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substrate Product List and Ranking from 548 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  4. 4 沖電気工業 産業営業本部　産業営業統括室 Tokyo//Information and Communications
  5. 5 null/null
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substrate Product ranking

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社　和歌山
  2. Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  3. All LCP Flexible Printed Circuit Board (FPC) 山下マテリアル
  4. 4 Electronic Component Reel Management System "Smart Reel Rack" JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrate Product List

1426～1440 item / All 1843 items

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Semiconductor heat dissipation substrate for the purpose of exothermic and endothermic processes - Base plate [Heat sink]

Semiconductor heat dissipation substrate for the purpose of exothermic and endothermic processes - Base plate [Heat sink]

Adoption of precision total extraction mold! High accuracy in outer shape and hole pitch, improved finish on the burr surface and shear surface!

We handle "base plates" and "heat sinks." Thanks to our precision progressive dies, the accuracy of the outer shape and hole pitch has significantly improved, resulting in enhanced finish quality on both the edge and shear surfaces. With the adoption of progressive dies for coil materials, continuous processing is possible for thicknesses up to 5mm, contributing to lower costs and shorter delivery times. We also utilize UV printing. Additionally, we can accommodate micron-level flatness and specified warp processing, as well as resist baked printing. 【Features】 ■ High accuracy of outer shape and hole pitch due to precision progressive dies ■ Continuous processing of coil materials up to 5mm thickness with the use of progressive dies ■ Adoption of UV printing ■ Capability for micron-level flatness and specified warp processing ■ Support for resist baked printing *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

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Aluminum foil etching processing and circuit board

Aluminum foil etching processing and circuit board

It is possible to reduce costs compared to copper foil etched circuit boards.

We will form circuits using composite materials such as aluminum foil and PET film through etching processing. Our unique aluminum foil etching method enables the formation of precise circuits for applications such as aluminum heater products, antennas, or sensors using aluminum foil.

  • aluminum
  • Sensors
  • Aluminum heater

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High thermal conductivity substrate "Metal substrate"

High thermal conductivity substrate "Metal substrate"

You can freely choose the layer composition according to your needs! Customization is also possible for various specifications of the substrate!

"Metal substrates" are high thermal conductivity substrates designed to efficiently conduct and dissipate heat generated by LEDs and power semiconductors to enclosures or heat sinks. They utilize the thermal conductivity of the base or core metal. The layer composition can be freely selected depending on the application. It is also possible to customize various specifications of the substrate, such as the thickness and type of base metal, the thermal conductivity of the insulation layer, and the thickness of the pattern copper, according to the purpose. [Features] ■ The layer composition can be freely selected depending on the application - Metal base substrate - Multi-layer metal base substrate - Metal core substrate (Aluminum) - Metal core substrate (Copper) ■ Customization of various specifications of the substrate is possible *For more details, please refer to the PDF document or feel free to contact us.

  • Company：HNS
  • Price：Other
  • others
  • Printed Circuit Board

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Printed circuit board "Silicone-based substrate (Silicone)"

Printed circuit board "Silicone-based substrate (Silicone)"

Utilizing the flexibility of the substrate, it can be implemented without a heat sink even on curved surfaces!

The "Silicone-based substrate" is a flexible printed circuit board that uses high thermal conductivity silicone sheets. Silicone resin is highly flexible and can be expected to prevent solder cracks during heat cycles. Additionally, by utilizing the flexibility of the substrate, it can be implemented without a heat sink on curved surfaces. 【Features】 ■ Flexible printed circuit board ■ Uses high thermal conductivity silicone sheets ■ Prevents solder cracks during heat cycles ■ Can be implemented without a heat sink on curved surfaces *For more details, please refer to the PDF document or feel free to contact us.

  • Company：HNS
  • Price：Other
  • others
  • Printed Circuit Board

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Introduction to Techno Staff Support Services

Introduction to Techno Staff Support Services

Support the development of young and mid-career technicians and skilled workers who will become the driving force behind Japan's manufacturing capabilities!

Techno Staff Co., Ltd. is a support company for human resource development and manufacturing that nurtures successors in mechanical, mold, and electrical technology and skills. We realize the aspirations of young people who want to acquire more advanced technology and skills, apply their improved abilities to their daily work, and contribute to Japan's manufacturing by participating in skill tests and skill Olympics. Our "professional instructors," who possess the technology and skills that supported Japan's rapid economic growth, will assist you in inheriting your "technology and abilities." [Support Services] ■ Processing, Assembly, Adjustment ■ Design, Drafting ■ Management, Operations *For more details, please refer to the PDF materials or feel free to contact us.

