We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for substrate.
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substrate Product List and Ranking from 561 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated: Aggregation Period:Jan 14, 2026~Feb 10, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Jan 14, 2026~Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社 和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  4. 4 JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  5. 5 共栄電資 Tokyo//Electronic Components and Semiconductors

substrate Product ranking

Last Updated: Aggregation Period:Jan 14, 2026~Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. [Exhibition Report] We exhibited at NEPCON Japan 2026! 太洋テクノレックス 本社 和歌山
  2. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社 和歌山
  3. [Notice_26.2] Regarding the Publication of Our Articles - Related to Space Business - 太洋テクノレックス 本社 和歌山
  4. 4 High-strength alumina substrate for thin films JAPAN FINE CERAMICS CO., LTD. (JFC) Tokyo Sales Office
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrate Product List

1441~1470 item / All 1884 items

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Expansion board "Raspberry Pi(R)"

We provide teaching materials and reference books that can be used in actual embedded business.

We offer the expansion board "Raspberry Pi(R)" as our own product. We provide teaching materials and reference books that can be used in actual embedded work. Please feel free to contact us if you have any requests. 【Lineup】 ■ Basic image processing programs: face recognition, color recognition, centroid determination, etc. ■ Japanese speech recognition ■ Japanese speech synthesis ■ Digital input/output: AD conversion input support ■ Embedded-compatible power configuration ■ Internet-based remote communication ■ 24-channel servo motor control: teaching operation possible *For more details, please download the PDF or contact us.

  • Circuit board design and manufacturing
  • substrate

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Ultra-small, high-precision flexible substrate

Custom-made support for narrow pitch high-definition and ultra-high-definition substrates! Leave flexible substrates (high-definition FPC) to us!

Our company is a specialized manufacturer of circuit boards, celebrating approximately 50 years this year. With our extensive experience and track record in solving various challenges in flexible circuit boards, we can produce high-resolution FPC prototypes in a short lead time, covering everything from cost considerations to prototype manufacturing and mass production. We utilize advanced techniques such as micro-hole processing using chemical etching, BVH connections, and polyimide micro-hole processing technology that allows for simultaneous hole drilling to meet our customers' needs. Please feel free to contact us with your requests. 【Features】 ■ Custom-made high-resolution and ultra-high-resolution boards with narrow pitch ■ Micro-hole processing and BVH connections using chemical etching ■ Introduction of polyimide micro-hole processing technology that allows for simultaneous hole drilling *For more details, please download the PDF or contact us.

  • Board to FPC connector
  • substrate

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Mountaineer "My Data MY15"

A compact feeder that allows for the removal of setup time! The tip tape can be set even if it is short.

"My Data MY15" is a mounter suitable for implementing various types and small lot sizes. It allows for the mounting of components on multiple types of printed circuit boards at once and can also handle irregularly shaped boards. Additionally, the feeder allows for quick setup by simply inserting the tip of the reel component, reducing work time. By scanning the barcode on the feeder and setting it in the magazine, the component setup is completed. 【Features】 ■ Capable of mounting components on multiple types of printed circuit boards at once ■ Capable of mounting components on irregularly shaped boards (no need for dummy boards) ■ Can mount circular, trapezoidal, star-shaped, and other types of printed circuit boards ■ Short changeover time ■ Can be set even with short tape on the tip of reel components *For more details, please refer to the PDF document or feel free to contact us.

  • others
  • substrate

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FPC

With our extensive experience and production technology, we provide timely FPCs that satisfy everyone at any stage of development cooperation, prototyping, and mass production.

Single-sided FPC, double-sided FPC, multi-layer FPC, low-rebound FPC, used in various applications such as space and aerospace equipment, medical devices, industrial equipment and robots, car electronics, mobile devices and computer-related equipment, cameras and movie equipment, and electronic components.

  • Board to FPC connector
  • substrate

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Aluminum base substrate [Noise and heat countermeasures with aluminum grounding]

Achieving grounding of the aluminum section! This improves the usability and design flexibility of the aluminum section.

