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substrate Product List and Ranking from 548 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  4. 4 沖電気工業 産業営業本部　産業営業統括室 Tokyo//Information and Communications
  5. 5 null/null
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substrate Product ranking

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社　和歌山
  2. Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  3. All LCP Flexible Printed Circuit Board (FPC) 山下マテリアル
  4. 4 Electronic Component Reel Management System "Smart Reel Rack" JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrate Product List

1276～1290 item / All 1843 items

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Porous ceramic substrate

Porous ceramic substrate

Promotion of binder removal and improvement of sintering efficiency through multi-layer stacking in the sintering process of ferrite and metal powder injection molding (MIM) products.

Porous ceramics are ceramics that have countless pores (porosity) inside. The presence of porosity reduces thermal conductivity and makes the material lightweight. Due to their extremely high permeability, they are used as setters in the firing process, resulting in excellent firing quality. Our porous ceramic substrates have a proven track record in processes such as "binder removal promotion" and "improvement of firing efficiency through multi-layer stacking" in the firing of ceramic products like ferrite substrates and metal injection molding (MIM) products.

  • Printed Circuit Board
  • Fine Ceramics

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Proposal to increase the number of shelf levels for firing setter ceramic substrates and firing jigs.

Proposal to increase the number of shelf levels for firing setter ceramic substrates and firing jigs.

Setter ceramic substrates optimized for the firing process, diverse ceramic technologies, and technology development that meets customer applications.

■Background We have developed a ceramic substrate optimized for "firing setters" by leveraging the characteristics of porous ceramics and utilizing our in-house integrated processes, such as printing on fired ceramic substrates, to meet the increasingly diverse needs of customers utilizing firing processes. Recommended for those who want to "fire more at once!" ■Usage Improving production efficiency in "batch vacuum furnaces" used in firing processes is a significant challenge. We often hear requests to "fit as many works as possible into a single firing process." By utilizing the "manufacturing technology for thin ceramic substrates" that we have cultivated, it is possible to increase the number of setter layers. This allows for an increase in the number of works that can be fired in a single process. In cases where there are space constraints in a firing furnace as illustrated, replacing conventional ceramic plates (7mm thick) with "our ceramic substrates for firing setters (1mm thick)" enables an increase in the number of shelf layers from 16 to 18, resulting in a 12% improvement in firing loading efficiency. Additionally, even with the same number of works, "thicker works" can be fired, allowing for a wider range of applications for the firing furnace.

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  • Ceramics

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Formation of fine electronic circuits on ceramic thin plates 500mm x 500mm (MAX)

Formation of fine electronic circuits on ceramic thin plates 500mm x 500mm (MAX)

From business card size to A4 size, forming thick film circuits in desired sizes and materials. From forming electronic circuits with ceramic materials to applications for firing setters.

Notice from Kyoritsu Elex - - - - - - - - - - - - - - - - - - - - - - - - - JPCA Show 2025 (Printed Circuit Board Technology Exhibition) Location: (Tokyo Big Sight) June 4 (Wednesday) to June 6 (Friday), 2025, for 3 days - - - - - - - - - - - - - - - - - - - - - - - - - We look forward to seeing you. Our company offers circuit formation for electronic component applications using the technology of printed circuit formation on ceramics substrates manufactured in-house, all through a consistent in-house process. By utilizing screen printing methods, we can provide custom solutions with shorter lead times compared to etching methods. Additionally, since the printed materials undergo high-temperature baking (850°C), they achieve stable performance and high reliability. The printed materials are not limited to wiring materials (metal paste) but also include insulating glass materials and ceramics, which can also be printed. Furthermore, we have achieved not only circuit formation but also "through-hole via formation" and "multilayer circuit structures." We are advancing technology development to meet various application possibilities, so we look forward to your inquiries.

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  • Other electronic parts

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Sanwa Electronics Circuit Co., Ltd. Business Introduction

Sanwa Electronics Circuit Co., Ltd. Business Introduction

We will take on and respond to all kinds of special substrates.

