We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
ipros is IPROS GMS IPROS One of the largest technical database sites in Japan that collects information on.

Substrate Product List and Ranking from 577 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated: Aggregation Period:May 06, 2026~Jun 02, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:May 06, 2026~Jun 02, 2026
This ranking is based on the number of page views on our site.

  1. 共栄電資 Tokyo//Electronic Components and Semiconductors
  2. 太洋テクノレックス 本社 和歌山 Wakayama//Electronic Components and Semiconductors
  3. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  4. 4 プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  5. 5 null/null

Substrate Product ranking

Last Updated: Aggregation Period:May 06, 2026~Jun 02, 2026
This ranking is based on the number of page views on our site.

  1. Busbar for Data Centers - High Current Board 共栄電資
  2. FPC for the space industry 太洋テクノレックス 本社 和歌山
  3. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  4. 4 PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
  5. 5 CAN/CANFD communication is possible with the sequencer! CANNEX サンプロシステム

Substrate Product List

1591~1620 item / All 1948 items

Displayed results

Double-sided circuit board

We offer non-through hole PCBs, copper through hole PCBs, silver through hole PCBs, and more!

We would like to introduce the "double-sided printed circuit board" that we handle. It is a type of printed wiring board where patterns (circuits) are formed on both sides of the substrate, also known as a two-layer board. Additionally, it allows for higher density wiring compared to single-sided boards and is widely used in electronic devices and white goods. 【Features】 ■ Printed circuit board with patterns (circuits) formed on both sides ■ Also referred to as a two-layer board ■ Allows for higher density wiring than single-sided boards, widely used in electronic devices and white goods ■ Available in non-through hole boards, copper through hole boards, silver through hole boards, etc. *For more details, please feel free to contact us.

  • ip 3-2銅スルーホール 1111-銅めっきスルーホール品 2916-2918-3-2 白.jpg
  • ip 3-2銅スルーホール 20250929-Cu-through-banked30deg-2-50-3-2 白.jpg
  • ip 3-3銀スル 1818-銀スルーホール品_-3-3-白.jpg
  • Printed Circuit Board
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Double-sided non-through hole substrate

Introducing a type of double-sided circuit board! It is widely used in LED circuit boards, electronic devices, and white goods.

The "double-sided non-through hole substrate" is a printed circuit board that does not connect the patterns on the front and back through through-holes, and it is also referred to as a double-sided non-through substrate or double-sided non-plated substrate. It is effective for heat dissipation and warping suppression, and is widely used in LED substrates. Additionally, we also handle printed circuit boards with patterns on the front and back connected by through-holes using copper plating or silver paste, known as "double-sided copper through-hole substrates" and "double-sided silver through-hole substrates." 【Features】 < Double-sided non-through hole substrate > ■ A printed circuit board that does not connect the patterns on the front and back through through-holes ■ Effective for heat dissipation and warping suppression < Double-sided copper through-hole substrate > ■ Allows for larger wiring and mounting space ■ Possible to reduce the size of the substrate *For more details, please feel free to contact us.

  • ip 2-両面基板 1515 両面長尺 001-003-2-白.jpg
  • Printed Circuit Board
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Convert a double-sided board to a single-sided board.

We will change the double-sided board to a single-sided board! Cost reduction is achievable.

Our company achieves cost reduction by changing double-sided boards to single-sided boards. By realizing cost reduction, we have pleased many customers. Please feel free to contact us when you need our services. 【Features】 ■ Cost reduction by changing double-sided boards to single-sided boards * For more details, please feel free to contact us.

  • Printed Circuit Board
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Artwork design - mass production

From artwork to mass production, we handle everything consistently! Leave your printed circuit boards to us.

Our company can provide consistent support from artwork design to prototyping, implementation, and mass production. If you have any concerns about printed circuit boards, please feel free to consult us. 【Features】 ■ Leave printed circuit boards to us ■ Consistent support from artwork to mass production *For more details, please feel free to contact us.

  • ip 12.アートワーク設計から量産まで一貫対応 12.jpg
  • Circuit board design and manufacturing
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Repair substrate

Create substrate data from the actual product and replicate equivalent items! Proven results from single-sided to multi-layer (4 layers).

