Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.
1261～1275 item / All 1843 items
We deliver high-quality and affordable crystals and materials from MTI Corporation in the United States.
We offer high-quality and affordable crystals and materials from MTI Corporation, a top-class company in the industry. You can purchase from as little as one piece. MTI's stock items can be delivered in as little as 1 to 2 weeks. For more details, please visit our website.
One-stop support for multiple projects! Stable supply to domestic and overseas locations at low prices is possible.
At Yumex, we handle everything from development to mass production using both our Japan and Philippines locations. Development is conducted in Japan, while procurement, prototyping, and mass production can be flexibly and quickly managed in the Philippines. If you have concerns such as "Managing multiple projects is cumbersome, so I want to entrust everything to one company" or "I'm relying on outsourcing in China and domestically, but I'm worried about the future," please feel free to contact us first. 【Features】 ■ We guarantee high quality based on years of manufacturing experience. ■ We have a wide range of applicators and can deliver in a short time frame due to domestic production. ■ We can quickly respond to small lot orders starting from just one piece. ■ We own overseas factories, allowing for stable supply to domestic and overseas locations at low prices. *For more details, please feel free to contact us.
![[Processing Material Example] Alumina Substrate ver](https://image.mono.ipros.com/public/product/image/15f/2000719377/IPROS17612683730815401846.png?w=280&h=280)
Excellent surface condition with smoothness and flatness! Widely used as IC substrates and semiconductor package elements.
"Alumina substrate" is a substrate made from alumina-based ceramics, which excels in mechanical strength, electrical insulation, corrosion resistance, heat resistance, and thermal conductivity. Its physical and chemical properties remain stable even in high-temperature environments. There is minimal variation in dimensions such as outer shape, thickness, slit pitch, and slit depth, resulting in low warping, bending, and waviness. It can be used for chip resistor substrates, HIC substrates, thin-film circuit substrates, and more. 【Features】 ■ A surface condition with few pores due to fine particles, excellent smoothness and flatness ■ Excellent adhesion to thick-film and thin-film materials ■ Stable physical and chemical properties even in high-temperature environments ■ A thermal expansion coefficient close to silicon, with high thermal conductivity ■ High-strength substrates with increased strength are also available *For more details, please refer to the PDF document or feel free to contact us.
Significant improvement in work efficiency! A porous chuck that allows for easy and reliable vacuum suction fixation.
The "RB31" is a porous chuck that securely holds the workpiece using a vacuum suction method created by negative pressure through a porous material. Not only can it easily and reliably fix extremely small, thin, and long workpieces, but it also accommodates non-magnetic materials, making it highly effective for grinding various materials. Customization of size and shape according to the workpiece is possible, as well as connecting multiple units. The ease of attaching and detaching the workpiece, as well as adjustments, significantly improves work efficiency. 【Features】 ■ Customizable ■ Easy to clear clogging ■ Grinding of the suction surface itself is possible ■ Compatible with various workpieces ■ No deformation due to processing heat For more details, please refer to the catalog or feel free to contact us.
We are a concierge for electronics.
Fightronics Co., Ltd. has been engaged in the planning, development, and manufacturing of electronics equipment, primarily in the industrial machinery sector, since its establishment in 1991. Our company offers "contract manufacturing services" that provide assembly technology for mechanical and electronic devices, as well as "contract development services" and "in-house product development services." We sincerely address all customer concerns and requests, providing a one-stop solution to problems. 【Business Activities】 ■ Printed Circuit Boards ■ Electronic Circuit Design Contracting ■ Computer Software Development ■ Equipment Control Software Development ■ Design and Manufacturing of Various Microprocessor-Based Devices, etc. *For more details, please refer to our catalog or feel free to contact us.
For the design, development, and manufacturing of printed circuit boards and electronic circuit boards, choose Japan Micron Co., Ltd.
As the core of electronics, ICs continue to grow in high-density multifunctionality. Japan Micron Corporation, as a technology development-oriented company, is always striving for technological innovation, establishing original technology development and high-density, high-precision processing techniques. We have provided reliable printed circuit boards and IC package substrates, as well as various micro-package substrates. Under the philosophy that "Electronics brings dreams and a bright future to all people, realizing a rich environment and a peaceful society," we will continue to challenge cutting-edge technologies to further enhance the development of new products and processing techniques. For more details, please contact us or download the catalog.
Chip size packages for various components used in mobile phones and other small devices.
The "CSP/module PWB" is a chip size package that further miniaturizes standard BGA. Using our unique technology, we manufacture packages with a three-dimensional cavity structure. By adopting electroless gold plating, it eliminates the need for plated leads, allowing for high-density wiring. The sheet structure can accommodate various forms of assembly substrates, including dicing cut method, hanging method, and push-back method. 【Features】 ■ Selection of materials with high rigidity, low dielectric constant, high heat resistance, and halogen-free options ■ High-density wiring capability ■ Sheet structure allows for various forms of assembly substrates *For more details, please refer to the catalog or feel free to contact us.
Directly mounting bear chips on the substrate! A high-density substrate that achieves miniaturization and thinness of devices.
"COB-compatible PWB" is a high-density substrate that directly mounts bare chips onto the board, achieving miniaturization and thinness of devices. It supports both electrolytic gold plating and electroless gold plating, providing stable bonding properties. By combining this with our unique cavity formation technology, it becomes possible to mount chips within the cavity, further reducing the thickness and size of the product. Additionally, for the sealing process after chip mounting, it is also possible to form a high sealing dam on the substrate that cannot be achieved with conventional printing inks. 【Features】 ■ Chips mounted within the cavity ■ Achieves miniaturization and thinness of devices ■ Supports electrolytic gold plating and electroless gold plating ■ Stable bonding properties ■ Unique mold design reduces dust generation from the edges after exterior pressing *For more details, please refer to the catalog or feel free to contact us.
