List of Sputtering Equipment products
- classification：Sputtering Equipment
61～120 item / All 216 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
Introduction of various experimental devices for research and development in semiconductors, electronic devices, fuel cells, displays, and thin film experiments.
- Sputtering Equipment
- Evaporation Equipment
- Annealing furnace
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
Composite thin film experimental device nanoPVD-ST15A capable of mixed installation of vacuum deposition (metal and organic deposition sources) and sputtering cathodes.
- Sputtering Equipment
- Evaporation Equipment
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
![[Hot Stage] Ultra High Temperature ...](https://image.mono.ipros.com/public/product/image/671/2000002653/IPROS21404174246949592221.png?w=280&h=280){kind=small}
An ultra-high temperature substrate heating stage that allows for substrate elevation, rotation, and RF/DC substrate bias all in one device! 'All-In-One' component.
- Sputtering Equipment
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
High-efficiency magnetron sputtering cathode compatible with RF, DC, and pulse DC for depositing metals and insulators without impurities. It also excels in maintainability.
- Sputtering Equipment
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
Sputter Cathode and Co-evaporation Source Mixed Thin Film Experimental Device: Metal deposition, organic deposition, and sputter cathode installed in a compact frame.
- Sputtering Equipment
- Evaporation Equipment
- Annealing furnace
【MiniLab】 Evaporation/Sputtering Dual Chamber System
Two thin film experimental devices are connected by a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected via the load lock. With Moorfield's unique load lock system, connections to the process chamber on the left, right, and rear are also possible (see photo below). 1. MiniLab-E080A (Evaporation Device) - EB evaporation: 7cc crucible x 6 - Resistance heating evaporation x 2 - Organic evaporation limit x 2 2. MiniLab-S060A (Sputtering Device) - Φ2" Magnetron cathode x 4 for simultaneous sputtering - Compatible with both DC and RF power supplies 3. Load Lock Chamber - Plasma etching stage In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC substrate bias stage," and the company's unique "soft etching" technology allows for a <30W low-power, damage-free plasma etching stage. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of Teflon substrates. (*This can also be installed in the main chamber stage.)
Suitable for the film formation of nanomaterials (metal nanoparticles, nanowires, nanosheets, materials for nanoelectronics)!
- Sputtering Equipment
High-end sputtering process for optical films used in aerospace engineering and medical/bio applications is possible!
- Sputtering Equipment
Ion beam sputtering equipment for research and development as well as small-scale production!
- Sputtering Equipment
DC pulse sputtering is possible (reactive sputtering of insulating films using conductive targets)!
- Sputtering Equipment
We apply hard DLC (diamond-like carbon) through sputtering, suitable for medical supplies and automotive parts! *Demo tests are currently being conducted.
- Sputtering Equipment
DLC film formation (film quality: ta-C domain, surface roughness Ra 0.16 nm, transmittance: 88%) achieved through sputtering, which has had many challenges in the past.
- Sputtering Equipment
It is a device that can be transitioned from a pilot line to a mass production line.
- Sputtering Equipment
There are five expansion slots, allowing for additional installation of sputter chambers, deposition devices, glove boxes, etc.
- Sputtering Equipment
Reduce damage to the substrate by over 60%! Improve film formation speed while maintaining low damage characteristics.
- Sputtering Equipment
Announcement of Exhibition at Kansai Metal Japan by Keihin Ramtech
We sincerely thank you for your continued patronage. We are pleased to announce that, following last October, our company will be exhibiting at Kansai Metal Japan held in Osaka. We will showcase the upgraded technologies and lineup of Ramtech, which have been enhanced to withstand the challenges posed by the new coronavirus. We kindly ask for your consideration in visiting us. We look forward to seeing you there.
Ideal for experiments, research, evaluation, and prototype production! Achieving high-speed, high-precision, low-damage vacuum deposition on flat substrates such as glass and metal!
- Sputtering Equipment
Leave the manufacturing of semiconductor sputtering targets to us.
