We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for substrate.
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substrate Product List and Ranking from 561 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated: Aggregation Period:Jan 14, 2026~Feb 10, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Jan 14, 2026~Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社 和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  4. 4 JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  5. 5 共栄電資 Tokyo//Electronic Components and Semiconductors

substrate Product ranking

Last Updated: Aggregation Period:Jan 14, 2026~Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. [Exhibition Report] We exhibited at NEPCON Japan 2026! 太洋テクノレックス 本社 和歌山
  2. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社 和歌山
  3. [Notice_26.2] Regarding the Publication of Our Articles - Related to Space Business - 太洋テクノレックス 本社 和歌山
  4. 4 High-strength alumina substrate for thin films JAPAN FINE CERAMICS CO., LTD. (JFC) Tokyo Sales Office
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrate Product List

1411~1440 item / All 1884 items

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Metal base substrate

A special substrate that is joined to a metal base by thermal pressing beneath the substrate. The through-hole section can be joined to the metal base by copper plating.

A solder plating or tin plating is applied in advance under the substrate, and by thermally bonding it to the metal plate, a complete surface joint is provided. It is also possible to use high-frequency compatible substrates made of low dielectric materials or substrates made of fluororesin. Such combinations can provide a very effective heat dissipation structure for high-frequency applications. Additionally, it is also effective for EMI countermeasures in RF applications.

  • High frequency/microwave parts
  • substrate

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Stretchable circuit board

Follows uneven surfaces and curves! A circuit board that serves as electrodes for various sensors and maintains conductivity even when stretched.

The "stretchable circuit board" conforms to uneven surfaces and curves, maintaining conductivity even during stretching. It allows for circuit formation on any material depending on the application, while ensuring elasticity. As a stretchable pressure sensor, it can be utilized in various applications such as monitoring beds and shoe insoles, and it does not break even under load. Additionally, the stretchable biosensor detects weak biological signals using Ag/AgCl electrodes. 【Features】 ■ Conforms to uneven surfaces and curves ■ Maintains conductivity during stretching ■ Supports various batch sizes ■ Can serve as electrodes for various sensors ■ Does not break under load *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • substrate

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[Information] Current Status of Stretchable Substrates Reaching Practical Levels

Meeting a wide range of user needs! An introduction to the current status of the development of stretchable substrates.

This document introduces the current status of the development of stretchable substrates. It includes information on material development, improvements in construction methods, and the expansion of application uses. Our company has been able to provide variations of standard connection methods, allowing for more diverse proposals for application development on the customer side. [Contents] ■ Preface ■ Material Development ■ Improvements in Construction Methods ■ Expansion of Application Uses ■ Future Developments *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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[Information] Various Measures for Heat Dissipation in Circuit Board Design

Introducing new heat dissipation technology in circuit board design! It is already widely adopted in various mass-produced circuit boards.

The miniaturization of devices, the high-frequency characteristics of circuits, and the increase in the current being handled have led to concerns about heat generation from the devices and circuits mounted on the substrate. This document provides detailed information on substrate design techniques that can accommodate everything from small-scale prototypes to mass production. We explain various new technologies for heat dissipation measures in substrate design. We encourage you to read it. 【Contents】 ■ Trends in devices ■ High heat dissipation measures for specific devices ■ Improving heat dissipation with surface structures ■ Metal core and metal base substrates ■ Thick copper substrates *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • substrate

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High-frequency compatible substrate

Hybrid structure of PTFE material and general-purpose materials achieves both performance and cost! Introduction of composite material substrates.

When focusing on cost and availability, FR4 becomes a material with significant losses at high frequencies, while PTFE, which has issues with cost, is highlighted when considering high-frequency characteristics. Additionally, the reality is that high-frequency material substrates are often difficult to obtain, and it is not easy to find manufacturers that can accommodate small-scale prototypes. The "composite material substrate" uses PTFE material for the layers that form high-frequency circuits. General circuits and power circuits are constructed with FR-4 or high Tg materials, providing multilayer substrates that are compatible with high frequencies while keeping total costs down. 【Composite Material Substrate Features】 ■ PTFE + General-purpose materials ■ PTFE material is used for the layers that form high-frequency circuits ■ General circuits and power circuits are constructed with FR-4 or high Tg materials ■ Multilayer substrates compatible with high frequencies that keep total costs down *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Heat management of mounted components on the substrate.