When it comes to aluminum base substrates, the mainstream options are those that have an insulating layer pre-attached to aluminum, released by substrate material manufacturers. However, this limits the choice of aluminum thickness and the dielectric constant of the substrate to only what is available in the existing lineup, imposing restrictions on design. To address this, our company has developed a unique method of bonding the substrate to aluminum, allowing us to create aluminum base substrates using the desired substrate and aluminum. This significantly enhances design flexibility, enabling requests such as increasing aluminum thickness or using high-dielectric materials like Teflon or PPE for miniaturization. Additionally, post-bonding processing is possible, allowing for the creation of cavities for mounting components by machining only the substrate portion. 【Features (Aluminum Base Through-Hole Substrate)】 ■ Method of bonding substrate material to aluminum - High-frequency bonding film - Eutectic solder (lead-free options available upon consultation) ■ Achieves grounding of the aluminum section ■ Dramatically improves the usability of the aluminum section ■ Automatic mounting via reflow is also possible (in collaboration with partner companies) *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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Large high multi-layer / large substrate

Production of ultra-large size boards such as motherboards and long boards for LED lighting is possible!

At Kyoei Denshi Co., Ltd., we are capable of producing long and large substrates exceeding 1,000mm in length. We accommodate various specifications such as high frequency, thick copper, and high multilayer. We support ultra-large size "large high multilayer substrates" for motherboards used in information and communication devices and for BTB applications, as well as "long substrates" up to a maximum of 1,000mm for LED lighting and A0 print heads. 【Features】 ■ Capable of producing ultra-large sizes ■ Vacuum forming press machine / heating plate size 750×1,100 ■ Supports up to 24 layers ■ Products up to a maximum of 1,000mm for LED lighting and A0 print heads *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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Hybrid substrate (honeycomb material laminated substrate)

By combining different substrate materials in horizontal and vertical directions, we can reduce assembly man-hours and save space!

Hybrid substrates integrate multiple substrate materials with different characteristics by combining them in horizontal and vertical directions (layering), allowing for the unification of what was previously divided into multiple boards, thus achieving a reduction in assembly labor and space-saving. Additionally, we offer "honeycomb substrates" that are ultra-lightweight and have excellent electrical properties through a composite technology that incorporates honeycomb materials into the substrate and layers them. Honeycomb materials are particularly effective when bonded with fluoropolymer (Teflon) substrates. Fluoropolymers are used as materials for high-frequency substrates due to their low dielectric constant, but the base material itself is soft, making it difficult to handle. When scaled up, thin substrates can bend or break, while making the substrate thicker can lead to warping due to its own weight. Honeycomb materials are lightweight and have high strength, allowing for reinforcement of the substrate when bonded, which helps to reduce warping. Furthermore, not only does it contribute to weight reduction, but the air within the honeycomb also serves as an insulating layer, making it effective when a lower dielectric constant is desired. Moreover, because the honeycomb material provides reinforcement, handling becomes easier compared to when using the substrate alone, thus improving work efficiency. *For more details, please refer to the PDF document or feel free to contact us.*

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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Molded cast products [We propose the selection of resins tailored to the required characteristics].

Product creation tailored to needs: ・High voltage resistance (proven up to 30kV) ・Custom resin formulation to match desired performance.

Molded cast products can conform to any shape for mold production and ensure insulation performance. They also excel in electrical properties, mechanical strength, dimensional stability, and chemical resistance. Leveraging our unique position as both a manufacturer and a trading company, we propose the optimal resin from multiple options based on the usage environment and the most important performance criteria you prioritize. Additionally, we can collaborate with resin manufacturers to custom blend resins to achieve the desired properties. Resins come with various performance characteristics. If you want to use them outdoors or need something resistant to chemicals, please feel free to consult us. 【Cast Products】 ■ High-strength resins ■ Low thermal expansion resins ■ Thermal conductive resins 【Applications and Examples】 ■ Switching devices ■ Circuit breakers ■ Power conditioners ■ Gap spacers 【Quality Control】 ■ Dielectric strength testing ■ Corona discharge testing *For more details, please refer to the PDF document or feel free to contact us using the form below.