- Sputtering Equipment
![[Example of Use] Sputtering Target ...](https://image.mono.ipros.com/public/product/image/f42/2000180520/IPROS14162266355367390576.jpeg?w=280&h=280){kind=small}
You are using SiC/Si composite materials as the target material.
- Sputtering Equipment
- Other metal materials
- Fine Ceramics
Remote source ion beam sputtering device manufacturer for remote plasma sources.
- Sputtering Equipment
Information on commissioned test film formation services (test film formation of high-quality reaction films, etc.)
Research on Co-sputtering of different materials, such as ferromagnetic targets and metal and ceramic targets, which are considered difficult to film using conventional sputtering devices. We strongly support advanced material research and process development, including the deposition of AlScN, which is attracting attention for next-generation MEMS applications. This is a groundbreaking technology that uses a helicon ion source as a plasma source, accelerating high-density ions obtained from it by applying a bias voltage to the target. Since it is an ion beam-type deposition method using a remote plasma system, stable film formation can be achieved even with ferromagnetic and dielectric targets, which are challenging for magnetron sputtering devices. By individually controlling the ion source and target application, it is possible to accommodate a wide range of deposition conditions while also achieving high deposition rates. Independent gas supply near the target and substrate allows for the deposition of various multilayer thin films, including oxide and nitride films. Since the substrate surface is not exposed to plasma, it is possible to maintain a low temperature during film formation.
High-throughput roll-to-roll sputtering equipment for the manufacture of FCCL (Flexible Copper Clad Laminate).
- Sputtering Equipment
FHR Star.100-Tetra Co is a very compact sputtering device designed for MEMS and high-performance optical products.
- Sputtering Equipment
Production ion beam milling equipment that achieves high rate and high reliability.
- Sputtering Equipment
The "FHR.Star.600-EOSS" is a high-performance magnetron sputtering device developed for precise optical filter film deposition.
- Sputtering Equipment
Highly acclaimed high-precision optical filter deposition magnetron sputtering device
This is a device specialized in optical thin films, such as high-performance optical filters that require multilayering and high reproducibility, particularly for applications like LiDAR, which are expected to see significant demand in the future. It demonstrates strong capabilities for high-quality and stable production. - Film formation that eliminates the influence of film quality changes due to target consumption using a cylindrical cathode. - Stable film formation of oxide films achieved by incorporating a reactive ion source. - Film formation of a wide range of multilayer films enabled by the installation of up to four cathodes.
High-spec compact coater compatible with various metals such as Ni, Cr, W, Ti, and Al!
- Sputtering Equipment
This is an ion coater ideal for full coating of large samples. Models are available for sizes ranging from 4 to 8 inches.
- Sputtering Equipment
Customizable to fit experimental purposes. Small RF sputtering device.
- Sputtering Equipment
Fully automatic ion coater suitable for sample preparation for SEM.
- Sputtering Equipment
Full automatic sputter coater with magnetron cathode to reduce ion damage.
- Sputtering Equipment
Multipurpose Vacuum Deposition Device HEX System Sample Stage | Fixed, Rotating, Rotating Heating, Rotating Water Cooling
- Sputtering Equipment
Modular Structure Vacuum Device - Multi-Purpose Vacuum Deposition Device HEX Series - High Expandability & High Maintainability
The 'True Modular Structure' changes the common understanding of vacuum devices. A compact vacuum device with a minimum installation area of 60cm square, which can be introduced with a minimal configuration and allows for flexible changes in structure according to shifts in research direction. Traditionally, vacuum devices had a fixed number and arrangement of ports upon installation, making changes impractical. However, the HEX system, featuring a hexagonal prism-shaped chamber, adopts a groundbreaking 'modular structure' that allows for the number and arrangement of ports to be freely changed by swapping out the panels that make up each side. This enables easy configuration changes and functional expansions, akin to assembling blocks, in response to changes in research direction. ◆ The 'Modular Structure' allows for flexible changes to the system configuration ◆ Supports sputtering, resistance heating deposition, electron beam deposition, and organic deposition ◆ Capable of simultaneous film deposition from multiple sources ◆ Supports sample rotation, heating, and water cooling ◆ Can be equipped with a film thickness monitor ◆ Compact design with a footprint of 60cm x 60cm ◆ Excellent expandability and maintainability ◆ Compatible with glove boxes *Please feel free to contact us for more details.