The thermal conductivity of copper inlay is 390 W/mK! It can efficiently dissipate heat to the heat sink.

With the increase in signal high frequency, there is a tendency for the heat generation from components to increase, and the heat generated from individual circuit components also rises due to the increase in electrical power of the circuit. If these components are used without sufficient heat dissipation, issues such as unstable operation, reduced output, and decreased reliability may occur. By embedding a copper inlay, which is a metal with good thermal conductivity, directly beneath the mounted components, it is possible to efficiently dissipate heat to the heat sink. Our company can accommodate everything from double-sided boards to multilayer boards, and we can use materials such as FR-4, high Tg materials, and high-frequency materials. Please contact us for details regarding configuration and materials. 【Features】 ■ Directly dissipates heat from mounted components to the heat sink ■ Thermal conductivity of copper inlay: 390W/mK ■ Compatible with double-sided boards to multilayer boards ■ Materials available include FR-4, high Tg materials, and high-frequency materials *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Hamamatsu Pulse Co., Ltd. Business Introduction

If you are considering outsourcing manufacturing for circuit board assembly, semi-finished products, and finished product assembly and packaging, primarily related to consumer goods machinery and industrial equipment, please contact us!

Our company is entrusted with the manufacturing of printed circuit board assembly, semi-finished module unit assembly, and finished product assembly and packaging, based on strong trust and a proven track record from major manufacturers, including small lot and diverse production. We have numerous orders for PCB assembly, not only for domestic production but also for the implementation of prototype boards intended for mass production overseas. If desired, we can also provide technical proposals regarding issues encountered during prototype assembly and the manufacturing process for mass production. We have established a comprehensive production system, so we strive to meet customer requests by offering high-value-added semi-finished module units that incorporate not only PCB assembly but also sheet metal parts and resin-molded components, along with proposals for Q.C.D. We actively accept orders for semi-finished module assembly and finished product assembly, even if PCB assembly is not involved, so please feel free to contact us. *Please consult us regarding prototype-only or limited-time cases. 【Business Content】 ■ Manufacturing, assembly, and packaging related to electronic musical instruments and industrial control devices ■ Development, manufacturing, and sales of LED film light-related products ■ Other related businesses *For more details, please download the PDF or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Semiconductor heat dissipation substrate for the purpose of exothermic and endothermic processes - Base plate [Heat sink]

Adoption of precision total extraction mold! High accuracy in outer shape and hole pitch, improved finish on the burr surface and shear surface!

We handle "base plates" and "heat sinks." Thanks to our precision progressive dies, the accuracy of the outer shape and hole pitch has significantly improved, resulting in enhanced finish quality on both the edge and shear surfaces. With the adoption of progressive dies for coil materials, continuous processing is possible for thicknesses up to 5mm, contributing to lower costs and shorter delivery times. We also utilize UV printing. Additionally, we can accommodate micron-level flatness and specified warp processing, as well as resist baked printing. 【Features】 ■ High accuracy of outer shape and hole pitch due to precision progressive dies ■ Continuous processing of coil materials up to 5mm thickness with the use of progressive dies ■ Adoption of UV printing ■ Capability for micron-level flatness and specified warp processing ■ Support for resist baked printing *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • substrate

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Aluminum foil etching processing and circuit board

It is possible to reduce costs compared to copper foil etched circuit boards.

We will form circuits using composite materials such as aluminum foil and PET film through etching processing. Our unique aluminum foil etching method enables the formation of precise circuits for applications such as aluminum heater products, antennas, or sensors using aluminum foil.

  • aluminum
  • Sensors
  • Aluminum heater
  • substrate

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High thermal conductivity substrate "Metal substrate"

You can freely choose the layer composition according to your needs! Customization is also possible for various specifications of the substrate!

"Metal substrates" are high thermal conductivity substrates designed to efficiently conduct and dissipate heat generated by LEDs and power semiconductors to enclosures or heat sinks. They utilize the thermal conductivity of the base or core metal. The layer composition can be freely selected depending on the application. It is also possible to customize various specifications of the substrate, such as the thickness and type of base metal, the thermal conductivity of the insulation layer, and the thickness of the pattern copper, according to the purpose. [Features] ■ The layer composition can be freely selected depending on the application - Metal base substrate - Multi-layer metal base substrate - Metal core substrate (Aluminum) - Metal core substrate (Copper) ■ Customization of various specifications of the substrate is possible *For more details, please refer to the PDF document or feel free to contact us.

