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Sputtering Equipment Product List and Ranking from 43 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

Sputtering Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. テルモセラ・ジャパン 本社 Tokyo//Industrial Electrical Equipment
  2. 神港精機 東京支店 Tokyo//Industrial Machinery
  3. サンユー電子 Tokyo//Testing, Analysis and Measurement
  4. 4 Bühler K.K. Kanagawa//Food Machinery
  5. 5 ジャパンクリエイト Saitama//Testing, Analysis and Measurement
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Sputtering Equipment Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. 【nanoPVD-S10A】Magnetron Sputtering Device テルモセラ・ジャパン 本社
  2. Desktop RF Sputtering Device 'SVC-700RFIII' サンユー電子
  3. HELIOS Sputtering Device for Optical Thin Films Bühler K.K.
  4. 4 Semi-automatic grinding device for steel samples SAB-2-200 ハルツォク・ジャパン
  5. 5 Supports multiple metals! It is an ultra-compact coater in the smallest class in the industry. サンユー電子

Sputtering Equipment Product List

31～45 item / All 136 items

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MiniLab-SA125A Multi-Target Sputtering System

MiniLab-SA125A Multi-Target Sputtering System

High-performance multi-sputtering device 6-element multi-sputter (for Φ4 inch) 4-element multi-sputter (for Φ6, 8 inch)

Continuous multilayer film, simultaneous film formation (2-6 element simultaneous film formation: RF, DC can be freely switched from HMI) High-power RF, DC power supplies, and pulse DC power supplies can be flexibly configured with multi-cathodes using our unique 'Plasma Switching Relay' module, allowing for versatile applications. High-temperature substrate heating stage (double jacket water-cooled) options: -1) Max 600℃ (lamp heating) -2) Max 1000℃ (C/C composite) -3) Max 1000℃ (SIC coating) Reverse sputtering stage in load lock: -1) 300W, or -2) Soft-Etching (<30W) System main control: 'IntelliDep' control system Windows PC (or TP HMI) interface All operations are centrally managed from a single HMI screen.

  • Sputtering Equipment
  • Evaporation Equipment
  • Etching Equipment

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Sputtering device "MiniLab series"

Sputtering device "MiniLab series"

Due to its modular embedded design, it is possible to flexibly assemble dedicated equipment according to the required film deposition method. A compact thin-film experimental device that can accommodate various research applications.

**Flexible System** The MiniLab thin film experimental device series allows for easy construction of a compact system without waste, even as a customized product, by incorporating suitable components (such as deposition sources and stages) and control modules according to the required deposition methods and materials from a wide range of options. By configuring the device with a modular control unit in a Plug&Play manner, the application range expands, enabling various thin film process experiments. The MiniLab series is a high-cost performance system that caters to a wide range of applications from research and development to small-scale production. **Small Footprint & Space-Saving** - Single Rack Type (MiniLab-026): 590(W) x 590(D)mm - Dual Rack Type (MiniLab-060): 1200(W) x 590(D)mm - Triple Rack Type (MiniLab-125): 1770(W) x 755(D)mm **Excellent Operability & Intuitive Operation Screen** Windows PC or 7” touch panel. Easy operation that does not require advanced skills, while ensuring maximum safety.

  • Sputtering Equipment
  • Evaporation Equipment
  • Etching Equipment

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Multi-functional Sputtering Device 【MiniLab-S060】

Multi-functional Sputtering Device 【MiniLab-S060】

A compact multi-thin film device that incorporates sputtering, deposition, electron beam (EB), and annealing thin film modules in a 60-liter volume chamber, suitable for various applications.

4 cathodes with Φ2 inch mounted Simultaneous film formation: 3-component simultaneous film formation (RF 500W or DC 850W) + HiPIMS (Pulse DC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed from the HMI screen using the plasma relay switch MFC x 3 systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coat) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Plasma etching can be installed in either the main chamber or the load lock chamber. ● Mixed specifications such as resistance heating deposition, organic material deposition, EB deposition, and PECVD can also be configured.

