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substrate Product List and Ranking from 548 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  4. 4 沖電気工業 産業営業本部　産業営業統括室 Tokyo//Information and Communications
  5. 5 null/null
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substrate Product ranking

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社　和歌山
  2. Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  3. All LCP Flexible Printed Circuit Board (FPC) 山下マテリアル
  4. 4 Electronic Component Reel Management System "Smart Reel Rack" JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrate Product List

1291～1305 item / All 1843 items

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End face electrode substrate "End face through-hole substrate"

End face electrode substrate "End face through-hole substrate"

Cutting the through holes at the ends of the substrate with contour processing! Suitable for mounting holes and power supply units, etc.

The "end face through-hole substrate" is created by cutting the through-holes at the edges of the substrate through contour processing. In conventional end face through-holes, copper burrs were generated during cutting, but thanks to our unique process, we can provide end face through-holes without burrs even with router processing. Please feel free to contact us when you need our services. 【Applications】 ■ Mounting holes ■ Power supply units ■ Converter substrates ■ Module substrates, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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End face electrode substrate "Narrow Pitch End Face Through Hole Substrate"

End face electrode substrate "Narrow Pitch End Face Through Hole Substrate"

We can also accommodate a pitch of 0.6mm and a hole diameter of φ0.15mm! We provide burr-free edge through holes.

We would like to introduce our "Narrow Pitch Edge Through-Hole Circuit Board." Thanks to our unique process, we can form edge through-holes with a narrow pitch. We can provide edge through-holes without burrs, regardless of the cutting method used, even for copper burrs generated during cutting. 【Applications】 ■ Mounting holes ■ Power supply units ■ Converter circuit boards ■ Module circuit boards, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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End face electrode substrate "Partial etching through-hole substrate"

End face electrode substrate "Partial etching through-hole substrate"

Only the copper in the cut section of the through hole is removed by etching! The board thickness can be accommodated from 0.04 to 0.3 mm.

We would like to introduce our "Partial Etching Through-Hole Substrate." In printed circuit boards used as substrate for devices, after component mounting, through-holes may be diced and used as soldering electrodes. However, cutting the copper plating of the through-holes inevitably leads to burr formation. Our company enables the production of cut-through-hole substrates without burrs by selectively etching away only the copper at the cut portions of the through-holes. [Applications] ■ Substrate boards for devices with through-hole electrodes, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Resistor hole filling board

Resistor hole filling board

By embedding solder resist ink in the through-hole section, it is possible to cover it!

We would like to introduce our "Solder Mask Plugging Board." By embedding solder mask ink into the through-hole areas, it is possible to cover them. This prevents flux and solder from creeping up to the surface during assembly. Please feel free to contact us when you need assistance. 【Applications】 ■ Device boards, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Silicone printed circuit board

Silicone printed circuit board

Support for metal-based substrates is also possible! Suitable for applications such as heat resistance and UV equipment.

We would like to introduce our "Silicone Printed Circuit Board." Our silicone ink has high weather resistance against heat and the recently noted UV-C, as well as a high reflectivity. Although it is prone to bleeding, requiring a larger clearance with the circuit, we can provide silicone ink-coated boards with a minimum clearance of 0.2mm from the edges of the mounted circuit, thanks to our unique technology. [Applications] ■ Heat-resistant, UV equipment-related, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Flexible circuit board

Flexible circuit board

Impedance accuracy is within standard ±10% and high precision ±5%! Available for small quantities.

"Flexible printed circuit boards" are printed circuit boards formed on an insulating film that is flexible and can be significantly deformed, such as being bent. Impedance control is also available, and we can provide small quantities. They are used in a wide variety of electronic and precision devices, including mobile devices, wearable devices, and medical equipment. 【Specifications】 ■ Number of layers: Single-sided / Double-sided ■ Board thickness: Base thickness 25μm / 50μm ■ Surface treatment: Heat-resistant preflux, electrolytic and electroless gold plating ■ Impedance accuracy: Standard ±10% or less, high precision ±5% or less *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Achieving high-density implementation and high heat dissipation. New possibilities with copper inlay substrates.

Achieving high-density implementation and high heat dissipation. New possibilities with copper inlay substrates.

In the era of IoT, we propose the use of copper inlay substrates and metal-based substrates for heat dissipation solutions, as well as ultra-thin substrates to enhance design flexibility for product miniaturization and thinness.