  • Company:HNS
  • Price:Other
  • others
  • Printed Circuit Board
  • substrate

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Printed circuit board "Silicone-based substrate (Silicone)"

Utilizing the flexibility of the substrate, it can be implemented without a heat sink even on curved surfaces!

The "Silicone-based substrate" is a flexible printed circuit board that uses high thermal conductivity silicone sheets. Silicone resin is highly flexible and can be expected to prevent solder cracks during heat cycles. Additionally, by utilizing the flexibility of the substrate, it can be implemented without a heat sink on curved surfaces. 【Features】 ■ Flexible printed circuit board ■ Uses high thermal conductivity silicone sheets ■ Prevents solder cracks during heat cycles ■ Can be implemented without a heat sink on curved surfaces *For more details, please refer to the PDF document or feel free to contact us.

  • Company:HNS
  • Price:Other
  • others
  • Printed Circuit Board
  • substrate

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Introduction to Techno Staff Support Services

Support the development of young and mid-career technicians and skilled workers who will become the driving force behind Japan's manufacturing capabilities!

Techno Staff Co., Ltd. is a support company for human resource development and manufacturing that nurtures successors in mechanical, mold, and electrical technology and skills. We realize the aspirations of young people who want to acquire more advanced technology and skills, apply their improved abilities to their daily work, and contribute to Japan's manufacturing by participating in skill tests and skill Olympics. Our "professional instructors," who possess the technology and skills that supported Japan's rapid economic growth, will assist you in inheriting your "technology and abilities." [Support Services] ■ Processing, Assembly, Adjustment ■ Design, Drafting ■ Management, Operations *For more details, please refer to the PDF materials or feel free to contact us.

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5C-SSM evaluation kit_box

Evaluation kit equipped with an odor sensor, "CEK box"

Evaluation kit consisting of three components: CMOS-type odor sensor "5C-SSM," interface board, and flow path fixture, all housed in a casing. The accompanying software includes automatic setting functions for sensor drive parameters and pixel selection, allowing for simple data acquisition. The CEK box (official name: 5C-SSM evaluation kit_box) is available for purchase starting from one set.

  • O2 sensor evaluation test device
  • Other Sensors
  • substrate

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Introduction to Liquid Resist Screen Printing (Photo Developing Type Solder Resist)

A manufacturing method that corresponds to the evolution of printed circuit boards from rough designs to those with fine structures.

Abe Print Circuit Board Co., Ltd. is focusing on liquid resin screen printing technology as its main method to adapt to the evolution of printed circuit boards, which range from coarse structures to fine structures, in response to the advancement of electronic devices. In this method, resin is applied in a thin film using screen printing, and light is partially irradiated to change its solubility, allowing for the removal of unnecessary parts through development. The process concludes with drying and printing of characters, and it has been adopted in many factories. *For more details, please feel free to contact us.*

  • Printing/Publishing
  • substrate

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"Design, manufacturing, and sales of printed circuit boards" *Business Introduction*

If you are having trouble with printed circuit boards, please contact us! We can also accommodate prototypes.

Stay Electronics Co., Ltd. is engaged in the design, manufacturing, and sales of printed circuit boards. Our company has built up expertise based on the craftsmanship spirit: STAY-ISM, fueled by the thoughts, requests, and expectations we have received from many customers over the years. Our motto is "Creating products that respond to the developer's thoughts and commitments." At Stay Electronics, we are dedicated to answering the developer's question, "What should I do in this situation?" We aim to be the company you turn to in times of trouble. 【Business Description】 ■ Design, manufacturing, and sales of printed circuit boards 【Products Offered】 ■ Flexible printed circuit boards ■ Rigid printed circuit boards 【Main Inspection Equipment】 ■ AOI/AVI ■ Image dimension measuring instruments/projectors ■ Ultra-depth multi-angle lenses ■ Microscopes ■ Two-dimensional automatic length measuring devices ■ Others: Equipment for prototype support available Please contact us if you want to reduce tool costs such as molds. *For questions or inquiries, please call us or contact us at the email address below. 042-774-4555 stay-4555@staydenshi.jp Contact Person: Kumada, Kikuchi

  • Wiring materials
  • substrate

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Image Analysis Using a Microscope / Flexible Substrate Mock Production

It is possible to create a simple mock-up of the base for those who want to analyze the internal structure of FPC products, troubleshoot issues, or pre-verify complex product shapes.

