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substrate Product List and Ranking from 42 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

  1. トリコ 東京支店 Tokyo//Industrial Electrical Equipment
  2. null/null
  3. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  4. 4 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  5. 5 DAIKIN FINETECH, LTD. Nara//Resin/Plastic
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substrate Product ranking

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

  1. Equipment Repair and Lifespan Extension: Trico's Repair Service for Industrial Equipment トリコ 東京支店
  2. PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
  3. Ceramic Laminated Substrates You Might Not Know: HTCC Substrates and LTCC Substrates
  4. 4 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  5. 5 Noise countermeasures in the artwork design of DC/DC converters グロース

substrate Product List

1606～1620 item / All 1847 items

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Things You Can't Ask Now! Basic Knowledge of Printed Circuit Boards

Things You Can't Ask Now! Basic Knowledge of Printed Circuit Boards

OKI, which handles various printed circuit boards, provides a thorough explanation of the basics of printed circuit boards (wiring boards)! [Free handbook available now]

OKI, which handles custom specifications of printed circuit boards (PCBs) with various functions such as high multi-layering, heat dissipation, and high-frequency compatibility, will explain the basics of printed circuit boards. From the basics like "What is a printed circuit board?" to accommodating high current, high voltage, and high heat dissipation specifications, as well as supporting high-speed and large-capacity transmission, this guidebook is filled with valuable knowledge that we encourage you to read. [Contents (partial)] ■ What is a printed circuit board? ■ Types of printed circuit boards ■ Support for high-speed and large-capacity transmission ■ Support for high-density build-up structures, etc. *For more details, please download the PDF or contact us.

  • Circuit board design and manufacturing

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Simulation case study

Simulation case study

Applied simulation to third-party designed boards! We redesigned it from a three-layer to a one-layer build-up.

We would like to introduce a case where we achieved cost reduction and shortened delivery time by converting a 3-layer build-up to a single layer. By applying simulation to a competitor's designed circuit board, we redesigned it in-house from a 3-layer to a single-layer build-up without compromising electrical and noise characteristics. Additionally, in a case where we utilized our small-diameter drilling technology to reduce crosstalk, the BGA extraction via section experienced reduced crosstalk. We proposed in advance that the coupling in the Z-axis direction between vias, which occurs in high-thickness boards, could be reduced through small-diameter φ0.15 drilling. [Case Studies] ■ Cost reduction and shortened delivery time by converting a 3-layer build-up to a single layer ■ Utilization of our small-diameter drilling technology to reduce crosstalk *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Simulation-based substrate design

Simulation-based substrate design

If you provide the required specifications, we will propose suitable board specifications and designs.

We will solve various issues related to printed circuit boards through simulation. We provide one-stop solutions for printed circuit boards that balance performance and cost. If you provide us with your required specifications, we can propose suitable board specifications and designs, leveraging our extensive background data and manufacturing technology unique to PCB manufacturers to suggest optimal characteristics. [Issues] - Non-functional, distorted waveforms, do not meet standards - Unstable operation under high load - Time-consuming cause investigation and countermeasures - Do not meet EMC standards *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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High board thickness and narrow pitch printed circuit board manufacturing technology.

High board thickness and narrow pitch printed circuit board manufacturing technology.

Applicable to semiconductor tester substrates! Achieving narrow pitch printed circuit boards in even higher multilayer and thicker board areas.

Based on the FITT (Fine pitch Through via Technology) method, we are promoting high-precision technology to achieve narrow pitch printed circuit boards in even higher multilayer and thicker board areas. With a board thickness of 7.65mm and a φ0.20 drill through processing, we can accommodate 0.50mm pitch BGA. This technology can be applied to semiconductor tester boards such as load boards, socket boards, and probe cards. 【Features】 ■ Accommodates 0.50mm pitch BGA with a board thickness of 7.65mm and φ0.20 drill through processing - Up to 76 layers ■ Accommodates 0.25mm pitch BGA with ultra-small diameter φ0.10 drill processing - Up to 26 layers with sequential structure possible ■ Achieves narrow pitch BGA compatible boards in even higher multilayer and thicker board areas *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Flex-rigid printed circuit board

Flex-rigid printed circuit board

Contributing to miniaturization and high density! No mold costs → We can respond at a low cost through router processing.

