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Sputtering Equipment Product List and Ranking from 50 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.

Sputtering Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.

  1. ジャパンクリエイト Saitama//Testing, Analysis and Measurement
  2. サンユー電子 Tokyo//Testing, Analysis and Measurement
  3. 神港精機 東京支店 Tokyo//Industrial Machinery
  4. 4 ティー・ケイ・エス Tokyo//Industrial Machinery
  5. 4 真空デバイス 本社 Ibaraki//Pharmaceuticals and Biotechnology
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Sputtering Equipment Product ranking

Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.

  1. Sputtering device ジャパンクリエイト
  2. Desktop RF Sputtering Device 'SVC-700RFIII' サンユー電子
  3. HELIOS Sputtering Device for Optical Thin Films Bühler K.K.
  4. 4 Magnetron sputtering device for high-precision optical filter film deposition ティー・ケイ・エス
  5. 5 Remote plasma ion beam sputtering device ティー・ケイ・エス

Sputtering Equipment Product List

61～90 item / All 137 items

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Powder sputtering device

Powder sputtering device

We also support contract film formation and on-site experiments based on customer-requested samples!

The "Powder Sputtering Device" is a machine that coats thin films on the surface of powders with a diameter of a few micrometers using vacuum and plasma. It has a stirring mechanism based on a barrel swing motion, allowing for film formation using RF or DC sputtering methods. Applications are expected in preventing the deterioration of powder materials, controlling the electrical conductivity of powder surfaces, and resource conservation through thin film formation of rare materials. 【Features】 ■ Uniform film formation with the stirring mechanism ■ No chemical reactions required ■ High purity and strong adhesion of the film *For more details, please download the PDF or feel free to contact us.

  • Sputtering Equipment
  • Sputtering Equipment

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[Static Electricity Countermeasures] ~ Film Coating ~

[Static Electricity Countermeasures] ~ Film Coating ~

Rich experience in processing various materials and substrates! Electromagnetic wave shielding, static electricity prevention, surface heating elements, etc.

Introducing the 'Sputtering Processing' of Sekisui Nano Coat Technology. - Compatible with non-woven fabrics, filters, fibers, and more. We also own sputtering equipment capable of handling widths up to 3400mm. Please feel free to consult us regarding thin film product development/sales, contract film formation processing, prototypes, and more. 【Features】 ■ Three technical axes: Optical adjustment, conductivity, antibacterial/antiviral ■ Proven track record in diverse applications/functions ■ Extensive processing experience with various materials and substrates - Materials: Various metals, alloys, compounds; Substrates: Films, metal foils, paper, etc. ■ Sputtering processing on fibers - Examples: Chemical fibers, carbon fibers, glass fibers, non-woven fabrics, etc. *For more details, please refer to the PDF materials or feel free to contact us.

  • Sputtering Equipment
  • Sputtering Equipment

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Nanomaterial film deposition solution

Nanomaterial film deposition solution

Suitable for the film formation of nanomaterials (metal nanoparticles, nanowires, nanosheets, materials for nanoelectronics)!

The "TFE News Sputtering Series" is a research and development as well as small-scale production system with a variety of functions. It is a compact sputtering device capable of high-temperature film deposition of metal films and dielectric films for nanomaterials such as metal nanoparticles, nanowires, and nanosheets, with temperatures up to 800°C. Additionally, it offers the option of manual or automatic load lock, and features complete automatic control via PLC and PC, as well as remote control over the internet. This sputtering device is recommended for engineers seeking high substrate heating temperatures (maximum heating temperature: 800°C) for thin film deposition of nanomaterials. 【Features】 ■ Suitable for thin film deposition of nanomaterials (metal nanoparticles, nanowires, nanosheets, materials for nanoelectronics) ■ Capable of 800°C substrate heating, which is difficult with other devices ■ Cost-effective sputtering with substrate rotation *For more details, please feel free to contact us.

  • Sputtering Equipment
  • Sputtering Equipment

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ITO film deposition PVD batch equipment

ITO film deposition PVD batch equipment

Solving the film quality control of ITO films.

