We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for substrate.
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substrate Product List and Ranking from 42 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

  1. トリコ 東京支店 Tokyo//Industrial Electrical Equipment
  2. null/null
  3. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  4. 4 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  5. 5 DAIKIN FINETECH, LTD. Nara//Resin/Plastic
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substrate Product ranking

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

  1. Equipment Repair and Lifespan Extension: Trico's Repair Service for Industrial Equipment トリコ 東京支店
  2. PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
  3. Ceramic Laminated Substrates You Might Not Know: HTCC Substrates and LTCC Substrates
  4. 4 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  5. 5 Noise countermeasures in the artwork design of DC/DC converters グロース

substrate Product List

1711～1725 item / All 1848 items

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Technical Introduction: "Improvement of Shape Accuracy (High-Density and Fine Processing Technology)"

Technical Introduction: "Improvement of Shape Accuracy (High-Density and Fine Processing Technology)"

Introducing technology for improving shape accuracy! High-precision shape processing tailored to patterns is possible.

At Sato-Sen Co., Ltd., we have achieved a positional accuracy of ±50μm in outline and pattern positioning. For pattern formation, we utilize the LDI (Laser Direct Imaging) method, and for outlines, we can perform high-precision outline processing tailored to the pattern using CCD technology. We improve hole position accuracy with ultra-high-speed micro-diameter drill machines, form high-density circuits (L/S = 30/30) with LDI, and provide high-density multilayer printed circuit boards with stable quality using X-ray reference drilling devices and X-ray length measuring machines. 【Features】 ○ We offer multilayer printed circuit boards → High density, IVH, BVH, and build-up with design flexibility ○ Implementation on through-holes is possible with flat plugs (pad-on-via) ○ Support for narrow pitch patterns with landless through-holes ○ Extremely fine printing is possible (1 character: vertical 0.28mm × horizontal 0.15mm) Please contact us for more details.

  • Printed Circuit Board

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Technical Introduction: "Heat Dissipation (High Brightness and Heat Dissipation Technology)"

Technical Introduction: "Heat Dissipation (High Brightness and Heat Dissipation Technology)"

Introducing heat dissipation technology! Heat dissipation is possible through pattern design, selection of heat dissipation materials, and setting conductor thickness.

At Sato-sen Co., Ltd., we propose optimal heat dissipation technologies for implementing devices with high heat generation. If it is necessary to lower the junction temperature of the mounted devices, heat dissipation can be achieved through pattern design, selection of heat dissipation substrates, and setting of conductor thickness. We also offer a wide variety of materials for substrates, including metal, CEM3, and multilayer heat dissipation materials. 【Features】 - Heat dissipation through thermal vias filled with copper paste in through-holes is possible. - Heat dissipation using heat sink pins inserted into through-holes is also possible. - Outline processing can be done using V-cut, routing, and pressing. For more details, please contact us.

  • Printed Circuit Board

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Technical Introduction: "Magnetic Reduction Technology"

Technical Introduction: "Magnetic Reduction Technology"

Introducing magnetic reduction technology for printed circuit boards! A method to reduce magnetism using flash gold plating.

At Sato-Sen Co., Ltd., we can propose methods to reduce magnetism with flash gold plating. It is possible to reduce magnetism by selecting the appropriate nickel plating solution. Additionally, we also offer special gold plating to completely eliminate magnetism. 【Advantages of Sato-Sen Co., Ltd.】 ○ Development and production system ○ Experience and know-how ○ Advanced equipment ○ Collaborative capabilities Please contact us for more details.

  • Printed Circuit Board

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[Design Examples and Technical Introduction] High-Frequency Solutions

[Design Examples and Technical Introduction] High-Frequency Solutions

Providing circuit boards with high simulation reproducibility by combining low dielectric loss alumina substrate manufacturing technology, high-precision patterning technology, and design and evaluation techniques.

