神港精機 List of Products and Services

High vacuum valve

• Vacuum Equipment

Our atmospheric pressure plasma system, which we handle, enables Ar plasma treatment that was difficult to achieve with conventional atmospheric pressure methods due to the adoption of a unique system. Additionally, the generation of ozone is significantly suppressed. Furthermore, by adopting a direct plasma method, we have achieved treatment effects close to those of vacuum RIE plasma. We can propose systems tailored to your desired processing form, such as magazine-to-magazine for lead frames, roll-to-roll, and sheet processing models. Please feel free to contact us. 【Main Effects】 - Surface activation - Organic matter removal - Nano-etching 【Examples of Applications】 - Surface modification of semiconductor lead frames before wire bonding - Cleaning of BGA substrates - Cleaning of film surfaces - Surface modification of mounting-related components *Sample demonstrations are available. Please feel free to contact us.

• Ashing device

We will provide a comprehensive proposal for the entire process from the previous stage to the next stage. (Film formation, etching/ashing, annealing) Since it is custom-made, we will propose cost-effective equipment that incorporates only the necessary functions.

• Sputtering Equipment
• Etching Equipment
• Annealing furnace

This is a dry surface treatment device that efficiently performs various coatings on three-dimensional shaped parts and molded products made of resin, glass, metal, etc. It can form thin films of various materials such as metals and ceramics over the entire surface. Features: ◎ Full surface film formation on three-dimensional shaped parts ◎ Coating of the inner surfaces of cups and tumblers using a special mechanism ◎ Naturally derived dry hydrophilic coating (plasma lava coating) ◎ Compatible with a wide range of applications from electronic substrates to resin decorations

• Sputtering Equipment
• Glass
• fiber

Coating Sakurajima lava using magnetron sputtering. Application of naturally derived lava for advanced surface treatment. Formation of thermally and chemically stable thin films utilizing the properties of lava. Realization of decorative films (transparent and interference colors) and hydrophilic films on various materials (metal, glass, fiber). Being a natural material, it does not cause allergies in humans and prevents alteration and discoloration of the material. It has been put into practical use for surface treatment of tableware, and market expansion is expected. Additionally, it excels in infrared light transmittance, and development for fiber coating is also anticipated. A lava coating with excellent energy-saving performance and environmental resistance, applied uniformly to three-dimensional shapes. A new era of surface treatment equipment.

• Sputtering Equipment
• Glass
• fiber

The vacuum soldering device removes voids in the solder by melting the solder in a vacuum. By performing preheating in a hydrogen atmosphere or formic acid atmosphere, it achieves flux-free soldering. It boasts the number one domestic track record as a standard machine in the power device manufacturing process. With the adoption of an upper lamp heater specification, it can accommodate large products and irregular substrates, including heavy items. [Exhibition Information] We will exhibit at Internepcon 2023. A panel of this device and samples of large products will be displayed. (Exhibition dates: January 25 (Wed) to January 27 (Fri) at Tokyo Big Sight, Booth Number: East Hall 1, 2-34) *For detailed specifications, please download the PDF. Feel free to contact us.

• Bonding Equipment
• Reflow Equipment
• Soldering Equipment

This is a load-lock type sputtering device designed for the automatic transport of large substrates. 【Main Features】 - Capable of bare transport of large-diameter substrates, such as Φ300mm (support for square substrates is also possible). - Ensures a wide range of film thickness distribution with a uniquely designed cathode mechanism using standard target sizes. - Chamber structure that allows for easy target replacement and inspection/repair of the deposition chamber. - Future expansion of the process chamber is also possible. - Optionally equipped with a unique dense film formation unit (patented technology). We can also provide a video introduction of the device. Please feel free to contact us.