We handle the "replacement circuit boards" that can be replicated from actual PCB samples. If you have an "old model with no data," "no drawings," or need "just a few circuit boards as spare parts," please leave it to us. We will create circuit board data from the actual item you provide. Additionally, there are no issues with assembled components. We will create the data and manufacture the circuit boards for you. 【Features】 ■ Create circuit board data from actual items and replicate equivalent products ■ No issues with assembled components ■ Proven track record from single-sided to multilayer (4 layers) *For more details, please feel free to contact us.

  • Printed Circuit Board
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Capacitor - Sanwa Capacitor Group Company Profile

The delivery time is a standard of 4 weeks! We accommodate various packages and deliver high-quality products to our customers.

Sanwa Capacitor Group has grown as a capacitor manufacturer originating from Korea for over half a century. Currently, production takes place in three countries: Korea, Thailand, and Indonesia, where we cater to various packages and deliver high-quality products to our customers. Our application fields include home appliances, automotive, and telecommunications. 【Products Offered】 ■ Capacitors *For more details, please feel free to contact us.

  • Capacitor
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

GNSS LNA『NT1191/1192』

Contributing to the realization of high-precision GNSS! Introducing LNA compatible with GNSS multi-band and L5/L2/L6 bands!

The "NT1191" is a wideband LNA that supports GNSS multi-band (1164MHz to 1610MHz), while the "NT1192" is a 1.2GHz LNA that supports the L5/L2/L6 bands (1164MHz to 1300MHz). For high-precision positioning, it is necessary to support multi-band reception of signals in both the 1.5GHz band and the 1.2GHz band. Our company will enhance its lineup of LNA products for high-precision GNSS. 【Features】 <NT1191> ■ Achieves gain flatness and low NF (noise figure) across all GNSS bands ■ Wide power supply voltage range ■ Packaged in a wettable flank package <NT1192> ■ Achieves high gain and low NF in the 1.2GHz band ■ Packaged in a compact and thin package *For more details, please refer to the PDF document or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

5G (Sub6) base station low distortion high gain LNA "NT1189"

Contributing to the improvement and enhancement of sensitivity to reception.

NT1189 is an LNA for 5G (Sub6) base stations. It contributes to improving and enhancing reception sensitivity with its low distortion and high gain characteristics, as well as low NF (noise figure) characteristics. By modifying external circuits, it can support a wide bandwidth from 3.3GHz to 5.0GHz. Additionally, the adoption of a compact and thin package helps reduce the mounting area in base stations with a high number of installations. Nisshinbo Micro Devices will release high-performance LNA products for 5G base stations to enhance the stability of the 5G communication network that supports an information society.

  • High frequency/microwave parts
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

5G and wiring circuit boards

Report on the Patent Technology Trends of 5G and Electronic Circuit Boards

You can view patent information categorized by the following technical classifications: - Perspective of electronic components - Perspective of antenna components - Improvement of high-frequency characteristics - Reduction of dielectric loss - Perspective of electronic devices - Other related technologies

  • Other electronic parts
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Communication equipment and circuit boards

Supporting the realization of an IoT society with the capability to cover a wide communication range.

Our company handles communication devices and circuit boards. Leveraging wireless communication technology developed through mobile phones and other devices as our core technology, we support the realization of an IoT society with our capability to cover a wide range of communication from NFC to GNSS. Based on wireless communication technology that connects people and things, as well as things to things, we are also developing payment units that respond to the advancement of a cashless society, and products utilizing LPWA communication technology suitable for IoT, enabling high-frequency and low-power communication. 【Main Product Achievements】 ■ Wireless payment terminals for vending machines ■ POS terminals ■ Card timers / Card reader-writers / Image adapters ■ Energy storage system control circuit boards ■ NFC modules (compliant with EMV standards), etc. *For more details, please download the PDF or feel free to contact us. *Our company changed its name to LIMNO Corporation in January 2023.

  • Company:LIMNO
  • Price:Other
  • Communications
  • Circuit board design and manufacturing
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

On-board equipment and circuit board

We handle control boards for vehicle batteries and vehicle LED units, among other products.

