Film formation device, sputtering device
We boast a wide range of achievements.
This device is a film-forming apparatus capable of installing up to four target sputter guns.
- Company：バキュームプロダクツ
- Price：Other
Sputtering Equipment Product List and Ranking from 50 Manufacturers, Suppliers and Companies | IPROS GMS
Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.
Sputtering Equipment Manufacturer, Suppliers and Company Rankings
Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.
Sputtering Equipment Product ranking
Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.
- Sputtering device ジャパンクリエイト
- Desktop RF Sputtering Device 'SVC-700RFIII' サンユー電子
- HELIOS Sputtering Device for Optical Thin Films Bühler K.K.
- 4 Magnetron sputtering device for high-precision optical filter film deposition ティー・ケイ・エス
- 5 Remote plasma ion beam sputtering device ティー・ケイ・エス
Sputtering Equipment Product List
91～120 item / All 137 items
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Sample transport device
Sample transport device
This product, the Sample Carrying System (KSC-1000), is a transport device that also serves as a sample introduction chamber. It allows for the transportation of samples while maintaining ultra-high vacuum conditions between multiple vacuum systems, making future expansion or addition of vacuum systems easy. Additionally, it comes standard with a six-slot sample transport carrier, making it ideal as a sample stocker, and the included heating mechanism enables cleaning of the sample surface.
- Company：北野精機
- Price：Other
Sputter Source "Ultra High Vacuum Compatible Magnetron RF Sputter Source"
It is possible to remove the magnet while maintaining the spatter source in ultra-high vacuum.
The "Ultra High Vacuum Compatible Magnetron RF Sputter Source" is a general-purpose compact magnetron sputter source compatible with ultra high vacuum. Since the entire body is bakeable, it enables film deposition with minimal impurities even with highly reactive targets. 【Features】 - Ultra high vacuum type that does not use O-rings - The magnet can be removed while maintaining the sputter source in ultra high vacuum - Baking up to 300°C is possible by removing the magnet - Target fixation is done with a retainer, allowing for quick target replacement - The gas inlet is integrated with the mounting flange, eliminating the need for a separate flange for gas introduction For more details, please contact us or download the catalog.
- Company：北野精機
- Price：Other
Sputter Source "Ultra High Vacuum Compatible Magnetron Sputter Source"
By removing the magnet, baking up to 300°C is possible.
This sputter source is a general-purpose compact magnetron sputter source compatible with ultra-high vacuum. Since the entire body is bakeable, it allows for film deposition with minimal impurities even with highly reactive targets. 【Features】 - Ultra-high vacuum type without O-rings - The magnet can be removed while maintaining the sputter source in ultra-high vacuum - Baking up to 300°C is possible by removing the magnet - The target is fixed with a retainer, allowing for quick replacement of the target - The gas inlet is integrated with the mounting flange, so a separate flange for gas introduction is unnecessary For more details, please contact us or download the catalog.
- Company：北野精機
- Price：Other
4-inch 3-source RF sputtering device
The substrate dimensions can accommodate up to 3 pieces with a maximum size of 3 inches! It is equipped with a heating mechanism and a reverse sputtering mechanism!
This product is a 3-source RF magnetron sputtering system designed for metal and insulating materials. The substrate features a heating mechanism and a reverse sputtering mechanism. The sputter cathodes consist of three φ4-inch magnetron cathodes, and the substrate insertion is designed for manual opening and closing of the top cover. 【Features】 ■ Substrate size: Maximum 3 inches (can accommodate 3 pieces) ■ Substrate holder: Substrate heating up to 500°C, substrate rotation, and reverse sputtering mechanism included ■ Sputter cathodes: Three φ4-inch magnetron cathodes ■ Gas system: Two systems of Ar and O2 MFC ■ Substrate insertion: Manual opening and closing of the top cover *For more details, please refer to the PDF document or feel free to contact us.
- Company：ケニックス
- Price：Other
Glovebox-connected organic vapor deposition and sputtering device
Transport between chambers is achieved by the transfer rod! Continuous film formation is possible without releasing into the atmosphere!
This product is designed for 50×50 substrates and is a device that connects a resistance heating evaporation system for organic transistors and EL elements, as well as an RF sputtering system for oxides, to a glove box. It transports materials between chambers using a transfer rod, allowing for continuous film deposition without releasing to the atmosphere. Please feel free to contact us when you need assistance. 【Features】 ■ Compatible with 50×50 substrates ■ Continuous film deposition possible without releasing to the atmosphere ■ Connects a resistance heating evaporation system for organic transistors and EL elements, and an RF sputtering system for oxides to a glove box *For more details, please refer to the PDF materials or feel free to contact us.