• Wafer

Equipped with a newly developed plasma source HCd (hollow cathode discharge) type electrode. Achieves a plasma density that is an order of magnitude higher than conventional electrodes with a simple k structure that is free of magnetic fields and antennas. Supports etching of not only various metals but also difficult-to-etch materials such as Cu thin films with uniquely developed high-density plasma and proprietary processes. The newly developed HCD type head allows for easy scale-up and enables high-precision etching of rectangular substrates and large substrates. Supports metal etching of 300 mm wafers, stacked substrates, and substrates up to 1 m². A new type of etching device that covers semiconductor peripheral materials (photo masks, high-density mounting substrates) that have seen increasing demand in recent years, breaking away from conventional plasma etching methods.

• Etching Equipment
• Ashing device
• Plasma surface treatment equipment

The vacuum soldering equipment from Shinko Seiki, which supports the production of power device modules, has been upgraded. It improves the heating and cooling characteristics and expands the processing dimensions. It accommodates the sintering bonding of metal paste through the conventional atmosphere control performance and the increase in processing temperature. The realization of low oxygen concentration and the reducing power of a 100% hydrogen atmosphere significantly enhance the wettability by preventing the oxidation of wet paste. The addition of an optional heating and pressurizing mechanism also enables void-free bonding. Shinko Seiki's new vacuum soldering equipment is compatible with next-generation bonding materials.

• Annealing furnace
• Reflow Equipment
• Industrial Furnace

Based on the highly successful batch-type plasma etching system "EXAM," the stage has been expanded to accommodate a maximum diameter of 600 mm or 500 mm square. The large stage supports a wide range of processes, including fine-pitch etching, ashing of various organic materials, surface modification, and cleaning. Similar to the conventional model EXAM, it performs etching on wafers, glass, and ceramic substrates, and has extensive experience in etching, cleaning, and surface treatment of large mounted substrates and pre-cut film substrates. This new dry process tool is also optimal for processing large products that require cleanliness and delicate surface treatment, such as semiconductor manufacturing equipment parts and materials, in addition to electronic devices.

• Etching Equipment
• Plasma surface treatment equipment

Achieving a hydrogen-free DLC film (hydrogen content in the film below 1%) that is unprecedented in conventional production equipment. Utilizing a high-density plasma sputtering technology that does not use hydrogen in the film formation process, with a new type of PVD equipment (ADMS = Arc Discharge Magnetron Sputtering Device). The hydrogen-free dense DLC film reduces the sliding characteristics in Mo-added lubricants to less than 1/15 compared to conventional hydrogen-containing DLC films (from 1 to 0.06). The latest film formation process also accommodates the formation of conductive carbon thin films, expanding applications across a wide range of fields from biotechnology to new energy. The low-voltage, low-pressure plasma generated by the newly developed arc discharge magnetron cathode is applied not only for film formation but also for ion nitriding and etching of substrate surfaces, providing high-quality integrated processing from pre-treatment and substrate hardening to coating. The hydrogen-free DLC film (ADMS-CN film) produced by this device (arc discharge magnetron sputtering device) represents a new dry process that goes beyond traditional DLC (hard film formation), significantly broadening the possibilities of plasma surface treatment technology.

• Sputtering Equipment
• Other machine tools
• Plasma surface treatment equipment

A new type of multi-purpose plasma cleaning device with a proven track record has arrived. In addition to the conventional surface cleaning function using plasma, it now features a reduction cleaning function using hydrogen plasma. The ability to remove surface oxide layers has significantly improved, and the hydrophilicity of substrates after cleaning has greatly increased. It also supports conventional plasma cleaning as before. Furthermore, with new cleaning functions such as combined cleaning with traditional Ar plasma cleaning and two-step cleaning with O2 (oxygen) cleaning, the cleaning targets and effectiveness have been greatly enhanced compared to general plasma cleaning. This new plasma cleaning device can accommodate everything from small-scale to full-scale production lines.

• Ashing device
• Plasma surface treatment equipment
• Other surface treatment equipment

A high-density plasma sputtering method developed in-house, the ADMS method (arc discharge type magnetron sputtering), enables the deposition of a dense AlN film on three-dimensional substrates, unlike anything seen before. It achieves a high-density plasma sputtering with ten times the amount of ions compared to conventional methods. With a unique high-reactivity sputtering process, crystalline AlN is formed at low temperatures below 500°C. This new thin-film formation device creates new surface functions for everything from electronic devices to mechanical parts.