Our company offers a batch-type sputtering device (PVD) for ITO film deposition that can handle everything from research and development to small-scale production. This device enables the deposition of ITO thin films for optical semiconductor devices and electronic devices. The device is equipped with both DC and RF power supplies, allowing for the control of sputtering voltage during discharge, which results in low resistance (<200μΩ·cm) and high transmittance (>90%@400~700nm [ITO itself]) ITO thin films. Additionally, it supports film deposition from low to high temperatures (up to 350°C) and allows for control of crystallinity. It is suitable for deposition on semiconductor wafers and glass substrates, as well as on resin substrates such as PET and polycarbonate.

  • Sputtering Equipment
  • Sputtering Equipment

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Tabletop Magnetron Sputtering Device "FDS/FRS Series"

Tabletop Magnetron Sputtering Device "FDS/FRS Series"

Reduce initial implementation costs and enable high performance through expansion! Upgrade according to the research stage.

The "FDS/FRS Series" is a tabletop magnetron sputtering device for research and development, equipped with the necessary functions. The basic specifications consist of a DC sputter/single cathode/rotary pump configuration for metal thin film sputtering. With expansion options such as RF conversion, additional cathodes, and turbo molecular pump specifications, it is possible to upgrade according to the research stage. 【Features】 ■ Keeps initial introduction costs low while allowing for high performance upgrades later ■ Comes with an MFC for argon in the basic specifications, enabling precise control of gas flow ■ Adopts a deposition-up method to prevent dust from adhering to the sample during film formation ■ Utilizes a high vacuum-sealing SUS chamber despite being a tabletop type *For more details, please refer to the PDF materials or feel free to contact us.

  • Sputtering Equipment
  • Sputtering Equipment

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CLUSTERLINE family - Supporting from wafers to panels.

CLUSTERLINE family - Supporting from wafers to panels.

A film deposition platform for semiconductor wafers and advanced packaging capable of various film deposition treatments.

"CLUSTERLINE" is a film deposition family for semiconductor wafers and advanced packaging from Evatec. It features a cluster architecture with fully automated processing from cassette to cassette for wafers up to 12 inches. It provides film deposition solutions for semiconductor advanced packaging, wafer front-end processes, power devices, wireless, optical thin films, and optoelectronic integration, including metals, piezoelectric films, and insulating films. You can choose tools for single wafer processing or batch processing using a combination of single process modules (SPM) capable of PVD, ALD, PECVD, etching, etc., or batch process modules (BPM).

  • Sputtering Equipment
  • Etching Equipment
  • CVD Equipment
  • Sputtering Equipment

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Sputtering Device QKG-Sputtering

Sputtering Device QKG-Sputtering

Film formation completed without exposure to the atmosphere in full auto! ~Sample measurement in progress!~

The conventional sputtering devices struggled with "film formation of multiple materials within a single badge," but this has been made possible by adopting a work mask, allowing the film formation to be completed in full auto mode without exposing the samples to the atmosphere. - Space-saving benefits for the workspace - Increased reproducibility of film formation - Reduced man-hours, decreased errors, and improved morale - Full auto film formation with one button → efficiency benefits - Cost reduction in materials with a 1-inch cathode Please consult us for jigs and customizations to achieve high-precision sputtering.

  • Sputtering Equipment
  • Sputtering Equipment

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Research and development spatula device 'HSK602VTA'

Research and development spatula device 'HSK602VTA'

Achieving space-saving! A sputtering device optimal for the formation of alloy films and stacked films through simultaneous discharge.

The "HSK602VTA" is a sputtering device equipped with six small cathodes, each having its own shutter and power supply, making it ideal for the formation of alloy films and multilayer films through simultaneous discharge. It features a revolver-type 4-sample holder, allowing for film deposition under four different conditions with a single vacuum pump-down. Additionally, its compact design achieves space-saving benefits. 【Features】 ■ Compact design ■ 6 cathodes ■ Equipped with a revolver-type 4-sample holder ■ Capable of film deposition under four conditions at once *For more details, please refer to the catalog or feel free to contact us.

  • Sputtering Equipment
  • Sputtering Equipment

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Vacuum Device Design and Manufacturing Case Study [Sputtering Device]

Vacuum Device Design and Manufacturing Case Study [Sputtering Device]

We will design and manufacture the vacuum equipment you desire with a short delivery time!

Introducing the features of vacuum container manufacturing by Cosmo Science! Please refer to the information below.