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  • Vacuum Equipment
  • Resin mold
  • substrate

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Heat-dissipating molded cast products [Resin molded products that combine heat dissipation and insulation properties]

Proposals for EV vehicles with increasing heat dissipation requirements, high-efficiency motors, power devices, etc.

We solve heat problems caused by the miniaturization of devices with the power of resin. We offer proposals for applications such as EV vehicles, high-efficiency motors, and power devices, where the demand for heat dissipation is increasing. Leveraging our unique position as both a manufacturer and a trading company, we suggest suitable resins from multiple manufacturers based on the usage environment and other factors. Additionally, we can collaborate with resin manufacturers to custom blend resins to achieve desired properties. Please feel free to consult us with any other requests. 【Features】 ■ Achieves thermal conductivity of 2.6 W/m·K ■ Breakdown voltage of 17 kV/mm *For more details, please refer to the PDF document or feel free to contact us.

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  • Other Auto Parts
  • substrate

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Bus bar (bus bar) high current substrate

By substrate-izing the busbar, high insulation and compactness are achieved!

We have substrate-ized busbars used for high current applications. By utilizing our special technology for substrate-ization, we achieve high insulation properties and a compact, lightweight design. We can accommodate lengths of up to 1,000mm. Additionally, substrate-ization offers the following benefits: - Mounting of power devices such as IGBTs and SiCs on the substrate. - After substrate mounting, installation into equipment is possible, leading to reduced assembly time and prevention of miswiring. - Space-saving due to simplified substrate and wiring, resulting in overall equipment miniaturization. - The greatest advantage of substrate-ization is its high insulation performance and usability. The insulation layer made with prepreg has a consistent thickness, eliminating concerns about variations in thickness like those seen with powder coating. - By covering areas other than the necessary parts with the substrate, handling becomes easier, and work during transportation and installation can be performed safely. *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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[Equipment Introduction] Leave implementation technology and circuit board assembly to us.

We offer a lead-free compatible line, discrete component inserters, inspection equipment, and more!

We would like to introduce the equipment owned by World Electronics Co., Ltd. The SMT L6 line (lead-free compatible line) includes a cream solder printer, adhesive applicator, high-speed component mounter, odd-form component mounter, and a lead-free compatible N2 reflow oven. Additionally, the high-speed axial component inserter "AVK3" supports self-insertion for board sizes (mm) with a maximum of 508×381 and a minimum of 50×50. 【Equipment Owned (Excerpt)】 ■ Flow Soldering Line - Spray Fluxer - Automatic Soldering Equipment: 3 lines for lead-free solder, 1 line for eutectic solder *For more details, please refer to the PDF document or feel free to contact us.

  • Soldering Equipment
  • Circuit Board Inspection Equipment
  • X-ray inspection equipment
  • substrate

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Transaction Flow

First, please feel free to contact us via the inquiry form or by phone!

We would like to introduce the flow of transactions with World Electronics Co., Ltd. First, please contact us via the inquiry form or by phone, and we will gather necessary information such as the type of product, quantity, and delivery date. Based on the information provided, we will create and present a quotation. Once you agree to it, we will proceed with the contract. Next, we will create a prototype and respond sincerely until the desired product is completed. Once the prototype is finished, we will manufacture the product and deliver it according to the desired delivery date. 【Transaction Flow】 1. Inquiry 2. Requirements Hearing 3. Quotation 4. Contract 5. Prototype Creation 6. Manufacturing 7. Delivery *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services
  • substrate

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Board "SY-KUS-01"

PCI Express board capable of high-capacity data transmission and reception using high-speed serial communication.

