SPI (Solder Paste Inspection Device) 'TR7007 SII Ultra'
The TR7007 SII Ultra operates at an industry-leading speed of up to 180 cm²/second.
The TR7007 SII Ultra appearance inspection device is built on an enhanced mechanical platform to ensure stability, accuracy, and precision during inspection. The 3D SPI supports Industry 4.0 with future innovative protocols such as IPC Connected Factory Exchange (CFX) and IPC Hermes9852 standards. *For product details, please refer to the catalog available for download below under "PDF Download."
- Company:ティアールアイ ジャパン 日本支社
- Price:Other