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Sputtering Equipment Product List and Ranking from 43 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

Sputtering Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. テルモセラ・ジャパン 本社 Tokyo//Industrial Electrical Equipment
  2. 神港精機 東京支店 Tokyo//Industrial Machinery
  3. サンユー電子 Tokyo//Testing, Analysis and Measurement
  4. 4 Bühler K.K. Kanagawa//Food Machinery
  5. 5 ジャパンクリエイト Saitama//Testing, Analysis and Measurement
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Sputtering Equipment Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. 【nanoPVD-S10A】Magnetron Sputtering Device テルモセラ・ジャパン 本社
  2. Desktop RF Sputtering Device 'SVC-700RFIII' サンユー電子
  3. HELIOS Sputtering Device for Optical Thin Films Bühler K.K.
  4. 4 Semi-automatic grinding device for steel samples SAB-2-200 ハルツォク・ジャパン
  5. 5 Supports multiple metals! It is an ultra-compact coater in the smallest class in the industry. サンユー電子

Sputtering Equipment Product List

61～75 item / All 136 items

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Combinatorial Magnetron Sputtering System CMS-6420

Combinatorial Magnetron Sputtering System CMS-6420

Effective area of a 25mm side triangle! It forms a composition distribution of hundreds of conditions on a single substrate.

The "CMS-6420" is a 6-component combinatorial magnetron sputtering device developed to expand the film deposition area, which has been difficult to achieve with the PLD method. The effective area is a triangle with sides of 25mm. Since it uses a 4-inch wafer as the standard substrate, it can be integrated into subsequent processes such as patterning and etching, enabling high throughput not only for film deposition but also for analysis. 【Features】 ■ Compatible with 4-inch wafers suitable for process lines ■ Effective area: triangle with sides of 25mm ■ Supports binary and ternary combinatorial film deposition ■ LabVIEW recipe input and automatic film deposition ■ Maximum 6-component configuration (6 units of 2-inch cathodes for matrix use) *For more details, please refer to the PDF document or feel free to contact us.

  • Sputtering Equipment

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[Static Electricity Countermeasures] ~ Film Coating ~

[Static Electricity Countermeasures] ~ Film Coating ~

Rich experience in processing various materials and substrates! Electromagnetic wave shielding, static electricity prevention, surface heating elements, etc.

Introducing the 'Sputtering Processing' of Sekisui Nano Coat Technology. - Compatible with non-woven fabrics, filters, fibers, and more. We also own sputtering equipment capable of handling widths up to 3400mm. Please feel free to consult us regarding thin film product development/sales, contract film formation processing, prototypes, and more. 【Features】 ■ Three technical axes: Optical adjustment, conductivity, antibacterial/antiviral ■ Proven track record in diverse applications/functions ■ Extensive processing experience with various materials and substrates - Materials: Various metals, alloys, compounds; Substrates: Films, metal foils, paper, etc. ■ Sputtering processing on fibers - Examples: Chemical fibers, carbon fibers, glass fibers, non-woven fabrics, etc. *For more details, please refer to the PDF materials or feel free to contact us.

  • Sputtering Equipment

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Nanomaterial film deposition solution

Nanomaterial film deposition solution

Suitable for the film formation of nanomaterials (metal nanoparticles, nanowires, nanosheets, materials for nanoelectronics)!

The "TFE News Sputtering Series" is a research and development as well as small-scale production system with a variety of functions. It is a compact sputtering device capable of high-temperature film deposition of metal films and dielectric films for nanomaterials such as metal nanoparticles, nanowires, and nanosheets, with temperatures up to 800°C. Additionally, it offers the option of manual or automatic load lock, and features complete automatic control via PLC and PC, as well as remote control over the internet. This sputtering device is recommended for engineers seeking high substrate heating temperatures (maximum heating temperature: 800°C) for thin film deposition of nanomaterials. 【Features】 ■ Suitable for thin film deposition of nanomaterials (metal nanoparticles, nanowires, nanosheets, materials for nanoelectronics) ■ Capable of 800°C substrate heating, which is difficult with other devices ■ Cost-effective sputtering with substrate rotation *For more details, please feel free to contact us.

  • Sputtering Equipment

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Tabletop Magnetron Sputtering Device "FDS/FRS Series"

Tabletop Magnetron Sputtering Device "FDS/FRS Series"

Reduce initial implementation costs and enable high performance through expansion! Upgrade according to the research stage.

