design! An ideal sputtering device for university and private research labs (researcher pricing).

Since its establishment in 1964, South Korea's A-tech has been providing thin film manufacturing equipment tailored to customer needs. The Desktop Pro is a compact, high-performance sputtering device that can be installed on a desktop and offers economic advantages. It is ideal for material property research, product QC and QA, and semiconductor failure analysis. ■ For details, please download the catalog ■ ● Inquiries: 03-5472-1722 (TEL)

  • Sputtering Equipment

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RF sputtering device for research and development experiments

Customization according to experimental purposes is possible. Small RF sputtering device.

☆Metal thin films, of course, as well as small RF sputtering devices for the production of insulating films/oxide films☆ Recommended POINT <Customization according to experimental purposes!!> 1. Three types of chambers available to match sample sizes 2. Cathode sizes compatible from 2 to 6 inches 3. The 2-inch cathode type also supports a three-source configuration = Achieving thin film stacking 4. A variety of options available Substrate heating unit / Substrate cooling unit / MFC unit, etc.

  • Coater

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RF sputtering device for research and development experiments

Customizable to fit experimental purposes. Small RF sputtering device.

A compact RF sputtering device compatible with the production of metal films, as well as insulating films/oxide films. 【Features】 ○ Three types of chambers available to match sample sizes 〇 Cathode sizes compatible with 2, 4, and 6 inches 〇 The 2-inch cathode type also supports a three-source configuration ⇒ Enables the production of stacked films 〇 A variety of options available   Substrate heating unit / Substrate cooling unit / MFC unit, etc.

  • SVC-700RF?.jpg
  • Sputtering Equipment

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Research and development sputtering equipment

This is a research and development sputtering device suitable for various film deposition applications, featuring high-level specifications and a wide range of options.

Features ■ Adopts a clean side sputtering method ■ Available in two models: load-lock type and batch type ■ Easy operation and film formation condition management via a touch panel, with a device concept that facilitates maintenance ■ Compact design that does not require much installation space ■ A wide range of options to meet customer requests and applications ■ Supports low-temperature and high-temperature sputtering ■ Standard equipped with a sputtering source that provides good distribution over a wide area (within ±5% (for SiO2 within φ170mm)) ■ Automatic transport options available for small-scale production and nighttime automatic operation ■ Applications - Organic EL, solar cells, optical components, bio, semiconductor and electronic components, automotive and resin, special films, MEMS ■ Typical film formation materials - Dielectric films and others SiN, SiO2, ZrO, TiO2, polymer films - Transparent conductive films ITO, ZnO - Metal films and others Au, Ag, Cu, Si, Ti, Sn, Cr, Al, Ni, DLC, electromagnetic wave shielding

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Sputtering device

Sputtering device

This is a film deposition device that utilizes the phenomenon of sputtering, where atoms or molecules that have been ionized and accelerated collide with a solid surface, causing solid material to be ejected from the surface. It has high industrial value because it can be applied to high melting point metals, alloy materials, dielectrics, and insulating materials.

  • Sputtering Equipment
  • Testing Equipment and Devices
  • Other laboratory equipment and containers

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Pressure Gradient Type Sputtering Device "PGS model"

We will introduce a device capable of forming low-damage, high-quality thin films through a high route.

The "PGS Model" is a revolutionary sputtering device that employs the pressure gradient phenomenon. It enables sputter deposition in a high vacuum environment. Additionally, it can form low-damage, high-quality thin films through a high route. This product is the result of collaborative research with Kyushu University, Meijo University, and Okayama University of Science. 【Features】 ■ Utilizes the pressure gradient phenomenon ■ Enables sputter deposition in a high vacuum environment ■ Result of collaborative research with Kyushu University, Meijo University, and Okayama University of Science *For more details, please refer to the PDF materials or feel free to contact us.

  • Other physicochemical equipment

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Multi-source RF sputtering device with glove box

A research membrane environment that aims to eliminate oxygen and moisture! Supports multilayer membranes, compound membranes, and reactive membranes!

This product is a sputtering device for the development of batteries, catalyst materials, and organic devices. It connects a load lock chamber and a glove box to the sputtering chamber. It can accommodate four UHV-compatible sputter cathodes. Additionally, it supports multilayer films, compound film deposition, and reactive film deposition. 【Features】 ■ For the development of batteries, catalyst materials, and organic devices ■ Connects a load lock chamber and a glove box to the sputtering chamber ■ Can accommodate four UHV-compatible sputter cathodes ■ Research film deposition environment that eliminates oxygen and moisture ■ Supports multilayer films, compound film deposition, and reactive film deposition *For more details, please refer to the PDF document or feel free to contact us.

  • Sputtering Equipment

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Small-scale research ion beam sputtering device

Experimental device equipped with an ion source, applicable for ultra-thin film multilayer deposition in precision optics.

The "Ion Beam Sputtering Device" from OSI is an experimental device equipped with an ion source that can be customized to meet the usage needs of customers. It demonstrates capabilities equivalent to Veeco's SPECTOR. It uses RF ion sources for sputtering and for assist applications, making it suitable for the deposition of ultra-thin multilayer films in precision optics, equipped with OMS or OTM software. 【Features】 ■ Experimental device equipped with an ion source ■ Equipped with capabilities equivalent to Veeco's SPECTOR ■ Ideal for ultra-thin multilayer film deposition in precision optics with OMS or OTM software ■ Customizable to meet usage needs For more details, please contact us or download the catalog.

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Sputtering device

Sputtering device

We offer the "Mirrortron sputtering device," which features unique technology developed by Choshu Industries and employs a counter-target method. It achieves low plasma damage and low substrate temperatures while allowing for the desired functional films to be obtained. In the organic EL field, it is ideal for forming transparent conductive films and sealing films in top-emission structures. We provide optimal processes across various fields, including organic devices such as organic solar cells and organic semiconductors, electronic components, and resin films. Additionally, we also offer sputtering devices using parallel plate and cylindrical methods.

  • Sputtering Equipment

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