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substrate Product List and Ranking from 548 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  4. 4 沖電気工業 産業営業本部　産業営業統括室 Tokyo//Information and Communications
  5. 5 null/null
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substrate Product ranking

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社　和歌山
  2. Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  3. All LCP Flexible Printed Circuit Board (FPC) 山下マテリアル
  4. 4 Electronic Component Reel Management System "Smart Reel Rack" JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrate Product List

1411～1425 item / All 1843 items

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BN substrate (substrate for high heat-resistant printed circuit boards)

BN substrate (substrate for high heat-resistant printed circuit boards)

Substrate for high-temperature printed circuit boards with excellent insulation reliability.

At Print Tech Co., Ltd., we handle substrates for printed circuit boards that excel in heat resistance. We offer "BN300," which is used as a substrate for semiconductor substrates due to its high heat resistance characteristics, and "BN-LX," a high-reliability substrate for printed circuit boards that achieves environmental compatibility, high heat resistance (TG = 300°C), and low warpage (CTE = 6ppm). Please feel free to consult us if you have any requests. 【Product Lineup】 ■ BN300 ■ BN-LX *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Other electronic parts
  • Other machine elements

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High multi-layer, large printed circuit boards (PCBs) and backplanes manufactured overseas.

High multi-layer, large printed circuit boards (PCBs) and backplanes manufactured overseas.

Our company's circuit board manufacturing specializes in high-layer and large circuit boards up to 60 layers. We will develop solutions for your interconnection issues.

For over 30 years, our technological advancements in PCBs and backplanes have enabled several key innovations in high-speed networking and computing products. 【Services Offered】 ■ PCB layout, CAD, design for manufacturability and cost ■ Quick-turn PCB prototyping for PCBs, backplanes, and flex circuits ■ Mass production and global manufacturing in North America and Asia ■ Advanced technologies: laminated boards, HDI, any layer through structure, multiple sequential laminations ■ Manufacturing services utilizing SVP (Simultaneous Via Partitioning™) and intellectual property licensing opportunities ■ Manufacturing of high-layer-count and large PCBs *For more details, please refer to the PDF document or feel free to contact Sanmina.

  • Contract manufacturing

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Overseas manufacturing of advanced PCBs (printed circuit boards) for aerospace, medical devices, communication equipment, etc.

Overseas manufacturing of advanced PCBs (printed circuit boards) for aerospace, medical devices, communication equipment, etc.

We have strengths in advanced technology for high multilayer and ultra-fine pitch developed for aerospace applications, and we respond to the needs for procuring advanced substrates overseas.

We would like to introduce our overseas manufacturing of advanced PCBs (printed circuit boards) for aerospace, medical devices, communication equipment, and more. Our company is a PCB manufacturing company with a long track record of providing PCB solutions for major markets in high-speed telecom, networking, computing, ATE, mission-critical defense and aerospace (MIL-PRF-31032, AS9100), automotive, and medical sectors. 【Features】 ■ Global footprint (two locations in the U.S., four factories in Singapore and China) ■ Design for PCB layout, CAD, productivity improvement, and cost reduction ■ Complete NPI support ■ Material technology ■ Technical leadership (multilayer boards, HDI, etc.) 【We will be exhibiting at NEPCON Japan 2025!】 Date: January 22 (Wed) - 24 (Fri), 2025, 10:00 AM - 5:00 PM Venue: Tokyo Big Sight (Booth # E28-17) *Please register your visit via the link below and stop by our booth! (No waiting time)

  • 航空宇宙向け等高度なPCB（基板）の海外製造2.PNG
  • 航空宇宙向け等高度なPCB（基板）の海外製造3.PNG
  • 航空宇宙向け等高度なPCB（基板）の海外製造4.PNG
  • 航空宇宙向け等高度なPCB（基板）の海外製造5.PNG
  • 航空宇宙向け等高度なPCB（基板）の海外製造6.PNG
  • Circuit board design and manufacturing

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High-precision, high-heat-dissipation device substrate / ultra-thin glass cloth multilayer substrate

High-precision, high-heat-dissipation device substrate / ultra-thin glass cloth multilayer substrate

The cup angle and bottom size can be freely selected! After implementation, the height of the board can be kept low.

This product is a "high-precision device substrate" that allows for a low profile of the board after mounting by installing an IC in the seat groove. It is designed for LED light reflectors, and the cup angle and bottom surface size can be freely selected. In addition, we also offer "high heat dissipation device substrates" and "ultra-thin glass cloth multilayer substrates." 【Features】 <High-Precision Device Substrate> ■ Enables a low profile of the board after mounting ■ Cup angle and bottom surface size can be freely selected <High Heat Dissipation Device Substrate> ■ Combines various heat dissipation technologies to meet advanced requirements ■ Copper pillars do not damage through-hole plating as they are not press-fitted *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board

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Heat-dissipating substrate "Thick Copper Special Substrate"

Heat-dissipating substrate "Thick Copper Special Substrate"

A thick copper three-layer substrate with a total thickness of 0.35mm! Suitable for applications such as mobile phone camera flash substrates.