The "FDS/FRS Series" is a tabletop magnetron sputtering device for research and development, equipped with the necessary functions. The basic specifications consist of a DC sputter/single cathode/rotary pump configuration for metal thin film sputtering. With expansion options such as RF conversion, additional cathodes, and turbo molecular pump specifications, it is possible to upgrade according to the research stage. 【Features】 ■ Keeps initial introduction costs low while allowing for high performance upgrades later ■ Comes with an MFC for argon in the basic specifications, enabling precise control of gas flow ■ Adopts a deposition-up method to prevent dust from adhering to the sample during film formation ■ Utilizes a high vacuum-sealing SUS chamber despite being a tabletop type *For more details, please refer to the PDF materials or feel free to contact us.

  • Sputtering Equipment

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CLUSTERLINE family - Supporting from wafers to panels.

CLUSTERLINE family - Supporting from wafers to panels.

A film deposition platform for semiconductor wafers and advanced packaging capable of various film deposition treatments.

"CLUSTERLINE" is a film deposition family for semiconductor wafers and advanced packaging from Evatec. It features a cluster architecture with fully automated processing from cassette to cassette for wafers up to 12 inches. It provides film deposition solutions for semiconductor advanced packaging, wafer front-end processes, power devices, wireless, optical thin films, and optoelectronic integration, including metals, piezoelectric films, and insulating films. You can choose tools for single wafer processing or batch processing using a combination of single process modules (SPM) capable of PVD, ALD, PECVD, etching, etc., or batch process modules (BPM).

  • Sputtering Equipment
  • Etching Equipment
  • CVD Equipment

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Sputtering Device QKG-Sputtering

Sputtering Device QKG-Sputtering

Film formation completed without exposure to the atmosphere in full auto! ~Sample measurement in progress!~

The conventional sputtering devices struggled with "film formation of multiple materials within a single badge," but this has been made possible by adopting a work mask, allowing the film formation to be completed in full auto mode without exposing the samples to the atmosphere. - Space-saving benefits for the workspace - Increased reproducibility of film formation - Reduced man-hours, decreased errors, and improved morale - Full auto film formation with one button → efficiency benefits - Cost reduction in materials with a 1-inch cathode Please consult us for jigs and customizations to achieve high-precision sputtering.

  • Sputtering Equipment

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Research and development spatula device 'HSK602VTA'

Research and development spatula device 'HSK602VTA'

Achieving space-saving! A sputtering device optimal for the formation of alloy films and stacked films through simultaneous discharge.

The "HSK602VTA" is a sputtering device equipped with six small cathodes, each having its own shutter and power supply, making it ideal for the formation of alloy films and multilayer films through simultaneous discharge. It features a revolver-type 4-sample holder, allowing for film deposition under four different conditions with a single vacuum pump-down. Additionally, its compact design achieves space-saving benefits. 【Features】 ■ Compact design ■ 6 cathodes ■ Equipped with a revolver-type 4-sample holder ■ Capable of film deposition under four conditions at once *For more details, please refer to the catalog or feel free to contact us.

  • Sputtering Equipment

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Vacuum Device Design and Manufacturing Case Study [Sputtering Device]

Vacuum Device Design and Manufacturing Case Study [Sputtering Device]

We will design and manufacture the vacuum equipment you desire with a short delivery time!

Introducing the features of vacuum container manufacturing by Cosmo Science! Please refer to the information below.

  • Contract manufacturing

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Simple experimental sputtering device

Simple experimental sputtering device

Two models: manual batch type and simple load lock type. The simple load lock type enables the mass production process of compound semiconductors. Currently accommodating sample tests and equipment tours.

This product is a simple and cost-effective sputtering device that covers everything from basic research to advanced process development. We offer two models: a fully manual, low-cost batch type and a simplified load lock type equipped with a manual transport mechanism. Both models achieve significant cost reductions while maintaining the process performance of higher-end models. We provide consistent and careful support from sample testing and specification compliance to post-delivery follow-up. 【Features】 ■ Reasonable cost and high process performance ■ High reliability capable of handling small-scale production ■ A wide range of options and flexible hardware support backed by extensive track records ■ Supports process development in advanced thin film development with load lock mechanisms and pre-deposition testing ■ A demo unit is permanently available for sample testing *For more details, please refer to the PDF document or feel free to contact us.

  • Sputtering Equipment
  • Plasma surface treatment equipment

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Ultra-High Vacuum Sputtering Equipment (Model STM2323)

Ultra-High Vacuum Sputtering Equipment (Model STM2323)

Ideal for research and development of advanced thin film devices. A customizable single-sheet ultra-high vacuum inline system. Responding to demands with a wealth of options and flexible support.