- Company：ケニックス
- Price：Other
Multilayer film deposition ion beam sputtering device for optical filters
It is an ion beam sputtering device for DWDM film deposition.
This is an ion beam sputtering device for the optical field. Sputter: 16cm RF Ion Source Assist: 16cm RF Ion Source Target: 2 surfaces, oscillation function Stage: rotation Film thickness control: transmission-type wavelength-variable laser film thickness control Main exhaust: cryopump or TMP + SUPCOLD For more details, please contact us.
- Company：アールエムテック
- Price：Other
New Counter-Target Sputtering (NFTS) Device
For applications in superconducting thin films and MEMS, it is possible to deposit films on organic substrates with low damage and low-temperature film formation.
The New Facing Targets Sputtering (NFTS) technology is a film deposition technique characterized by its principle and structure that can suppress damage to the deposited substrate caused by the impact of energy species (recoiled particles, ions, electrons) by confining high-density plasma in a box-shaped space. With NFTS technology, it is possible to form high-quality thin films at low temperatures and with low damage, which was considered difficult with conventional sputtering techniques, making it a film deposition technology with high production capabilities. **Features** - **Opposing Target Structure** - Plasma confinement between opposing targets → Suppression of high-energy particles to the substrate → Low-damage film deposition → Suppression of a large number of electrons to the substrate (suppression of Joule heating) → Low-temperature film deposition - **Box-Shaped Plasma Source** - Separation of the vacuum chamber and plasma source → Realization of miniaturization of the entire device through the downsizing of the vacuum chamber → Improved operability and maintainability of the device *For more details, please refer to the PDF document or feel free to contact us.*
- Company：トヤマ
- Price：Other
Small sputtering device 'SS-DC・RF301'
Compact design yet maintains performance! A sputtering device capable of substrate heating at high temperatures.
The "SS-DC・RF301" is a compact sputtering device equipped with one 2" magnetron cathode and a substrate heating mechanism. Thanks to its simple design, it can be installed in about half the space of an office desk. It employs a substrate up-and-down mechanism, allowing for adjustable distance between the target and the substrate. In addition to being able to heat the substrate at high temperatures, it can also operate using only electricity and gas, and allows for reconfiguration between sputter-up and sputter-down. 【Features】 ■ Space-saving with a simple design ■ Adjustable distance between the target and the substrate ■ Capable of high-temperature substrate heating ■ Standard equipped with a chiller *For more details, please refer to the catalog. Feel free to contact us with any inquiries.
- Company：アリオス
- Price：Other
【nanoPVD-S10A】Magnetron Sputtering Device
High-performance, cost-effective RF/DC magnetron sputtering system for research and development.
High-Performance RF/DC Magnetron Sputtering Equipment ● Achievable pressure: 5 x 10^-5 Pa (*1 x 10^-4 Pascal in the fastest 30 minutes!) ● 3 x Manetron cathodes: Sequential multi-layer film, 2 sources' co-deposition ● Film uniformity ±3% ● Various options: Substrate rotation and Z-shift, substrate heating (Max 500℃), cathodes for magnetic targets, and more ◉ nanoPVD can be used for various purposes, including up to 3 sputter sources + 3 gas flow control (MFC control), RF/DC PSU upgrade (up to 2 power supplies), sequential multi-layer film, and 2 sources' co-deposition (RF/DC or DC/DC only). - Insulating films - Conductive metal films - Compounds, etc. 【Main Features】 ◉ Substrate size: Up to Φ4 inch ◉ 2" cathodes x up to 3 sources ◉ 7" touch panel for easy operation with PLC automatic process control ◉ APC automatic pressure control ◉ High-precision process control with capacitance manometer ◉ 1 Ar gas system (standard) + N2, O2 expandable up to 3 systems ◉ USB port for connection to Windows PC, allowing the creation and storage of recipes for up to 1000 layers and 50 films. Data logging on PC ◉ Other various options available
- Company：テルモセラ・ジャパン 本社
- Price：Other
Magnetron Sputtering Device MSP-20MT
The target is a 4-inch size that can coat large samples as they are.
The Magnetron Sputtering Device MSP-20MT is a coating device for applying conductive treatment to electron microscope samples. It uses a magnetron target to minimize sample damage. It is designed for a 4-inch target size and can process large samples or multiple samples at once. For more details, please contact us or refer to the catalog.
- Company：真空デバイス 本社
- Price：1 million yen-5 million yen
Magnetron sputtering device MSP-8 inch
Equipped with a large-area sample stage compatible with 8-inch wafers.