In the millimeter wave and terahertz wave regions used in Beyond 5G (6G), low-loss substrate characteristics and fine patterning technology are required. In addition to the manufacturing technology of low dielectric loss ceramic substrates that we have cultivated over many years, high-precision patterning technology, and design technology that meets customer requests, we have also become capable of simulation and measurement at high frequencies. As a result, we can provide high-frequency circuit substrates with high reproducibility in simulations. Please feel free to consult us with any requests or questions, such as "I want this kind of passive component." We will solve problems with our technological development capabilities and comprehensive strength that only a substrate manufacturer can provide.

  • High frequency/microwave parts

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Formation of fine electronic circuits on ceramic thin plates 500mm x 500mm (MAX)

Formation of fine electronic circuits on ceramic thin plates 500mm x 500mm (MAX)

From business card size to A4 size, forming thick film circuits in desired sizes and materials. From forming electronic circuits with ceramic materials to applications for firing setters.

Notice from Kyoritsu Elex - - - - - - - - - - - - - - - - - - - - - - - - - JPCA Show 2025 (Printed Circuit Board Technology Exhibition) Location: (Tokyo Big Sight) June 4 (Wednesday) to June 6 (Friday), 2025, for 3 days - - - - - - - - - - - - - - - - - - - - - - - - - We look forward to seeing you. Our company offers circuit formation for electronic component applications using the technology of printed circuit formation on ceramics substrates manufactured in-house, all through a consistent in-house process. By utilizing screen printing methods, we can provide custom solutions with shorter lead times compared to etching methods. Additionally, since the printed materials undergo high-temperature baking (850°C), they achieve stable performance and high reliability. The printed materials are not limited to wiring materials (metal paste) but also include insulating glass materials and ceramics, which can also be printed. Furthermore, we have achieved not only circuit formation but also "through-hole via formation" and "multilayer circuit structures." We are advancing technology development to meet various application possibilities, so we look forward to your inquiries.

  • KZ3_curbe_print.jpg
  • KZ3_print.jpg
  • alumina_print.jpg
  • L35_S35_Au_Plate.jpg
  • 内層回路基板.png
  • LEDPKG各種.png
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  • KEX_Image20211224.jpg
  • Other electronic parts

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[Thin Plate Bending Circuit Board] A substrate with a thickness of 0.1mm or less can be used by bending!

[Thin Plate Bending Circuit Board] A substrate with a thickness of 0.1mm or less can be used by bending!

Using FR-4 material with a thickness of 0.1mm or less, it can be bent and used like a flexible circuit board. Initial costs can be addressed at a low price.

Our "Thin Plate Bending Circuit Board" uses glass epoxy substrates (FR-4) with a thickness of 0.1mm or less, making it suitable for applications that require several bending actions during bending and assembly. Thanks to router processing, there is no need for coverlay processing molds or outline processing molds. This helps reduce initial costs from prototyping to mass production, allowing for cost-effective manufacturing of products. It is suitable for circuit boards that require component mounting and bending, and can be used in industrial equipment, LED lighting, and wearable devices (such as VR headsets and controllers). 【Features】 - Ideal for applications that require several bending actions during bending and assembly. - More cost-effective in terms of product and initial costs compared to flexible circuit boards (when compared to our offerings). - No need for coverlay processing molds or outline processing molds. - Capable of handling small to medium production volumes. *For more details, please refer to the materials. Feel free to contact us with any inquiries. *Materials for special circuit boards other than thin plate bending circuit boards can also be viewed via download.

  • Printed Circuit Board

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Understand the printed circuit board manufacturing process in 5 minutes [Materials available].

Understand the printed circuit board manufacturing process in 5 minutes [Materials available].

You can also use it for new employee training and internal study sessions. *Currently running an initial discount campaign for new customers on design and circuit board manufacturing!

This document provides a simple diagrammatic explanation of the printed circuit board manufacturing process, including: - Types and characteristics of main materials - Types of printed circuit board manufacturing methods - Types of surface treatments and more. *Some specifications and processes are unique to our company. *This document can be viewed via download. *You can also download an introduction to our special circuit boards. ~Campaign Announcement~ We are currently running a limited-time discount campaign on design and initial manufacturing costs for new customers only. ■Period: Until March 7, 2025 If you have a request to reduce initial costs, please take advantage of this opportunity! For more details, feel free to contact us through our website.