A versatile vacuum deposition device that allows for flexible configuration changes like assembling blocks | Sputtering, resistance heating deposition, electron beam deposition, organic deposition.
- Sputtering Equipment
Modular Structure Vacuum Device - Multi-Purpose Vacuum Deposition Device HEX Series - High Expandability & High Maintainability
The 'True Modular Structure' changes the common understanding of vacuum devices. A compact vacuum device with a minimum installation area of 60cm square, which can be introduced with a minimal configuration and allows for flexible changes in structure according to shifts in research direction. Traditionally, vacuum devices had a fixed number and arrangement of ports upon installation, making changes impractical. However, the HEX system, featuring a hexagonal prism-shaped chamber, adopts a groundbreaking 'modular structure' that allows for the number and arrangement of ports to be freely changed by swapping out the panels that make up each side. This enables easy configuration changes and functional expansions, akin to assembling blocks, in response to changes in research direction. ◆ The 'Modular Structure' allows for flexible changes to the system configuration ◆ Supports sputtering, resistance heating deposition, electron beam deposition, and organic deposition ◆ Capable of simultaneous film deposition from multiple sources ◆ Supports sample rotation, heating, and water cooling ◆ Can be equipped with a film thickness monitor ◆ Compact design with a footprint of 60cm x 60cm ◆ Excellent expandability and maintainability ◆ Compatible with glove boxes *Please feel free to contact us for more details.
Organic deposition source for the multipurpose vacuum deposition device HEX system.
- Sputtering Equipment
Modular Structure Vacuum Device - Multi-Purpose Vacuum Deposition Device HEX Series - High Expandability & High Maintainability
The 'True Modular Structure' changes the common understanding of vacuum devices. A compact vacuum device with a minimum installation area of 60cm square, which can be introduced with a minimal configuration and allows for flexible changes in structure according to shifts in research direction. Traditionally, vacuum devices had a fixed number and arrangement of ports upon installation, making changes impractical. However, the HEX system, featuring a hexagonal prism-shaped chamber, adopts a groundbreaking 'modular structure' that allows for the number and arrangement of ports to be freely changed by swapping out the panels that make up each side. This enables easy configuration changes and functional expansions, akin to assembling blocks, in response to changes in research direction. ◆ The 'Modular Structure' allows for flexible changes to the system configuration ◆ Supports sputtering, resistance heating deposition, electron beam deposition, and organic deposition ◆ Capable of simultaneous film deposition from multiple sources ◆ Supports sample rotation, heating, and water cooling ◆ Can be equipped with a film thickness monitor ◆ Compact design with a footprint of 60cm x 60cm ◆ Excellent expandability and maintainability ◆ Compatible with glove boxes *Please feel free to contact us for more details.
Rich experience in processing various materials and substrates! Electromagnetic wave shielding, static electricity prevention, surface heating elements, etc.
- Sputtering Equipment
![[Heat Shielding Measures] ~ Film Co...](https://image.mono.ipros.com/public/product/image/660/2001038071/IPROS81370821817375888120.jpeg?w=280&h=280){kind=small}
Substrate × Film = Optical adjustment, conductivity, antibacterial/antiviral! Exhibits heat insulation and thermal retention effects.
- Sputtering Equipment
Suppress the growth of bacteria/viruses with metals/alloys! Sputtering processing on fibers is possible.
- Sputtering Equipment
![[Mold Prevention Measures] ~ Film C...](https://image.mono.ipros.com/public/product/image/34e/2001037961/IPROS05532312531430526084.jpeg?w=280&h=280){kind=small}
Rich experience in processing various materials and substrates! Effective sputtering technology for mold prevention as well.
- Sputtering Equipment
Various antibacterial/antiviral treatments, anti-mold, etc.! Sputtering processing on fibers and films.