Our company provides high manufacturing quality globally based on design technology and manufacturing know-how aimed at achieving zero defects in automotive quality. We can offer high-quality products thanks to our capability to comply with the international standard for the automotive industry, "IATF16949," as well as our expertise in high-density mounting and mass production design technology. Please feel free to contact us if you have any requests. 【Main Product Achievements】 ■ Control boards for automotive batteries ■ Automotive LED units ■ Control units for construction machinery ■ Business operation management systems ■ CAN communication units for agricultural machinery *For more details, please download the PDF or feel free to contact us. *Our company changed its name to LIMNO Corporation in January 2023.

  • Company:LIMNO
  • Price:Other
  • Circuit board design and manufacturing
  • Contract manufacturing
  • Other optical parts
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Polycrystalline ultra-high thermal conductivity optical grade diamond substrate

Multi-crystal ultra-high thermal conductivity optical grade wafer/sheet

Laser, optoelectronic devices, high output heat dissipation, and other high-end applications.

  • Ceramics
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Single crystal super high thermal conductivity diamond substrate

Highest grade thermal conductivity

High-output electronic devices, laser systems, heat dissipation management, etc.

  • Ceramics
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Substrate manufacturing

Select and propose suitable manufacturers for the project! Procurement is possible not only from domestic but also from overseas PCB manufacturers.

At Tokai Corporation, we can manufacture from a single printed circuit board. We support a variety of boards, including "rigid boards (single-sided to high multilayer)," "IVH and BVH boards," "build-up boards," and "special boards (such as Teflon, aluminum, glass, etc.)." We will select and propose the most suitable manufacturers based on specifications, quality, and cost for each project. Additionally, we can procure from domestic as well as overseas board manufacturers, so please feel free to consult us when needed. 【Supported Boards (partial)】 ■ Rigid boards (single-sided to high multilayer) ■ IVH and BVH boards ■ Build-up boards ■ Flexible boards (single-sided to multilayer) ■ Rigid-flex boards *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Printed circuit board for electronic component evaluation

We respond to the various needs for printed circuit boards required in the development of electronic components and the production process!

We would like to introduce our "Printed Circuit Boards for Electronic Component Evaluation." We can offer various printed circuit boards required at each stage of the engineering chain and value chain for electronic component manufacturers. We provide a seamless service for all tasks related to printed circuit board development. With the LDI process, both patterns and solder resist (SR) can be finished with high precision. 【Benefits for Customers】 ■ We can provide a seamless service for all tasks related to printed circuit board development. ■ The LDI (Laser Direct Imaging) process allows for high-precision finishing of both patterns and solder resist (SR). ■ There is no concept of end-of-life (EOL) due to the absence of original artwork, film plates, and screen plates, allowing for orders to be placed at any time. *For more details, please download the PDF or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

OKI Circuit Technology Pattern Design

Achieving short delivery times! Smooth flow from pattern design to circuit board manufacturing to assembly.

Our company offers pattern design focused on the manufacturing of printed circuit boards. We achieve short delivery times through simultaneous parallel design. We have approximately 10,000 design achievements ranging from communication and measurement equipment to space and defense products. Furthermore, all designers hold first and second-class qualifications as printed circuit board manufacturing technicians and can propose analyses through various simulations. 【Features】 ■ Short delivery times ■ Abundant track record ■ Pattern design considering board quality and assembly quality ■ Design quality check system through the introduction of proprietary verification tools ■ All designers hold qualifications as printed circuit board manufacturing technicians An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Printed Circuit Board: Various Custom Printed Circuit Board Catalogs

Printed Circuit Board: Introducing OKI Circuit Technology's custom printed circuit boards.

This document is a catalog of "various custom printed circuit boards" handled by OKI Circuit Technology Co., Ltd., which develops, designs, and manufactures printed circuit boards. We introduce various custom printed circuit boards, including "copper coin (heat dissipation structure) printed circuit boards" embedded with copper coins for efficient heat dissipation from heat-generating parts, "high current, high voltage, and high heat dissipation compatible printed circuit boards" for applications requiring high current and voltage, and "high-speed, large-capacity transmission compatible printed circuit boards" supporting high-speed transmission of 25 to 400 Gbps. [Contents] ■ Copper coin (heat dissipation structure) printed circuit boards ■ High current, high voltage, high heat dissipation specification printed circuit boards ■ High-speed, large-capacity transmission printed circuit boards ■ High-density component compatible printed circuit boards ■ High-density build-up printed circuit boards ■ Flex-rigid printed circuit boards ■ Composite board thickness printed circuit boards (T-SEC-Board) An article from our company has been published in MONOist. [How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing cumulative hours by 480 over three years] https://monoist.atmarkit.co. *For more details, please download the PDF or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Support for flex-rigid structures

Achieving miniaturization, high density, and high reliability through flex-rigid integration!

