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substrate Product List and Ranking from 42 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

  1. トリコ 東京支店 Tokyo//Industrial Electrical Equipment
  2. null/null
  3. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  4. 4 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  5. 5 DAIKIN FINETECH, LTD. Nara//Resin/Plastic
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substrate Product ranking

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

  1. Equipment Repair and Lifespan Extension: Trico's Repair Service for Industrial Equipment トリコ 東京支店
  2. PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
  3. Ceramic Laminated Substrates You Might Not Know: HTCC Substrates and LTCC Substrates
  4. 4 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  5. 5 Noise countermeasures in the artwork design of DC/DC converters グロース

substrate Product List

1591～1605 item / All 1847 items

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[Research Material] Global Market for Silicon Carbide (SiC) Substrates

[Research Material] Global Market for Silicon Carbide (SiC) Substrates

World Market for Silicon Carbide (SiC) Substrates: Ultra, Production, Research, Dummy, IT, LED Lighting, Automotive, Industrial, Consumer, Others

This research report (Global Silicon Carbide (SiC) Substrate Market) investigates and analyzes the current status and outlook for the global silicon carbide (SiC) substrate market over the next five years. It includes information on the overview of the global silicon carbide (SiC) substrate market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments of the silicon carbide (SiC) substrate market by type include ultra, production, research, and dummy, while the segments by application cover IT, LED lighting, automotive, industrial, consumer, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of silicon carbide (SiC) substrates. It also includes the market share of major companies in the silicon carbide (SiC) substrate market, product and business overviews, and sales performance.

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[Research Material] Global Market for Semiconductor and IC Packaging Materials

[Research Material] Global Market for Semiconductor and IC Packaging Materials

Global Market for Semiconductor and IC Packaging Materials: Organic Substrates, Bonding Wires, Lead Frames, Ceramic Packages, Solder Balls ...

This research report (Global Semiconductor and IC Packaging Materials Market) investigates and analyzes the current state and future outlook of the global market for semiconductor and IC packaging materials over the next five years. It includes information on the overview of the global semiconductor and IC packaging materials market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the semiconductor and IC packaging materials market include organic substrates, bonding wires, lead frames, ceramic packages, solder balls, and others, while the segments by application cover the electronics industry, medical, automotive, telecommunications, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size for semiconductor and IC packaging materials. The report also includes the market share of major companies in semiconductor and IC packaging materials, product and business overviews, and sales performance.

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[Research Material] World Market for Ceramic Substrates

[Research Material] World Market for Ceramic Substrates

World Market for Ceramic Substrates: Alumina, Aluminum Nitride, Silicon Nitride, Beryllium Oxide, Home Appliances, Automotive, Communication, Industrial, Military, Aerospace Electronics

This research report (Global Ceramic Substrates Market) investigates and analyzes the current state and outlook for the global ceramic substrates market over the next five years. It includes information on the overview of the global ceramic substrates market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the ceramic substrates market focus on alumina, aluminum nitride, silicon nitride, and beryllium oxide, while the segments by application cover home appliances, automotive, telecommunications, industrial, military, and aerospace. The regional segments calculate the market size of ceramic substrates by dividing it into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in the ceramic substrates market, product and business overviews, and sales performance.

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[Research Material] Global Market for Display Glass Substrates

[Research Material] Global Market for Display Glass Substrates

Global Market for Display Glass Substrates: LCD Display Type, LED Display Type, OLED Display Type, Television, Computer ...

This research report (Global Glass Substrates for Displays Market) investigates and analyzes the current status and outlook for the global market of glass substrates for displays over the next five years. It includes information on the overview of the global glass substrates market for displays, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments for glass substrates for displays by type include LCD display type, LED display type, and OLED display type, while the segments by application cover televisions, computers, smartphones, tablet devices, automobiles, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size for glass substrates for displays. The report also includes the market share of major companies in the glass substrates for displays market, product and business overviews, and sales performance.

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[Research Material] World Market for Double-Sided Printed Circuit Boards

[Research Material] World Market for Double-Sided Printed Circuit Boards

World Market for Double-Sided Printed Circuit Boards: Glass Fiber, Paper, Metal, Ceramic, Others, Industrial/Medical, Home Appliances, Military/Aerospace, Others

This research report (Global Double Sided Printed Circuit Board Market) investigates and analyzes the current state and outlook for the global market of double-sided printed circuit boards over the next five years. It includes information on the overview of the global double-sided printed circuit board market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the double-sided printed circuit board market include fiberglass, paper, metal, ceramic, and others, while the segments by application cover industrial/medical, home appliances, military/aerospace, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of double-sided printed circuit boards. The report also includes the market share of major companies in the double-sided printed circuit board sector, product and business overviews, and sales performance.

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[Research Material] Global Market for Flexible Printed Circuit Boards

[Research Material] Global Market for Flexible Printed Circuit Boards

Global Market for Flexible Substrates: Plastic, Glass, Metal, Home Appliances, Solar Energy, Medical & Healthcare, Aerospace & Defense

This research report (Global Flexible Substrate Market) investigates and analyzes the current state of the global flexible substrate market and its outlook for the next five years. It includes information on the overview of the global flexible substrate market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments of the flexible substrate market by type include plastics, glass, and metals, while the segments by application cover home appliances, solar energy, medical and healthcare, and aerospace and defense. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of flexible substrates. It also includes the market share of major companies in the flexible substrate market, product and business overviews, and sales performance.

