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substrate Product List and Ranking from 577 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Jul 22, 2026～Aug 18, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jul 22, 2026～Aug 18, 2026
This ranking is based on the number of page views on our site.

  1. スクリーンプロセス Kanagawa//others
  2. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  3. 共立エレックス Saga//Ceramics
  4. 4 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  5. 5 アイン 本社工場 Nagano//Electronic Components and Semiconductors
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substrate Product ranking

Last Updated： Aggregation Period:Jul 22, 2026～Aug 18, 2026
This ranking is based on the number of page views on our site.

  1. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  2. Ceramic substrate for firing setters 共立エレックス
  3. Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  4. 4 PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
  5. 5 Wrist Frequency Correction Vibration Acceleration Effective Value Measuring Instrument 'TVHP-001' 吉川電機製作所

substrate Product List

1441～1470 item / All 1969 items

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"PCB Design and Manufacturing Services" Introducing special technologies for PCBs!

"PCB Design and Manufacturing Services" Introducing special technologies for PCBs!

We support your company from creation to manufacturing! [Free materials available]

We would like to introduce our "Circuit Board Design and Manufacturing Services." Our circuit board design takes into account the assembly process and repairs. You can also trust us with high-frequency circuit board design. We primarily offer domestic manufactured circuit boards for prototypes and short lead times. We can accommodate urgent requests such as "I need a circuit board urgently." Additionally, we can handle both OUT-OUT and OUY-IN for overseas manufactured circuit boards. Please leave it to our experienced company. 【Features】 ■ Circuit Board Design - Design considering the assembly process and repairs - You can also trust us with high-frequency circuit board design ■ Circuit Board Manufacturing - Prototype samples / small quantity and variety / mass production boards / special boards *Available from just one piece - Domestic manufactured circuit boards: Focus on prototypes and short lead times, capable of handling high difficulty level boards - Overseas manufactured circuit boards: 6 years of experience with major automotive circuit boards *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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Achieving automation and efficiency in production lines through karakuri improvements for small and medium-sized manufacturing industries.

Achieving automation and efficiency in production lines through karakuri improvements for small and medium-sized manufacturing industries.

How about considering "Recruitment Alchemy" to gain profits and talent through efficiency achieved by automation?

The automation of factories as envisioned by us, Tsumori Ironworks. The goal is not merely the introduction of robots or autonomous driving. We aim to achieve both efficiency and securing human resources simultaneously with the current funding, and we propose automation solutions! We define this as "Recruitment Alchemy." < Unique Proposals from Tsumori Ironworks > We handle many automation lines and related equipment for major manufacturing companies. In particular, we recommend a technology that moves objects without relying on power sources, known as "Karakuri Improvement," for local automobile manufacturers. Based on this concept, we design with minimal use of power whenever possible. ⇒ This is why we can offer the best automation proposals while keeping costs down! ★ We will visit your factory in person, check the factory layout and personnel placement, and propose a simple line setup. Why not start with a consultation and have a conversation?

  • Contract manufacturing
  • substrate

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Introduction to Chiyo Electronic Industry Co., Ltd. "Circuit Board Manufacturing"

Introduction to Chiyo Electronic Industry Co., Ltd. "Circuit Board Manufacturing"

We are working on establishing a manufacturing system that can meet our customers' needs!

Chiyo Electronic Industries Co., Ltd. has 7 SMT lines and produces high-quality circuit boards with short lead times that are difficult to achieve with overseas production. We accommodate both small-batch production of various types and mass production, switching between approximately 40 lots of different models per day. Additionally, by managing components with our unique barcode system, we ensure accurate inventory management and traceability. 【Manufactured Items】 ■ Circuit boards for currency processing machines ■ Circuit boards for analytical instruments ■ Circuit boards for car navigation systems ■ Circuit boards for plasma power supplies ■ Currency processing machine units ■ Analytical measurement instruments *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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System Core Co., Ltd. Business Introduction

System Core Co., Ltd. Business Introduction

We will assist you with the automation of equipment and the development of new products.