  • Contract manufacturing
  • Sputtering Equipment

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Simple experimental sputtering device

Simple experimental sputtering device

Two models: manual batch type and simple load lock type. The simple load lock type enables the mass production process of compound semiconductors. Currently accommodating sample tests and equipment tours.

This product is a simple and cost-effective sputtering device that covers everything from basic research to advanced process development. We offer two models: a fully manual, low-cost batch type and a simplified load lock type equipped with a manual transport mechanism. Both models achieve significant cost reductions while maintaining the process performance of higher-end models. We provide consistent and careful support from sample testing and specification compliance to post-delivery follow-up. 【Features】 ■ Reasonable cost and high process performance ■ High reliability capable of handling small-scale production ■ A wide range of options and flexible hardware support backed by extensive track records ■ Supports process development in advanced thin film development with load lock mechanisms and pre-deposition testing ■ A demo unit is permanently available for sample testing *For more details, please refer to the PDF document or feel free to contact us.

  • Sputtering Equipment
  • Plasma surface treatment equipment
  • Sputtering Equipment

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Ultra-High Vacuum Sputtering Equipment (Model STM2323)

Ultra-High Vacuum Sputtering Equipment (Model STM2323)

Ideal for research and development of advanced thin film devices. A customizable single-sheet ultra-high vacuum inline system. Responding to demands with a wealth of options and flexible support.

A super high vacuum sputtering device with exhaust performance of 10⁻⁷ Pa. It is equipped with a cassette chamber, transfer chamber, etching chamber, and multiple sputtering chambers in a standard configuration. It achieves efficiency in research and development work through fully automated operation using a fully automatic CtC method. You can also choose deposition mechanisms such as high-efficiency ferromagnetic cathodes and wide erosion cathodes, and we can accommodate individual requirements based on substrates and purposes. It can also support a simple device configuration, achieving reasonable cost solutions. As an advanced specification, a cluster-type transfer chamber can be equipped, and it is an evolved sputtering device capable of incorporating different process chambers such as annealing and deposition.

  • Sputtering Equipment
  • Plasma surface treatment equipment
  • Sputtering Equipment

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Simple experimental sputtering device (SRV3100 type)

Simple experimental sputtering device (SRV3100 type)

Compact-type sputtering device exclusively for small substrate, achieving low cost with fully manual operation. Standard type for research and experiments.

Commonization of high-reliability upper models with vacuum chambers and exhaust systems. Cost reduction achieved through manual operation methods. Various components (cathodes, substrate holders, etc.) can be selected according to the type of film and purpose. The efficiency and quality of research and development work can be improved with the well-established mechanisms and stable film deposition performance.

  • Other physicochemical equipment
  • Sputtering Equipment
  • Sputtering Equipment

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Hybrid hard film coating device (DLC-CVD + PVD device)

Hybrid hard film coating device (DLC-CVD + PVD device)

Composite coating device for CVD-DLC and hard film PVD. Smooth surface PVD film + high-rate DLC. Hardness + tribological thin film.

A high-density sputter cathode ADM system (arc discharge type magnetron sputtering cathode) has been added to the well-established PIG-type DLC coating equipment for automotive DLC films. A hard alloy film is laminated onto the DLC film, which has excellent tribological properties, achieving a new hard coating with a smooth surface. The conventional DLC film has also been enhanced with the new cathode's functions, improving performance. Adhesion and resistance to surface pressure can be easily improved. Of course, the conventional PIG-type DLC coating equipment can be upgraded with additional functions. The latest model of the new functional hard film coating equipment can fully demonstrate the performance of CVD/PVD alone.

  • Plasma surface treatment equipment
  • Other processing machines
  • Other machine tools
  • Sputtering Equipment

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R&D Multi-Chamber Sputtering Device

R&D Multi-Chamber Sputtering Device

Specialized for responding to R&D and niche processes, a new type of multi-chamber sputtering device for small-scale production and prototyping/research and development, which is difficult with mass production equipment.

A low-cost multi-chamber sputtering system dedicated to the development of advanced thin film processes and small-scale production. It accommodates a wide range of fields with a high-efficiency cathode that excels in film thickness control and a variety of optional mechanisms. Proven in various processes, not only for Si semiconductor electrodes and wiring films but also for magnetic films, insulating films, and protective films for micro-magnetic devices and MEMS. It features the ability to equip different process chambers such as evaporation, annealing, and CVD, allowing for full custom-made production that freely connects each process chamber to a proven mainframe (transport system).