We would like to introduce the services provided by Stay Electronics Co., Ltd. The "Flexible Circuit Board Mock Production using a High-Performance Cutting Plotter" is a service that creates simple mock-ups of flexible circuit boards using polyimide film for those who have never handled flexible circuit boards before or wish to pre-validate complex product shapes. Additionally, the "Image Analysis using a Super Depth Multi-Angle Lens Microscope" can be utilized for internal structure analysis and defect analysis of FPC products. *For questions or inquiries, please call us or contact us at the email address below. 042-774-4555 stay-4555@staydenshi.jp Contact Person: Kumada, Kikuchi [Service Operations] ■ Image Analysis using a Super Depth Multi-Angle Lens Microscope ■ Flexible Circuit Board Mock Production using a High-Performance Cutting Plotter *For more details, please refer to the PDF document or feel free to contact us.

  • Microscope
  • substrate

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[Production Example] Superconducting Device (Flexible for Superconducting Circuit Evaluation)

Examples of superconducting devices (for superconducting circuit evaluation) operating at ultra-low temperatures of -269℃. *Source: Yokohama National University

We would like to introduce a case study of the fabrication of a superconducting device flex that operates at an ultra-low temperature of -269°C. Using flex materials that operate in a superconducting environment, we produced flex for superconducting devices, including single flux quantum circuits (SFQ circuits) and adiabatic quantum flux parametron (AQFP), for the purpose of verifying the operation of superconducting circuits. Laser processing was applied due to the tolerances required for the device electrode parts. [Case Overview] ■ Materials Used - 2-layer materials (2 types) - 3-layer materials (2 types) *Materials were determined after verification experiments. ■ Laser processing was applied due to the tolerances required for the device electrode parts. *For more details, please refer to the PDF document or feel free to contact us.

  • Piezoelectric Devices
  • substrate

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[Design and Production Example] Coil_FPC for Motor Field Windings

A circuit is formed considering the thickness of the flexible printed circuit (adjusting the L/S pitch). For the motor's field winding (for generating a high electromagnetic field) flexible printed circuit. *Source: Gunma University

We would like to introduce a case study of the design and production of field winding using flexible substrates that we conducted. To wind around the main pole piece, a circuit was formed considering the thickness of the flexible substrate so that the coil wiring overlaps at the same position (L/S pitch was corrected and adjusted). Due to the long structure, we implemented correction processing considering the shrinkage characteristics of the flexible material and the etching factor of the conductor, utilizing ultra-thin copper foil material. 【Case Overview】 ■L/S=100μ/100μ ■Specifications: Double-sided structure ■Base PI thickness: 25μ (no adhesive material) ■Cu thickness: 2μ (excluding Cu plating thickness) *For more details, please refer to the PDF document or feel free to contact us.

  • Contract manufacturing
  • substrate

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[Case] Flexibility case for substrate + wire products

Improved integrated flex! There are application examples for dental examination table devices and EEG measurement sensor devices.

We would like to introduce a case of flexing our substrate and wire products. We improved a product that was composed of a rigid substrate and wire into an integrated flex design. There are application examples for dental examination tables and EEG measurement sensor devices. 【Application Examples】 ■ Dental Examination Table ■ EEG Measurement Sensor Device *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Other contract services
  • substrate

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[Design and Manufacturing Example] Stator Coil for Ultra-Small Motor_FPC

Base PI thickness is 25μ, Cu thickness is 18μ! A case study of coil flex design and manufacturing aimed at achieving a strong magnetic field formation.

We would like to introduce a case study of the design and manufacturing of coil flex aimed at achieving a very small yet powerful magnetic field formation, as requested by the manufacturer. Within an outer dimension of approximately 4.0mm x approximately 3.0mm, we configured a single-sided structure with L/S=35μ/35μ, 6 turns x 3 blocks. Additionally, within an outer dimension of approximately 4.0mm x approximately 10.0mm, we configured a double-sided structure with L/S=70μ/50μ, 4 turns x 3 blocks. The materials used for both the single-sided and double-sided structures are adhesive-free, with a base PI thickness of 25μ and a copper thickness of 18μ. 【Case Overview】 ■ Materials Used - Single-sided: Adhesive-free material - Double-sided: Adhesive-free material ■ Base PI Thickness: 25μ ■ Copper Thickness: 18μ *For more details, please refer to the PDF document or feel free to contact us.