  • Printed Circuit Board

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Can you find hints for improving manufacturing with special substrates? [Materials available for distribution]

Can you find hints for improving manufacturing with special substrates? [Materials available for distribution]

In fact, Sanwa's special substrates are used in such places. We support the resolution of various challenges such as implementation defects, costs, and man-hours with substrate technology.

Our company is a specialized manufacturer of printed circuit boards, actively challenging complex processing and difficult requests, with a wealth of experience and trust. We cater to a wide range of needs, from general circuit boards to special boards aimed at solving challenges related to assembly and product commercialization. Your development concerns, on-site work improvements, and issues related to enhancing product value may be resolved with our printed circuit boards. 【Are you facing any of these issues?】 ■ I want to make the product smaller. ■ I want to use a cavity structure to reduce the height of the product. ■ I am looking for alternatives to FPC. ■ I want to bend FR-4 or aluminum boards for use inside equipment. ■ I want to eliminate copper burrs on side electrodes. ■ I want to eliminate glass cloth or resin debris from the edge of the board. ■ I want to suppress heat generation from components using the board. ■ I want to use boards that are cost-effective and suitable for high-frequency applications. We will work together to address your challenges, supporting your product development with a consistent system from the design stage to prototyping and mass production. No matter how trivial the matter may seem, please feel free to contact us with your ideas or concerns!

  • Printed Circuit Board

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Temperature Dependence of Discoloration in Wafer-Type Ceramic (Sapphire Substrate)

Temperature Dependence of Discoloration in Wafer-Type Ceramic (Sapphire Substrate)

In Ar plasma, the color difference is small, while in O2 plasma, there is a tendency for the color difference to become larger.

We would like to introduce the temperature dependence of discoloration in wafer-type ceramic (sapphire substrate) technical data. When the wafer-type ceramic was heated to 400°C and subjected to plasma treatment, a tendency for the color difference to decrease was observed with Ar plasma, while an increase in color difference was observed with O2 plasma. Although there is a temperature dependence on discoloration, it was confirmed that it can still be used as an indicator even at 400°C. 【Overview of Ar/O2 Plasma Treatment】 ■ Method: CCP (RF) ■ Initial Vacuum Level: 5.0×10^-4 Pa ■ RF Power: 50 W ■ Gas Flow Rate: 40 sccm ■ Treatment Gas Pressure: 10 Pa ■ Treatment Time: 10 minutes *For more details, please refer to the related links or feel free to contact us. *The first image shows Ar plasma treatment, and the second image shows O2 plasma treatment.

  • Other inspection equipment and devices

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Metal matrix composite substrate Baseplate

Metal matrix composite substrate Baseplate

High thermal conductivity, low expansion, high rigidity, strong bonding, good weldability.

AlSiC substrates are widely used in equipment equipped with high-power IGBT modules due to their excellent thermodynamic and mechanical properties.

  • Other metal materials

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Quality Policy: Traceability System

Quality Policy: Traceability System

Process management to maintain quality

In our quality assurance process, we inspect all products after assembly using an inspection sheet. We confirm the quality that has already been integrated into the standardized work processes at each stage. ★Manufacturing Number Management System★ A manufacturing number is assigned for each order. All work records, including process communication documents, are managed by the manufacturing number. In the unlikely event of a defect in market products, we can instantly identify the manufacturing period. ★Parts Information Tracking★ We centrally manage inventory data and parts receipt and dispatch that are always linked to the bill of materials for the circuit board in our inventory management system. Anyone can track parts information for each project. Any changes to parts are recorded in the bill of materials and stored for ten years. ★Shipping History Records★ We record the shipping method for each order. In the case of delivery, we import the tracking number and shipping information into our internal system, allowing for past tracking. When products are shipped, we notify customers with a shipping completion email. *For more details, please refer to the PDF document or feel free to contact us.*

  • Circuit board design and manufacturing

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Cross-reference table for other companies' EOL piezo buzzers (July updated version)

Cross-reference table for other companies' EOL piezo buzzers (July updated version)

A cross-reference table with many equivalent products for discontinued items, where you can also compare specifications.