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World Market for Indium Tin Oxide (ITO) Coated Substrates

World Market for Indium Tin Oxide (ITO) Coated Substrates

World Market for Indium Tin Oxide (ITO) Coated Substrates: ITO Coated Slides & Cover Slips, ITO Coated ...

This research report (Global Indium Tin Oxide (ITO) Coated Substrates Market) investigates and analyzes the current status and outlook for the global market of indium tin oxide (ITO) coated substrates over the next five years. It includes information on the overview of the global indium tin oxide (ITO) coated substrates market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type include ITO coated slides & cover slips, ITO coated cover slips, ITO coated slides, and ITO coated glass plates, while the segments by application cover electrochromic displays, EMI shielding, solar cells, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of indium tin oxide (ITO) coated substrates.

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High-frequency fluororesin FPC substrate

High-frequency fluororesin FPC substrate

Effective in millimeter wave bands such as 5G communication! Products with low transmission loss, low dielectric constant, and high flexibility.

The "High-Frequency Fluororesin FPC Substrate" manufactured by Sumitomo Electric Industries enables low-loss data transmission of high-frequency signals ranging from 20GHz to 100GHz. As a type of flexible substrate, it allows for wiring in tight spaces, contributing to the miniaturization and lightweight design of devices. When used with millimeter-wave planar antennas, it can achieve either antenna miniaturization or enhanced performance per antenna size. 【Features】 ■ Low Transmission Loss: Can be utilized as a wiring material that achieves low transmission loss in high-frequency signal transmission. ■ Thinness and Narrow Pitch: Achieves both thinness and narrow pitch, while offering high design flexibility, contributing to airflow within enclosures and high-density designs. ■ Excellent Gain: By routing antenna circuits on a fluororesin substrate, it can be utilized as an antenna with efficient space usage and excellent gain. *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board

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OKI Circuit Technology Implementation Services

OKI Circuit Technology Implementation Services

Combining OKI's technology and skills with your products to realize the development of new products! Please feel free to consult with us.

At OKI, we provide high-quality support for large, high-density substrates and short-term production of a wide variety of small quantities. This is a comprehensive production contract service that leverages the design and production technologies cultivated in the information and communication manufacturing sector. By combining OKI's technology and skills with your products, we realize the development of new products. Please feel free to consult with us. 【Features】 ■ Procurement of materials can be accepted ■ Comprehensive support from development to implementation ■ Low-cost solutions for 0402 chips and manual soldering ■ Comprehensive production contract service utilizing design and production technologies *For more details, please refer to the PDF materials or feel free to contact us.

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Support for high-density build-up structures

Support for high-density build-up structures

We can accommodate high-density build-up structures, such as 4-layer full-stack prototypes!

Our company enables the mounting of narrow-pitch components through a high-density build-up structure. In the interlayer thick structure, the interlayer thickness is set to 100-120μm, achieving high insulation reliability. Additionally, we support mass production of three-tier full stacks and skip via structures. Please feel free to contact us when you need our services. 【Specifications Supported】 ■ Narrow pitch support ■ Thick copper foil specifications ■ Mixed IVH & LVH ■ High-frequency support An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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Proposal for thermal management and fanless heat dissipation structure using copper coin printed circuit boards.

Proposal for thermal management and fanless heat dissipation structure using copper coin printed circuit boards.

Mass production of copper coin printed circuit boards is possible for high-speed, high-frequency applications and high multilayer substrates. The unique copper coin structure achieves high heat dissipation.

Our company is capable of providing copper coin (heat dissipation structure) wiring boards. With the advancement of high-performance 5G communication devices, managing the heat generated by high-speed, high-frequency components has become a challenge. Additionally, as devices become more compact, semiconductors and electronic components are mounted on substrates at high density, and a fanless structure that eliminates fans and heat sinks within the device is required for low power consumption. Copper coin printed circuit boards can achieve an advanced "heat dissipation structure" that efficiently dissipates the heat generated by electronic components within a limited area. *Copper coin: A material shaped into a cylindrical form, significantly improving the thermal conductivity of the substrate compared to thermal vias. 【Features】 <Development> - Realization of embedding copper coins directly beneath heat-generating components on high-layer-count substrates. - Ensuring high reliability by embedding cylindrical copper using a unique method that minimizes load. - Dramatic improvement in the thermal conductivity of the substrate due to the copper coin structure. - Independently developed equipment for embedding copper coins, flexibly adapting to various coin sizes. - Comprehensive support for thermal simulation, prototyping, and mass production. - Capability for fanless housing design to achieve space-saving and high-efficiency heat dissipation. - Significant improvement in heat dissipation when used in conjunction with thermal management components such as heat pipes and thermal conductive sheets.

  • Circuit board design and manufacturing

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Printed circuit boards (wiring boards) for space and defense equipment.