At System Core Co., Ltd., we develop devices that control objects using electronic circuit boards and computers equipped with microcontrollers (MCUs). In the design, development, and production of electronic circuit boards and embedded devices, we have developed numerous board devices such as logic circuit boards, motor and solenoid driver boards, and LED lighting boards. In embedded program (microcontroller) software development, we assist clients who specialize in board development or those who are lacking embedded programming staff, and we can also develop microcontroller software exclusively. 【Business Activities】 ■ Embedded hardware and software design, development, and production ■ Control equipment Windows software development ■ Electronic board development, design, and production ■ Various product shipping inspection devices ■ Other various software and hardware development and design *For more details, please download the PDF or feel free to contact us.

  • Circuit board design and manufacturing
  • Other embedded systems (software and hardware)
  • Embedded system design service
  • substrate

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Low dielectric materials for communication equipment Smart Cellular Board

Low dielectric materials for communication equipment Smart Cellular Board

Achieved further reduction in dielectric constant of engineering plastics and super engineering plastics with unique foaming technology. Contributed to solving design challenges arising from multi-band and high-frequency applications.

The Smart Cellular Board (SCB) from Furukawa Electric is a low dielectric material in a finely foamed sheet form. Our proprietary foaming technology allows us to foam resins that are highly heat-resistant and difficult to foam, such as engineering plastics and super engineering plastics. As a result, we can fill air into various inherently low dielectric resins, reducing their dielectric properties to levels that are difficult to achieve with conventional resin materials. In particular, the low dielectric constant (Dk) achieves a value below 2.0, which is challenging with solid resins. If you are facing challenges in designing communication devices for high frequency and multi-band applications, please consider our product. 【SCB Features for Substrate Applications】 - Reduction of transmission loss due to low Dk and low Df - Compatibility of low height and low transmission loss due to low Dk - Suppression of miniaturization of array antennas associated with high frequency 【SCB Features for Radome Applications】 - Suppression of radio wave reflection due to low Dk - Assurance of radio wave transparency over a wide bandwidth and wide angle without worrying about radome thickness - Suppression of reflection and interference of radio waves within the antenna - Lightweight radome design

  • plastic
  • Engineering Plastics
  • substrate

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Freesia Auto Research Co., Ltd. Business Introduction

Freesia Auto Research Co., Ltd. Business Introduction

We respond to all needs from the design, prototyping, manufacturing, to assembly of printed circuit boards.

Our company, as one of the leading circuit board manufacturers in Japan, provides comprehensive support from circuit board design to assembly. With the teamwork of planners and printed circuit board designers who have extensive experience, we design and manufacture printed circuit boards that are thoroughly focused on circuit performance. Leveraging the network of our various locations across Japan, we respond flexibly to meet our customers' needs. 【Business Activities】 ■ Circuit Board Design ■ Circuit Board Prototyping ■ Circuit Board Manufacturing ■ Circuit Board Assembly *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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Limited Liability Company R.I.F. Business Introduction

Limited Liability Company R.I.F. Business Introduction

Leave electronic circuit design, electronic system design, and embedded board design to us!

RIF Co., Ltd. specializes in electronic circuit design, electronic system design, and the sale of embedded circuit board design. We offer a wide range of products, including LED digital thermometers, simple infrared remote control repeaters, and LANC mode selectors. Additionally, we can produce prototypes and evaluation boards at low prices for small-scale production and hobby projects, so please feel free to contact us with your requests. 【Features】 ■ We can make some modifications to related products or develop new ones. ■ Depending on the content, we can produce even one unit. *For more details, please feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • substrate

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Dissimilar copper thick coexistence substrate

Dissimilar copper thick coexistence substrate

A high-current substrate suitable for miniaturized power devices!