Sanwa Electronic Circuit Co., Ltd. was established in 1955 as Sanwa Electric Manufacturing Co., Ltd. and has consistently engaged in the production of printed circuit boards for over half a century. Currently, with the dramatic evolution of electronic devices, printed circuit boards are required to fulfill new roles beyond their traditional electrical functions, including thermodynamic, optical, and structural roles, necessitating different perspectives and ideas in manufacturing. To swiftly respond to these customer needs, we integrated our group companies involved in printed circuit boards in 2004, marking a new beginning as Sanwa Electronic Circuit Co., Ltd. Through this integration, we have consolidated the development, production, and sales capabilities cultivated over many years by our group companies, establishing a system that can comprehensively meet QCD (Quality, Cost, Delivery) requirements while maintaining and developing a production system that leverages the unique characteristics of each factory. This has allowed us to build a flexible production system capable of accommodating a wide range of product specifications and lot sizes, from small to large. Moving forward, we will focus on strengthening our proposal-based sales capabilities and enhancing the development, production technology, and production management necessary to realize this. For more details, please contact us or download our catalog.

  • Printed Circuit Board

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Device substrate (LED substrate, sensor substrate)

Device substrate (LED substrate, sensor substrate)

We can accommodate a substrate thickness of 0.04mm! We respond widely to our customers' needs.

The "device substrate" becomes a single electronic component by mounting elements through bonding and other methods. As the miniaturization of electronic components has progressed in recent years, device substrates are also required to be smaller and thinner. Our company can accommodate substrate thicknesses starting from 0.04mm, and we respond widely to our customers' needs. 【Our Specifications】 ■ Thickness: 0.04mm to 5.0mm ■ Hole diameter: φ0.1 and above ■ Materials: BT resin, FR-4 (including HF), G-10, high heat-resistant substrates *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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Printed circuit board "double-sided board"

Printed circuit board "double-sided board"

The substrate mainly uses FR-4 and CEM-3 materials! We provide circuit boards tailored to your needs.

A "double-sided board" is a printed circuit board that forms circuits on both sides of the substrate and connects the circuits on both sides through plated through holes. Our company offers various substrates tailored to applications, including high-density boards for miniaturization and increased component placement flexibility, thin boards, COH boards, edge-plated through-hole boards, and thick copper boards for high current applications. We can also accommodate requests for short delivery times, and we mainly use FR-4 and CEM-3 materials as the substrate. 【Features】 ■ Mainly uses FR-4 and CEM-3 materials as the substrate ■ Can accommodate requests for substrates with high heat resistance and other specifications ■ Can respond to requests for short delivery times *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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Printed circuit board "Single-sided board"

Printed circuit board "Single-sided board"

We accommodate requests for short delivery times! We provide circuit boards tailored to various applications.

A "single-sided board" is a printed circuit board that has circuits formed only on one side of the substrate. Our company offers various types of boards tailored to different applications, including high-density single-sided boards for miniaturization and increased component mounting density, as well as power boards that can handle high currents. We can also accommodate single-sided boards that excel in soldering using special molds. Additionally, we respond to requests for small lot sizes, router-processed products, and short delivery times. 【Features】 ■ The base materials primarily used are FR-4, CEM-3, and FR-1. ■ We can also accommodate single-sided boards that excel in soldering using special molds. ■ We respond to requests for small lot sizes, router-processed products, and short delivery times. *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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Build-up substrate

Build-up substrate

Mounting of narrow-pitch electronic components due to the build-up structure! Compatible with chip-on-hole.

We would like to introduce our "Build-Up Boards." We can accommodate layer counts from 4 to 16 layers, and the VIA structure can support various inter-layer connections through laser and drill processing. Additionally, we can handle narrow pitch BGA/CSP mounting, impedance control, and various substrate materials tailored to different applications. 【Features】 ■ Layer count: Supports from 4 to 16 layers ■ VIA structure: Supports various inter-layer connections through laser and drill processing ■ Compatible with narrow pitch BGA/CSP mounting ■ Supports impedance control ■ Various substrate materials available for different applications ■ Chip-on-hole compatible *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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IVH substrate

IVH substrate

By using various VIA structures, we provide substrates tailored to your needs!

We would like to introduce the "IVH substrate" that we handle. It supports layer counts from 4 layers to 20 layers, and the VIA structure can accommodate various interlayer connections. It also supports ultra-small diameter VIAs. Additionally, it is compatible with impedance control and chip-on-hole, and we can provide various substrate materials tailored to different applications. 【Features】 ■ Layer count: Supports from 4 layers to 20 layers ■ VIA structure: Supports various interlayer connections ■ Supports ultra-small diameter VIAs ■ Supports impedance control ■ Various substrate materials available for different applications ■ Supports chip-on-hole *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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End face through-hole substrate

End face through-hole substrate

Contributing to the miniaturization of device substrates and module substrates, as well as the improvement of implementation density on motherboards!