We handle "heat dissipation structure substrates" with built-in copper. We use a thick copper three-layer substrate (inner layer copper thickness 0.2mm, total board thickness 0.35mm) and ultra-thin PP (0.03mm). These are used for applications such as mobile phone camera flash substrates. 【Required Performance】 ■ Circuit and SR alignment tolerance of 0.04mm ■ Surface treatment for gold wire bonding (electroless NiPdAu plating) ■ Deviation tolerance between the outer shape centerline and the component pad centerline of ±0.075mm *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Other electronic parts

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High Heat Dissipation Substrate "High Precision Heat Dissipation Via"

High Heat Dissipation Substrate "High Precision Heat Dissipation Via"

We meet advanced requirements through the combination of high-precision machining and high heat dissipation structures!

Our company handles the heat dissipation substrate "High Precision Heat Dissipation Via." The applicable substrate methods include general through-hole TH, BVH, IVH, and build-up methods. The finishing plating options include electroless NiAu, bonding NiAu, and other impedance control solutions. By combining high-precision machining with a high heat dissipation structure, we meet advanced requirements. 【Features】 ■ Applicable substrate methods: Compatible with general through-hole TH, BVH, IVH, and build-up methods ■ Finishing plating: Electroless NiAu, bonding NiAu 　　　　　　　　Other impedance control compatible ■ Resin dam structure compatible with both high and low standards *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing

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Heat dissipation substrate "Heat dissipation Via"

Heat dissipation substrate "Heat dissipation Via"

Multilayering of thick copper substrates is also possible! We can handle filling of blind vias and vacuum filling in-house.

Our company handles the heat dissipation substrate "Heat Dissipation Via." With the increasing heat generation due to the high performance and miniaturization of electronic components, there is a growing need for heat dissipation pathways that allow the heat generated by components to escape from the space to the pattern, in order to maintain the performance of electronic devices and extend their lifespan. We propose solutions to these issues as heat dissipation measures. It is also possible to create multilayer thick copper substrates, allowing for the development of new applications that have not been seen before. 【Features】 ■ Thick copper substrate with copper foil thickness of 210μm ■ Copper paste VIA hole filling (thermal conductivity 0.58–7.8W/mk) - Small diameter VIA φ 0.15 is supported, - Bottom-filled VIA hole filling can also be handled in-house with vacuum filling. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Special processing for substrates used in high-precision devices.

Special processing for substrates used in high-precision devices.

Special processing such as ZAGRI processing, laser processing, and high-precision processing for pattern alignment is possible!

Our company handles special processing of "high-precision substrates for high-precision devices." The accuracy of the counterbore processing is ±20μm, the high-precision outer diameter processing by laser is ±10μm, and the high-precision processing for pattern alignment is ±50μm. By installing ICs in the counterbore section, it is possible to keep the height of the substrate low after mounting. 【High-Precision Processing】 ■ Counterbore processing accuracy: ±20μm ■ High-precision outer diameter processing by laser: ±10μm ■ High-precision processing for pattern alignment: ±50μm *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Other electronic parts
  • converter

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Metal base substrate

Metal base substrate

A special substrate that is joined to a metal base by thermal pressing beneath the substrate. The through-hole section can be joined to the metal base by copper plating.

A solder plating or tin plating is applied in advance under the substrate, and by thermally bonding it to the metal plate, a complete surface joint is provided. It is also possible to use high-frequency compatible substrates made of low dielectric materials or substrates made of fluororesin. Such combinations can provide a very effective heat dissipation structure for high-frequency applications. Additionally, it is also effective for EMI countermeasures in RF applications.

  • High frequency/microwave parts

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Stretchable circuit board

Stretchable circuit board

Follows uneven surfaces and curves! A circuit board that serves as electrodes for various sensors and maintains conductivity even when stretched.

The "stretchable circuit board" conforms to uneven surfaces and curves, maintaining conductivity even during stretching. It allows for circuit formation on any material depending on the application, while ensuring elasticity. As a stretchable pressure sensor, it can be utilized in various applications such as monitoring beds and shoe insoles, and it does not break even under load. Additionally, the stretchable biosensor detects weak biological signals using Ag/AgCl electrodes. 【Features】 ■ Conforms to uneven surfaces and curves ■ Maintains conductivity during stretching ■ Supports various batch sizes ■ Can serve as electrodes for various sensors ■ Does not break under load *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board

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[Information] Current Status of Stretchable Substrates Reaching Practical Levels

[Information] Current Status of Stretchable Substrates Reaching Practical Levels

Meeting a wide range of user needs! An introduction to the current status of the development of stretchable substrates.