  • Sputtering Equipment
  • Evaporation Equipment
  • CVD Equipment

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Ultra-compact Magnetron Sputtering Device MSP-mini

Ultra-compact Magnetron Sputtering Device MSP-mini

This is a metal coating device for optical microscope samples (transparent materials) or SEM samples. It is the smallest model in the industry. It is a super compact coating device.

The coating is done at a very low voltage using a magnetron electrode. A simple yet highly glossy metal film can be coated with just one touch. Set the sample. Set the timer according to the desired coating thickness. Once you press the start button, it automatically progresses from preliminary evacuation to coating. When the coating is complete, the RP stops and automatically air leaks.

  • Other machine tools

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Magnetron Sputtering Device MSP-20UM

Magnetron Sputtering Device MSP-20UM

To apply a conductive film treatment to the sample for the electron microscope. Magnetron sputtering device.

The Magnetron Sputtering Device MSP-20UM is a device used for applying conductive film treatment to samples for electron microscopy. It employs a magnetron target to minimize sample damage. It is equipped with adjustment functions that allow it to accommodate various applications. It also has features for introducing and adjusting the pressure of argon gas and other gases, which contributes to improving film purity. For more details, please contact us or refer to the catalog.

  • Other FA equipment

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Magnetron Sputtering Device MSP-1S

Magnetron Sputtering Device MSP-1S

For SEM samples. It is a sample-friendly magnetron-type ion coater.

The Magnetron Sputtering Device MSP-1S allows for coating at low voltage and features a floating sample stage, ensuring no damage to the samples. It is a magnetron-type ion coater that is gentle on samples. Its compact size means it doesn't take up much space and can operate in a corner of your desk. For more details, please contact us or refer to the catalog.

  • Other FA equipment

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Magnetron Sputtering Device MSP-20TK

Magnetron Sputtering Device MSP-20TK

It is a coating device for tungsten thin films for electron microscopes.

The Magnetron Sputtering Device MSP-20-TK is a tungsten coating device for applying conductive treatment to electron microscope samples. By adopting a magnetron target, it minimizes sample damage. For more details, please contact us or refer to the catalog.

  • Plasma surface treatment equipment
  • Other surface treatment equipment
  • Other physicochemical equipment

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Multi-film deposition device VES-10

Multi-film deposition device VES-10

Complete integration of hydrophilic treatment, deposition equipment, and ion sputtering functions.

The multi-film deposition device VES-10 is a compact tabletop unit that fully integrates hydrophilic treatment, deposition, and ion sputtering functions. It deposits replacement leads for mechanical pencils. It uses a magnetron target for low-damage sputtering. The operations for ion sputtering and hydrophilic treatment are fully automated, allowing for automatic execution from the start of evacuation to the end of coating. Function switching is easy with just one button. For more details, please contact us or refer to the catalog.

  • Other physicochemical equipment
  • Plasma surface treatment equipment
  • Other surface treatment equipment

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IONIX® Magnetron Sputter Source

IONIX® Magnetron Sputter Source

The unique cooling water pathway allows the entire magnetron to be cooled at a constant temperature at all times.

We handle the rectangular type 'IONIX® Magnetron Sputter Source'. It can be installed both internally and externally. Thanks to its unique cooling water pathway, the entire magnetron can be cooled to a constant temperature at all times. Additionally, it supports KF, ISO, and CF connections, and with its unique magnetic pole arrangement, it is compatible with the UMBS configuration. 【Features】 ■ Constant temperature cooling for the entire unit ■ Installable both internally and externally ■ Supports KF, ISO, and CF connections ■ Compatible with UMBS configuration due to unique magnetic pole arrangement ■ Cooling structure that does not put stress on the target, preventing deformation of the target *For more details, please refer to the PDF document or feel free to contact us.

