Last Updated： Aggregation Period:Jan 07, 2026～Feb 03, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jan 07, 2026～Feb 03, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jan 07, 2026～Feb 03, 2026
This ranking is based on the number of page views on our site.
1126～1140 item / All 1900 items
We have a variety of products available to meet our customers' diverse needs.
This is a substrate with copper foil on only one side of the paper phenol or glass epoxy insulating board. There is no copper foil on the walls of the holes. (It is produced using the line from the first factory.)
Leave it to us for anything related to FPC, including small quantities, a variety of products, short delivery times, prototypes, and mass production!
We would like to introduce our domestic factory's response to FPC (Flexible Printed Circuit Board). Our factory features a fully integrated production line for rapid manufacturing. In "Pattern Design," professionals in implementation technology provide pattern designs suitable for the required specifications, while in "Manufacturing Design," we verify all design data before production. Additionally, in our "Manufacturing Line," we produce all types of flexible, rigid boards, and rigid-flex boards in-house. We also provide assembly services for printed boards in-house. 【Features】 ■ Super-fast delivery with an in-house integrated line ■ Supports small lots and a variety of products, accepting orders from a single repeat ■ Cost reduction through efficient manufacturing processes for small lots ■ High reliability achieved with over 20 years of manufacturing know-how ■ Flexibility and responsiveness made possible by a small, elite team *For more details, please refer to the related links or feel free to contact us.
Introducing our product lineup that covers everything from printed circuit board design and manufacturing to component assembly and assembly.
The "High Heat Dissipation Flow Path Substrate" is a product handled by Arrow Industry Co., Ltd. Our company is capable of creating products that meet customer needs due to our in-house integrated production of printed circuit boards (substrates). Furthermore, we collaborate with local companies to provide services from printed circuit board design and manufacturing to component mounting and assembly. 【Our Features】 ■ In-house integrated production of printed circuit boards (substrates) ■ Collaboration with local companies ■ Services from printed circuit board design and manufacturing to component mounting and assembly ■ Proposals and provision of products tailored to customer needs *For more details, please refer to the PDF document or feel free to contact us.
Introducing our product lineup, which covers everything from printed circuit board design and manufacturing to component assembly and assembly.
The "Copper Core Substrate" is a product handled by Arrow Industry Co., Ltd. Our company is capable of creating products that meet customer needs due to our in-house integrated production of printed circuit boards (substrates). Furthermore, we collaborate with local companies to provide services from printed circuit board design and manufacturing to component mounting and assembly. 【Our Features】 ■ In-house integrated production of printed circuit boards (substrates) ■ Collaboration with local companies ■ Services from printed circuit board design and manufacturing to component mounting and assembly ■ Proposals and provision of products tailored to customer needs *For more details, please refer to the PDF document or feel free to contact us.
Introducing our product lineup, which covers everything from printed circuit board design and manufacturing to component assembly and assembly.
The "Copper Bump Substrate" is a product handled by Arrow Industry Co., Ltd. Our company is capable of creating products that meet customer needs due to our in-house integrated production of printed circuit boards (substrates). Furthermore, we collaborate with local companies to provide services ranging from printed circuit board design and manufacturing to component mounting and assembly. 【Our Features】 ■ In-house integrated production of printed circuit boards (substrates) ■ Collaboration with local companies ■ Services from printed circuit board design and manufacturing to component mounting and assembly ■ Proposals and provision of products tailored to customer needs *For more details, please refer to the PDF materials or feel free to contact us.
We propose suitable heat dissipation measures for devices that carry large currents! Introducing a substrate compatible with large currents!
The "High Current Compatible Substrate" is a metal substrate designed to accommodate high-output devices by incorporating thick copper foil into the heat dissipation characteristics of a metal base substrate. We propose suitable heat dissipation measures for devices that carry high currents. 【Features】 ■ Incorporates thick copper foil into the heat dissipation characteristics of the metal base substrate ■ Proposes suitable heat dissipation measures for devices that carry high currents *For more details, please refer to the PDF document or feel free to contact us.
Effective for thermal management of low energy conversion efficiency devices like UV LEDs! Water-cooled flow circuit substrate.
The "Water-Cooled Flow Path Circuit Board" is a product handled by Arrow Industries, which manufactures and sells substrates for industrial equipment, semiconductor bare chip mounting, and consumer electronics. It directly bonds a water-cooled unit to a metal base substrate, effectively addressing heat issues for low energy conversion efficiency devices such as UV LEDs. 【Features】 ■ Directly bonds a water-cooled unit to a metal base substrate ■ Effectively addresses heat issues for low energy conversion efficiency devices such as UV LEDs *For more details, please refer to the PDF document or feel free to contact us.