- Sputtering Equipment
Rich experience in processing various materials and substrates! Substrate × thin film = optical adjustment, conductivity, antibacterial/antiviral.
- Sputtering Equipment
Multi-purpose vacuum deposition device HEX system RF & DC sputtering source
- Sputtering Equipment
Modular Structure Vacuum Device - Multi-Purpose Vacuum Deposition Device HEX Series - High Expandability & High Maintainability
The 'True Modular Structure' changes the common understanding of vacuum devices. A compact vacuum device with a minimum installation area of 60cm square, which can be introduced with a minimal configuration and allows for flexible changes in structure according to shifts in research direction. Traditionally, vacuum devices had a fixed number and arrangement of ports upon installation, making changes impractical. However, the HEX system, featuring a hexagonal prism-shaped chamber, adopts a groundbreaking 'modular structure' that allows for the number and arrangement of ports to be freely changed by swapping out the panels that make up each side. This enables easy configuration changes and functional expansions, akin to assembling blocks, in response to changes in research direction. ◆ The 'Modular Structure' allows for flexible changes to the system configuration ◆ Supports sputtering, resistance heating deposition, electron beam deposition, and organic deposition ◆ Capable of simultaneous film deposition from multiple sources ◆ Supports sample rotation, heating, and water cooling ◆ Can be equipped with a film thickness monitor ◆ Compact design with a footprint of 60cm x 60cm ◆ Excellent expandability and maintainability ◆ Compatible with glove boxes *Please feel free to contact us for more details.
Resistance heating evaporation source for the multi-purpose vacuum deposition device HEX system.
- Sputtering Equipment
Modular Structure Vacuum Device - Multi-Purpose Vacuum Deposition Device HEX Series - High Expandability & High Maintainability
The 'True Modular Structure' changes the common understanding of vacuum devices. A compact vacuum device with a minimum installation area of 60cm square, which can be introduced with a minimal configuration and allows for flexible changes in structure according to shifts in research direction. Traditionally, vacuum devices had a fixed number and arrangement of ports upon installation, making changes impractical. However, the HEX system, featuring a hexagonal prism-shaped chamber, adopts a groundbreaking 'modular structure' that allows for the number and arrangement of ports to be freely changed by swapping out the panels that make up each side. This enables easy configuration changes and functional expansions, akin to assembling blocks, in response to changes in research direction. ◆ The 'Modular Structure' allows for flexible changes to the system configuration ◆ Supports sputtering, resistance heating deposition, electron beam deposition, and organic deposition ◆ Capable of simultaneous film deposition from multiple sources ◆ Supports sample rotation, heating, and water cooling ◆ Can be equipped with a film thickness monitor ◆ Compact design with a footprint of 60cm x 60cm ◆ Excellent expandability and maintainability ◆ Compatible with glove boxes *Please feel free to contact us for more details.
Multi-purpose vacuum deposition device for HEX system with 1-source and 4-source electron beam deposition sources.
- Sputtering Equipment
Modular Structure Vacuum Device - Multi-Purpose Vacuum Deposition Device HEX Series - High Expandability & High Maintainability
The 'True Modular Structure' changes the common understanding of vacuum devices. A compact vacuum device with a minimum installation area of 60cm square, which can be introduced with a minimal configuration and allows for flexible changes in structure according to shifts in research direction. Traditionally, vacuum devices had a fixed number and arrangement of ports upon installation, making changes impractical. However, the HEX system, featuring a hexagonal prism-shaped chamber, adopts a groundbreaking 'modular structure' that allows for the number and arrangement of ports to be freely changed by swapping out the panels that make up each side. This enables easy configuration changes and functional expansions, akin to assembling blocks, in response to changes in research direction. ◆ The 'Modular Structure' allows for flexible changes to the system configuration ◆ Supports sputtering, resistance heating deposition, electron beam deposition, and organic deposition ◆ Capable of simultaneous film deposition from multiple sources ◆ Supports sample rotation, heating, and water cooling ◆ Can be equipped with a film thickness monitor ◆ Compact design with a footprint of 60cm x 60cm ◆ Excellent expandability and maintainability ◆ Compatible with glove boxes *Please feel free to contact us for more details.