The Magnetron Sputtering Device MSP-8 Inch features a magnetron target electrode and is equipped with a large-area sample stage compatible with 8-inch wafers. The variation in coating thickness is within 10%, effectively utilizing the entire stage area. Coating is done at a voltage of 500V or lower to reduce damage from ion impact. For more details, please contact us or refer to the catalog.
- Company：真空デバイス 本社
- Price：1 million yen-5 million yen
HPC-20 Fully Automatic Osmium Coater
High functionality and low price! Equipped with a touch panel full-auto coating feature, all performance has been powered up!
A new type of osmium coater for pre-treatment for electron microscope observation. We have fully automated parts that were previously difficult to operate manually. This represents a new dimension of osmium coating that allows for safer and easier operations. Equipped with a touch panel, it enables simple and clear operation. Anyone can easily create conductive films for electron microscopes. Additionally, we offer a variety of options to enhance safety and functionality. This device has been meticulously designed, yet we have achieved an astonishingly low price. If you are interested in osmium coating or have concerns about operation, please consider our osmium coater. We are also accepting requests for test coating and demonstrations at any time.
- Company：真空デバイス 本社
- Price：1 million yen-5 million yen
Magnetron Sputtering Device MSP-40T
Multipurpose, fully automatic film deposition device for experimental use. Magnetron sputtering device MSP-40T type.
The Magnetron Sputtering Device MSP-40T is a multipurpose, multi-metal, experimental ion sputtering deposition system. It features an electrode-separated sample stage to avoid sample damage, efficient deposition with high-speed exhaust and simple operation, and offers good cost performance at a low price. As a successor to the MSP-30T, it has been upgraded with full auto-coating, a touch panel, and recipe functions. For more details, please contact us or refer to the catalog.
- Company：真空デバイス 本社
- Price：1 million yen-5 million yen
Tohoku University Technology: High-density plasma sputtering device: T16-141
Damage-less sputtering / Independent control of ion energy and flux / Useable in ferromagnetic target
With the increase of request for device miniaturization and thin crystal film quality improvement, the ion damage on substrate has become a major issue in sputtering. The magnetron sputtering method is widely used but since the plasma is formed directly between the target material and the substrate, “1 it is difficult to avoid ion damage”. This issue is amplified when generating highdensity plasma. In addition, since a single power supply is responsible for both the plasma generation and ion attraction, “2 it is impossible to independently control the ion flux and energy flowing into the target material”. Moreover, since the plasma is confined by the magnetic leakage flux on the target surface, “3 it is difficult to use for ferromagnetic material target”. This invention solves above 1/2/3 issues by generating highdensity plasma with helicon discharge and by controlling the plasma shape with a curved magnetic field, etc. This invention could also be considered to be used as a heating mechanism of the target material, or as an uniform & fast film deposition.
- Company：Tohoku Techno Arch Co., Ltd.
- Price：Other
Vacuum products sputtering equipment
The management innovation plan has been approved for the small roll coater.
For anything related to spatter devices, please leave it to Fuji R&D Corporation. For more details, please contact us.
- Company：富士アールアンドディー
- Price：Other
Roll to Roll Sputtering System
Coating equipment for manufacturing functional films for Flexible Displays.
The Roll to Roll Sputter System is a coating equipment for the production of functional films such as flexible display films, capable of high-speed coating while maintaining the thickness of the coating film on thin films.
- Company：ＳＵＫＷＯＮ
- Price：Other
Load lock type sputtering device "SPH-2500-II"
Film thickness distribution: Achieved ±1.2% within the tray and ±1.5% between trays.
Showa Vacuum has fully revamped its bestselling device, the SPH-2500, which boasts approximately 15 years of proven performance. The load-lock type sputtering device "SPH-2500-II" inherits the features of the previous model while incorporating the latest technology, achieving performance that surpasses the conventional model in every aspect. 【Features】 ○ Dimensions: W1200×D2500×H1440, maintaining the same footprint while significantly reducing height ○ By improving the cathode, target usage efficiency has been greatly increased to 44% ○ Adopting a rack and pinion system eliminates transport issues caused by roller slippage For more details, please contact us or download the catalog.
- Company：昭和真空
- Price：Other
Automatic sample stage unit 'TP-TRM-1'
Continuous measurement is possible without opening the sample cover! Automatic sample stage unit.
The "TP-TRM-1" is an automatic sample stage unit that can be mounted on the terahertz spectrometer "TeraProspector." By attaching six samples to the sample mounting plate installed on the stage, continuous measurement of samples can be performed without opening the sample cover. This reduces the number of times the sample cover needs to be opened, improving measurement efficiency and minimizing the influx of water vapor. Additionally, we also offer the reflective automatic sample stage unit "TP-RFL-1." 【Features】 ■ Attach six samples to the plate (One location is used for reference measurement. The number of samples can be changed as an option.) ■ Continuous measurement of samples can be performed without opening the sample cover ■ Improves measurement efficiency and minimizes the influx of water vapor *For more details, please refer to the PDF document or feel free to contact us.