The "Hybrid Copper Thickness Coexistence Substrate" is a high-current substrate that allows for the coexistence of 300μm thick copper foil and 70μm thin copper foil within the same layer, enabling switching between them. It achieves a reduction in assembly processes and component count, making it suitable for power devices represented by GaN and SiC, which are becoming more compact. 【Features】 ■ Switchable between 300μm and 70μm ■ 300μm and 70μm can be interwoven ■ Combination of copper inlays is possible *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • substrate

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High current substrate

High current substrate

With a rich lineup of copper foil thicknesses, we can accommodate current values from a few amperes to several hundred amperes!

The "High Current Substrate" is a printed circuit board that can carry large currents ranging from several tens to several hundred amperes, featuring thick copper foil. We offer "Ultra Thick Copper High Current Substrates" that use copper thicknesses of 300μm, 400μm, and 500μm, exceeding the conventional copper thickness of 105 to 240μm, as well as "Irregular Copper Thickness Coexisting Substrates" suitable for power devices represented by GaN and SiC, which are becoming more compact. 【Features】 - In the case of 300μm, coexistence with 50μm thin copper foil is possible in the same layer. - For thicknesses of 500μm or more, it is possible to draw copper foil out of the substrate from the inner or outer layers. - Exposure within the substrate is also possible. - Terminal processing, bending processing, and three-dimensional shaping of the substrate are possible. *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Copper inlay substrate

Copper inlay substrate

A high-current, high-heat-dissipation substrate that achieves effective heat dissipation!

The "copper inlay substrate" is used in a wide range of fields and is particularly adopted as a critical component related to human life in automotive applications, being a high-current and high-heat-dissipation substrate. It achieves an excellent cost-performance heat dissipation method. By pressing copper directly beneath heat-generating components, it effectively dissipates heat. Additionally, eliminating the need for screw fastening for each heat-generating component enhances reliability, reduces costs, and decreases assembly labor. 【Features】 ■ Compared to aluminum heat dissipation substrates, the lower coefficient of thermal expansion of copper improves the reliability of solder joints. ■ Compared to aluminum heat dissipation substrates, it allows for the use of high multilayer substrates and double-sided mounted substrates, increasing design flexibility. ■ Increased circuit efficiency due to greater freedom in component placement. ■ Miniaturization. ■ Both SMD and lead components can adopt the same heat dissipation structure. *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • substrate

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BN substrate (substrate for high heat-resistant printed circuit boards)

BN substrate (substrate for high heat-resistant printed circuit boards)

Substrate for high-temperature printed circuit boards with excellent insulation reliability.

At Print Tech Co., Ltd., we handle substrates for printed circuit boards that excel in heat resistance. We offer "BN300," which is used as a substrate for semiconductor substrates due to its high heat resistance characteristics, and "BN-LX," a high-reliability substrate for printed circuit boards that achieves environmental compatibility, high heat resistance (TG = 300°C), and low warpage (CTE = 6ppm). Please feel free to consult us if you have any requests. 【Product Lineup】 ■ BN300 ■ BN-LX *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Other electronic parts
  • Other machine elements
  • substrate

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High multi-layer, large printed circuit boards (PCBs) and backplanes manufactured overseas.

High multi-layer, large printed circuit boards (PCBs) and backplanes manufactured overseas.

Our company's circuit board manufacturing specializes in high-layer and large circuit boards up to 60 layers. We will develop solutions for your interconnection issues.

For over 30 years, our technological advancements in PCBs and backplanes have enabled several key innovations in high-speed networking and computing products. 【Services Offered】 ■ PCB layout, CAD, design for manufacturability and cost ■ Quick-turn PCB prototyping for PCBs, backplanes, and flex circuits ■ Mass production and global manufacturing in North America and Asia ■ Advanced technologies: laminated boards, HDI, any layer through structure, multiple sequential laminations ■ Manufacturing services utilizing SVP (Simultaneous Via Partitioning™) and intellectual property licensing opportunities ■ Manufacturing of high-layer-count and large PCBs *For more details, please refer to the PDF document or feel free to contact Sanmina.