• Other processing machines
• Plasma surface treatment equipment

Dedicated sputtering equipment for research on thin-film solid-state secondary batteries. Post-processing is possible. It allows for the simultaneous formation of the anode, electrolyte, and cathode using a multi-component cathode, as well as sealing the substrate to prevent exposure to the atmosphere after film formation. Pre-film tests using a dedicated Li target are also available (for a fee). Comprehensive support for materials (targets), soft (film formation tests), and hard (dedicated equipment). Sulfide targets and dedicated glove boxes can also be equipped, achieving both versatility and individual customization.

• Plasma surface treatment equipment
• Sputtering Equipment

A low-cost multi-chamber sputtering system dedicated to the development of advanced thin film processes and small-scale production. It accommodates a wide range of fields with a high-efficiency cathode that excels in film thickness control and a variety of optional mechanisms. Proven in various processes, not only for Si semiconductor electrodes and wiring films but also for magnetic films, insulating films, and protective films for micro-magnetic devices and MEMS. It features the ability to equip different process chambers such as evaporation, annealing, and CVD, allowing for full custom-made production that freely connects each process chamber to a proven mainframe (transport system).

• Sputtering Equipment
• Plasma surface treatment equipment

Achieves a plasma density that is an order of magnitude higher compared to conventional capacitively coupled plasma etching devices. High-precision etching is possible solely through innovations in the electrode structure, without using high-frequency antennas or magnets. It also has high hardware compatibility with conventional etching devices (CCP type and ICP type), contributing to low cost, high reliability, and operational efficiency. Capable of etching not only wafer-level substrates but also large substrates. A new type of high-density plasma etching device that can smoothly accommodate the increase in substrate size.

• Etching Equipment
• Ashing device
• Plasma surface treatment equipment

Replacement of the atmosphere in the furnace with hydrogen reduction. Achieving low oxygen concentration and reduction atmosphere treatment that cannot be realized with an inert atmosphere using N2 through continuous processing in a conveyor furnace. Utilizing the reduction effect of the hydrogen atmosphere, it supports high-temperature soldering and continuous reduction atmosphere heat treatment that require high reliability, which cannot be addressed by conventional reflow. There is also a wealth of experience in firing various pastes. The system covers the reflow process for wafer bumps of system LSI with a CtC type compatible with 300 mm wafers. In addition to conventional soldering, brazing, and paste firing processes, it also has a proven track record in sintering bonding for next-generation bonding materials (metal nano-paste). A demonstration machine is permanently available to reliably support initial tests for various applications through to mass production.

• Reflow Equipment
• Annealing furnace
• Electric furnace

Forming side electrodes of passive electronic components (resistors, capacitors) of the surface mount type using a dry process. A clean process that does not require waste liquid treatment. An electrode film is formed with strong adhesion only on the end faces of the components. Metal films such as Sn and Ni are formed with high throughput (also compatible with oxide film formation). We contribute to the drying and cost reduction of the production process for small electronic components, as well as stable production, through our proven hardware and unique film formation process.

• Evaporation Equipment
• Plasma surface treatment equipment
• Other processing machines

Using the independent high-density sputtering method, conductive carbon thin films are formed through a process equivalent to metal film deposition via arc discharge magnetron sputtering (ADMS method). Compared to conventional sputtered carbon thin films, these films are characterized by significantly higher density and adhesion. Due to their conductive properties and film stability, they are suitable for new fields such as energy and biosensors. Conductive carbon thin films excel in hardness and surface smoothness, making them applicable for surface treatment of mechanical parts (tribological applications) due to their high adhesion to metals.