Our company creates many benefits through integrated flex-rigid technology. We solve issues such as "high initial costs preventing prototype development" and "wanting to ensure high reliability." We contribute to miniaturization and high density through connector-less designs, as well as reducing cable connection errors and wiring labor. 【Features】 ■ Support available from a single unit ■ Data receipt to shipment: possible in as little as 5 days ■ Cost reduction of mold expenses through router processing ■ Possible multilayer structure for flex layers ■ Use of liquid crystal polymer materials for flex layers Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Support for high-density components

High-density component mounting such as narrow pitch CSP is possible! We will propose specifications according to your application.

Our company enables high-density component mounting such as narrow-pitch CSP. We offer specifications tailored to applications, including measures to prevent solder blowout during the mounting of via-in-pad structures. Please feel free to contact us when you need assistance. 【Specification Proposals】 ■ Increased wiring density for inner and outer layers → Build-up, IVH structure ■ Measures to prevent solder blowout during the mounting of via-in-pad structures → Pad-on-hole structure ■ High-density CSP mounting with a pitch of 0.65mm or less → Build-up, pad-on-hole structure An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, multi-product factory, reducing cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Integrated design and manufacturing solution services

All of our printed circuit boards, including special products, can be accommodated for assembly!

Our company provides a consistent solution service for design and manufacturing. We offer services utilizing OKI-EMS's comprehensive capabilities, including circuit design, firmware development, mechanical design, and AW design. Additionally, all of our printed circuit boards, including special products, are capable of implementation. 【Features】 ■ FPGA IP (image, audio, communication, embedded systems) ■ DSP platform ■ Wireless EtherCAT analog support ■ Enclosure and mechatronics design An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Composite board thick wiring board "T-SEC-Board"

Increase the number of layers to match the pin count of the mounted components! We can accommodate thick multilayer printed circuit boards.

Introducing the PCI-Express compatible wiring board "T-SEC-Board." In addition to increasing the freedom of characteristic impedance wiring width, the use of inner layer metals (copper, aluminum) is possible. This is a high-function wiring board equipped with multi-pin BGA, which allows for partial control of the board thickness at the terminal connector section. 【Features】 ■ Layer count can be increased according to the number of pins of the mounted components ■ Increased freedom of characteristic impedance wiring width ■ Inner layer copper foil thickness can be increased for heat dissipation purposes ■ Adoption of inner layer metals is possible (improving strength and heat dissipation, etc.) Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Custom and special purpose circuit boards

Developed with proven technology over many years! Pre-verification of characteristics through simulation is possible.

We provide printed circuit boards that combine functional materials tailored to various characteristic requirements. We can accommodate industrial applications and small quantities, and pre-validation of characteristics through simulation is possible. Developed with proven technology over many years, we guarantee long-term reliability. 【Features】 ■ Aluminum-based substrate - Achieves high heat dissipation and lightweight design ■ Edge shielded substrate - Suppresses radiated noise by shielding the edges - Adopts the ED method to accommodate special shapes ■ Millimeter-wave substrate - Hybrid structure of low-loss material and FR4 - High-precision patterning *For more details, please refer to the PDF document or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Substrate lineup

Supports specific functional materials such as capacitors and heat dissipation! Balances performance and cost.

We provide printed circuit boards that combine functional materials tailored to various characteristic requirements. By using a hybrid structure of functional materials such as low-loss materials and capacitor materials along with general materials, we achieve a balance between performance and cost. Additionally, we accommodate low-loss materials both domestically and internationally. 【Application Example】 <Embedded Capacitor> ■ Number of Layers: 20 layers ■ Base Material: Faradflex + Megtron6 ■ Application Example: Networks, semiconductor testing *For more details, please refer to the PDF document or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Copper coin embedded printed circuit board

Improving thermal conductivity by embedding copper coins! Introducing printed circuit boards that efficiently dissipate heat.