The "SY-KUS-01" is a PCI Express board equipped with a Xilinx Kintex UltraScale FPGA. It enables high-speed serial communication for large-capacity data transmission and reception. It features two channels of DDR4 as external memory. It is equipped with the FPGA XCKU035-2FFVA1156C, and options for 025, 040, and 060 are also available. Additionally, it includes two QSPI (totaling 512Mbit). 256Mbit can be used as user space. 【Features】 ■ PCI Express (supports up to Gen3 x 8) ■ Oscillator ・ Equipped with 100MHz, 200MHz, and 250MHz ■ Two channels of DDR4 (1 channel = 32Gbit 64bit_DataBus) ■ SFP+ 4ch ■ MMCX 2Lane (Tx/Rx) + RefCLK ■ 8-pin PinHeader external interface *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Contract manufacturing
  • substrate

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[Solution Example] i.MX8M Mini <Differences in Patterns>

Compare the differences and start testing with four types of design and pattern variations! Please take a look.

The preliminary evaluation has been completed to some extent, and we have created four types of circuit boards with different wiring patterns for LP-DDR4. We are comparing the differences between the pattern simulations during the design phase and the actual devices, providing feedback, and adjusting detailed CPU parameter settings while confirming operation and accumulating data. We are progressing with the evaluation work to propose suitable solutions. 【Design and Patterns】 ■Standard patterns based on NXP evaluation boards ■Consideration of delay constraint relaxation for high-density design support ■Verification of crosstalk effects ■Consideration of layer reduction *Details of the case studies can be viewed via the related links. For more information, please feel free to contact us.

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[Solution Case] FPGA In-house Research Meeting vol.1

Control the ping pong balls inside the tube! Introducing research on high-speed image processing and motor control.

Our company regularly holds research meetings to improve FPGA technology in-house. This time, we are using an FPGA with an ARM core to process images captured by a camera while controlling a fan motor, and to control a ping pong ball inside a tube at the same location where the image was taken. We are advancing research that enables simultaneous processing on the ARM and FPGA, allowing for faster and more appropriate feedback. By continuing such in-house research, we are tackling new technological fields. *Details of the case can be viewed through the related links. For more information, please feel free to contact us.*

  • Embedded Board Computers
  • Development support tools (ICE, emulators, debuggers, etc.)
  • substrate

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Printed circuit board

Developing printed circuit boards that support technology! Bringing products to life that meet various needs.

Daishin Sangyo Co., Ltd. develops printed circuit boards with a skilled and experienced design team specializing in technical expertise. We are capable of manufacturing special substrates, including build-up boards, Teflon boards, and aluminum boards. We offer a wide range of services from circuit tracing to power supply, analog, digital, high frequency, impedance, and FPGA design. 【Features】 ■ Possible to ship as soon as the next day ■ Supports small lots to mass production ■ Circuit design ■ Artwork design (pattern design) ■ Metal mask production *For more details, please refer to the PDF document or feel free to contact us.

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  • Circuit board design and manufacturing
  • Printed Circuit Board
  • substrate

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[Information] Daishin Sangyo Co., Ltd. Manufacturing Supplement

Introducing numerous examples of high-difficulty substrates, such as 0.5 pitch BGA mounted 8-layer through resin-filled boards (t0.6)!

This document is a supplementary manufacturing material from Oshin Industry Co., Ltd. It includes information such as the lineup of standard substrate materials, maximum sizes of multilayer boards, and maximum board thickness. Additionally, as examples of high-difficulty substrates, we introduce technologies such as "0.4 pitch BGA mounted 8-layer through resin-filled substrate (t1.6)" and "0.4 pitch BGA mounted 16-layer L1-2/L1-3…L1-8 continuous IVH substrate (t3.2)." We encourage you to read it. 【Contents (partial)】 ■General - Standard substrate materials - Maximum sizes of multilayer boards - Maximum board thickness ■Technology (Examples of high-difficulty substrate achievements) - 0.5 pitch BGA mounted 12-layer 2-8-2 build-up substrate (t1.6) - 0.5 pitch BGA mounted 16-layer L1-8/L9-16 IVH + through resin-filled substrate (t2.0) *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board processing machine
  • Other processing machines
  • substrate

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Printed circuit board "10-layer 3-4-3 build-up board"

Introducing a printed circuit board with a core section of 4-layer TH, resin-filled and lid-plated! It features a 0.4 pitch 256-pin BGA.