You can eliminate wiring constraints with OKI's flex-rigid printed circuit boards. We solve customer issues such as "I can't find space for connectors to connect cables" and "I want to eliminate variations in contact resistance due to connectors." Our products can be used for miniaturization and high density without connectors, as well as for reducing cable connection errors and wiring labor. 【Features】 ■ Proposal for flex-rigid printed circuit boards ■ Suggestion to adopt rigid structure into the inner layer of flexible material ■ No mold costs required → Supported by router processing (cost-effective) ■ Proposal for multilayer structure of flexible layers *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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High current, high voltage, and high heat dissipation compatible printed circuit board.

High current, high voltage, and high heat dissipation compatible printed circuit board.

For thick copper foil circuit boards, metal core circuit boards, and metal base circuit boards! Pre-shipment inspection possible with dielectric strength testing.

This is an introduction to printed circuit boards designed to solve issues related to high current, high voltage, and heat dissipation. They can be used for thick copper foil boards, metal core boards, and metal base boards. We can conduct high current (up to 400A) conduction tests in-house. 【Features】 ■ Pre-shipment inspection possible with dielectric strength testing ■ Multi-layer formation with conductor thickness up to 500μm ■ Production of products with 2.5mm metal is possible ■ In-house high current (up to 400A) conduction testing available *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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High-end EMS "Advanced M&EMS" *Exhibited at Nepcon

High-end EMS "Advanced M&EMS" *Exhibited at Nepcon

Presentation of Case Studies for Problem Solving: One-stop support from design to maintenance! We respond to various needs such as entering new markets and multilayering of circuit boards.

Our company offers a design and production outsourcing service called 'Advanced M&EMS' for information and communication equipment, medical devices, industrial equipment, and measuring instruments. We can support everything from design to procurement, implementation, prototyping, equipment assembly, and maintenance. We can meet various needs, including entry into the medical device market, small-batch production of diverse products, and miniaturization of multilayer ceramic capacitors. ★ We will be exhibiting at the "36th NEPCON Japan" held from January 19, 2022! 【Overview of the "36th NEPCON Japan"】 Dates: January 19 (Wednesday) to 21 (Friday), 2022 Venue: Tokyo Big Sight Booth Number: East Hall 1, 9-22 We will showcase many examples of our technology and applications that contribute to solving manufacturing challenges. Please feel free to visit our booth. *We are currently offering a collection of case studies on problem-solving. For more details, please check the "PDF Download."

  • others

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DSP Multi-Modem Board

DSP Multi-Modem Board

Leave the development of the modem to us! We will develop products that comply with international standards and recommendations.

Features of the DSP Multi-Modem Board This is a modulation and demodulation board for data transmission using dedicated voice bandwidth lines. The modulation methods comply with the following four types: - International Standard Recommendation ITU T V.29 9600bps, 7200bps, 4800bps - International Standard Recommendation ITU T V.27bis 4800bps, 2400bps - International Standard Recommendation ITU T V.26, V.26bis 2400bps, 1200bps - International Standard Recommendation ITU T V.23 1200bps, 600bps *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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OKI-EMS provides comprehensive manufacturing services in the high-end sector.

OKI-EMS provides comprehensive manufacturing services in the high-end sector.

From design and development to manufacturing, evaluation, and certification, we support our customers' challenges with OKI-EMS's "Comprehensive Manufacturing Services."

We provide design and production contract services in high-end fields such as medical devices, aerospace, information and communication, industry, and measurement under the name 'Advanced M&EMS'. We will be exhibiting at the "22nd Printed Circuit Board EXPO" held from January 20 (Wednesday) to 22 (Friday), 2021! 【Overview of the "22nd Printed Circuit Board EXPO"】 Date: January 20 (Wednesday) to 22 (Friday), 2021 Venue: Tokyo Big Sight, West Hall 3 (4th floor of the West Exhibition Building), Booth No. W22-38 * A virtual (online) booth will also be prepared. We will showcase many examples of our technology and applications that contribute to solving manufacturing challenges. Please feel free to visit our booth.

  • EMS

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Introduction to printed circuit boards.

Introduction to printed circuit boards.

We propose highly reliable and high-performance circuit boards that support a wide range of fields, including information communication and industry!