Easy discharge operation! Compact design with automatic matching for RF power supply.
- Sputtering Equipment
Reduce initial implementation costs and enable high performance through expansion! Upgrade according to the research stage.
- Sputtering Equipment
High-precision alignment (within 1μm of the target) is now possible in all directions of X-Y-Z-θx-θy-θz.
- Sputtering Equipment
- Semiconductor inspection/test equipment
- Photomask
![[Data Download Available/EBSD] Eval...](https://image.mono.ipros.com/public/product/image/bf8/2000765586/IPROS14612971495413530885.png?w=280&h=280){kind=small}
The electron backscatter diffraction method (EBSD) is useful for evaluating the performance of aluminum sputter films and selecting substrate materials.
- Other metal materials
- Sputtering Equipment
- Ceramics
Supports work widths of 255, 350, 450, 550, 600, and 750 mm!
- Sputtering Equipment
- Food Packaging Machinery
- Beverage Production Equipment
Ideal for use in clean rooms! It is a fully automatic system for cleaning rolls.
- Sputtering Equipment
- Bag making machine/slitter
- Special labels, etc.
The ULT roll-to-roll web cleaner device stably removes dust even at a converting production line speed of 300m/min.
- Sputtering Equipment
- Bag making machine/slitter
- Food Packaging Machinery
Equipped with a heater stage (1000°C)! Usable for various applications from the development process to mass production.
- Sputtering Equipment
Introducing the ion beam sputtering device equipped with a maximum of 5 targets (220mm diameter) or 4 targets (300mm diameter)!
- Sputtering Equipment
Maximum 200mm diameter substrate! Double ring magnetron (Fraunhofer FEP)
- Sputtering Equipment
A multipurpose sputtering device specialized for surface treatment of three-dimensional shaped parts, the entire outer surface, both sides of flat substrates, and film formation on three-dimensional s...
- Sputtering Equipment
- Glass
- fiber
EUROVAC's VARIAN type low-cost 3keV ion gun
- Plasma surface treatment equipment
- Vacuum Equipment
- Sputtering Equipment
This device can clean adhesive rolls during maintenance more quickly and efficiently, addressing a challenge that has troubled customers across various industries!
- Sputtering Equipment
Coating Sakurajima lava with the latest plasma technology. Naturally derived functional surface treatment. Achieving new functions such as various vegetation and hydrophilicity for all types of equipm...
- Sputtering Equipment
- Glass
- fiber
This is a sheet-type sputtering device that achieves high-quality radio wave transmission films.
- Sputtering Equipment
It is an optimal post-oxidation sputtering device for multilayer optical thin films.
- Sputtering Equipment
This is a research and development sputtering device suitable for various film deposition applications, featuring high-level specifications and a wide range of options.
- Sputtering Equipment
We will give you a free copy of "Thin Film Q&A," which summarizes the differences and characteristics of various coating methods, coating examples, and frequently asked questions!
- Surface treatment contract service
- Sputtering Equipment
- Ceramics
Leave your analysis requests to us! Free download of the "Analysis Equipment List"!
The evaluation of thin films is determined by the purpose for which the thin film is used. For example, if the thin film is used for enhancing mechanical strength, important factors for evaluation include hardness and adhesion. If the film is intended to impart optical properties, values such as reflectivity and transmittance become important. Toho Kaken has three main divisions: the "Ion Plating Division," the "Material Analysis Division," and the "Environmental Analysis Center," which allows us to possess a wide range of analytical equipment. In addition to requests for thin film coating, we can also handle analysis and evaluation. We also accept inquiries for "inspection and analysis only" apart from thin film coating, so please feel free to contact us!
Free technical data available! Enables precise and hard film formation! Applicable to the production of automotive mirrors and more.
- Sputtering Equipment
Introducing a case study of a sputtering device capable of automatically creating multilayer films!
- Sputtering Equipment
- Vacuum Equipment