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substrate Product List and Ranking from 548 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  4. 4 沖電気工業 産業営業本部　産業営業統括室 Tokyo//Information and Communications
  5. 5 null/null
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substrate Product ranking

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社　和歌山
  2. Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  3. All LCP Flexible Printed Circuit Board (FPC) 山下マテリアル
  4. 4 Electronic Component Reel Management System "Smart Reel Rack" JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrate Product List

1246～1260 item / All 1843 items

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SAMBA head printing control board USB 3.0 communication specification version

SAMBA head printing control board USB 3.0 communication specification version

Printing control board for FujiFilm Dimatix's SAMBA head G3L. Ultra-fast USB 3.0 communication specification version.

Printing control board for FujiFilm-Dimatix SAMBA Head G3L. Ultra-fast USB 3.0 communication specification version. High-speed label printing with the ability to update print data for each print (approximately 8 sheets/second). Print speed of 1m/second with the ability to update different print data for each print. - Equipped with the industry's fastest USB 3.0 communication function. * Maximum 200MB/second print data transfer when connecting one board to USB. * Print memory: 1GB equipped. Next print data can be transferred during printing. - Maximum ejection cycle: 120kHz. Can be synchronized with the transport system encoder. * Head temperature control (external) is possible. - 1200 dpi / water-based, UV, solvent, latex. - VersaDrop capability (multi-drop function). - Head drive waveform generation software is available. - Configurable as a CMYK color printer using multiple heads. - Bitmap data can be used for printing. - Printing control software that makes system construction easy is also provided. * User application DLLs can be supplied. - Ink circulation pump available for SAMBA head.

  • Other process controls

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Ricoh GEN6 head drive control USB 3.0 communication (up to 200MB)

Ricoh GEN6 head drive control USB 3.0 communication (up to 200MB)

Printing control board for Ricoh GEN6 head. Control data communication USB 3.0 (up to 200 MB). Capable of handling different print data at 10 sheets per second.

Printing control board for Ricoh GEN6 head and CMYK color printing control software. Control data communication via USB 3.0 (up to 200 MB). Capable of receiving the next printing data during printing. Can handle different printing data at 10 sheets per second for each print. Even if the "address, product name, name," etc. differ for each print, a printing speed of 60 m/min is possible. Basic Information: 1. The head control and drive AMP for GEN6 consist of two boards. * The connection between the head control board and the drive AMP board can be extended. * Head temperature and board temperature can be measured. 2. Full specification control and drive of GEN6 is possible. 3. Printing data and control use USB 3.0 (up to 200 MB). * As of 2020, this is the fastest in the industry. * Capable of receiving the next printing data during printing. * Can handle different printing data at 10 sheets per second for each print. ⇒ Different printing data is possible even at a printing speed of 60 m/min. * Data communication speed varies depending on the number of computers or boards. 4. Maximum ejection cycle of 50 kHz. Can be synchronized with the transport system encoder. 5. Printing data can use BITMAP data. 6. There is software for generating head drive waveforms.

  • Other FA equipment

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Low Noise Amplifier

Low Noise Amplifier

With abundant knowledge and experience, along with the technical capabilities of a connector manufacturer, we will meet our customers' demands!

At Stack Electronics, we manufacture all customer-specific "Low Noise Amplifiers" (LNA). The electrical performance is based on extensive knowledge and experience, while the shape and structure maximize the technical capabilities of connector manufacturers. We provide products that match our customers' requirements. 【Features】 ■ Electrical performance and connectors can be customized (TNC/N/SMA) ■ Compatible from VHS to SHF ■ Structure can include dust and water resistance measures ■ Power supply can be applied to the power terminal or superimposed on the input/output signal lines *For more details, please refer to the PDF materials or feel free to contact us.

  • Other network tools
  • Other image-related equipment

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Composite Material MMC for Solar Cell Manufacturing Equipment

Composite Material MMC for Solar Cell Manufacturing Equipment

High thermal conductivity surpassing ceramics! Achieving low thermal expansion comparable to silicon!

By combining SiC ceramics with metallic silicon, we have achieved high thermal conductivity that surpasses ceramics and low thermal expansion comparable to silicon. Thermal conductivity that exceeds SiC and AlN! By changing the composite ratio, various properties can be realized. Surface treatment (plating) is possible, and it can also be used for electrostatic chucks. It can be made larger than ceramics. We also offer a combination of SiC and aluminum. For more details, please refer to the PDF catalog.