A "printed circuit board" refers to a substrate on which a pattern (electronic circuit) called a pattern is printed on the surface of an insulating board. Our company proposes high-reliability and high-performance substrates tailored to customer requirements, supporting a wide range of fields such as "information and communication," "semiconductor-related," "aerospace," and "industrial." We offer a rich lineup of products, including flexible substrates that achieve space-saving through the reduction of supporting materials, such as "self-supporting sliding FPC," "high-flex FPC," and "high-speed transmission FPC," as well as innovative products with self-supporting and high-flex capabilities. 【Features】 - Lamination, plating, and patterning technologies that support the manufacturing of characteristic impedance-controlled substrates - In-house developed order management systems and design/manufacturing tools that accommodate single prototype and development needs, as well as small to medium volume production of various types - Highly flexible and sliding flexible substrates *For more details, please refer to the external link page or feel free to contact us.

  • Wiring materials

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Printed circuit board

Printed circuit board

Reliable, high processing capability, unique processing technology. We continue to challenge new manufacturing technologies.

We handle various prototypes, manufacturing, and mass production of printed circuit boards. With reliable and high-capacity processing, and unique processing technologies, we specialize in flexible circuit boards, acrylic and copper plates, router processing, laser processing, press processing, V-cut processing, and various other services. We strive for reliable and fast processing, so please feel free to contact us for inquiries and quotes, especially if you are in a hurry. 【Business Contents】 ■ Prototyping and manufacturing of flexible circuit boards ■ Processing of special materials such as acrylic and copper plates ■ Creation of molds specifically for aluminum substrates ■ Support for various plating on printed circuit boards ■ Production of dip jigs for soldering, etc. *For more details, please download the PDF or feel free to contact us.

  • Processing Contract
  • Printed Circuit Board
  • Circuit board design and manufacturing

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Automotive LED light/power supply board

Automotive LED light/power supply board

This is a circuit board for car light lamps, so materials with good heat dissipation are required. Therefore, it is designed as a double-sided board with an aluminum base.

Stratum 2L (with single layer metal board) Board thickness 1.8 mm Base material FR-4 + MCPCB (aluminum base) Copper thickness 2 Oz Surface treatment OSP

  • Other electronic parts

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Overheated steam (facial device)

Overheated steam (facial device)

Production of control circuit boards for beauty devices.

We have manufactured a control board for a facial device that uses superheated steam.

  • Other process controls

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【OMRON：C500-IA121】

【OMRON：C500-IA121】

【Support for Electronic Component Procurement】 We support the urgent procurement of discontinued products (EOL products) and hard-to-obtain electronic components and semiconductors! We have established a thorough inspection system.

Are you looking for this model number product? ■Manufacturer: OMRON ■Model number: C500-IA121 Owen Corporation swiftly procures electronic components that have become difficult to obtain due to production discontinuation or delivery issues from a global network. We will definitely issue a quotation, so you can confirm the details before placing an order, providing peace of mind. A veteran inspector who has monitored market distribution inventory for over 20 years conducts inspections, and only products that pass inspection are shipped. All delivered items include an inspection report. 【Our Inspection System】 ■X-ray Inspection Non-destructive testing to check internal structures and detect counterfeit or inferior products. ■Microscope Carefully checks for lead bending and any discrepancies in printed fonts. ■Digital Caliper Measures dimensions to the hundredth of a millimeter to detect cleverly crafted counterfeits. ■Curve Tracer Displays the voltage and current characteristic waveforms between terminals on the screen to detect defective products. ★Please visit our website from the link below. ★You can view our company brochure from the download button below. ▼For other model numbers you can inquire about, please refer to the lineup below.

  • others

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Appearance Inspection Table "Built-in Transmitted Light Illumination" PE Porous Chuck

Appearance Inspection Table "Built-in Transmitted Light Illumination" PE Porous Chuck

A porous chuck that can softly hold large workpieces of 500×500mm! Compatible with transparent light AOI (Automatic Optical Inspection)!

The "Embedded Type Transparent Light Illumination PE Porous Chuck" uses soft polyethylene porous material to gently chuck FPCs, wafers, LF, glass substrates, etc., and performs AOI with embedded transparent light illumination. 【Features】 ■ Uses translucent ultra-high molecular weight polyethylene for the porous material ■ Reduces introduction costs and equipment weight compared to ceramic and metal materials ■ When clogging occurs in the porous material, it can be replaced at a low cost ■ When using porous material with an average air pore diameter of less than 5μm, partial adsorption is possible *For more details, please download the PDF materials from <Download Catalog>.

  • Other lighting equipment

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