See Semiconductor Manufacturing Equipment's detailed category ranking
- CVD Equipment
- Sputtering Equipment
- Annealing furnace
- Coater
- Resist Device
- Oxidation/Diffusion Device
- Stepper
- Etching Equipment
- Ion implantation equipment
- Ashing device
- Evaporation Equipment
- Electron beam lithography equipment
- Tester
- Semiconductor inspection/test equipment
- Wafer processing/polishing equipment
- Molding Equipment
- Bonding Equipment
- CMP Equipment
- Photomask
- Other semiconductor manufacturing equipment
A sheet socket that enables stable inspection in semiconductor back-end process inspection! What is "PCR" that allows high-speed and high-density measurements? Technical materials on operating principles and more will be provided!
We equip our company with processing machines tailored to our know-how! This allows us to provide highly reliable products to our customers.
Automatically distill 1ppb grade hydrochloric acid, hydrofluoric acid, and nitric acid to 10ppt grade, reducing the procurement costs of high-purity acids.
Introducing the comprehensive catalog of the pioneer of laminators, the MCK Laminator!
Introducing noise control tubes, conductive gaskets, and more! We also offer wiring protection products against chemicals, heat, and wear.
A light curing device that can dry and bake only the surface area without damaging substrates with low heat resistance!
Package removal without causing physical or electrical damage! High selectivity etching.
In addition to viewing information, data analysis is possible!
Cavitation meter (ultrasonic intensity measuring device)
Low elasticity makes bending of FPC easy. Contributes to thinner, lighter designs and increased design flexibility.
If the PMC-ROM data of the old FANUC models disappears, the equipment will be unusable for a long time. As part of preventive maintenance, please create a backup!
We deliver products that make life simpler and more comfortable.
Exhibits stable high performance even with repeated long-duration door opening and closing operations! Excellent durability of the load port.
FOUP/FOSB compatible wafer transfer system (300mm wafer transfer system)
Featuring the latest products from Tokyo Electron Kyushu, a leading company in semiconductor manufacturing equipment!
A new temperature management system that combines "efficiency" and "savings."
Holes in ceramic substrates and FPC substrates can be transferred non-contact regardless of the position of the holes.
We manufacture small, low-cost, and quick-delivery equipment suitable for research, prototype production, die, gravure, roll coat, and roll-to-roll applications! *Test coating services are also available!
A soundproof shield room that combines electromagnetic shielding performance and sound insulation performance, creating an excellent inspection environment!
A dedicated belt grinder designed for incorporation into robots and devices. It has the highest output in the lineup, suitable for heavy grinding of castings and welded parts.
A circular rotating table made with aluminum honeycomb panels! Achieved both weight reduction and cost savings!
The standard seismic isolation device "ISO-Base" can be retrofitted, reconfigured, and reused! Earthquake protection for IT equipment has become surprisingly easy.
Compatible with low to high viscosity resists! We can manufacture equipment for any wafer size, from small diameter to large diameter!
It is a UV irradiation device that can utilize DUV light up to 248nm and allows for wavelength selection and switching.
High-performance laser lithography equipment for research and development.
Buff polishing machine with a transmission device that can be adjusted to the appropriate rotation speed for the type and size of the buff!
Significant cost reduction for AI appearance inspection systems!! A starter set that can be introduced more easily, more simply, and in a short period of time.
Technological capabilities that contribute to the development and practical application of advanced materials.
This is a film suitable for masks used in printed circuit board (PCB) manufacturing.
Contributes to the efficiency and quality improvement of semiconductor manufacturing processes. Since there are no specialized parts, maintenance is easy, allowing for quick recovery. It achieves low costs.
No special tools are required! The three processes of drilling, pulling, and end face machining can be easily performed with one machine.
Polishing technology that creates gloss. It is possible to prevent nutrient leaching by processing raw materials without washing with water.
This is a research and development sputtering device suitable for various film deposition applications, featuring high-level specifications and a wide range of options.
High quality, high throughput, and energy-saving! Compliant with SEMI standards, as well as UL and CE standards.
An automatic polishing machine specialized for "reproducibility"! It is a single unit that also excels in maintainability.
Atomization of liquid without pressurization by piezo vibration. Enables uniform application while reducing power consumption and liquid waste.
The measurement medium temperature ranges from -10°C to a maximum of 300°C.
Safe and efficient semiconductor wafer transport containers! A wide lineup is available. Compatible with various wafer sizes.
The compound semiconductor wafers (GaAs, InP, GaP) are transported to a designated position non-contactly through manual operation.