To efficiently utilize the thermal conductivity of copper (390 W/m·K) for heat dissipation, we introduce a printed circuit board embedded with copper coins in the heat-generating area. In conventional methods, heat dissipation vias were arranged as much as possible, but due to the inability to increase the cross-sectional area of copper, there were limitations in heat dissipation. In the developed product, the thermal conductivity has been improved by embedding copper coins. 【Comparison of Conductor Cross-sectional Area】 ■ Through Hole (25μm) - φ3.0mm 1 hole: 0.23 mm² - φ8mm area: 1.41 mm² (φ0.4mm TH, 1.0mm pitch, 48 holes) ■ Copper Coin - φ3.0mm 1 hole: 7.07 mm² (approximately 30 times) - φ8mm area: 50.24 mm² (1 hole of φ8mm copper coin) (approximately 35 times) *For more details, please refer to the PDF document or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

High-reliability build-up wiring board

High board thickness specifications, low dielectric material specifications, stack via specifications, etc.! We can accommodate various specifications.

We offer build-up wiring boards that support high density and high reliability. We can accommodate various specifications, including 0.4mm pitch, high board thickness, low dielectric material, stacked via specifications, and large interlayer thickness (100-120um). We deliver printed circuit boards with specific functions added for each application, from pattern design to manufacturing in a consistent system. Please feel free to consult us when you need assistance. *For more details, please refer to the PDF materials or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

High-speed high-frequency compatible printed circuit board

For those who want to use materials suitable for their products. We propose optimal materials (low dielectric, tangent materials) based on measured data!

In high-speed, high-frequency compatible printed circuit boards, we will assist in the development of printed circuit boards aimed at 25Gbps to 100Gbps. We solve customer issues such as "I want to reduce transmission loss and delay time" and "I want to use materials suitable for the product." We will propose suitable materials (low dielectric, low loss tangent) based on measured data. 【Features】 ■ Proposal of suitable materials (low dielectric, low loss tangent) based on measured data ■ Support from the design stage with pre-simulation (single-ended, differential) ■ Proposals based on measured values of material transmission characteristics (loss, delay) ■ Proposal of composite structure circuit boards using high-frequency materials and FR-4 *For more details, please refer to the PDF document or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

High-density compatible printed circuit board

We can propose specifications tailored to your needs! We provide printed circuit boards with structures customized for your applications.

We provide printed circuit boards with structures tailored to your applications. Increased wiring density for inner and outer layers → Build-up printed circuit boards Implementation of blind vias to prevent solder blowout → Pad-on-hole structure printed circuit boards Pitch of 0.65mm or less → Build-up or pad-on-hole structure printed circuit boards We can propose specifications according to your needs. Please feel free to consult us. 【Usage Scenarios】 ■ By Product / Minimum Through-Hole Pitch - Probe Card: 0.65mm - CSP Main Image: 0.40mm - Performance Board: 0.50mm - Burn-in Board: 0.40mm *For more details, please refer to the PDF document or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

[Use Case] Supporting IoT integration through wiring wearable devices into clothing.

The conductor resistance value is low, and the change in conductor resistance during expansion and contraction is small! Suitable for applications that were difficult to apply in the past!

We would like to introduce a case where our EMS (design and manufacturing contract services) supported the IoT integration of clothing through the wiring of wearable devices. The customer's challenge was to improve the performance and quality of their own wearable devices. By using copper foil for the circuit conductors, we achieve low conductor resistance and minimal changes in resistance during stretching. This feature allows for wide application in areas that were previously difficult to implement. [Challenges] ■ Desire to improve the performance and quality of their own wearable devices ■ Traditional flexible substrates have issues with lack of elasticity ■ Unable to realize the desired wearable device *For more details, please refer to the PDF document or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Simulation-based substrate design

The appropriateness of the design will be quantitatively assessed through simulation.

At Oki Electric Industry, we support efficient manufacturing by verifying design validity during the development stage. By conducting functional verification before actual production, we reduce cut-and-try efforts. We provide support from identifying causes to planning countermeasures and confirming their effectiveness. We solve issues such as "not functioning" and "taking time for countermeasures" through simulations at the circuit board design stage. 【Features】 ■ Reduces cut-and-try efforts through functional verification before actual production ■ Quantitatively assesses design validity through simulations ■ Supports from cause identification to countermeasure planning and effectiveness confirmation *For more details, please refer to the PDF materials or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration