We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
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Substrate Product List and Ranking from 561 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Jan 07, 2026～Feb 03, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jan 07, 2026～Feb 03, 2026
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  4. 4 JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  5. 5 スクリーンプロセス Kanagawa//others
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Substrate Product ranking

Last Updated： Aggregation Period:Jan 07, 2026～Feb 03, 2026
This ranking is based on the number of page views on our site.

  1. [Exhibition Report] We exhibited at NEPCON Japan 2026! 太洋テクノレックス 本社　和歌山
  2. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社　和歌山
  3. Handbook for Circuit Board Noise Countermeasures グロース
  4. 4 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  5. 5 Understand in 3 minutes! A substrate that dissipates heat faster [Materials available]. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所

Substrate Product List

1156～1170 item / All 1900 items

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ABL's 'Manufacturing and Sales of Electronic Devices'

ABL's 'Manufacturing and Sales of Electronic Devices'

We respond to product development, manufacturing, inspection, and shipping in all fields with short lead times.

Our company conducts product development, manufacturing, inspection, and shipping across various fields with a short delivery time through collaboration in development, implementation, processing, and assembly. As the number of engineers decreases, we respond to a wide range of manufacturing needs, including circuit board wiring and modifications, with reliable technology. Additionally, we offer proposals tailored to customer needs for resin parts that support the casing, which pertains to the appearance of industrial products, as well as electronic components. We can also accommodate wireless measurement and wire bonding, so please feel free to consult with us. 【Service Offerings】 ■ Universal circuit board wiring and assembly ■ Case design, engineering, and manufacturing ■ Wireless measurement systems and wire bonding ■ Sales of various conversion boards *For more details, please refer to the PDF document or feel free to contact us.

  • Embedded system design service
  • Contract manufacturing
  • Semiconductor inspection/test equipment
  • Substrate

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Liquid Flow Sensor Evaluation Kit 'EK-SLG-0150'

Liquid Flow Sensor Evaluation Kit 'EK-SLG-0150'

The maximum operating pressure is 1200 bar (17500 psi)! Introducing our evaluation kit.

We would like to introduce our liquid flow sensor evaluation kit, 'EK-SLG-0150'. The maximum flow rate is 8 ml/min (water-based). The interfaces (connectors) available are RS485, I2C, USB, or analog (4-pin M8). Our sensor solutions are used in a wide range of applications and markets. Please feel free to contact us when you need assistance. 【Included Items】 ■ SLG-0150 × 1 ■ SCC1-USB Sensor Cable × 1 ■ SCC1-Analog Sensor Cable × 1 ■ Basic Fitting Set ■ Quick Start Guide *For more details, please download the PDF or feel free to contact us.

  • Evaluation Board
  • Substrate

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Particle Matter Sensor Evaluation Kit 'SEK-SPS30'

Particle Matter Sensor Evaluation Kit 'SEK-SPS30'

Compact, ultra-thin package! Includes SPS30 and UART-USB adapter cable.

We would like to introduce our particle matter sensor evaluation kit, 'SEK-SPS30'. It offers advanced particle size binning provided through calibrated digital output. In addition to its unique long-term stability due to contamination resistance, it comes in a compact, ultra-thin package. 【Included Items】 ■SPS30×1 ■UART-USB adapter cable (2m long)×1 *For more details, please download the PDF or feel free to contact us.

  • Other Sensors
  • Evaluation Board
  • Substrate

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Liquid Flow Sensor Evaluation Kit 'EK-SLI-1000'

Liquid Flow Sensor Evaluation Kit 'EK-SLI-1000'

IP65 waterproof and dust resistant! Maximum flow rate is 1ml/min (aqueous) and 10ml/min (hydrocarbon).

We would like to introduce our liquid flow sensor evaluation kit, 'EK-SLI-1000'. It features IP65 waterproof and dust resistance, with a maximum flow rate of 1ml/min (aqueous) and 10ml/min (hydrocarbon). The interfaces (connectors) available are RS485, I2C, USB, or analog (4-pin M8). Please feel free to contact us if you have any inquiries. 【Included Items】 ■ SLI-1000 ×1 ■ SCC1-USB sensor cable ×1 ■ SCC1-Analog sensor cable ×1 ■ Basic fitting set ■ Quick start guide *For more details, please download the PDF or feel free to contact us.