  • Contract manufacturing
  • substrate

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Overseas manufacturing of advanced PCBs (printed circuit boards) for aerospace, medical devices, communication equipment, etc.

Overseas manufacturing of advanced PCBs (printed circuit boards) for aerospace, medical devices, communication equipment, etc.

We have strengths in advanced technology for high multilayer and ultra-fine pitch developed for aerospace applications, and we respond to the needs for procuring advanced substrates overseas.

We would like to introduce our overseas manufacturing of advanced PCBs (printed circuit boards) for aerospace, medical devices, communication equipment, and more. Our company is a PCB manufacturing company with a long track record of providing PCB solutions for major markets in high-speed telecom, networking, computing, ATE, mission-critical defense and aerospace (MIL-PRF-31032, AS9100), automotive, and medical sectors. 【Features】 ■ Global footprint (two locations in the U.S., four factories in Singapore and China) ■ Design for PCB layout, CAD, productivity improvement, and cost reduction ■ Complete NPI support ■ Material technology ■ Technical leadership (multilayer boards, HDI, etc.) 【We will be exhibiting at NEPCON Japan 2025!】 Date: January 22 (Wed) - 24 (Fri), 2025, 10:00 AM - 5:00 PM Venue: Tokyo Big Sight (Booth # E28-17) *Please register your visit via the link below and stop by our booth! (No waiting time)

  • 航空宇宙向け等高度なPCB（基板）の海外製造2.PNG
  • 航空宇宙向け等高度なPCB（基板）の海外製造3.PNG
  • 航空宇宙向け等高度なPCB（基板）の海外製造4.PNG
  • 航空宇宙向け等高度なPCB（基板）の海外製造5.PNG
  • 航空宇宙向け等高度なPCB（基板）の海外製造6.PNG
  • Circuit board design and manufacturing
  • substrate

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High-precision, high-heat-dissipation device substrate / ultra-thin glass cloth multilayer substrate

High-precision, high-heat-dissipation device substrate / ultra-thin glass cloth multilayer substrate

The cup angle and bottom size can be freely selected! After implementation, the height of the board can be kept low.

This product is a "high-precision device substrate" that allows for a low profile of the board after mounting by installing an IC in the seat groove. It is designed for LED light reflectors, and the cup angle and bottom surface size can be freely selected. In addition, we also offer "high heat dissipation device substrates" and "ultra-thin glass cloth multilayer substrates." 【Features】 <High-Precision Device Substrate> ■ Enables a low profile of the board after mounting ■ Cup angle and bottom surface size can be freely selected <High Heat Dissipation Device Substrate> ■ Combines various heat dissipation technologies to meet advanced requirements ■ Copper pillars do not damage through-hole plating as they are not press-fitted *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Heat-dissipating substrate "Thick Copper Special Substrate"

Heat-dissipating substrate "Thick Copper Special Substrate"

A thick copper three-layer substrate with a total thickness of 0.35mm! Suitable for applications such as mobile phone camera flash substrates.

We handle "heat dissipation structure substrates" with built-in copper. We use a thick copper three-layer substrate (inner layer copper thickness 0.2mm, total board thickness 0.35mm) and ultra-thin PP (0.03mm). These are used for applications such as mobile phone camera flash substrates. 【Required Performance】 ■ Circuit and SR alignment tolerance of 0.04mm ■ Surface treatment for gold wire bonding (electroless NiPdAu plating) ■ Deviation tolerance between the outer shape centerline and the component pad centerline of ±0.075mm *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Other electronic parts
  • substrate

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High Heat Dissipation Substrate "High Precision Heat Dissipation Via"

High Heat Dissipation Substrate "High Precision Heat Dissipation Via"

We meet advanced requirements through the combination of high-precision machining and high heat dissipation structures!