  • others

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5C-SSM evaluation kit_box

5C-SSM evaluation kit_box

Evaluation kit equipped with an odor sensor, "CEK box"

Evaluation kit consisting of three components: CMOS-type odor sensor "5C-SSM," interface board, and flow path fixture, all housed in a casing. The accompanying software includes automatic setting functions for sensor drive parameters and pixel selection, allowing for simple data acquisition. The CEK box (official name: 5C-SSM evaluation kit_box) is available for purchase starting from one set.

  • O2 sensor evaluation test device
  • Other Sensors

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Introduction to Liquid Resist Screen Printing (Photo Developing Type Solder Resist)

Introduction to Liquid Resist Screen Printing (Photo Developing Type Solder Resist)

A manufacturing method that corresponds to the evolution of printed circuit boards from rough designs to those with fine structures.

Abe Print Circuit Board Co., Ltd. is focusing on liquid resin screen printing technology as its main method to adapt to the evolution of printed circuit boards, which range from coarse structures to fine structures, in response to the advancement of electronic devices. In this method, resin is applied in a thin film using screen printing, and light is partially irradiated to change its solubility, allowing for the removal of unnecessary parts through development. The process concludes with drying and printing of characters, and it has been adopted in many factories. *For more details, please feel free to contact us.*

  • Printing/Publishing

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"Design, manufacturing, and sales of printed circuit boards" *Business Introduction*

"Design, manufacturing, and sales of printed circuit boards" *Business Introduction*

If you are having trouble with printed circuit boards, please contact us! We can also accommodate prototypes.

Stay Electronics Co., Ltd. is engaged in the design, manufacturing, and sales of printed circuit boards. Our company has built up expertise based on the craftsmanship spirit: STAY-ISM, fueled by the thoughts, requests, and expectations we have received from many customers over the years. Our motto is "Creating products that respond to the developer's thoughts and commitments." At Stay Electronics, we are dedicated to answering the developer's question, "What should I do in this situation?" We aim to be the company you turn to in times of trouble. 【Business Description】 ■ Design, manufacturing, and sales of printed circuit boards 【Products Offered】 ■ Flexible printed circuit boards ■ Rigid printed circuit boards 【Main Inspection Equipment】 ■ AOI/AVI ■ Image dimension measuring instruments/projectors ■ Ultra-depth multi-angle lenses ■ Microscopes ■ Two-dimensional automatic length measuring devices ■ Others: Equipment for prototype support available Please contact us if you want to reduce tool costs such as molds. *For questions or inquiries, please call us or contact us at the email address below. 042-774-4555 stay-4555@staydenshi.jp Contact Person: Kumada, Kikuchi

  • Wiring materials

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Image Analysis Using a Microscope / Flexible Substrate Mock Production

Image Analysis Using a Microscope / Flexible Substrate Mock Production

It is possible to create a simple mock-up of the base for those who want to analyze the internal structure of FPC products, troubleshoot issues, or pre-verify complex product shapes.

We would like to introduce the services provided by Stay Electronics Co., Ltd. The "Flexible Circuit Board Mock Production using a High-Performance Cutting Plotter" is a service that creates simple mock-ups of flexible circuit boards using polyimide film for those who have never handled flexible circuit boards before or wish to pre-validate complex product shapes. Additionally, the "Image Analysis using a Super Depth Multi-Angle Lens Microscope" can be utilized for internal structure analysis and defect analysis of FPC products. *For questions or inquiries, please call us or contact us at the email address below. 042-774-4555 stay-4555@staydenshi.jp Contact Person: Kumada, Kikuchi [Service Operations] ■ Image Analysis using a Super Depth Multi-Angle Lens Microscope ■ Flexible Circuit Board Mock Production using a High-Performance Cutting Plotter *For more details, please refer to the PDF document or feel free to contact us.

  • Microscope

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[Production Example] Superconducting Device (Flexible for Superconducting Circuit Evaluation)

[Production Example] Superconducting Device (Flexible for Superconducting Circuit Evaluation)

Examples of superconducting devices (for superconducting circuit evaluation) operating at ultra-low temperatures of -269℃. *Source: Yokohama National University

We would like to introduce a case study of the fabrication of a superconducting device flex that operates at an ultra-low temperature of -269°C. Using flex materials that operate in a superconducting environment, we produced flex for superconducting devices, including single flux quantum circuits (SFQ circuits) and adiabatic quantum flux parametron (AQFP), for the purpose of verifying the operation of superconducting circuits. Laser processing was applied due to the tolerances required for the device electrode parts. [Case Overview] ■ Materials Used - 2-layer materials (2 types) - 3-layer materials (2 types) *Materials were determined after verification experiments. ■ Laser processing was applied due to the tolerances required for the device electrode parts. *For more details, please refer to the PDF document or feel free to contact us.