Printed circuit boards (wiring boards) for space and defense equipment.

We supply printed circuit boards for space and defense applications. The printed circuit boards that withstand harsh operating environments are a testament to the high reliability of our products.

OKI Circuit Technology Co., Ltd. is a manufacturer of printed circuit boards that primarily engages in the development, design, and manufacturing of printed wiring boards, electronic devices, and electronic components, and is part of the OKI Group (OKI Electric Industry Co., Ltd.). The company has obtained certification from the Ministry of Defense and the Japan Aerospace Exploration Agency (JAXA), achieving high quality and high reliability in printed circuit boards that can cater to the aerospace industry, earning a high reputation within the industry. Among the products created with our technology, the "flex-rigid board," which combines flexible printed circuits (FPC) with standard rigid boards, eliminates the need for connector space for connecting cables, achieving space-saving and lightweight designs. Furthermore, it provides high reliability by eliminating concerns about connector connections due to vibrations, contributing to the development of the aerospace industry. Please feel free to consult with us. Our article has been published in MONOist. [Reducing a cumulative 480 hours over three years: How we advanced smart manufacturing in a low-volume, high-mix factory] https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html

  • Printed Circuit Board

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Proposal for thermal management of electronic devices and solutions for heat dissipation.

Proposal for thermal management of electronic devices and solutions for heat dissipation.

Mass production of copper coin printed circuit boards is possible for high multilayer substrates that require heat dissipation and thermal management. High heat dissipation is achieved with a uniquely developed copper coin structure.

Our company is capable of providing copper coin※ (heat dissipation structure) wiring boards. With the advancement of 5G communication devices, thermal management of high-speed, high-frequency components has become a challenge. Additionally, as devices become more compact, semiconductors and electronic components are mounted on substrates at high density, and a fanless structure that eliminates fans and heat sinks within the device is required for low power consumption. Copper coin printed circuit boards can achieve an advanced "heat dissipation structure" that efficiently dissipates the heat generated by electronic components within a limited area. ※Copper coin: A material shaped into a cylindrical form, significantly improving the thermal conductivity of the substrate compared to thermal vias. 【Features】 <Development> - Realization of embedding copper coins directly beneath heat-generating components on high-layer-count substrates. - Ensuring high reliability by embedding cylindrical copper using a unique method that minimizes load. - Dramatic improvement in the thermal conductivity of the substrate due to the copper coin structure. - Unique development of equipment for embedding copper coins, allowing flexible adaptation to various coin sizes. - Comprehensive support for thermal simulation, prototyping, and mass production. - Capability for fanless housing design to achieve space-saving and high-efficiency heat dissipation. - Significant improvement in heat dissipation when used in conjunction with thermal management components such as heat pipes and thermal conductive sheets.

  • Circuit board design and manufacturing

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Millimeter-wave radar compatible printed circuit board (substrate)

Millimeter-wave radar compatible printed circuit board (substrate)

We would like to propose a printed circuit board equipped with a millimeter-wave antenna!

Our company will realize products that support the millimeter wave frequency range of 30 to 300 GHz. Do you have any concerns such as "I would like to consider next-generation millimeter wave radar-equipped devices"? We will support you in solving challenges for product commercialization. We will make proposals tailored to your needs, such as the adoption of new high-frequency materials and joint evaluations. [We solve the following concerns] ■ I would like to consider substrates for millimeter wave radar applications. ■ I would like to consider substrates for next-generation high-frequency applications. ■ I want to reduce transmission loss and delay time. ■ I want to accurately match characteristic impedance. ■ I want to reduce the cost of high-speed, high-frequency compatible substrates. An article about our company has been published in MONOist. [How we advanced smart manufacturing in a small-lot, diverse-product factory to reduce cumulative hours by 480 over three years] https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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High-frequency compatible printed circuit board [Basic knowledge materials on printed circuit boards provided]

High-frequency compatible printed circuit board [Basic knowledge materials on printed circuit boards provided]

Supports high frequency and millimeter wave frequency bands from 30 to 300 GHz! "I want to consider high frequency printed circuit boards, but it's difficult." We will solve such problems!

Our company will realize products that support high-frequency and millimeter-wave frequency bands from 30 to 300 GHz. Do you have any concerns such as "I want to consider next-generation high-frequency printed circuit boards, but it's difficult to realize"? We will support you in solving challenges towards product commercialization. We will provide proposals tailored to your needs, such as adopting new high-frequency materials, evaluating frequency characteristics, and assessing environmental resistance together. [We solve the following concerns] ■ I want to consider next-generation high-frequency application substrates ■ I want to consider millimeter-wave radar application substrates ■ I want to reduce transmission loss and delay time ■ I want to accurately match characteristic impedance ■ I want to keep costs down for high-speed high-frequency compatible substrates ■ I want to know about printed circuit boards for the fifth-generation mobile communication system (5G) ■ I want to learn about the latest lamination technology and pattern design ■ I want to know about selecting suitable printed circuit board materials, etc. *For more details, please refer to the PDF document, or feel free to contact us if you wish to have a technical consultation.

  • Circuit board design and manufacturing

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