Our company handles the heat dissipation substrate "High Precision Heat Dissipation Via." The applicable substrate methods include general through-hole TH, BVH, IVH, and build-up methods. The finishing plating options include electroless NiAu, bonding NiAu, and other impedance control solutions. By combining high-precision machining with a high heat dissipation structure, we meet advanced requirements. 【Features】 ■ Applicable substrate methods: Compatible with general through-hole TH, BVH, IVH, and build-up methods ■ Finishing plating: Electroless NiAu, bonding NiAu 　　　　　　　　Other impedance control compatible ■ Resin dam structure compatible with both high and low standards *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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Heat dissipation substrate "Heat dissipation Via"

Heat dissipation substrate "Heat dissipation Via"

Multilayering of thick copper substrates is also possible! We can handle filling of blind vias and vacuum filling in-house.

Our company handles the heat dissipation substrate "Heat Dissipation Via." With the increasing heat generation due to the high performance and miniaturization of electronic components, there is a growing need for heat dissipation pathways that allow the heat generated by components to escape from the space to the pattern, in order to maintain the performance of electronic devices and extend their lifespan. We propose solutions to these issues as heat dissipation measures. It is also possible to create multilayer thick copper substrates, allowing for the development of new applications that have not been seen before. 【Features】 ■ Thick copper substrate with copper foil thickness of 210μm ■ Copper paste VIA hole filling (thermal conductivity 0.58–7.8W/mk) - Small diameter VIA φ 0.15 is supported, - Bottom-filled VIA hole filling can also be handled in-house with vacuum filling. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Special processing for substrates used in high-precision devices.

Special processing for substrates used in high-precision devices.

Special processing such as ZAGRI processing, laser processing, and high-precision processing for pattern alignment is possible!

Our company handles special processing of "high-precision substrates for high-precision devices." The accuracy of the counterbore processing is ±20μm, the high-precision outer diameter processing by laser is ±10μm, and the high-precision processing for pattern alignment is ±50μm. By installing ICs in the counterbore section, it is possible to keep the height of the substrate low after mounting. 【High-Precision Processing】 ■ Counterbore processing accuracy: ±20μm ■ High-precision outer diameter processing by laser: ±10μm ■ High-precision processing for pattern alignment: ±50μm *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Other electronic parts
  • converter
  • substrate

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Metal base substrate

Metal base substrate

A special substrate that is joined to a metal base by thermal pressing beneath the substrate. The through-hole section can be joined to the metal base by copper plating.

A solder plating or tin plating is applied in advance under the substrate, and by thermally bonding it to the metal plate, a complete surface joint is provided. It is also possible to use high-frequency compatible substrates made of low dielectric materials or substrates made of fluororesin. Such combinations can provide a very effective heat dissipation structure for high-frequency applications. Additionally, it is also effective for EMI countermeasures in RF applications.

  • High frequency/microwave parts
  • substrate

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Stretchable circuit board

Stretchable circuit board

Follows uneven surfaces and curves! A circuit board that serves as electrodes for various sensors and maintains conductivity even when stretched.

The "stretchable circuit board" conforms to uneven surfaces and curves, maintaining conductivity even during stretching. It allows for circuit formation on any material depending on the application, while ensuring elasticity. As a stretchable pressure sensor, it can be utilized in various applications such as monitoring beds and shoe insoles, and it does not break even under load. Additionally, the stretchable biosensor detects weak biological signals using Ag/AgCl electrodes. 【Features】 ■ Conforms to uneven surfaces and curves ■ Maintains conductivity during stretching ■ Supports various batch sizes ■ Can serve as electrodes for various sensors ■ Does not break under load *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • substrate

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[Information] Current Status of Stretchable Substrates Reaching Practical Levels

[Information] Current Status of Stretchable Substrates Reaching Practical Levels

Meeting a wide range of user needs! An introduction to the current status of the development of stretchable substrates.