Daishin Sangyo Co., Ltd. was founded in the early Showa period in the Fukushima Ward of Osaka and has been a trading company primarily selling electrical and electronic products for many years. The "10-layer 3-4-3 build-up substrate" is a printed circuit board equipped with a 0.4 pitch 256 pin BGA. It features via-on-via with via fill copper plating. The resist is exposed using DI laser, with a laser hole diameter of φ0.1. 【Features】 ■ Via-on-via with via fill copper plating ■ Core section 4-layer TH is resin-filled and covered with plating ■ L5/6 layer clearance φ0.35 (TH φ0.2 drill) *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board processing machine
  • Circuit board design and manufacturing
  • substrate

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Solid State Lighting (SSL) Printed Circuit Board (PCB) Solutions Guide

ODM services from research and development to mass production of solid-state lighting (SSL). Proven delivery records to major multinational companies worldwide. [Catalog available]

We provide comprehensive services from the idea stage to the design and implementation of circuit boards, thermal management solutions for light source design and production, and final lighting fixture production. From IMS, PCB, and MCPCB to assembly and system integration, we have manufactured world-class products in fields such as automotive, medical, and industrial equipment, building a solid track record. Please feel free to entrust us with your needs. [Content] ■ Consistent support from concept design → prototyping → product development → manufacturing. ■ Solid State Lighting (SSL) solutions. ■ Solutions for IMS, PCB, MCPCB, and more. *For more details, please download our catalog or feel free to contact us.

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FSM Adapter Board

The substrate dimensions are 70×47×1.4mm! A product for the RZ/V2M Evaluation Board Kit.

We would like to introduce the "FSM Adapter Board for RZ/V2M Evaluation Board Kit" that we handle. This product is compatible with the "RZ/V2M ISP Support Package" provided by Renesas Electronics. It allows you to connect FRAMOS sensor modules to the V2M_EVK. Please feel free to contact us if you have any inquiries. 【Features】 ■ Image sensor conversion board for RZ/V2M Evaluation Board Kit ■ Capable of connecting FRAMOS sensor modules to V2M_EVK ■ Compatible with the "RZ/V2M ISP Support Package" provided by Renesas Electronics *For more details, please refer to the PDF document or feel free to contact us.

  • Evaluation Board
  • substrate

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Numerous adoption achievements for aerospace applications - power control boards & battery modules.

Many achievements in mounting on satellites! The satellite is alive because the power supply is operational. The heart of electronic devices, power control board and battery module [Catalog available].

Numerous achievements in mounting on space probes and satellites! The satellites are alive because the power supply is operational. Here is an introduction to our power control boards and lithium-ion batteries, which have been widely adopted. 【Adoption Achievements】 ◆ The University of Tokyo TRICOM-1R (SS-520:5) ◆ NESTA Hodoyoshi No. 3 and No. 4 (Dnepr), among many others 【Product Introduction】 ◆ Multi-functional lithium-ion battery models ◆ Hodoyoshi-mounted EPS modules, among many others *For more details, please download the catalog or feel free to contact us.

  • Secondary Cells/Batteries
  • Fuel Cells
  • Lithium-ion battery
  • substrate

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Coated prisms for electrical components, perforated substrates, medical polishing substrates, etc.

Actively responding to customer requirements such as flatness and surface roughness in grinding.