  • Ceramics
  • Fine Ceramics
  • Other metal materials

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High-quality alumina substrate

High-quality alumina substrate

Birth of a substrate utilizing new materials.

■Low surface roughness ■High bending strength ■Low dielectric loss ■Dense

  • Printed Circuit Board

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Thin-film integrated circuit components

Thin-film integrated circuit components

Consistent production from low-loss ceramic substrates in the microwave band to thin film pattern formation. Providing high-quality products at low prices and short delivery times, from prototyping to mass production.

We provide thin film integrated circuit components with circuit formation on substrates that have undergone various through-hole processing and slitting. 【Features】 ○ Formation of side patterns (0.38t or more) and AuSn solder patterns ○ Simultaneous mounting of conductors, thin film resistors, and thin film inductors ○ Low loss and low noise circuit formation in high-frequency bands made possible by the combination of our unique 99.9% alumina substrate and fine patterns ○ Substrate materials: Aluminum nitride substrates (AlN substrates), quartz substrates, etc. ○ Total technology development, quality assurance, and problem-solving made possible by being a substrate manufacturer ○ We provide quality according to product functions and specifications, and we respond quickly to short delivery times and design changes. For other functions and details, please contact us.

  • Other electronic parts

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[Useful Information] Alumina Alternative Composite Material SA701

[Useful Information] Alumina Alternative Composite Material SA701

To customers struggling with large alumina parts - that problem can be solved with ceramic composite materials.

With the expansion of the semiconductor manufacturing equipment market, procurement issues related to ceramics have arisen. In particular, large alumina components have limited suppliers, and extended lead times are impacting equipment development schedules. The ceramic-metal composite material SA701 has slightly lower Young's modulus and bending strength compared to alumina, but it has high fracture toughness and is less prone to cracking, making it easy to handle. Its density is about 3/4 that of alumina, and it can be machined for direct threading, eliminating the need for metal bushings and enabling weight reduction. We encourage you to consider the adoption of metal-ceramic composite materials, which excel in producing larger components compared to alumina. *For more details, please refer to the materials available for download via the PDF button. We also welcome any questions or inquiries through the contact button.*

  • Other metal materials
  • Ceramics
  • Fine Ceramics

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[Design Examples and Technical Introduction] High-Frequency Solutions

[Design Examples and Technical Introduction] High-Frequency Solutions

Providing circuit boards with high simulation reproducibility by combining low dielectric loss alumina substrate manufacturing technology, high-precision patterning technology, and design and evaluation techniques.

In the millimeter wave and terahertz wave regions used in Beyond 5G (6G), low-loss substrate characteristics and fine patterning technology are required. In addition to the manufacturing technology of low dielectric loss ceramic substrates that we have cultivated over many years, high-precision patterning technology, and design technology that meets customer requests, we have also become capable of simulation and measurement at high frequencies. As a result, we can provide high-frequency circuit substrates with high reproducibility in simulations. Please feel free to consult us with any requests or questions, such as "I want this kind of passive component." We will solve problems with our technological development capabilities and comprehensive strength that only a substrate manufacturer can provide.

  • High frequency/microwave parts

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Printed circuit board (design and implementation)

Printed circuit board (design and implementation)

Fully utilize the technology cultivated over many years as the foundation for manufacturing technology.

The production of printed circuit boards utilizes high-density mounting technology that has been cultivated over many years in the manufacturing of measurement instruments and industrial machinery substrates.

  • Contract manufacturing

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Motor Driver Board 'V1.0'

Motor Driver Board 'V1.0'

A circuit board for motor drive control! Size 30×56×27(mm)

The "V1.0" is a circuit board that performs motor drive control by receiving PWM signals from external sources such as microcontrollers. The power supply voltage is 3 to 27V. The continuous output current is 3A, and the instantaneous maximum current is 4.5A for 100ms. The board size is 30×56×27(mm). 【Specifications】 ■ Power supply voltage (VIN): 3 to 27V ■ Mounted FET: TA8429HQ (Toshiba bipolar linear integrated circuit) 1 unit ■ PWM signal voltage: 0 to VCC ■ Continuous output current: 3A ■ Instantaneous maximum current: 4.5A for 100ms ■ Board size: 30×56×27(mm) ■ Mounting hole size: Compatible with M3 screws, hole pitch 24×50(mm) *For more details, please refer to the PDF document or feel free to contact us.