We solve your heat-related issues with Sanwa Electronics Circuit's heat dissipation substrates. In IoT devices such as 5G, the heat generation of components is increasing, and due to higher density, fanless structures are required, necessitating effective heat dissipation in limited areas. LED lighting also generates more heat with increased brightness, making it essential to efficiently dissipate heat. Additionally, there is a demand for integration into limited spaces and for designs that accommodate specific shapes. 【Products Offered】 ■ Copper Inlay Substrates - By embedding copper coins into the substrate, efficient heat dissipation to the backside is possible. - Various diameters of copper coins are always in stock. ■ Metal Base Substrates - Single-sided boards made of aluminum or copper are available. - Our technology allows for double-sided boards to be affixed with heat dissipation sheets. ■ Bendable Aluminum Substrates - Thin aluminum base substrates with a thickness of 0.40mm can be shaped by bending. - The use of flexible resins and aluminum allows for the maintenance of bent shapes. ■ Thin Rigid Substrates - We can accommodate incredibly thin double-sided rigid substrates down to 0.04mm. *For more details, please feel free to contact us. Our sales representatives will provide you with an explanation right away.

  • Printed Circuit Board

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[Thin Plate Bending Circuit Board] A substrate with a thickness of 0.1mm or less can be used by bending!

[Thin Plate Bending Circuit Board] A substrate with a thickness of 0.1mm or less can be used by bending!

Using FR-4 material with a thickness of 0.1mm or less, it can be bent and used like a flexible circuit board. Initial costs can be addressed at a low price.

Our "Thin Plate Bending Circuit Board" uses glass epoxy substrates (FR-4) with a thickness of 0.1mm or less, making it suitable for applications that require several bending actions during bending and assembly. Thanks to router processing, there is no need for coverlay processing molds or outline processing molds. This helps reduce initial costs from prototyping to mass production, allowing for cost-effective manufacturing of products. It is suitable for circuit boards that require component mounting and bending, and can be used in industrial equipment, LED lighting, and wearable devices (such as VR headsets and controllers). 【Features】 - Ideal for applications that require several bending actions during bending and assembly. - More cost-effective in terms of product and initial costs compared to flexible circuit boards (when compared to our offerings). - No need for coverlay processing molds or outline processing molds. - Capable of handling small to medium production volumes. *For more details, please refer to the materials. Feel free to contact us with any inquiries. *Materials for special circuit boards other than thin plate bending circuit boards can also be viewed via download.

  • Printed Circuit Board

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Understand the printed circuit board manufacturing process in 5 minutes [Materials available].

Understand the printed circuit board manufacturing process in 5 minutes [Materials available].

You can also use it for new employee training and internal study sessions. *Currently running an initial discount campaign for new customers on design and circuit board manufacturing!

This document provides a simple diagrammatic explanation of the printed circuit board manufacturing process, including: - Types and characteristics of main materials - Types of printed circuit board manufacturing methods - Types of surface treatments and more. *Some specifications and processes are unique to our company. *This document can be viewed via download. *You can also download an introduction to our special circuit boards. ~Campaign Announcement~ We are currently running a limited-time discount campaign on design and initial manufacturing costs for new customers only. ■Period: Until March 7, 2025 If you have a request to reduce initial costs, please take advantage of this opportunity! For more details, feel free to contact us through our website.

  • Printed Circuit Board

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Can you find hints for improving manufacturing with special substrates? [Materials available for distribution]

Can you find hints for improving manufacturing with special substrates? [Materials available for distribution]

In fact, Sanwa's special substrates are used in such places. We support the resolution of various challenges such as implementation defects, costs, and man-hours with substrate technology.

Our company is a specialized manufacturer of printed circuit boards, actively challenging complex processing and difficult requests, with a wealth of experience and trust. We cater to a wide range of needs, from general circuit boards to special boards aimed at solving challenges related to assembly and product commercialization. Your development concerns, on-site work improvements, and issues related to enhancing product value may be resolved with our printed circuit boards. 【Are you facing any of these issues?】 ■ I want to make the product smaller. ■ I want to use a cavity structure to reduce the height of the product. ■ I am looking for alternatives to FPC. ■ I want to bend FR-4 or aluminum boards for use inside equipment. ■ I want to eliminate copper burrs on side electrodes. ■ I want to eliminate glass cloth or resin debris from the edge of the board. ■ I want to suppress heat generation from components using the board. ■ I want to use boards that are cost-effective and suitable for high-frequency applications. We will work together to address your challenges, supporting your product development with a consistent system from the design stage to prototyping and mass production. No matter how trivial the matter may seem, please feel free to contact us with your ideas or concerns!