This document introduces the current status of the development of stretchable substrates. It includes information on material development, improvements in construction methods, and the expansion of application uses. Our company has been able to provide variations of standard connection methods, allowing for more diverse proposals for application development on the customer side. [Contents] ■ Preface ■ Material Development ■ Improvements in Construction Methods ■ Expansion of Application Uses ■ Future Developments *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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[Information] Various Measures for Heat Dissipation in Circuit Board Design

[Information] Various Measures for Heat Dissipation in Circuit Board Design

Introducing new heat dissipation technology in circuit board design! It is already widely adopted in various mass-produced circuit boards.

The miniaturization of devices, the high-frequency characteristics of circuits, and the increase in the current being handled have led to concerns about heat generation from the devices and circuits mounted on the substrate. This document provides detailed information on substrate design techniques that can accommodate everything from small-scale prototypes to mass production. We explain various new technologies for heat dissipation measures in substrate design. We encourage you to read it. 【Contents】 ■ Trends in devices ■ High heat dissipation measures for specific devices ■ Improving heat dissipation with surface structures ■ Metal core and metal base substrates ■ Thick copper substrates *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • substrate

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High-frequency compatible substrate

High-frequency compatible substrate

Hybrid structure of PTFE material and general-purpose materials achieves both performance and cost! Introduction of composite material substrates.

When focusing on cost and availability, FR4 becomes a material with significant losses at high frequencies, while PTFE, which has issues with cost, is highlighted when considering high-frequency characteristics. Additionally, the reality is that high-frequency material substrates are often difficult to obtain, and it is not easy to find manufacturers that can accommodate small-scale prototypes. The "composite material substrate" uses PTFE material for the layers that form high-frequency circuits. General circuits and power circuits are constructed with FR-4 or high Tg materials, providing multilayer substrates that are compatible with high frequencies while keeping total costs down. 【Composite Material Substrate Features】 ■ PTFE + General-purpose materials ■ PTFE material is used for the layers that form high-frequency circuits ■ General circuits and power circuits are constructed with FR-4 or high Tg materials ■ Multilayer substrates compatible with high frequencies that keep total costs down *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Heat management of mounted components on the substrate.

Heat management of mounted components on the substrate.

The thermal conductivity of copper inlay is 390 W/mK! It can efficiently dissipate heat to the heat sink.

With the increase in signal high frequency, there is a tendency for the heat generation from components to increase, and the heat generated from individual circuit components also rises due to the increase in electrical power of the circuit. If these components are used without sufficient heat dissipation, issues such as unstable operation, reduced output, and decreased reliability may occur. By embedding a copper inlay, which is a metal with good thermal conductivity, directly beneath the mounted components, it is possible to efficiently dissipate heat to the heat sink. Our company can accommodate everything from double-sided boards to multilayer boards, and we can use materials such as FR-4, high Tg materials, and high-frequency materials. Please contact us for details regarding configuration and materials. 【Features】 ■ Directly dissipates heat from mounted components to the heat sink ■ Thermal conductivity of copper inlay: 390W/mK ■ Compatible with double-sided boards to multilayer boards ■ Materials available include FR-4, high Tg materials, and high-frequency materials *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Hamamatsu Pulse Co., Ltd. Business Introduction

Hamamatsu Pulse Co., Ltd. Business Introduction

If you are considering outsourcing manufacturing for circuit board assembly, semi-finished products, and finished product assembly and packaging, primarily related to consumer goods machinery and industrial equipment, please contact us!

Our company is entrusted with the manufacturing of printed circuit board assembly, semi-finished module unit assembly, and finished product assembly and packaging, based on strong trust and a proven track record from major manufacturers, including small lot and diverse production. We have numerous orders for PCB assembly, not only for domestic production but also for the implementation of prototype boards intended for mass production overseas. If desired, we can also provide technical proposals regarding issues encountered during prototype assembly and the manufacturing process for mass production. We have established a comprehensive production system, so we strive to meet customer requests by offering high-value-added semi-finished module units that incorporate not only PCB assembly but also sheet metal parts and resin-molded components, along with proposals for Q.C.D. We actively accept orders for semi-finished module assembly and finished product assembly, even if PCB assembly is not involved, so please feel free to contact us. *Please consult us regarding prototype-only or limited-time cases. 【Business Content】 ■ Manufacturing, assembly, and packaging related to electronic musical instruments and industrial control devices ■ Development, manufacturing, and sales of LED film light-related products ■ Other related businesses *For more details, please download the PDF or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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NFC Magnetic Field Driven Motor Control Circuit <Under Development>