  • Other machine elements

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Motor Driver Board 'V2.0'

Motor Driver Board 'V2.0'

A circuit board for motor drive control! 2-channel drive model.

The "V2.0" is a motor driver board for a 2-channel drive model. It can perform motor drive control by receiving PWM signals from external sources such as microcontrollers. The power supply voltage is 3 to 27V. The continuous output current is 3A, and the instantaneous maximum current is 4.5A for 100ms. The board size is 40×56×27(mm). 【Specifications】 ■ Power supply voltage (VIN): 3 to 27V ■ Mounted FET: 2 TA8429HQ (Toshiba bipolar linear integrated circuit) ■ PWM signal voltage: 0 to VCC ■ Continuous output current: 3A ■ Instantaneous maximum current: 4.5A for 100ms ■ Board size: 40×56×27(mm) ■ Mounting hole size: M3 screw compatible, hole pitch 34×50(mm) *For more details, please refer to the PDF document or feel free to contact us.

  • Other machine elements

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Motor Driver Board 'V1.0X'

Motor Driver Board 'V1.0X'

Motor drive control can be performed by receiving PWM signals from external sources such as microcontrollers.

The "V1.0X" is a circuit board that performs motor drive control by receiving PWM signals from external sources such as microcontrollers. The power supply voltage is 10-45V. The output current is 3A at peak and approximately 1.5A on average. The board size is 41×60×21(mm). 【Specifications】 ■ Power Supply Voltage (VIN): 10-45V ■ Mounted FET: TB6568KQ (Toshiba Bi-CMOS Integrated Circuit) ■ PWM Signal Voltage: 0-5V ■ Output Current (peak): 3A ■ Output Current (average): ~1.5A ■ Board Size: 41×60×21(mm) ■ Mounting Hole Size: M3 screw compatible, hole pitch 34×50(mm) *For more details, please refer to the PDF document or feel free to contact us.

  • Other machine elements

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Shield board "I2C_4SENSOR board"

Shield board "I2C_4SENSOR board"

You can save I/O pins! Up to 4 VL53L0X laser distance sensors can be connected.

The "I2C_4SENSOR board" is a shield board that connects to the Arduino Uno (R3) to read values from the VL53L0X laser distance sensor. Since the VL53L0X laser distance sensor communicates via I2C, it allows for saving I/O pins. Up to four VL53L0X laser distance sensors can be connected. 【Features】 ■ Connects to Arduino Uno to read values from the VL53L0X laser distance sensor ■ Saves I/O pins ■ Up to four VL53L0X laser distance sensors can be connected *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts

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Supercapacitor DMT/DMF family

Supercapacitor DMT/DMF family

Murata Supercapacitors Now From CAP-XX !!

The lineup of CAP-XX, which holds unique patented technology for electric double-layer capacitors, has been expanded to include the DMT/DMF family transferred from Murata. The specifications are as follows: for the 4.2V/-40-85℃ products, there are 220mF/300mohm and 470mF/130mohm; for the 5.5V/-40-70℃ products, there are 470mF/45mohm and 1000mF/40mohm. All products come in a thin laminated package with a thickness ranging from 2.2mm to 3.7mm.

  • Capacitor

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Daishin Machinery Co., Ltd. Business Introduction

Daishin Machinery Co., Ltd. Business Introduction

Leave the assembly from precision machining to Oshin Kiko.

Daishin Kiko Co., Ltd. has been engaged in the overhaul of various machine tools in the machine tool sector since its establishment. Currently, we utilize our technology to meet the more advanced needs of our valued customers, working on automation solutions for machine tools, including auto loaders, conveyor systems, and extraction and stock devices for industrial machinery. As we enter the 21st century, Daishin Kiko, driven by a spirit of further challenge, is committed to maximizing the know-how accumulated to date through research and development, and has created a new rotary powder molding machine to introduce to the world. We are dedicated to enhancing our technical capabilities to ensure customer satisfaction and to meet their needs. For more details, please contact us or download our catalog.

  • Mechanical Design
  • Contract manufacturing
  • Other machine tools

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