Significantly improved circuit density! A substrate that enables more three-dimensional and high-density configurations.
"Build-Up PWB" mounts components on the connection via pads. Due to fewer restrictions on through holes, it significantly increases circuit density. By combining our unique machining technology, we have achieved a more three-dimensional and high-density configuration. Filled vias with copper plating are also available (subject to separate consultation). 【Features】 ■ Components mounted on connection via pads ■ Fewer restrictions on through holes ■ Significantly increases circuit density ■ Three-dimensional and high-density configuration *For more details, please refer to the catalog or feel free to contact us.
Manufacturing high-brightness, high-heat-dissipation PWB for LEDs by combining high-precision processing technology with substrates and plating!
Our company manufactures high-brightness, high-heat-dissipation "PWB for LEDs" by combining high-precision processing technology with substrates, resist, plating, and more. We are capable of high-precision slit processing using routers, as well as slit processing with special presses and reflector-shaped hole processing. Additionally, by tenting one side of the through-hole with solder resist or copper foil, we prevent mold resin from flowing onto the backside during bulk molding after assembly. We create substrates with high heat dissipation structures by attaching thick copper foil or copper plates, or by processing copper plates using our high-precision machining technology. 【Features】 - Compatible with 0.1mm thick substrates and thin materials of 50 microns thickness - Gold plating, silver plating, and dual-color gold-silver plating available - Prevents mold resin overflow - Processes copper plates with high-precision cavity formation technology - High heat dissipation structure *For more details, please refer to our catalog or feel free to contact us.
High-density and high-reliability multilayer boards can be manufactured!
"Double-sided and multilayer PWB" is a double-sided and multilayer substrate required in various fields. By adopting our unique technology, we can manufacture high-density and highly reliable substrates. By filling through-holes with resin and applying a cover plating on top, it is possible to form pads on the through-holes as well. It is also possible to create semi-cut through-holes in the product outline, enabling miniaturization of the product. Additionally, our unique pin insertion technology allows for the insertion and fixation of lead pins into the substrate. 【Features】 ■ High density and high reliability ■ Pads can be formed on through-holes ■ Enables miniaturization of products ■ Selection of materials with high rigidity, low dielectric, high heat resistance, and halogen-free options ■ Allows for the insertion and fixation of lead pins into the substrate *For more details, please refer to the catalog or feel free to contact us.
A flat push-back board that achieves a flat finish for improved efficiency during assembly.
The "Flat Pushback Technology" provides a superior substrate during component mounting by suppressing the curvature of the sheet through advanced mold technology and our unique flat pushback sheet shape. It ensures the necessary holding force during component mounting while also being easy to separate after installation. Additionally, defective products within the sheet can be removed and replaced with good ones. 【Features】 ■ Flat shape that suppresses curvature ■ Advantageous during component mounting ■ Processing of half-cut through holes in the pushback area is also possible *For more details, please refer to the catalog or feel free to contact us.
A technology capable of forming high dams of approximately 0.1 to 0.6 mm through a unique special printing method.
Nippon Micron Co., Ltd. offers products with heat dissipation properties by applying heat spreaders using its unique metal sheet bonding technology. By bonding rigid substrates with sealing frames and rigid substrates with copper foil, it is possible to create package structures that are difficult to achieve with conventional multilayer designs. It is easy to form dams of varying heights and dimensions within the same product, and high dams of approximately 0.1 to 0.6 mm, which cannot be formed with conventional printing inks, can be created using our unique special printing method. Additionally, it eliminates gaps on the bonding surfaces that are likely to occur with adhesive-type sealing frames, allowing for batch processing unlike dispensers. 【Features】 ■ Gaps on bonding surfaces can be eliminated ■ Batch processing is possible ■ High dams can be formed using a special printing method ■ It is easy to form dams of varying heights and dimensions within the same product *For more details, please refer to the catalog or feel free to contact us.
In recent years, with the miniaturization, lightweight design, and high performance of electronic devices, the importance of heat dissipation measures due to high-density mounting of electronic components has been increasing.
In particular, with high-brightness LEDs, it has become difficult to implement heat resistance measures with resin package specifications, making alumina ceramics materials indispensable for heat dissipation and heat resistance. Additionally, due to the recent increase in demand for ultraviolet LEDs, interest in ceramic packages has been rising. Our company offers ceramic package substrates with excellent heat resistance characteristics based on our unique technology. Our unique technology for "improving heat dissipation performance" has become increasingly important alongside the high brightness (high output) of LED elements, leading to a significant rise in the demand for heat resistance in packaging materials and heat dissipation characteristics. We have received many inquiries regarding "improving heat dissipation using a general-purpose alumina ceramics substrate compared to a heat-dissipating aluminum nitride substrate." By applying our unique printed circuit technology, we process through-holes in the alumina ceramics substrate and fill the through-hole sections with "special silver-based materials," achieving a higher heat dissipation effect than typical alumina ceramics substrates.
We can provide high-reflectivity ceramic substrates made from alumina ceramics as the base material.
Ceramic substrate with high reflectivity characteristics We can provide high reflectivity ceramic substrates made from alumina ceramics as the base material. Since no special additives or coatings are used in the manufacturing process, there is no concern about contamination in subsequent processes. It is possible to accommodate mass production equivalent to existing products, as equipment for conventional alumina substrates can be shared. Additionally, because it is composed of existing raw material groups, it does not contain any substances regulated by environmental regulations.