  • Sputtering Equipment
  • Plasma surface treatment equipment
  • Sputtering Equipment

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Multi-purpose sputtering device for surface treatment, model STV6301.

Multi-purpose sputtering device for surface treatment, model STV6301.

A multipurpose sputtering device specialized for surface treatment of three-dimensional shaped parts, the entire outer surface, both sides of flat substrates, and film formation on three-dimensional shapes. It is also suitable for film formation on the inner surface of tumblers.

This is a dry surface treatment device that efficiently performs various coatings on three-dimensional shaped parts and molded products made of resin, glass, metal, etc. It can form thin films of various materials such as metals and ceramics over the entire surface. Features: ◎ Full surface film formation on three-dimensional shaped parts ◎ Coating of the inner surfaces of cups and tumblers using a special mechanism ◎ Naturally derived dry hydrophilic coating (plasma lava coating) ◎ Compatible with a wide range of applications from electronic substrates to resin decorations

  • Sputtering Equipment
  • Glass
  • fiber
  • Sputtering Equipment

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Experimental sputtering device

Experimental sputtering device

Equipped with a simple yet φ3-inch target magnetron cathode and a wide-range turbo molecular pump with a capacity of 200 L/s.

● Price: 5 million yen (including tax) ● φ3 inch target, 1 molybdenum cathode ● RF 300W power supply, with automatic matching box ● Gas system: 1 system (up to 3 systems available as an option), adjustable via mass flow controller ● Capable of sputtering insulators such as oxides. ● Option to install a substrate heater available. ● Simple structure that is easy to use while eliminating unnecessary components. ● Space-saving dimensions: 800W × 600L × 900H.

  • Company：ヤシマ
  • Price：1 million yen-5 million yen
  • Plasma surface treatment equipment
  • Organic EL
  • Sputtering Equipment
  • Sputtering Equipment

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【Delivery Case】Osaka Industrial Technology Research Institute, a local independent administrative agency.

【Delivery Case】Osaka Industrial Technology Research Institute, a local independent administrative agency.

Introducing a case study of a sputtering device capable of automatically creating multilayer films!

We would like to introduce a case where we delivered a magnetron sputtering device to the Osaka Institute of Industrial Technology, a local independent administrative institution. The device delivered this time is our "MS-3C100L model," which consists of a sputtering chamber, a load lock chamber (LL chamber), a vacuum exhaust system, a gas introduction system, a power supply system, a substrate temperature control system, and an operation and control system composed of a PC and control device. The sputtering chamber is equipped with three cathodes for attaching targets, and it is possible to apply RF or DC voltage to each cathode, or to superimpose the voltages. [Case Overview] ■ Delivery Destination: Osaka Institute of Industrial Technology, a local independent administrative institution ■ Delivered Product: MS-3C100L model *For more details, please refer to the PDF document or feel free to contact us.

  • Sputtering Equipment
  • Vacuum Equipment
  • Sputtering Equipment

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【Thorough Developer Perspective】Custom manufacturing of various devices available.

【Thorough Developer Perspective】Custom manufacturing of various devices available.

Consultations are welcome! We handle everything in-house from design to manufacturing and assembly! If you are having trouble with various equipment manufacturing, please feel free to consult with us. *Case study materials are currently available.

Our company has established a consistent production system that covers everything from development to material procurement, processing, assembly, and quality assurance, and we accept custom orders for equipment from various companies. "If only I could design something like this..." "I want to improve work efficiency..." "I want to reduce labor costs..." If you have any concerns, please feel free to consult with us first. We are confident in our quality control and support system. Additionally, we conduct sample processing with demo machines, so please do not hesitate to contact us when needed. 【Production Achievements (Excerpt)】 ■ Ultra-high temperature sputtering equipment for thin-film MEMS ■ Batch-type sputtering equipment for thin-film MEMS ■ Multi-composite sputtering equipment ■ Sputtering equipment with GB for organic EL ■ Load-lock type binary sputtering equipment *For more details, please refer to the PDF materials or feel free to contact us.