  • Flow Sensor
  • Evaluation Board
  • Substrate

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Liquid Flow Sensor Evaluation Kit 'EK-LD20-2600B'

Liquid Flow Sensor Evaluation Kit 'EK-LD20-2600B'

The interface (connector) is I2C! Maximum flow rate 1000ml/h (aqueous), bamboo joint.

We would like to introduce our liquid flow sensor evaluation kit, 'EK-LD20-2600B'. It is a disposable biomedical product with a maximum flow rate of 1000 ml/h (aqueous) and a bamboo shoot connector. The interface (connector) is I2C, and an SCC1-USB sensor cable is required separately. 【Included Items】 ■ LD20-2600B ×3 ■ Base Station ×3 ■ Quick Start Guide *For more details, please download the PDF or feel free to contact us.

  • Flow Sensor
  • Evaluation Board
  • Substrate

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Liquid Flow Sensor Evaluation Kit 'EK-SLF3C-1300F'

Liquid Flow Sensor Evaluation Kit 'EK-SLF3C-1300F'

Fluid control and system reliability are achieved, leading to a dramatic improvement in performance and end-user satisfaction!

We would like to introduce our liquid flow sensor evaluation kit, 'EK-SLF3C-1300F'. The "SLF3S-1300F" combines our long-standing excellent track record in low flow and minimum flow sensing with a thoroughly optimized mechanical design, elevating its already well-established functionality to a higher level in terms of price-to-performance ratio. This sensor provides the highest level of safety, stability, and long-term reliability across a wide range of fields, including diagnostics, analytical equipment, and life sciences. 【Features of SLF3S-1300F】 ■ Optimizes costs by simplifying design based on CMOSens Technology without sacrificing fluid, electrical, or mechanical connections. ■ Offers outstanding chemical resistance and excellent media compatibility. ■ Monitors the operation of the entire system and detects common failure modes. *For more details, please download the PDF or feel free to contact us.

  • Flow Sensor
  • Evaluation Board
  • Substrate

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Ain Corporation "Business Introduction"

Ain Corporation "Business Introduction"

Leave it to us for heat management substrates and high-frequency wiring boards!

Ain Corporation is a company primarily engaged in the sale of printed circuit boards, ceramic inks, and chemical industrial products. We provide a consistent product development process from design to production. We handle a wide range of high-performance substrates, such as "ceramics" and "VCM," which achieve excellent through-hole performance and bonding strength with low resistance values. 【Business Activities】 ■ Design, manufacturing, and sales of printed circuit boards ■ Manufacturing and sales of information control devices ■ Manufacturing, sales, and rental of printed circuit board manufacturing machinery and equipment ■ Sales of chemical industrial products *For more details, please download the PDF or feel free to contact us.

  • Other electronic parts
  • Substrate

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Metal base wiring board

Metal base wiring board

High thermal conductivity and low thermal expansion base wiring board! Custom specifications can also be discussed.

The "metal base wiring board" is a high thermal conductivity wiring board that accommodates everything from standard aluminum base boards to copper base boards and custom specifications. We have various stock of aluminum and copper bases in a laminated structure, allowing for short delivery times. Additionally, we can accommodate special specifications (structure and materials) as per your requests. 【Features】 ■ High thermal conductivity ■ Short delivery times available ■ Special specifications can also be discussed *For more details, please download the PDF or feel free to contact us.

  • Other semiconductors
  • Printed Circuit Board
  • Other electronic parts
  • Substrate

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Printed Circuit Board Assembly

Printed Circuit Board Assembly

We accept orders regardless of quantity! Comprehensive support from design to implementation of printed circuit boards!

We can accept component mounting on printed circuit boards regardless of quantity. We offer a consistent response from design and manufacturing of printed circuit boards to component procurement and component mounting. (Some processes are outsourced.) We can also respond to requests for assembly, adjustment, and inspection, so please feel free to consult with us. 【Features】 ■ Integrated system from design and manufacturing to component procurement and component mounting *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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AMB substrate

AMB substrate

High insulation, heat dissipation, and reliability! Thick copper ceramic substrates for power devices.

The "AMB substrate" is a substrate that joins thick copper to ceramics using the AMB (Active Metal Brazing) method. It is a thick copper ceramic substrate for power devices that has high insulation, heat dissipation, and reliability. 【Specifications】 ■ Base material: Silicon nitride (Si₃N₄) 　　　　Aluminum nitride (AlN) 　　　　Alumina (Al₂O₃) ■ Conductor thickness: 300 to 1000 μm *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • Substrate

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Through Hole Filling

Through Hole Filling

Superior electrical and thermal properties due to special copper plating! Introducing the filling of DPC substrates.

"Through hole filling" refers to the process of filling holes in ceramic substrates that excel in electrical (low resistance) and thermal (high thermal conductivity) properties due to special copper plating. We will introduce hole filling for diameters of Φ0.1 mm, as well as Φ0.15 mm and Φ0.2 mm, with photos. *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • Substrate

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Thick copper wiring board

Thick copper wiring board

A wiring board that enables miniaturization and cost reduction through the substrate of high current circuits.

The "thick copper wiring board" is a wiring board that uses copper plates in the wiring layer to respond to the "high current" demands of the electronics industry. By creating a substrate for high current circuits, it enables miniaturization and cost reduction. 【Features】 ■ Responds to the "high current" demands of the electronics industry ■ Uses copper plates in the wiring layer ■ Miniaturization ■ Cost reduction *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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UV LED, power LED, thermal management substrate for LD *Implementation example materials will be provided.

UV LED, power LED, thermal management substrate for LD *Implementation example materials will be provided.

Heat countermeasures, from proposal and design of metal-based special substrates to implementation, all in one go. Introducing our track record of adoption!

When designing modules that use high-power optical semiconductors, such as UV LEDs, a suitable wiring board for implementation is necessary. Our company proposes appropriate wiring boards considering various materials and structures for each requirement. We can also handle the design and manufacturing of wiring boards, as well as the modularization (implementation). ★ You can view detailed materials summarizing photos, structural diagrams, cross-sections, and achievements of "Thermal Countermeasures and Wiring Boards" from the "PDF Download." 【Contents】 ■ DPC Boards (Boards using plating methods) Comparison with thick film and thin film methods is also explained. ■ Copper Base Wiring Boards with Posts (High Thermal Conductivity Wiring Boards) Directly conducts heat from heat-generating components to the base material. ■ Metal Base Wiring Boards (High Thermal Conductivity Wiring Boards) Supports everything from standard aluminum base boards to copper base and custom specifications. ■ Ultraviolet High Reflective Film A film that can be applied to the surfaces of ceramics and metals, excellent in insulation, heat resistance, and ultraviolet resistance, reflecting even in the ultraviolet range. ■ Overview of EMS Services ■ List of Equipment from Partner Companies for Implementation

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  • Circuit board design and manufacturing
  • Substrate

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Design, manufacturing, and sales of high-frequency substrates *Flexible response to special processing as well.

Design, manufacturing, and sales of high-frequency substrates *Flexible response to special processing as well.

Compatible with various materials including fluororesin circuit boards, alumina, and high dielectric ceramics.

Our company designs, manufactures, and sells "high-frequency substrates" using various high-frequency substrate materials, tailored to performance, cost, and delivery time. The materials include fluoropolymer materials and ceramics such as alumina and aluminum nitride. We can also provide laminated substrates combining fluoropolymer substrates with standard FR-4 substrates, as well as copper-based fluoropolymer substrates with higher thermal conductivity. Additionally, we are flexible in accommodating special processing (treatments) such as "cavity structure formation," "counterbore and irregular router processing," "through-hole filling processing," and "electroplating, electroless plating." 【Examples of Achievements】 ■ Substrates for VSAT BUC and LNB (microwave) ■ Substrates for millimeter-wave radar and antennas ■ Substrates for Doppler sensors ■ Substrates for high-frequency power amplifiers ■ Optical transmission/reception units (TOSA/ROSA) *For more details, please refer to the materials. Feel free to contact us with any inquiries.

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  • Circuit board design and manufacturing
  • Substrate

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Metal core printed circuit board

Metal core printed circuit board

We also support special processing such as ZAGRI processing, tap hole processing, and countersunk screw hole processing!

The "Metal Core Wiring Board" is a double-sided high thermal conductivity wiring board that uses metal as the core material. It supports high thermal conductive materials up to 10 W/m·K and low elastic materials (to reduce solder cracking), as well as "special insulation layers," "multilayer," "special processing," and "special materials." 【Specifications】 ■ Aluminum Core Wiring Board Insulation Layer - Thermal Conductivity: 5.0 W/m·K - Thickness: 120 μm - Young's Modulus: 33 GPa - Copper Plate Thickness: (0.2～) 0.5/1.0/1.5/2.0(～3.0) mm - Foil Thickness: 35/70(～200) μm *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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