• Sputtering Equipment
• Plasma surface treatment equipment
• Other processing machines

A dedicated annealing device designed for special applications such as epitaxial layers of compound semiconductors and the annealing of polished Si wafers. After high vacuum evacuation, the atmosphere is replaced with hydrogen up to atmospheric pressure, allowing for uniform heating at high temperatures (1000°C) in a high-purity reducing atmosphere.

• Annealing furnace
• Electric furnace
• Other surface treatment equipment

Achieved SiC film formation using a PVD method that was not previously available through a newly developed arc filament-type ion plating method. Adopted a new film formation technology that enables the formation of dense SiC films with excellent wear resistance and oxidation resistance at low temperatures below 400°C. The ion plating method, using solid silicon as the starting material, realizes a simple and environmentally friendly clean process with low environmental impact. The new film formation equipment offers high control over film thickness and quality, and excels in exhaust gas treatment, maintenance, installation area, and running costs compared to CVD.

• Other machine tools
• Other processing machines
• Plasma surface treatment equipment

◆In the chemical industry, when replacing water-sealed vacuum pumps with dry pumps, various suction materials can cause issues with standard dry vacuum pumps. However, our dry vacuum pumps have a structure that minimizes the accumulation of suction materials inside, allowing for stable continuous operation. ◆In standard dry vacuum pumps, even a small amount of condensable gases, powders, byproducts, or liquids can lead to malfunctions. Our dry vacuum pumps discharge suction materials thanks to a uniquely designed screw rotor. ◆With the optional cleaning set, it is possible to wash away any residual suction materials while the pump is installed. ◆The optional seal and purge set prevents contamination of bearings, gears, and other components. ◆Since a pressure of less than 1 Pa can be achieved, when used in combination with a mechanical booster and water seal, it can be simplified and space-saving by consolidating to a standalone dry pump. ◆Disassembly work (condition checks, consumable replacements, internal cleaning) can be performed on-site, minimizing running costs.

• Vacuum pump

A vacuum pump with a proven track record in chemical processes (water-sealed vacuum pump and mechanical booster) has been integrated into a unit. The pump materials and peripheral equipment are optimized according to the process characteristics, gas types, and exhaust volumes of the CVD equipment. The main exhaust pump is a water-sealed vacuum pump with a liquid circulation system, using an alkaline solution for the circulating sealing liquid, achieving both the exhaust and neutralization of chlorine-based gases. This significantly reduces the load on the downstream gas treatment equipment. It is particularly effective in the exhaust system for chlorine-based gases in thermal CVD equipment for surface treatment, and is widely used in the production of tools, molds, and semiconductor jigs. It can also be applied to the exhaust of chlorine-based gases during Si epitaxial growth and etching. The main pump's water-sealed vacuum pump is also made entirely of stainless steel, providing excellent corrosion resistance in a dedicated vacuum exhaust system.

• Vacuum Equipment
• Vacuum pump
• Other semiconductor manufacturing equipment

In chemical processes, various gases containing corrosive substances are suctioned. The gas contact section uses stainless steel (equivalent to SUS316), which significantly outperforms regular iron in terms of corrosion resistance, making it a water-sealed vacuum pump. ◆ It has numerous achievements in applications such as distillation, drying, and reactions. ◆ The gas contact section is made of high-grade SCS14 (SUS316) stainless steel, allowing for the suction of corrosive gases. ◆ It is also ideal for exhausting powders, condensable gases, and flammable gases. ◆ The shaft sealing section can be equipped with either gland packing or mechanical seals. ◆ Material changes for O-rings and mechanical seals are also possible. ◆ Since it uses a general-purpose motor, explosion-proof types can also be installed.

• Vacuum pump

In vacuum sintering furnaces, the binder that scatters can accumulate in oil rotary vacuum pumps, leading to failures, and the oil can become contaminated, necessitating frequent oil changes. Our dry pumps have a structure that minimizes binder accumulation inside, preventing failures and significantly reducing the running costs associated with oil changes. ● Replacing oil rotary vacuum pumps with dry pumps in vacuum sintering furnaces is currently a trend. ● Our uniquely designed screw rotor discharges the sucked binder. In typical dry pumps, binders accumulate inside, causing failures. ● With the optional cleaning set, it is possible to wash away any remaining binder inside while the unit is installed. ● By introducing seal gas and purge gas, contamination of bearings, gears, etc., is prevented. ● Disassembly work (condition checks, consumable replacements, internal cleaning) can be easily performed on-site, minimizing running costs.