Our company specializes in the polishing and molding of optical glass for electronic devices. We are capable of purchasing and manufacturing various materials such as single crystal LiNbO3, LiTaO3, La3Ga5SiO14, and SrTiO3. We actively respond to customer requirements regarding flatness and surface roughness in polishing. 【Features】 ■ Advanced technology and extensive know-how accumulated in the field of parallel plane polishing of optical glass for electronic devices ■ Proven track record in special glass processing for environmental numerical measuring instruments, with high evaluations from major glass manufacturers ■ High quality and short delivery times. We carefully respond to customer needs to ensure greater satisfaction. 【Photo Content】 1) BK-7 glass substrate 2) Drilled substrate 3) Polished substrate for medical use 4) Drilled substrate 5) Polished substrate with coating for electrical components prism *For more details, please feel free to contact us.

  • Glass
  • Processing Contract
  • substrate

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Long-sized printed circuit board ☆ up to 1500mm ☆

Leave everything related to printed circuit boards to us! We can handle everything from single-sided to build-up, aluminum core, and rigid-flex, even in small quantities.

Our company provides electronic devices, including printed circuit boards, based on our unique value chain and network with "high quality," "low price," and "short delivery time." ---------------------------- ◆ Quality <Q> We ensure reliable quality by having a QA organization centered around Japanese personnel that works closely with the factory. We can accommodate from AW design, enabling designs that consider manufacturing. ◆ Price <C> Depending on the type and quantity of the circuit boards, we can procure them at prices 30% to over 50% lower than domestic products. ◆ Delivery <D> We have a dedicated organization for delivery management, minimizing delivery issues through detailed management. ---------------------------- Our feature is that we can provide "Chinese-produced products at low prices with Japanese quality." We can flexibly utilize short delivery domestic manufacturing and low-cost overseas manufacturing, accommodating a wide range from single-sided boards to build-up mass production. We have our own factory in China, and we are also equipped to produce special-shaped boards, such as long boards over 1 meter and thin boards of 0.2 mm. *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Plywood composite substrate

Achieving the quality desired by customers by combining various raw materials.

We achieve and provide the quality that our customers seek by combining various raw materials, such as plywood + plywood and plywood + MDF, to meet strength and surface characteristics based on their applications. By thoroughly managing press time, press pressure, and adhesive, we guarantee reliable traceability and adhesive performance. Furthermore, with high-precision thickness adjustment and surface finishing, we deliver more user-friendly products. 【Features】 ■ We combine various raw materials to meet the quality that our customers seek. ■ We guarantee reliable traceability and adhesive performance. ■ We deliver more user-friendly products. *For more details, please contact us.

  • wood
  • Wood products
  • Contract manufacturing
  • substrate

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Analog amplifier circuit board "CMC-PIB-A"

High precision and high temperature characteristics! Zero-span adjustment volume orientation can be specified at the time of shipment.

The "CMC-PIB-A" is an analog amplifier board specifically designed for strain gauge sensors. It outputs voltage according to the input signal, eliminating unnecessary functions such as monitoring, and is specialized for data measurement in research and embedded devices. Please feel free to consult us when you need assistance. 【Features】 ■ Compact design allows for flexible installation ■ Zero and span adjustment volume orientation can be specified at the time of shipment ■ High precision and high temperature characteristics ■ Equipped with a pseudo input switch for convenient calibration *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Single-sided circuit board

Priority selection of various electronic products is relatively easy to produce at low cost. They are used in small household electrical appliances, such as computers, radios, and printers.

Low cost! Easy to design and produce! Furthermore, short delivery time!

  • Circuit board design and manufacturing
  • substrate

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Four-layer flexible circuit board

We can meet the diverse design needs of our customers.

The advantages of copper foil circuits are their ability to withstand high temperatures and their rigidity. They are suitable for various types of handheld mobile devices, printers, and table equipment.

  • Circuit board design and manufacturing
  • EMS
  • substrate

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Six-layer multi-layer circuit board

For computers, cameras, automobiles, etc.

Can handle more complex functions. Higher quality. Greater power, greater operational capability, and faster speed. Improved durability. Smaller size and lighter weight.

  • Other electronic parts
  • Processing Contract
  • Circuit board design and manufacturing
  • substrate

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