  • Inductor Coil
  • Contract manufacturing
  • Other contract services
  • substrate

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[Power Supply Design Proposal Example] Comprehensive support from circuit board production to electrical operation testing.

Even if the manufacturer goes out of business, we can still provide support! We can reduce the burden on our customers!

The manufacturer we had commissioned for the production of the power supply board has gone out of business. We received an inquiry asking if we could take on not only the board production but also the electrical operation testing. Although the initial request was for board production, we proposed the development and manufacturing of an automatic testing device, as well as conducting the electrical operation tests in-house. By providing a comprehensive solution, we were able to reduce the burden on the customer. [Case Summary] ■ Issue: Inquiry about whether we could handle not only board production but also electrical operation testing ■ Proposal: Development and manufacturing of an automatic testing device, and conducting electrical operation tests in-house ■ Result: We were able to reduce the customer's burden through a comprehensive solution *For more details, please refer to the related link page or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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[Free Handbook] "Key Points of Pattern Design in Power Supply Boards"

We are currently offering a technical document that explains the key points of circuit board layout to maximize the performance of power ICs, based on specific examples!

"The Essentials of Pattern Design in Power Supply Boards" is a document compiled for power design engineers, summarizing key points in the design of power supply boards. We will explain using specific examples tailored to various situations, so please make use of this information during your actual power supply board design. [Contents] ■ The Importance of Pattern Design in Power Supply Boards ■ Examples of Pattern Design Proposals for Power Supply Boards  ◎ Connection methods for bypass capacitor lines in power ICs  ◎ Connection methods for current detection lines  ◎ Connection methods for power output bypass capacitors  ◎ Ground separation  ◎ Connection methods for power output bypass capacitors  ◎ Placement of aluminum electrolytic capacitors considering current balance  ◎ Connection methods for output feedback lines  ◎ Relationship between power input and switching lines  ◎ Noise countermeasures for high current lines  ◎ Noise generation countermeasures due to magnetic flux *For more details, please refer to the PDF document or feel free to contact us.

  • Switching Power Supply
  • Circuit board design and manufacturing
  • Technical and Reference Books
  • substrate

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Analog Sensor Board "TypeWEST"

You can create an analog sensor board that is resistant to damage from the start bar sensor!

The "TypeWEST" is an analog sensor board equipped with 2 analog sensors, 5 digital sensors, and 1 start bar detector. It features a structure that is resistant to damage for the start bar sensor, and also includes a ceramic capacitor for noise countermeasures. 【Specifications】 ■ Distance between analog sensors: 42mm ■ Reinforced fixation for Φ3mm infrared LED for digital sensors ■ Power supply voltage: 5.0V ■ Weight: approximately 10g *For more details, please download the PDF or contact us.

  • Printed Circuit Board
  • substrate

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Trial Repeat Manufacturing [Printed Circuit Board] Renewal Open

Leave the prototype circuit board event to Shirai Electronics!

"Prototype Repeat Manufacturing" is the REPEAT-SYSTEM that delivers the repeat manufacturing of the initial new prototype in the shortest time possible. We will ship within 4 days at the earliest. ★ We provide full support from prototyping and mass production to design and implementation. * This applies to the first new delivery date within 3 months and up to 2 times. * The surface treatment for standalone PCBs is water-soluble pre-flux, and schedules for gold plating and solder leveling will take an additional 2 days. * Orders for prototype repeats must be placed by 14:00 on the same day. * For more details, please refer to the PDF document or feel free to contact us.

  • Visual Inspection Equipment
  • Printed Circuit Board
  • substrate

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Super Express Manufacturing of Single-Sided PCBs - A Challenge to Speed - [Printed Circuit Boards]

Single-sided board (double-sided non-TH board) completed in 12 hours!

Shirai Electronics fully supports product development with our long years of experience and know-how in the EX system (for express manufacturing) and a flexible support system. We respond flexibly to a wide range of needs and realize development support in various situations. If you place a consolidated order with our company (PDS), you can complete your ordering process in one go, allowing for overall delivery schedule adjustments and reductions in lead time. 【Features】 ■ Quick-turn prototypes and small-lot, multi-variety production ■ Total support ■ Implementation available on Saturdays and Sundays 【Delivery Examples】 ■ Double-sided through-hole boards: as fast as 22 hours ■ 4-layer through-hole boards: shipped in 2 days (Note: This is for prototype-level support and may vary based on quantity, processing content, and specifications.) *For more details, please refer to the PDF materials or feel free to contact us.