• Vacuum pump

Application of the basic configuration of a vacuum soldering device with a proven track record. High-speed heat treatment using a heated plate for soldering. Degassing and drying of high-density mounting substrates and printed boards before film formation. Ideal for various applications such as drying ceramic materials. Effective for low-temperature baking of solar cell cells and annealing of thin films, also compatible with inline processes.

• Heating device
• Soldering Equipment
• Annealing furnace

Customizing an annealing device with extensive experience in Si processes for compound semiconductor processes. Capable of high temperatures (900-1000°C) compared to hot plate types for GaAs. Proven results in the alloying of electrodes for nitride semiconductor films. Equipped with a rapid temperature rise and fall heating furnace to control the annealing of electrode films with uniform heating and optimal temperature profiles. A heat treatment device for wafer processes with a proven track record that can propose optimal equipment configurations based on production volume and processes.

• Annealing furnace
• Heating device

This is a "liquid-sealed circulation type" vacuum pump that prevents harmful gases from dissolving in the sealing liquid and being discharged. It circulates the sealing liquid without direct outflow, making it suitable for situations where wastewater treatment is a concern. ◆ It consists of a water-sealed vacuum pump, a gas-water separation tank, and a heat exchanger, all compactly integrated into a unit. ◆ For applications where corrosive gases are involved, it is possible to select materials with excellent corrosion resistance, such as stainless steel (equivalent to SUS316). ◆ The shaft seal area can be equipped with either a gland packing or a mechanical seal. ◆ It comes standard with a heat exchanger that has a disassemblable tube plate for easy cleaning.

• Vacuum pump

A large-diameter cryopump has been adopted in a more compact chamber than conventional types, and ultra-high vacuum compatibility has been implemented in each mechanism of the chamber, enabling a clean high-vacuum environment. The evaporation source uses an electron gun with a water-cooled reflective electron trap, achieving low-damage film formation that prevents electron bombardment on the substrate. The well-established six-gun electron gun is compatible with the formation of multilayer film electrodes that include high-melting-point metals. It features stable deposition, eliminating substrate damage from micro-arcs and abnormalities on the film surface caused by droplets. It can also accommodate lift-off deposition according to the process and production volume. During lift-off deposition, a water-cooling mechanism from the back of the substrate compatible with thick-film electrodes allows for the formation of precious metal thick-film electrodes.

• Evaporation Equipment

Ideal for forming high heat-resistant wear-resistant films necessary for the coating of precision lens molds. Precious metal alloys such as Pt and Ru suitable for lens mold coatings are efficiently formed using a multi-target simultaneous sputtering method with a small-diameter cathode. Additionally, films with excellent heat resistance and hardness can also be formed using a nano-multilayer structure. A special substrate holder that can rapidly heat substrates like precision lens molds, along with a dedicated load-lock mechanism, achieves improved throughput.

• Sputtering Equipment
• Plasma surface treatment equipment

Upgraded and customized the highly experienced plasma cleaning device "POEM" for DLC film removal. Improved the energy of ions during processing compared to conventional types, enabling the removal of dense DLC films. Proven results not only in the standard O2 cleaning process but also in the multi-gas process for the removal of various customized DLC films, including Si-containing DLC. Naturally, it also supports the removal of molding residues and oxidation layers on mold surfaces, as well as cleaning before plating. Provides proven processes for cleaning and surface treatment before and after mold specifications.