Introducing a multilayer metal base substrate that supports high-density wiring!
The "Multi-layer Metal Base Substrate" is a product handled by Arrow Industries, which manufactures and sells substrates for industrial equipment, semiconductor bare chip mounting, and consumer electronics. By laminating double-sided printed circuit boards and multi-layer printed circuit boards onto a metal surface with an insulating layer or a high thermal conductivity insulating sheet, it enables higher density wiring and component mounting compared to single-sided metal base substrates. 【Features】 ■ Metal substrate compatible with high-density wiring *For more details, please refer to the PDF document or feel free to contact us.
Direct heat dissipation from the LED's neutral terminal! A substrate with a structure that efficiently releases heat.
The "Metal (Copper, Aluminum) Bump Substrate" is a product handled by Arrow Industries, which manufactures and sells substrates for industrial equipment, semiconductor bare chip mounting, and consumer electronics. It features a structure that directly connects the heat dissipation fins of UV LEDs, high-brightness LEDs, and high-power semiconductors to the metal bump section, allowing heat to escape efficiently. 【Features】 ■ Direct heat dissipation from the neutral electrode of the LED ■ Structure that efficiently dissipates heat *For more details, please refer to the PDF document or feel free to contact us.
Introducing a printed circuit board with an insulating layer on a metal surface, copper foil arranged, and circuits formed on top!
The "metal base single-sided substrate" is a printed circuit board that has an insulating layer and copper foil on a metal surface, with circuits formed on top of it. The insulating layer includes a glass epoxy prepreg type and a high thermal conductivity insulating sheet tailored to specific applications. It is proposed for thermal management of high-brightness LEDs and high-power semiconductors. 【Features】 ■ Insulating layer and copper foil are arranged on the metal surface, with circuits formed on top ■ The insulating layer includes a glass epoxy prepreg type and a high thermal conductivity insulating sheet tailored to specific applications ■ Proposed for thermal management of high-brightness LEDs and high-power semiconductors *For more details, please refer to the PDF document or feel free to contact us.
We have accumulated many achievements.
From the development, design, and manufacturing of electronic devices to product commercialization support and even product evaluation and analysis, Fuji Print Industry plays a role in supporting cutting-edge manufacturing.
![Component-integrated board SIMPACT [Reducing dead space for miniaturization!]](https://image.mono.ipros.com/public/product/image/3bb/2000229929/IPROS5081154782342606499.jpg?w=280&h=280)
Support available from just one piece! A component-integrated board that reduces dead space and achieves miniaturization! Ideal for the miniaturization and integration of printed circuit boards!
Recently, in response to the miniaturization and high density of electronic devices, there is a demand for the miniaturization and integration of printed circuit boards. The technology of embedded substrate, which reduces the surface area for component mounting by embedding components within the circuit board and minimizing dead space, is being sought after. SIMPACT is accepting orders for prototypes of embedded substrates. Please feel free to inquire from just one piece. 【Features】 ■ Components can be mounted at low temperatures and in a short time ■ Reduced load on components due to a dry process that eliminates the need for drilling and copper plating after mounting ■ Technology that connects wiring between different layers at arbitrary positions, enabling the shortest possible wiring formation ■ Vertical embedding allows for the embedding of many chips *For details, please request materials or view the PDF data from the download.
Excellent heat dissipation and heat resistance! A substrate that can also be specified with high thermal conductivity type.
Aluminum substrates have excellent heat dissipation and heat resistance that far surpass the commonly used substrate materials FR-4 and CEM-3. Recently, there has been a significant increase in substrates equipped with high-power LEDs. At Fuji Print Industry, we can create single-sided substrates with a pattern formed by laminating an insulating layer and copper foil on an aluminum-based material, as well as double-sided substrates with a core of aluminum, where an insulating layer and copper foil are laminated to create through holes and form patterns. 【Features】 ○ Excellent heat dissipation ○ Excellent thermal conductivity For more details, please contact us or download the catalog.
The sequencer board of KAIKEN that leads the era.
A control board for machine embedding aimed at a wide range of applications. It is designed to minimize wiring compared to conventional control devices and is equipped with highly versatile I/O options.
This substrate is laminated and bonded with an insulating sheet of high thermal conductivity between an aluminum plate and copper foil.
Using this substrate is suitable for applications of printed circuit boards that require heat dissipation due to high current handling and the heat generated by electronic components.