  • Piezoelectric Devices

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[Design and Production Example] Coil_FPC for Motor Field Windings

[Design and Production Example] Coil_FPC for Motor Field Windings

A circuit is formed considering the thickness of the flexible printed circuit (adjusting the L/S pitch). For the motor's field winding (for generating a high electromagnetic field) flexible printed circuit. *Source: Gunma University

We would like to introduce a case study of the design and production of field winding using flexible substrates that we conducted. To wind around the main pole piece, a circuit was formed considering the thickness of the flexible substrate so that the coil wiring overlaps at the same position (L/S pitch was corrected and adjusted). Due to the long structure, we implemented correction processing considering the shrinkage characteristics of the flexible material and the etching factor of the conductor, utilizing ultra-thin copper foil material. 【Case Overview】 ■L/S=100μ/100μ ■Specifications: Double-sided structure ■Base PI thickness: 25μ (no adhesive material) ■Cu thickness: 2μ (excluding Cu plating thickness) *For more details, please refer to the PDF document or feel free to contact us.

  • Contract manufacturing

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[Case] Flexibility case for substrate + wire products

[Case] Flexibility case for substrate + wire products

Improved integrated flex! There are application examples for dental examination table devices and EEG measurement sensor devices.

We would like to introduce a case of flexing our substrate and wire products. We improved a product that was composed of a rigid substrate and wire into an integrated flex design. There are application examples for dental examination tables and EEG measurement sensor devices. 【Application Examples】 ■ Dental Examination Table ■ EEG Measurement Sensor Device *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Other contract services

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[Design and Manufacturing Example] Stator Coil for Ultra-Small Motor_FPC

[Design and Manufacturing Example] Stator Coil for Ultra-Small Motor_FPC

Base PI thickness is 25μ, Cu thickness is 18μ! A case study of coil flex design and manufacturing aimed at achieving a strong magnetic field formation.

We would like to introduce a case study of the design and manufacturing of coil flex aimed at achieving a very small yet powerful magnetic field formation, as requested by the manufacturer. Within an outer dimension of approximately 4.0mm x approximately 3.0mm, we configured a single-sided structure with L/S=35μ/35μ, 6 turns x 3 blocks. Additionally, within an outer dimension of approximately 4.0mm x approximately 10.0mm, we configured a double-sided structure with L/S=70μ/50μ, 4 turns x 3 blocks. The materials used for both the single-sided and double-sided structures are adhesive-free, with a base PI thickness of 25μ and a copper thickness of 18μ. 【Case Overview】 ■ Materials Used - Single-sided: Adhesive-free material - Double-sided: Adhesive-free material ■ Base PI Thickness: 25μ ■ Copper Thickness: 18μ *For more details, please refer to the PDF document or feel free to contact us.

  • Inductor Coil
  • Contract manufacturing
  • Other contract services

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[Power Supply Design Proposal Example] Comprehensive support from circuit board production to electrical operation testing.

[Power Supply Design Proposal Example] Comprehensive support from circuit board production to electrical operation testing.

Even if the manufacturer goes out of business, we can still provide support! We can reduce the burden on our customers!

The manufacturer we had commissioned for the production of the power supply board has gone out of business. We received an inquiry asking if we could take on not only the board production but also the electrical operation testing. Although the initial request was for board production, we proposed the development and manufacturing of an automatic testing device, as well as conducting the electrical operation tests in-house. By providing a comprehensive solution, we were able to reduce the burden on the customer. [Case Summary] ■ Issue: Inquiry about whether we could handle not only board production but also electrical operation testing ■ Proposal: Development and manufacturing of an automatic testing device, and conducting electrical operation tests in-house ■ Result: We were able to reduce the customer's burden through a comprehensive solution *For more details, please refer to the related link page or feel free to contact us.

  • Circuit board design and manufacturing

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Analog Sensor Board "TypeWEST"

Analog Sensor Board "TypeWEST"

You can create an analog sensor board that is resistant to damage from the start bar sensor!

The "TypeWEST" is an analog sensor board equipped with 2 analog sensors, 5 digital sensors, and 1 start bar detector. It features a structure that is resistant to damage for the start bar sensor, and also includes a ceramic capacitor for noise countermeasures. 【Specifications】 ■ Distance between analog sensors: 42mm ■ Reinforced fixation for Φ3mm infrared LED for digital sensors ■ Power supply voltage: 5.0V ■ Weight: approximately 10g *For more details, please download the PDF or contact us.

  • Printed Circuit Board

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