  • Printed Circuit Board

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Temperature Dependence of Discoloration in Wafer-Type Ceramic (Sapphire Substrate)

Temperature Dependence of Discoloration in Wafer-Type Ceramic (Sapphire Substrate)

In Ar plasma, the color difference is small, while in O2 plasma, there is a tendency for the color difference to become larger.

We would like to introduce the temperature dependence of discoloration in wafer-type ceramic (sapphire substrate) technical data. When the wafer-type ceramic was heated to 400°C and subjected to plasma treatment, a tendency for the color difference to decrease was observed with Ar plasma, while an increase in color difference was observed with O2 plasma. Although there is a temperature dependence on discoloration, it was confirmed that it can still be used as an indicator even at 400°C. 【Overview of Ar/O2 Plasma Treatment】 ■ Method: CCP (RF) ■ Initial Vacuum Level: 5.0×10^-4 Pa ■ RF Power: 50 W ■ Gas Flow Rate: 40 sccm ■ Treatment Gas Pressure: 10 Pa ■ Treatment Time: 10 minutes *For more details, please refer to the related links or feel free to contact us. *The first image shows Ar plasma treatment, and the second image shows O2 plasma treatment.

  • Other inspection equipment and devices

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Original DPGA (for high brightness and high heat dissipation LEDs)

Original DPGA (for high brightness and high heat dissipation LEDs)

Introducing a high thermal conductivity substrate that connects the LED heat dissipation pad and copper base through a copper bump.

The "Original DPGA (for high-brightness, high-heat-dissipation LEDs)" is a high-heat-dissipation substrate that connects the LED's heat dissipation pad to a copper base via copper bumps. Thanks to the high thermal conductivity of copper, it is possible to efficiently release the heat from high-brightness LEDs. The significant difference between aluminum substrates, CEM3 substrates, and DPGA substrates is that they connect directly to the LED heat dissipation pad, allowing for efficient heat dissipation. 【Features】 ■ Efficiently releases heat from high-brightness LEDs ■ High thermal conductivity of copper ■ Enables efficient heat dissipation *For more details, please refer to the PDF materials or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board

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Custom-made item: "Assembled product, ceramics"

Custom-made item: "Assembled product, ceramics"

The cold cathode tube components and assemblies are combinations of multiple products.

The assembled products consist of cold cathode tube components and assemblies that combine multiple products. (Excluding double pins and pins with shafts) Ceramic products can be made in small lots. The materials used are alumina, zirconia, steatite, and forsterite. 【Usage Examples】 ○ Temperature sensor components → Used in temperature sensor components for preventing overheating in gas ranges → Composed of multiple parts ○ Ceramics → Used for earring pins → Ceramics are used to prevent metal allergies For more details, please contact us or download the catalog.

  • Other machine elements

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Flexible Printed Circuit Board "Low-Rebound FPC"

Flexible Printed Circuit Board "Low-Rebound FPC"

Customize softness! We offer a variety that meets low rebound needs!

We have revamped the lineup of Maruwa Manufacturing's thin FPC representative brand "MK Series" to offer variations that meet the demand for low rebound. Here are solutions for making devices thinner and more compact. 【Applications】 ○ Suppressing springback in thin LCD modules, etc. ○ Sliding applications in compact areas such as small camera modules, etc. For more details, please contact us or download the catalog.

  • Printed Circuit Board
  • Circuit board design and manufacturing

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Thin FPC "Low Resilience FPC"

Thin FPC "Low Resilience FPC"

Custom softness! We offer variations to meet low-rebound needs.

"Low-Rebound FPC" is a solution that addresses the challenges of making devices thinner and smaller. We have refreshed the lineup of our flagship thin FPC brand, the "MK Series," to offer variations that meet low-rebound needs. 【Features】 ■ In-house developed products ■ Customizable softness ■ Thinner and smaller devices ■ High flexibility and low recovery rate *For more details, please refer to the PDF document or feel free to contact us.

  • Other machine elements
  • Other electronic parts
  • others

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