This one machine handles everything from wrapping (rough polishing) to polishing, and is capable of precision polishing of compound semiconductors such as GaAs and InP.
FPD Wet Line Various Sheet-Type Wet Processing Equipment for LCD/PDP
Compatible with high aspect ratio TGV/TSV. The world's largest chamber size for ALD (1000mm□).
It is suitable for visual inspection of wafers, lenses, and glass substrate surfaces.
Introducing a diverse lineup of polishing machines, including polishers and buffers!
Dry in / dry out is possible! Equipment for mirror finishing of silicon wafers.
Value Impact Co., Ltd. offers value in "connecting." We provide tube fittings used for vacuum piping and high-pressure gas piping.
Nishida Machine Works' steel ball grinding machine that realizes a production environment tailored to conditions and objectives.
Starting with research and development, a wide range of equipment selection is possible according to the purpose, up to semi-production applications.
The full coating process proceeds in a completely sealed state! A CED coater utilizing the latest advanced technology.
Early detection of liquid leaks to minimize accidents! The OD-7, compliant with RoHS and CE, has been added to the oil and organic solvent detectors.
Achieving low prices with a simple structure. We have also succeeded in reducing power consumption, installation space, and GWP. In case of emergencies, we also provide repairs.
[Must-see for the semiconductor industry] Check chips more accurately! Inspection possible without damaging integrated circuits using high-precision polishing technology!
All components are custom-made, allowing for flexible customization. We offer one-stop support, including software compatibility, at attractive prices.
Supports multiple wafer sizes! Dicing using the Bosch process with inductively coupled plasma.
Our company's unique multilayer film deposition multi-mirror lamp house-equipped device.
A dense chromium oxide film is formed on the surface of SUS316L! Excellent corrosion resistance is achieved against HF and HCl.
Standard ball valve compatible with oil and water prohibition. Easy to install with LET-LOK (bite-type joint) connection. Also suitable for vacuum applications. Standard stock item!
The QC-LOK quick connector for instrumentation allows for easy locking with just a push, thanks to its high-performance, high-strength locking mechanism, enabling smooth and safe connections.
Ideal for collecting fallen or adhered foreign objects.
A polishing machine that can be used widely for the shaping and polishing of brittle materials, compatible with gemstones and optical glass!
By using the wafer inversion unit, both sides of the wafer can be automatically coated!
It can uniformly and well coat large substrates up to 430mm square! It can be applied according to the application, such as square, rectangular, or irregular shapes.
Supports low to high viscosity resist! Equipment can be manufactured for any wafer size!
Can be continuously used for long periods at high temperatures of 1000℃! Heat-resistant glass fiber.
Optical sputtering device from Bühler Leybold Optics
Chemical-resistant fluororubber seal! Significantly improved chemical resistance compared to conventional fluororubber.
Easily create cross-sectional observation samples for SEM! Marking is possible with a positional accuracy of ±2.5μm.
Since the pipe is narrow, we can solve the problem of the adhesive clogging or corroding in a short time!
This is the world's first amorphous chrome plating that achieves approximately twice the hardness of hard chrome (Hv 1800) and high corrosion resistance due to its crack-free nature.
Optimal for use in a vacuum environment where oil cannot be used.
It can be used for various applications, from solder formation on the wafer to soldering of semiconductor chips, and even large-area soldering for power devices.
~Information on Zinc Coating, Vacuum Deposition, and UV Coating~
No soldering required. The new standard for cooling plates.
A polishing and grinding system based on diverse and highly reliable technologies that pursues the production of high-quality samples.
<Semiconductor-related Masks - Basic Information Release> A must-see for those who are handling various masks for the first time due to departmental transfers or job changes! A detailed explanation of the structure, types, and manufacturing methods of masks.
Easy to operate for anyone! A compact, space-saving centerless grinding machine.
Compatible with any manufacturer's mounter or printer, securely holds the entire board not only for single-sided boards but also for double-sided boards. Zero setup time!
Achieving probing compatible with multiple simultaneous measurements! Correcting misalignment after dicing.
Just gently insert the work! We will fulfill your wish to easily polish it.
Real-time information feedback! High reproducibility and minimal rotation error spin coater.
For the semiconductor industry! Process analyzer / Online analyzer for monitoring tetramethylammonium hydroxide (TMAH) in developer solutions!
You can quickly find the perfect polishing tool for your needs and preferences!
High-quality and diverse substrate transport tools.
Leave the automation of metal polishing, grinding, and deburring to FUJIYA TECH.
Thin layer coating possible! A coater that accommodates a wide range of coating speeds from low to high.