• Etching Equipment
• Ashing device
• Plasma surface treatment equipment

Achieved damage-less ashing using downflow plasma while eliminating charge-up damage. High throughput is realized through high-rate ashing with surface wave plasma (SWP) and an ashing chamber equipped with two rooms. In addition to ashing, the RIE chamber enables the removal of special resists and organic films, as well as the removal of hardened resists after ion implantation. It achieves both the removal of hardened resist on the surface and damage-less ashing of the underlying resist. The adoption of a compact single-wafer load lock chamber and twin-hand robots allows for a compact installation size. Proven capability to handle not only standard wafers but also special substrates such as wafers thicker than 1 mm and rectangular substrates. A versatile single-wafer etching and ashing device.

• Ashing device
• Etching Equipment
• Plasma surface treatment equipment

In the process of sucking in corrosive gases, adopting corrosion-resistant materials for the gas contact parts can reduce failures. ◆ It is manufactured using high-grade SCS14 (SUS316) stainless steel as a corrosion-resistant material. ◆ The shaft sealing section can be equipped with either a gland packing or a mechanical seal. ◆ Material changes for O-rings and mechanical seals are also possible. ◆ Since the connection is the same as that of iron pumps of the same model, no piping work is required, allowing for replacement from existing machines. ◆ As it is a water-sealed vacuum pump, it can also exhaust condensable and flammable gases. ◆ The water-sealed vacuum pump has high discharge capability and will not stop due to minor dust. ◆ Being a two-stage pump, it can achieve a pressure of 2,300 Pa (at a water temperature of 15°C). Additionally, when combined with an air ejector, it can lower the pressure to between 800 and 1,300 Pa. ◆ It comes standard with a silencer that also functions as a gas-water separation tank. ◆ To prevent harmful gases from dissolving in the sealing water and being discharged, we also offer a "sealed liquid circulation type" water-sealed vacuum pump that circulates the sealing water without direct outflow.

• Vacuum pump

Actively responding to various applications and substrates that are difficult to accommodate with standard specifications. Dedicated mechanisms are prepared for many substrates, including R&D, discrete components, compounds, MEMS, packaging, assembly processes, masks, and small FPDs. Tray transport of substrates is also standard, enabling film deposition and processing of different types of substrates on the same device through atmospheric substrate handling. In addition to application-specific cathodes (wide erosion, ferromagnetic materials, oxides, reactive types), we support a wide range of applications with special substrate mechanisms (high-temperature heating, magnetic field application, cooling, etc.). Dedicated devices are individually designed based on process tests using in-house demonstration machines.

• Sputtering Equipment
• Plasma surface treatment equipment

A top-class vacuum pump exhaust unit in the industry. Boasting a large number of deliveries over many years. By combining water-sealed vacuum pumps, oil rotary vacuum pumps, dry pumps, and mechanical boosters, we achieve new performance and value. We solve vacuum exhaust issues for a wide range of applications, including chemical processes such as drying, distillation, and degassing, metallurgical applications like degassing, hard film coating equipment, CVD equipment, and general industrial applications such as resin molding!

• Vacuum Equipment

A plasma etching device that realizes automatic sheet transport of thin wafers (100μm or less). It supports a wide range of processes with multi-mode plasma and step processes, from natural oxide film removal to thick film resist ashing, cleaning, and descumming. It is actively used in mass production environments for various devices such as discrete ICs, power devices, compound semiconductors, and MEMS, employing diverse processes.

• Etching Equipment
• Ashing device
• Plasma surface treatment equipment

A AlN template on a sapphire substrate necessary for reducing the manufacturing cost of UV-LEDs is created by sputtering. An AlN film with a C-axis orientation of less than 100 arc/sec is formed by sputtering at low temperatures (below 700°C). This contributes to the cost reduction of UV-LEDs with a simple and stable process and high throughput. Sample testing is currently underway, and development for expansion into high-frequency devices is also in progress.

• Sputtering Equipment
• Plasma surface treatment equipment

Expanding a batch-type vacuum soldering device with a rich track record for full-scale mass production. In addition to the conventional H2 atmosphere process, support for formic acid has been added. Achieving voidless soldering with higher reliability on the mass production line. A standard device for soldering automotive power device modules. Responding to requirements with process support from in-house demo units and flexible hardware solutions.