We would like to introduce our "Edge Through-Hole Boards" that we handle. They enable high-density mounting, significantly contributing to the miniaturization of device boards and module boards, as well as improving the mounting density of motherboards. Additionally, we have established mass production technology for narrow-pitch edge through-holes. Please feel free to contact us when you need assistance. 【Features】 ■ Enables high-density mounting ■ Allows for the miniaturization of device boards and module boards ■ Significantly contributes to improving the mounting density of motherboards *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Aluminum base substrate

Aluminum base substrate

We offer substrates tailored for various applications that require heat dissipation! Aluminum thickness can be accommodated up to 2.00mm.

The "aluminum base substrate" we handle is a high heat dissipation substrate that utilizes the heat dissipation properties of aluminum. We provide substrates tailored for various applications that require heat dissipation, with aluminum thickness options of 1.00mm, 1.50mm, 2.00mm, and a special specification of 0.30mm. For other specifications such as insulation layer thickness, thermal conductivity, and copper foil thickness, please feel free to consult us. 【Features】 ■ High heat dissipation substrate that utilizes the heat dissipation properties of aluminum ■ Substrates provided for various applications requiring heat dissipation *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board

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Multilayer substrate

Multilayer substrate

From 4 layers to 36 layers! We provide high-precision multilayer PCBs tailored to the needs of high multilayer/high density.

We would like to introduce the "multilayer boards" that we handle. We can accommodate layer counts from 4 layers to 36 layers, with board thicknesses ranging from thin boards to a maximum of 8mm. We also support micro-diameter vias and impedance control. Additionally, we offer various substrate materials tailored to different applications, and we can accommodate chip-on-hole designs as well. 【Features】 ■ Layer count: Supports from 4 layers to 36 layers ■ Board thickness: Supports from thin boards to a maximum of 8mm ■ Supports micro-diameter vias ■ Supports impedance control ■ Various substrate materials available for different applications ■ Supports chip-on-hole designs *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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High Thermal Conductivity Substrate "Bending Aluminum Base Substrate"

High Thermal Conductivity Substrate "Bending Aluminum Base Substrate"

The intended use is for automotive decorative accessories, etc.! A thin aluminum base substrate with a thickness of 0.40mm.

We would like to introduce our high thermal conductivity substrate, the "Bendable Aluminum Base Substrate." One of its features is that it has flexibility similar to that of a flexible circuit while being able to maintain a bent shape, which is a significant advantage. It also possesses heat dissipation properties as an aluminum base substrate. Please feel free to consult us when you need assistance. 【Features】 ■ Thickness: 0.40mm ■ Flexibility similar to that of a flexible circuit ■ Ability to maintain a bent shape ■ Also possesses heat dissipation properties *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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High-speed signal and high-density substrate "IVH substrate"

High-speed signal and high-density substrate "IVH substrate"

Supports IVH substrates from 4 layers to 20 layers! Component mounting on the surface of the IVH section is also possible.

We would like to introduce our high-speed signal and high-density substrate, the "IVH substrate," which we handle. By using the IVH structure, we can achieve high density tailored to our customers' needs. Additionally, we can accommodate low dielectric materials for high-frequency applications. Please feel free to consult us when you need assistance. 【Features】 ■ Supports IVH substrates from 4 layers to 20 layers ■ High density tailored to customer needs ■ Component mounting on the surface of the IVH part is possible, compatible with chip-on-hole ■ Impedance control is possible ■ Can also accommodate low dielectric materials for high-frequency applications *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Bonding substrate

Bonding substrate

Miniaturization of devices, heat dissipation applications, and printed circuit boards tailored to individual product implementations!

Our company is capable of providing custom-designed printed circuit boards (PCBs) that meet your specific requirements, thanks to our special three-layer substrates and the bonding structures of materials and copper foils. Applications include device substrates and substrates with bonded structures of metals (such as copper foil and aluminum) or other materials. Printed circuit boards for devices require structures that accommodate miniaturization, heat dissipation, and individual product implementations. 【Applications】 ■ Device substrates ■ Substrates with bonded structures of metals (such as copper foil and aluminum) or other materials *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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