- Company：日邦プレシジョン
- Price：Other
Sputtering equipment for manufacturing high-performance coating films
Equipment for manufacturing coating films for in-vehicle sensors under the Strategic Base Technology Advancement Support Project.
The "High-Performance Coating Film Manufacturing Sputtering Device" is a device used to produce anti-reflective films for onboard cameras and sensors installed in next-generation vehicles, making it ideal for the strategic foundation technology enhancement support project for onboard sensors. We are developing a sputtering device that incorporates the latest technology into conventional sputtering methods to obtain high-performance optical thin films. 【Features】 ■ Control of film deposition rate and film quality through transition area control ■ Plasma densification using HIPIMS power supply *For more details, please refer to the catalog or feel free to contact us.
- Company：広島
- Price：Other
SSP2500G Spatter Device with Glove Box
A small sputtering device for research and development that allows for the exchange of substrates and targets in an inert gas atmosphere.
The "SSP2500G Sputtering Device with Glove Box" is a compact sputtering device designed for research and development that achieves high quality at a low price, allowing for substrate and target exchanges in an inert gas atmosphere. Despite its small size, it is equipped with two 2-inch cards and can change the distance between target substrates without breaking the vacuum, enabling substrate rotation and film deposition while heating. Additionally, the front hatch and substrate chucking mechanism allow for easy substrate exchange. A simple glove box with a vacuum-replaceable pass box is directly connected to the front hatch of the sputtering chamber, enabling substrate and target exchanges without exposing them to the atmosphere. *For more details, please download the PDF or feel free to contact us.*
- Company：菅製作所
- Price：Other
Magnetron sputtering
It is a device for applying a conductive film treatment to samples for electron microscopy.
The "Magnetron Sputtering Device" utilizes the principle of using a powerful magnet behind the target to promote ionization at the cathode surface layer, and by applying an electric field, it causes ions to collide with the target, releasing metal molecules. This device, manufactured by Vacuum Device Co., Ltd., is characterized by extremely low damage to samples. Additionally, we offer a variety of sputtering target types, sample sizes, and prices to meet our customers' needs. Please feel free to contact us with your requests. 【Product Lineup】 ■MSP-mini ■MSP-1S ■MSP-20-UM ■MSP-20-MT ■MSP-20-TK, etc. *For more details, please download the PDF or feel free to contact us.
- Company：ユニオン
- Price：Other
The ideal small sputtering device for research and prototyping: 'VS-R400G'
Ideal for experiments, research, evaluation, and prototype production! Achieving high-speed, high-precision, low-damage vacuum deposition on flat substrates such as glass and metal!
The "VS-R400G" is a sputtering device that adopts a unique LIA (Low Inductance Antenna) plasma source, achieving ultra-fast and high-quality vacuum deposition. Thanks to the assist effect of the LIA method's inductively coupled plasma (LIA-ICP), it reduces damage without lowering the deposition speed, resulting in high-quality film formation. Additionally, it can also accommodate reactive sputtering by leveraging the characteristics of high-density plasma. 【Features】 ■ A sputtering device suitable for experiments, research, evaluation, and prototyping ■ Reduces damage without lowering deposition speed, achieving high-quality film formation ■ Capable of reactive sputtering by utilizing the characteristics of high-density plasma ■ Enables faster deposition speeds by incorporating a rotary cathode ■ Easy to expand into production machines *For more details, please refer to the related links or feel free to contact us.
- Company：SCREENファインテックソリューションズ
- Price：Other
【Free Technical Data Giveaway!】What is Powder Sputtering?
From surface modification to catalyst utilization! Introducing high-adhesion powder sputtering technology with examples of film formation!
This document introduces the "Powder Sputtering Technology" handled by A.S.D. Corporation. It includes comparisons between plating (wet method) and sputtering (dry method) in powder coating, as well as examples of film formation (optical microscope observation images) and exterior diagrams of powder sputtering equipment. [Contents] ■ Comparison between plating (wet method) and sputtering (dry method) in powder coating ■ Expansion of applicability ■ Exterior diagram of powder sputtering equipment ■ Examples of film formation - Optical microscope observation images - Cross-sectional SEM observation images ■ Specifications of demo experimental equipment *For more details, please refer to the PDF document or feel free to contact us.