• Reflow Equipment
• Annealing furnace

A load-lock type sputtering device based on single-sheet substrate transport, sharing the process chamber and transport mechanism with a higher-end model (multi-chamber type). Capable of meeting high-level film quality requirements for mass production and prototyping of various ICs (discrete ICs, custom ICs, compounds). Proven track record in the development of next-generation devices (ferroelectric film development, oriented nitride film formation) in both software and hardware. Achievements include AlN films for UV-LED templates, oxide films for sensors, highly uniform electrode films, thin-film heaters, ferroelectric (PZT) films, and many others.

• Sputtering Equipment
• Plasma surface treatment equipment
• Other mounting machines

A high-density sputter cathode ADM system (arc discharge type magnetron sputtering cathode) has been added to the well-established PIG-type DLC coating equipment for automotive DLC films. A hard alloy film is laminated onto the DLC film, which has excellent tribological properties, achieving a new hard coating with a smooth surface. The conventional DLC film has also been enhanced with the new cathode's functions, improving performance. Adhesion and resistance to surface pressure can be easily improved. Of course, the conventional PIG-type DLC coating equipment can be upgraded with additional functions. The latest model of the new functional hard film coating equipment can fully demonstrate the performance of CVD/PVD alone.

• Plasma surface treatment equipment
• Other processing machines
• Other machine tools

Expanding the PIG-type DLC film formation device, which has a proven track record in hard films and surface treatment applications, for infrared optical applications. A DLC film with over 90% high transmittance is formed uniformly on both sides of the substrate, achieving hard, high-transmittance DLC films with high productivity.

• Plasma surface treatment equipment
• Plasma Generator
• CVD Equipment

A lineup of standard deposition equipment that broadly supports everything from research and development of semiconductors, MEMS, and various electronic components (sensors, quartz oscillators, etc.) to full-scale mass production. All models are compatible with clean rooms and clean vacuum environments, equipped with various selection mechanisms. We respond meticulously to individual requests based on our extensive experience with standard specifications. Customization is available for evaporation sources, heating temperatures, substrate mechanisms (planetary dome, rotary dome), operation, and logging software. We also offer process testing with in-house demo units, providing a wide range of flexible hardware and support.

• Evaporation Equipment
• Other surface treatment equipment

Plasma technology with a wealth of experience in etching and cleaning supports water-repellent coating. Water-repellent treatment for various substrates including resin films, glass, and metal thin films. Adaptable to hydrophilization and cleaning through process changes. Compact, affordable, and highly reliable, cooperating in process development through sample testing. A plasma surface treatment device with proven results and support.

• Plasma surface treatment equipment
• CVD Equipment

A versatile vacuum oven capable of large batch processing with dimensions of 800mm□×800mmH. It achieves high vacuum processing, inert atmospheric pressure treatment after vacuum replacement, low vacuum gas flow processing, and multiple processing modes all in one unit. Uniform heating under high vacuum for degassing and baking. Defoaming, degreasing, and vacuum drying in a low vacuum gas flow atmosphere. High-speed heating annealing of parts and molded products in an inert atmosphere after vacuum replacement. Customizable options available from a well-established standard type to meet individual needs. A lineup ranging from small sizes to suit various purposes.

• Annealing furnace
• Electric furnace
• Heating device

Maximizing the reducing power of hydrogen to achieve high-quality thin films and substrate surfaces that are unprecedented. Ideal for thermal processing (bake and anneal) of delicate compound devices and dielectric substrates. High reliability supported by proven results and experience ensures safety. Responding from the initial stage, including testing, based on extensive achievements in enhancing the quality of electrodes and wiring films, controlling the resistance and stress of high melting point metal films, and end processing of polished wafers for special applications.

• Annealing furnace
• Oxidation/Diffusion Device
• Heating device