This document introduces the current status of the development of stretchable substrates. It includes information on material development, improvements in construction methods, and the expansion of application uses. Our company has been able to provide variations of standard connection methods, allowing for more diverse proposals for application development on the customer side. [Contents] ■ Preface ■ Material Development ■ Improvements in Construction Methods ■ Expansion of Application Uses ■ Future Developments *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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[Information] Various Measures for Heat Dissipation in Circuit Board Design

[Information] Various Measures for Heat Dissipation in Circuit Board Design

Introducing new heat dissipation technology in circuit board design! It is already widely adopted in various mass-produced circuit boards.

The miniaturization of devices, the high-frequency characteristics of circuits, and the increase in the current being handled have led to concerns about heat generation from the devices and circuits mounted on the substrate. This document provides detailed information on substrate design techniques that can accommodate everything from small-scale prototypes to mass production. We explain various new technologies for heat dissipation measures in substrate design. We encourage you to read it. 【Contents】 ■ Trends in devices ■ High heat dissipation measures for specific devices ■ Improving heat dissipation with surface structures ■ Metal core and metal base substrates ■ Thick copper substrates *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board

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High-frequency compatible substrate

High-frequency compatible substrate

Hybrid structure of PTFE material and general-purpose materials achieves both performance and cost! Introduction of composite material substrates.

When focusing on cost and availability, FR4 becomes a material with significant losses at high frequencies, while PTFE, which has issues with cost, is highlighted when considering high-frequency characteristics. Additionally, the reality is that high-frequency material substrates are often difficult to obtain, and it is not easy to find manufacturers that can accommodate small-scale prototypes. The "composite material substrate" uses PTFE material for the layers that form high-frequency circuits. General circuits and power circuits are constructed with FR-4 or high Tg materials, providing multilayer substrates that are compatible with high frequencies while keeping total costs down. 【Composite Material Substrate Features】 ■ PTFE + General-purpose materials ■ PTFE material is used for the layers that form high-frequency circuits ■ General circuits and power circuits are constructed with FR-4 or high Tg materials ■ Multilayer substrates compatible with high frequencies that keep total costs down *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Heat management of mounted components on the substrate.

Heat management of mounted components on the substrate.

The thermal conductivity of copper inlay is 390 W/mK! It can efficiently dissipate heat to the heat sink.

With the increase in signal high frequency, there is a tendency for the heat generation from components to increase, and the heat generated from individual circuit components also rises due to the increase in electrical power of the circuit. If these components are used without sufficient heat dissipation, issues such as unstable operation, reduced output, and decreased reliability may occur. By embedding a copper inlay, which is a metal with good thermal conductivity, directly beneath the mounted components, it is possible to efficiently dissipate heat to the heat sink. Our company can accommodate everything from double-sided boards to multilayer boards, and we can use materials such as FR-4, high Tg materials, and high-frequency materials. Please contact us for details regarding configuration and materials. 【Features】 ■ Directly dissipates heat from mounted components to the heat sink ■ Thermal conductivity of copper inlay: 390W/mK ■ Compatible with double-sided boards to multilayer boards ■ Materials available include FR-4, high Tg materials, and high-frequency materials *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Hamamatsu Pulse Co., Ltd. Business Introduction

Hamamatsu Pulse Co., Ltd. Business Introduction

If you are considering outsourcing manufacturing for circuit board assembly, semi-finished products, and finished product assembly and packaging, primarily related to consumer goods machinery and industrial equipment, please contact us!

Our company is entrusted with the manufacturing of printed circuit board assembly, semi-finished module unit assembly, and finished product assembly and packaging, based on strong trust and a proven track record from major manufacturers, including small lot and diverse production. We have numerous orders for PCB assembly, not only for domestic production but also for the implementation of prototype boards intended for mass production overseas. If desired, we can also provide technical proposals regarding issues encountered during prototype assembly and the manufacturing process for mass production. We have established a comprehensive production system, so we strive to meet customer requests by offering high-value-added semi-finished module units that incorporate not only PCB assembly but also sheet metal parts and resin-molded components, along with proposals for Q.C.D. We actively accept orders for semi-finished module assembly and finished product assembly, even if PCB assembly is not involved, so please feel free to contact us. *Please consult us regarding prototype-only or limited-time cases. 【Business Content】 ■ Manufacturing, assembly, and packaging related to electronic musical instruments and industrial control devices ■ Development, manufacturing, and sales of LED film light-related products ■ Other related businesses *For more details, please download the PDF or feel free to contact us.

  • Circuit board design and manufacturing

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