- Company：エイ・エス・ディ 技術研究所
- Price：Other
FHR.Roll.1600-FCCL Sputtering Device
High-throughput roll-to-roll sputtering equipment for the manufacture of FCCL (Flexible Copper Clad Laminate).
This is a roll-to-roll sputtering device for the manufacturing of FCCL (Flexible Copper Clad Laminate). Features: 1. High degree of freedom in equipment configuration 2. High temperature stability 3. Proper seed layer formation 4. Chrome-free adhesive layer available as an option 5. Achieves high peel strength For more details, please contact us.
- Company：ティー・ケイ・エス
- Price：Other
High Rate Ion Beam Sputtering High-Speed Film Deposition System (HR-PVD)
High-rate and high-quality film formation of dielectric and ferromagnetic materials.
This is a high-speed ion beam sputtering (IBD) device that excels in the deposition of dielectrics such as Al2O3 and SiO2, which typically have low deposition rates in conventional magnetron sputtering, as well as ferromagnetic materials like Fe. By using a helicon plasma source as the ion source and a groundbreaking method that accelerates the high-density ions obtained from it through the application of bias voltage to the target, it achieves high-rate and highly directional film deposition. It also contributes to cost reduction in deposition processes using valuable and rare targets by efficiently utilizing the entire target surface. <Features> ■ High-speed, high-efficiency ion beam sputtering Optimal solution for dielectric and ferromagnetic targets ■ Helicon plasma ion source and target application Achieving both high-speed sputtering and low contamination Reduction of running costs through improved target utilization efficiency Maintenance reduction due to gridless structure Sputtering while keeping the substrate at low temperature through remote plasma configuration ■ Wafer processing Improved step coverage Composite film deposition using cluster tools ■ Excellent directionality Uniform film thickness can be achieved with a highly directional ion beam, resulting in excellent step coverage in film deposition.
- Company：ティー・ケイ・エス
- Price：Other
Combinatorial Magnetron Sputtering System CMS-3200
A composition distribution with several hundred conditions is formed on a single substrate. The effective film formation area is an equilateral triangle with a side length of 25 mm.
The "CMS-3200" is a three-component combinatorial magnetron sputtering device that supports binary and ternary combinatorial composition gradient film deposition. The effective area is an equilateral triangle with a side length of 25mm. It is designed to use 2-inch wafers as standard substrates, allowing for integration into post-processing steps such as patterning and etching, enabling high throughput not only for film deposition but also for analysis. 【Features】 ■ Supports binary and ternary combinatorial composition gradient film deposition ■ Effective film deposition area: equilateral triangle with a side length of 25mm ■ Equipped with three 2-inch magnetron sputter cathodes ■ Can accommodate up to six RF and DC power supplies in three sets ■ Recipe editing and fully automated combinatorial film deposition using LabView *For more details, please refer to the PDF document or feel free to contact us.
- Company：コメット
- Price：Other
Multilayer film sputtering device 'S600'
Equipped with a heater stage (1000°C)! Usable for various applications from the development process to mass production.
The S600 is a multilayer sputtering device that contributes to the enhancement of electronic component quality and productivity through improvements in multilayer and stacked film deposition processes. By achieving high-quality and high-precision film deposition, it enhances device quality. It increases cost competitiveness through high throughput, improved production yield, and optimized material utilization efficiency. With options that accommodate various deposition conditions, it is capable of supporting small-batch production of diverse products and flexible production planning. 【Features】 - Equipped with up to 5 cathodes to achieve diverse processes and high productivity - Maintains long-term uniformity of film thickness through T/S distance adjustment - Improves sputtered thin film characteristics with unique plasma control (MP sputtering) technology - Capable of high-temperature processes with a heater stage (up to 1000°C) - Usable for various applications from development processes to mass production *For more details, please refer to the PDF document or feel free to contact us.
- Company：パナソニック プロダクションエンジニアリング
- Price：Other
Product Catalog - Textile Equipment
Products that support the technical aspects of new product development in the diversified and segmented textile industry are featured!
This catalog features the textile equipment handled by Hirano K&E Co., Ltd. We introduce various products, including the compact heat setter "Simplex Tenta," which accommodates a wide range of textile materials, the "Shrink Surfer," which significantly promotes relaxation and anti-shrinkage with ultra-powerful air beating, and the "Suction Drum Dryer," which has a simple structure and is easy to maintain. [Contents] - Simplex Tenta - SST Type Jet Dryer - Shrink Surfer - Multi-stage Pin Tenta & Heat Setter - Short Loop Dryer, etc. *For more details, please download the PDF or contact us.
- Company：ヒラノK&E
- Price：Other