At Same Sky, we continuously manufacture and sell magnetic buzzers and piezo buzzers. Among them, we have received numerous inquiries regarding the EOL products of Murata Manufacturing's piezo buzzers, so we have listed our products that are believed to be as close as possible.

  • Sound Parts

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【TTL_展示会レポート】JPCAShow2024出展内容

【TTL_展示会レポート】JPCAShow2024出展内容

『FPCのお困り事、一刀両断！』太洋テクノレックスは次代のニーズを敏感にキャッチし、フレキシブルな技術力でFPCを牽引！

フレキシブルプリント配線板 高周波フッ素複合材3層FPC 　誘電特性に優れたフッ素複合材FPCでノイズ対策と狭小化を両立。同軸ケーブルからの転換にも好適。 MSAP工法～超細線FPC～ 　めっきアップで高精度、かつ高密度の微細配線を実現。配線断面の矩形性に優れ、イメージ通りの配線形成が可能。 透明FPC 　優れた光透過性と耐熱性を備えチップ実装も可能なFPC。 　製品のデザインを損なうことなく配線の引き回しが可能。 6層スタックビアFPC 　ビアフィリング技術によるスタックビア構造で、さらなる高密度配線化を実現。配線スペースの有効活用により、設計自由度の向上に貢献。 基板検査システム【最終外観検査】 　パッケージ・モジュール系基板に好適な光学分解能2.5µm仕様機が遂にラインナップ！　 　虚報低減AIシステム『ザイス』と欠陥検出AIシステムの採用で最終外観検査工程の効率化を大幅にアップしました。 マテハン・協働ロボット活用で自動化・効率化を提案 協働ロボット・産業用ロボットのシステムインテグレートや周辺機器など、お客様の業種や業態に適したFAシステムをご提案致します。

  • Printed Circuit Board

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Experience Taiyo Technorex's FPC at Nepcon Japan 2025!

Experience Taiyo Technorex's FPC at Nepcon Japan 2025!

Fureki's social study trip, experience Taiyo Technorex's FPC at Nepcon Japan 2025!

◎FPC (Flexible Printed Circuit Board): Under the theme of "Discovering Applications for FPC," you can experience the characteristics of FPC in four zones: lightweight, flexible, fine, and special. 1. Comparison of weight between rigid boards and FPC 2. FPC that you can actually touch and bend 3. Reduction of board area through high-density wiring 4. FPC with special features such as transparent, high-frequency, and pressure-resistant types Additionally, we are showcasing next-generation circuit technologies such as stack vias and via fills. It's not just about FPC! We also have live demonstrations of 'FA Automation' and 'Latest Appearance Inspection Systems using AI Technology'! ◎FA Automation: By achieving teaching-less automation through visual feedback control, we eliminate calibration burdens and realize high-precision, high-speed operation. We have prepared a demonstration of rigid board transport and are waiting for you. ◎The latest final appearance inspection system, AI system 'TY-VISION XAIS,' has entered Chapter 2! In addition to improving efficiency by reducing false positives in the final appearance inspection process, it also supports defect detection using AI. It is effective for defects with low brightness differences that are difficult to detect by inspection devices, even though they can be identified visually.

  • Printed Circuit Board

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X-ray Component Counter "Assure Series"

X-ray Component Counter "Assure Series"

Instant measurement of reel internal parts! Compatible with trays, sticks, and cut products.

The "Assure Series" is an X-ray component counter that accurately counts the number of internal parts in a reel with "Smart," "Simple," and "Speedy" features. It can measure while still in the packaging, allowing for counting even in ESD bags or with desiccants. Additionally, as a feature exclusive to the Pro model, it can be managed even more efficiently with the built-in barcode camera. 【Features】 ■ One of the smallest installation footprints in the industry ■ Fast and easy counting ■ Measurement can be done while still in packaging ■ Component absence detection function ■ Pro model exclusive features *For more details, please refer to the related links or feel free to contact us.

  • X-ray inspection equipment

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