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  • Sputtering Equipment
  • Sputtering Equipment

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High-Rate Depo. Piezoelectric Film Formation Sputtering Device

High-Rate Depo. Piezoelectric Film Formation Sputtering Device

For semiconductors, MEMS, electronic components, etc.! High-speed and stable continuous film deposition is possible from single crystal epitaxial buffer layers to piezoelectric films!

The "piezoelectric film formation sputtering device" is a product that enables continuous film formation from a single crystal epitaxial buffer layer to a piezoelectric film. Through plasma analysis and feedback control using a plasma emission monitor, it allows for fast and stable reactive sputtering, as well as the detection of elements that contribute to the degradation of piezoelectric properties. It is equipped with our unique rapid heating and cooling substrate heating mechanism, achieving a substrate temperature of 900°C. *For more details, please refer to the PDF materials or feel free to contact us.

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  • Sputtering Equipment
  • Sputtering Equipment

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HELIOS Sputtering Device for Optical Thin Films

HELIOS Sputtering Device for Optical Thin Films

Optical sputtering device from Bühler Leybold Optics

HELIOS is a sputtering device developed for the production of high-quality optical films. It is particularly suitable for the manufacture of multilayer filters that require low absorption and low dispersion. The HELIOS series is available in two types: 400 and 800 (substrate sizes).

  • Evaporation Equipment
  • Sputtering Equipment

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Ion Beam Sputtering Device for Precision Optics IBS1400/1600

Ion Beam Sputtering Device for Precision Optics IBS1400/1600

Beuler-Lieboldt Optics Vacuum IBS Equipment

Rivolt Optics, with nearly 160 years of history as the world's largest vacuum equipment and device manufacturer, has long-standing experience as an industry leader and provides vacuum thin film manufacturing equipment and processes to achieve high-precision optical coatings. We offer a variety of vacuum chamber sizes, from research and development applications to large-scale production equipment, to meet our customers' diverse needs.

  • Other surface treatment equipment
  • Sputtering Equipment

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Semi-automatic grinding device for steel samples SAB-2-200

Semi-automatic grinding device for steel samples SAB-2-200

Semi-automatic belt grinding device for steel sample optical emission spectroscopy (OES) pre-treatment SAB-2-200

This is a semi-automatic belt grinding machine designed for various steel samples. By simply placing the sample in the designated position and pressing the start button, it performs a complete cycle of automatic operation. It is a safe device that does not require the operator to touch the machine while it is in operation. The sample moves back and forth in a direction perpendicular to the belt rotation for grinding, and by utilizing not only the center of the belt but also both ends, it contributes to reducing running costs. Since the sample holding pressure and the number of sample reciprocations can be set arbitrarily, it is possible to change the conditions based on the material of the sample and the state of the belt.

  • Other machine tools
  • Spectroscopic Analysis Equipment
  • X-ray fluorescence analyzer
  • Sputtering Equipment

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ホロカソードエッジング式スパッタ装置

ホロカソードエッジング式スパッタ装置

-ホロカソードガンとスッパッタガンをワンチャンバーに搭載

ホロカソードで強力にプレエッジング

  • Other cutting tools
  • Press Dies
  • Other Auto Parts
  • Sputtering Equipment

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Supports multiple metals! It is an ultra-compact coater in the smallest class in the industry.

Supports multiple metals! It is an ultra-compact coater in the smallest class in the industry.

High-spec compact coater compatible with various metals such as Ni, Cr, W, Ti, and Al!

The "SC-701Mk II ADVANCE" is a high-spec compact coater compatible with various metals such as Ni, Cr, W, Ti, and Al. It is the smallest ultra-compact model in the DC sputtering category. Thin film production of various metals can be easily performed with this compact and user-friendly device. 【Features】 ○ Equipped with a vacuum gauge to ensure reproducibility of film formation conditions ○ Small, compact & high-spec ○ Standard manual shutter included ○ Easy adjustment of the T-S distance with a dedicated sample stage ○ Capable of tungsten coating, making it suitable for sample preparation for high-resolution SEM For more details, please contact us or download the catalog.

  • Other physicochemical equipment
  • Sputtering Equipment

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Compact Coater "SVC-700TMSG/Adexcel"

Compact Coater "SVC-700TMSG/Adexcel"

You can attach three types of targets simultaneously! It is possible to create a multilayer film.