  • Cooling system

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Three-Element Magnetron Sputtering Device 'NS-023'

Three-Element Magnetron Sputtering Device 'NS-023'

Development of new thin films using simultaneous three-source sputtering! Customizable according to experimental content and budget.

The NS-023 is a ternary magnetron sputtering device capable of simultaneously depositing three types of targets. In addition to multi-target simultaneous sputtering, it supports various applications by adopting a platinum heater for high-temperature activation of the substrate (heater temperature: 950°C) and reactive sputtering. Additionally, it can accommodate assist plasma sources (ECR, ICP, etc.). 【Features】 ■ Capable of simultaneously depositing three types of targets ■ Supports various applications beyond multi-target simultaneous sputtering ■ Customizable according to experimental content and budget ■ Compatible with assist plasma sources *For more details, please refer to the PDF document or feel free to contact us.

  • Sputtering Equipment

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Experimental small-scale sputtering device

Experimental small-scale sputtering device

Three types of targets can be installed! The substrate is automatically transported in a vacuum!

It automatically performs everything from vacuum pumping to substrate transport and sputtering. With its compact design, it is optimal as an experimental device without taking up much space. ~Features~ - The main pump uses a turbo molecular pump. - The sputtering chamber, where the film is deposited, is separated from the chamber where the film is retrieved by a gate valve. After setting the substrate, it is automatically transported in a vacuum. - Up to three types of targets can be installed. - The substrate moves under the targets in the order set, using an automatic rotation mechanism for film deposition.

  • Vacuum Equipment

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Multi-film deposition device for development: "PVD for R&D"

Multi-film deposition device for development: "PVD for R&D"

Magnetron sputtering, thermal evaporation, and EB compatible! A composite film deposition device for the development of IoT and automotive devices.

The "PVD for R&D" is a multi-layer deposition device designed for development purposes. It supports magnetron sputtering, thermal evaporation, and E-Beam. It boasts a delivery record of over 400 units worldwide. With a modular design, combinations can be customized according to your needs. 【Features】 ■ Development-focused deposition device specialized for R&D ■ Over 400 units delivered to renowned research institutes, universities, and companies ■ Combinations of magnetron sputtering, thermal evaporation, and E-Beam are possible (Combinations can also be changed through modifications) *For more details, please refer to the PDF document or feel free to contact us.

  • Other machine elements
  • Other processing machines

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In-Line Sputtering System

In-Line Sputtering System

Equipment for coating a thin film on a flat glass substrate.

The In-Line Sputter System is equipment for coating thin films on flat glass substrates, making it highly competitive for continuous mass production.

  • Sputtering Equipment
  • Coater
  • Stepper

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Batch Type Sputtering System

Batch Type Sputtering System

A method of production that mounts a substrate in a single chamber.

The Batch Type Sputtering System is a method that mounts substrates in a single chamber, allowing for significant cost reductions.

  • Sputtering Equipment
  • Coater
  • Stepper

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Heating Sample Stage Unit 'TP-HEA-1'

Heating Sample Stage Unit 'TP-HEA-1'

The sample part is vacuumed for insulation! Heating stage unit for transmission measurement.

The "TP-HEA-1" is a heating stage unit for transmission measurements that can be mounted on the terahertz spectrometer "TeraProspector." The sample section is used under vacuum for insulation. The vacuum is manually created after the sample is set, and the unit, sealed under vacuum, is placed in the sample chamber for measurement. The temperature is monitored at the metal part that contacts the sample and controlled by an electric heater. A chiller is used for heat dissipation, circulating cooling water. 【Features】 ■ The sample section is used under vacuum for insulation. ■ The temperature is monitored at the metal part that contacts the sample. ■ A chiller and circulating cooling water are used for heat dissipation. *For more details, please refer to the PDF document or feel free to contact us.

  • Spectroscopic Analysis Equipment
  • Testing Equipment and Devices

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