A super high vacuum sputtering device with exhaust performance of 10⁻⁷ Pa. It is equipped with a cassette chamber, transfer chamber, etching chamber, and multiple sputtering chambers in a standard configuration. It achieves efficiency in research and development work through fully automated operation using a fully automatic CtC method. You can also choose deposition mechanisms such as high-efficiency ferromagnetic cathodes and wide erosion cathodes, and we can accommodate individual requirements based on substrates and purposes. It can also support a simple device configuration, achieving reasonable cost solutions. As an advanced specification, a cluster-type transfer chamber can be equipped, and it is an evolved sputtering device capable of incorporating different process chambers such as annealing and deposition.

  • Sputtering Equipment
  • Plasma surface treatment equipment

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Simple experimental sputtering device (SRV3100 type)

Simple experimental sputtering device (SRV3100 type)

Compact-type sputtering device exclusively for small substrate, achieving low cost with fully manual operation. Standard type for research and experiments.

Commonization of high-reliability upper models with vacuum chambers and exhaust systems. Cost reduction achieved through manual operation methods. Various components (cathodes, substrate holders, etc.) can be selected according to the type of film and purpose. The efficiency and quality of research and development work can be improved with the well-established mechanisms and stable film deposition performance.

  • Other physicochemical equipment
  • Sputtering Equipment

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Hybrid hard film coating device (DLC-CVD + PVD device)

Hybrid hard film coating device (DLC-CVD + PVD device)

Composite coating device for CVD-DLC and hard film PVD. Smooth surface PVD film + high-rate DLC. Hardness + tribological thin film.

A high-density sputter cathode ADM system (arc discharge type magnetron sputtering cathode) has been added to the well-established PIG-type DLC coating equipment for automotive DLC films. A hard alloy film is laminated onto the DLC film, which has excellent tribological properties, achieving a new hard coating with a smooth surface. The conventional DLC film has also been enhanced with the new cathode's functions, improving performance. Adhesion and resistance to surface pressure can be easily improved. Of course, the conventional PIG-type DLC coating equipment can be upgraded with additional functions. The latest model of the new functional hard film coating equipment can fully demonstrate the performance of CVD/PVD alone.

  • Plasma surface treatment equipment
  • Other processing machines
  • Other machine tools

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R&D Multi-Chamber Sputtering Device

R&D Multi-Chamber Sputtering Device

Specialized for responding to R&D and niche processes, a new type of multi-chamber sputtering device for small-scale production and prototyping/research and development, which is difficult with mass production equipment.

A low-cost multi-chamber sputtering system dedicated to the development of advanced thin film processes and small-scale production. It accommodates a wide range of fields with a high-efficiency cathode that excels in film thickness control and a variety of optional mechanisms. Proven in various processes, not only for Si semiconductor electrodes and wiring films but also for magnetic films, insulating films, and protective films for micro-magnetic devices and MEMS. It features the ability to equip different process chambers such as evaporation, annealing, and CVD, allowing for full custom-made production that freely connects each process chamber to a proven mainframe (transport system).

  • Sputtering Equipment
  • Plasma surface treatment equipment

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Multi-purpose sputtering device for surface treatment, model STV6301.

Multi-purpose sputtering device for surface treatment, model STV6301.

A multipurpose sputtering device specialized for surface treatment of three-dimensional shaped parts, the entire outer surface, both sides of flat substrates, and film formation on three-dimensional shapes. It is also suitable for film formation on the inner surface of tumblers.

This is a dry surface treatment device that efficiently performs various coatings on three-dimensional shaped parts and molded products made of resin, glass, metal, etc. It can form thin films of various materials such as metals and ceramics over the entire surface. Features: ◎ Full surface film formation on three-dimensional shaped parts ◎ Coating of the inner surfaces of cups and tumblers using a special mechanism ◎ Naturally derived dry hydrophilic coating (plasma lava coating) ◎ Compatible with a wide range of applications from electronic substrates to resin decorations

  • Sputtering Equipment
  • Glass
  • fiber

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Experimental sputtering device

Experimental sputtering device

Equipped with a simple yet φ3-inch target magnetron cathode and a wide-range turbo molecular pump with a capacity of 200 L/s.

● Price: 5 million yen (including tax) ● φ3 inch target, 1 molybdenum cathode ● RF 300W power supply, with automatic matching box ● Gas system: 1 system (up to 3 systems available as an option), adjustable via mass flow controller ● Capable of sputtering insulators such as oxides. ● Option to install a substrate heater available. ● Simple structure that is easy to use while eliminating unnecessary components. ● Space-saving dimensions: 800W × 600L × 900H.

  • Company：ヤシマ
  • Price：1 million yen-5 million yen
  • Plasma surface treatment equipment
  • Organic EL
  • Sputtering Equipment

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