The multi-compact coater "SVC-700TMSG/Adexcel" is a small film deposition device that generates plasma through direct current discharge using a magnetron cathode in a low vacuum environment. It sputters a metal target attached to the cathode with ions in the plasma, creating a thin film on the surface of the sample. Since three types of targets can be mounted simultaneously, it is possible to select targets in a vacuum and produce multilayer films. 【Features】 - Structure allows for optional installation of film thickness sensors, sample heating units, etc. - Can also be used as a resistance heating vacuum deposition device → Replace the exhaust unit with a resistance heating unit and connect a dedicated power supply. For more details, please contact us.

  • Coater
  • Sputtering Equipment

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Desktop RF Sputtering Device 'SVC-700RFIII'

Desktop RF Sputtering Device 'SVC-700RFIII'

Equipped with three sources of cathodes in a compact tabletop size. It is also possible to produce insulating thin films, oxide, and nitride thin films.

The "SVC-700RFIII" is a compact RF magnetron sputtering device that can be placed on a desk, equipped with three φ2-inch cathodes. It is capable of forming stacked films using three types of targets. It can be expanded with a gas introduction mechanism, allowing for the introduction of up to three types of gases, including argon gas. In addition to metal thin films, it can accommodate the production of various thin films such as insulating films, oxides, and nitrides. 【Features】 ■ Desktop size for research and development ■ Sample size: up to φ2 inches ■ Additional film thickness sensor available *For more details, please refer to the documentation. Feel free to contact us with any inquiries.

  • Sputtering Equipment
  • Sputtering Equipment

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Single-sided sputtering device

Single-sided sputtering device

This is a sheet-type sputtering device that achieves high-quality radio wave transmission films.

Features ■ Low attenuation radio wave transmission film (discontinuous film) ■ Easy automation due to sheet-type design ■ Proven track record with the top market share in Japan

  • Sputtering Equipment
  • Sputtering Equipment

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Post-oxidation sputtering device

Post-oxidation sputtering device

It is an optimal post-oxidation sputtering device for multilayer optical thin films.

Features ■ Achieves high productivity by adopting a post-oxidation method ■ Realizes excellent film thickness uniformity of ±1% or less ■ Allows for full-area sputtering through horizontal substrate transport

  • Sputtering Equipment
  • Sputtering Equipment

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Magnetron Sputtering Device 'scia Magna 200'

Magnetron Sputtering Device 'scia Magna 200'

Maximum 200mm diameter substrate! Double ring magnetron (Fraunhofer FEP)

The "scia Magna 200" is a magnetron sputtering device with a rotating single magnetron. Applications include temperature compensation films (SiO2) for TC-SAW, piezoelectric films such as AlN, high and low refractive index films for optics, and insulating films (Si3N4, SiO2, Al2O3). Additionally, the process is magnetron sputtering. Please feel free to consult us when needed. 【Features】 ■ Maximum substrate diameter of 200mm ■ Rotating single magnetron (maximum diameter of 300mm) ■ Confocal 4 magnetron ■ Double ring magnetron (Fraunhofer FEP) *For more details, please refer to the PDF document or feel free to contact us.

  • Sputtering Equipment
  • Sputtering Equipment

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Ion Beam Sputtering Device 'scia Coat 200/500'

Ion Beam Sputtering Device 'scia Coat 200/500'

Introducing the ion beam sputtering device equipped with a maximum of 5 targets (220mm diameter) or 4 targets (300mm diameter)!

The "scia Coat 200/500" is a product compatible with a maximum of 200mm wafer substrates or 300mm x 500mm substrates. The processes include Ion Beam Sputtering (IBS), Ion Beam Etching (IBE), and Dual Ion Beam Sputtering (DIBS). Please feel free to consult us when needed. 【Features】 ■ Compatible with a maximum of 200mm wafer substrates or 300mm x 500mm substrates ■ Can accommodate up to 5 (220mm diameter) or 4 (300mm diameter) targets ■ RF source (120mm to 350mm) ■ Linear Microwave ECR source (2 x 380mm long) *For more details, please refer to the PDF materials or feel free to contact us.

  • Sputtering Equipment
  • Sputtering Equipment

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