  • Contract manufacturing
  • Circuit board design and manufacturing
  • Other contract services
  • substrate

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Waterproofing and long-life enhancement of the implementation substrate: "Resin potting application."

[Waterproof and Dirt Prevention] Are you having trouble with making your circuit board waterproof, vibration-resistant, or preventing dirt accumulation? Achieve a longer lifespan for your board with resin potting.

The challenge with implementation boards is the reduced lifespan due to various environmental factors. - Damage from vibration and impact - Accumulation of water droplets, dust, and dirt In response to the above, we recommend "resin potting" for enhancing the water resistance, seismic resistance, and longevity of the boards. By injecting urethane resin into cases, dust, dirt, and water can be completely shut out. Additionally, since the board is fixed by the resin, it can also be protected from vibrations. **Benefits of Resin Potting:** - No worries about dust or dirt adhering to the board - Excellent waterproof and moisture-proof properties - Strong against vibrations and impacts as the case can be filled and fixed with resin - Can extend the component replacement cycle, proving effective for products aimed at overseas markets In this way, Astom, with over 20 years of experience, offers various solutions to the challenges and concerns related to boards. Please feel free to consult us regarding any issues related to implementation boards.

  • Contract manufacturing
  • Testing Equipment and Devices
  • Circuit Board Inspection Equipment
  • substrate

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Printed circuit board

Leave the design and production of printed circuit board patterns to us!

Kobayashi Electronic Industry Co., Ltd. primarily manufactures printed circuit boards for industrial equipment, responding to customer needs from pattern design to printed circuit board assembly. Additionally, through a thorough quality control system and production management system, we deliver "peace of mind" to our customers. 【Business Description】 ■ Design, manufacturing, and sales of printed circuit boards for industrial equipment *For more details, please download the PDF or contact us.

  • Printed Circuit Board
  • Contract manufacturing
  • substrate

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Thorough quality control and production management at Kobayashi Electronics!

We have implemented our own production management system, managing everything from order receipt to delivery with barcode tracking.

Since our establishment in 1970, we have been delivering "peace of mind" to many customers. We have implemented our unique production management system, which allows us to manage the entire process from order receipt to delivery using barcode management, ensuring reliable delivery date management. Not only do we manage delivery dates, but we also carefully manage customer information to reduce the hassle for repeat customers.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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Voices from the Development Manufacturer: Avery Corporation

Evaluation board for medium to high voltage ICs. Our flexible response to customer needs and ongoing support have been well received.

Kai Electronics Co., Ltd. has been involved in the design and manufacturing of printed circuit boards and the overall development of electronic devices, working with many development manufacturers. Within the company, there are three engineers specializing in system design, enclosure design, and printed circuit board design. We can pursue designs that consider requests from other processes and seek optimal solutions from multiple perspectives. This time, we would like to share feedback from a development representative at Averyk Co., Ltd. They have entrusted us with the design and manufacturing of evaluation boards for high-voltage ICs. [Customer Feedback] - They responded flexibly to the situation while maintaining close communication even after the specification document was submitted. - They contributed to quality improvement and accelerated development. - They are expected to provide support for the increasingly complex IC specifications. *For more details, please refer to the PDF document or feel free to contact us.*

  • Circuit board design and manufacturing
  • substrate

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NBC's Electronics Division

We strive for quality with a reliable system. We also manufacture high thermal conductivity metal substrates, which have received positive feedback from our customers.

Introducing NBC's "Electronic Business Division." This division plays a role in automotive electronics through the design, manufacturing, and sales of printed circuit boards, with a motto of "creating reliable products" required in automotive electronics. Recently, we have also started manufacturing metal substrates aimed at improving reliability against heat, which has been well received by our customers. 【Features】 - Primarily focused on automotive products, but also provides a wide range of products for communications and industrial equipment. - Capable of handling small lot products from single-layer to high multilayer. - Addresses thermal measures with metal-based substrates and high heat-resistant materials. - Committed to creating high-quality, highly reliable products to meet diverse customer needs. *For more details, please refer to the PDF document or feel free to contact us.

  • Contract manufacturing
  • substrate

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