NFC Magnetic Field Driven Motor Control Circuit <Under Development>

We are developing a circuit that drives a motor using the magnetic field of a smartphone's NFC!

We have published a video of the experiment to unlock a thumb turn (key) on our company website.

  • IC tag
  • Other security
  • substrate

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Aluminum foil etching processing and circuit board

Aluminum foil etching processing and circuit board

It is possible to reduce costs compared to copper foil etched circuit boards.

We will form circuits using composite materials such as aluminum foil and PET film through etching processing. Our unique aluminum foil etching method enables the formation of precise circuits for applications such as aluminum heater products, antennas, or sensors using aluminum foil.

  • aluminum
  • Sensors
  • Aluminum heater
  • substrate

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High thermal conductivity substrate "Metal substrate"

High thermal conductivity substrate "Metal substrate"

You can freely choose the layer composition according to your needs! Customization is also possible for various specifications of the substrate!

"Metal substrates" are high thermal conductivity substrates designed to efficiently conduct and dissipate heat generated by LEDs and power semiconductors to enclosures or heat sinks. They utilize the thermal conductivity of the base or core metal. The layer composition can be freely selected depending on the application. It is also possible to customize various specifications of the substrate, such as the thickness and type of base metal, the thermal conductivity of the insulation layer, and the thickness of the pattern copper, according to the purpose. [Features] ■ The layer composition can be freely selected depending on the application - Metal base substrate - Multi-layer metal base substrate - Metal core substrate (Aluminum) - Metal core substrate (Copper) ■ Customization of various specifications of the substrate is possible *For more details, please refer to the PDF document or feel free to contact us.

  • Company：HNS
  • Price：Other
  • others
  • Printed Circuit Board
  • substrate

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Printed circuit board "Silicone-based substrate (Silicone)"

Printed circuit board "Silicone-based substrate (Silicone)"

Utilizing the flexibility of the substrate, it can be implemented without a heat sink even on curved surfaces!

The "Silicone-based substrate" is a flexible printed circuit board that uses high thermal conductivity silicone sheets. Silicone resin is highly flexible and can be expected to prevent solder cracks during heat cycles. Additionally, by utilizing the flexibility of the substrate, it can be implemented without a heat sink on curved surfaces. 【Features】 ■ Flexible printed circuit board ■ Uses high thermal conductivity silicone sheets ■ Prevents solder cracks during heat cycles ■ Can be implemented without a heat sink on curved surfaces *For more details, please refer to the PDF document or feel free to contact us.

  • Company：HNS
  • Price：Other
  • others
  • Printed Circuit Board
  • substrate

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Introduction to Techno Staff Support Services

Introduction to Techno Staff Support Services

Support the development of young and mid-career technicians and skilled workers who will become the driving force behind Japan's manufacturing capabilities!

Techno Staff Co., Ltd. is a support company for human resource development and manufacturing that nurtures successors in mechanical, mold, and electrical technology and skills. We realize the aspirations of young people who want to acquire more advanced technology and skills, apply their improved abilities to their daily work, and contribute to Japan's manufacturing by participating in skill tests and skill Olympics. Our "professional instructors," who possess the technology and skills that supported Japan's rapid economic growth, will assist you in inheriting your "technology and abilities." [Support Services] ■ Processing, Assembly, Adjustment ■ Design, Drafting ■ Management, Operations *For more details, please refer to the PDF materials or feel free to contact us.

  • others
  • substrate

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