See Semiconductor Manufacturing Equipment's detailed category ranking
- CVD Equipment
- Sputtering Equipment
- Annealing furnace
- Coater
- Resist Device
- Oxidation/Diffusion Device
- Stepper
- Etching Equipment
- Ion implantation equipment
- Ashing device
- Evaporation Equipment
- Electron beam lithography equipment
- Tester
- Semiconductor inspection/test equipment
- Wafer processing/polishing equipment
- Molding Equipment
- Bonding Equipment
- CMP Equipment
- Photomask
- Other semiconductor manufacturing equipment
A new temperature management system that combines "efficiency" and "savings."
We will process SiC and GaN substrates using the CARE method!
Exhibits stable high performance even with repeated long-duration door opening and closing operations! Excellent durability of the load port.
A small tabletop type spin developer that can perform spray and paddle development.
Nishida Machine Works' steel ball grinding machine that realizes a production environment tailored to conditions and objectives.
All-in-one type UPS equipped with a standard maintenance bypass!
Low elasticity makes bending of FPC easy. Contributes to thinner, lighter designs and increased design flexibility.
Demo units available for loan! High-quality drying equipment with a single carrier (25 sheets or 13 sheets) processing type.
A small etching machine equipped with pressure gauges on both the top and bottom of the spray!
Polishing technology that creates gloss. It is possible to prevent nutrient leaching by processing raw materials without washing with water.
Safe and efficient semiconductor wafer transport containers! A wide lineup is available. Compatible with various wafer sizes.
Fully compatible with ultra-precision cleaning of semiconductors, HDDs, FPDs, and more.
Meeting the needs of the times and pioneering the high-tech era! Achieving high functionality and high precision in polishing processing.
A controllable current transducer and frequency that continuously monitors wire deformation.
This is a film suitable for masks used in printed circuit board (PCB) manufacturing.
A highly versatile and widely used type primarily intended for coating cushioning materials, building materials, and food plastics!
Supports multiple wafer sizes! Dicing using the Bosch process with inductively coupled plasma.
Supports wafers up to φ200mm! This is a plasma CVD system capable of both film deposition and etching.
The 1 light band represents a flatness of 0.00029mm! The surface is finished through various polishing processes.
A compact design device programmer compatible with a vast array of programmable devices.
Supports up to 12-inch wafers! Direct drawing compatible with general-purpose CAD eliminates the costs and time associated with photomask production!
High-frequency cleaning machines suitable for precision cleaning (500kHz, 1MHz) ---- <<Test machine rental (for a fee), please contact us>>
We propose a series of thin film coating equipment that can meet customer needs, utilizing our long-standing thin film coating technology, expertise in film formation, and database.
In addition to viewing information, data analysis is possible!
Next-generation soldering materials that respond to modern needs with a focus on environmental compatibility and health.
This one machine handles everything from wrapping (rough polishing) to polishing, and is capable of precision polishing of compound semiconductors such as GaAs and InP.
High-precision pressure gauge for high-purity fluids.
A dispenser that can draw lines of 1 micron! 'UPD System'
High-precision alignment (within 1μm of the target) is now possible in all directions of X-Y-Z-θx-θy-θz.
We offer a variety of options to meet all needs, including semiconductor manufacturing equipment, LCD panel manufacturing equipment, and general FA equipment!
Samples will be displayed at the exhibition. Improved separation from printed circuit boards! Chemical resistance including organic solvents and alkali.
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We perform deburring processing that meets specifications using servo press molds and laser processing.
We will finish to your desired surface roughness using two methods: wrapping processing and polishing processing (mirror polishing method)!
Early detection of liquid leaks to minimize accidents! The OD-7, compliant with RoHS and CE, has been added to the oil and organic solvent detectors.
Auto-lamination without bubbles under preset pasting conditions.
Starting with research and development, a wide range of equipment selection is possible according to the purpose, up to semi-production applications.
Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace
A tabletop UV irradiation device that enables advanced cleaning without damaging the sample.
Suitable for commercial use! It has very stable and predictable characteristics and behavior.
Carbon dioxide has excellent effects in preventing static electricity. It is a device that controls the specific resistance value of DIW by supplying CO2 gas through a hollow fiber membrane.
Ultrasonic polishing device suitable for processing the corners of discharge targets!
Achieving efficient polishing with an 8-shaped centrifugal surface flow type.
A must-see for those involved in the new development of photomasks! A dry etching device with a compact design that can process photomasks and wafers of various sizes.
A wide range of high-performance products for materials and gases used in device manufacturing processes, from the purification of materials used in semiconductor manufacturing processes.
We achieve film formation by freely controlling reactive sputtering and alloy sputtering.
Innovative electro-polishing equipment for yellow gold, red gold, white gold, and silver.
Achieve cost reduction without compromising quality. Stainless steel 316 double ferrule fittings (bite-type fittings). Suitable for low to high pressure applications.
Proven results with a variety of chemical solutions! The reason for our low prices is that we handle everything in-house, from design to sales.
It is a compact resist development system for small-lot, multi-variety production and development applications. Unlike DIP, it can stabilize quality due to its sheet-fed design.
Keep the negative taper angle constant! This is an automatic resist development system compatible with post-exposure bake (PEB) required for negative resist and image reversal resist.
Cleaning equipment, UV/O3 cleaning equipment, dry cleaning equipment, cleaner (cleaning device), stripper (stripping device)
We have started the release of alternatives for the transition away from fluorine due to future environmental issues, compliant with FDA standards.
SPD EEPROM programmer capable of reading, saving, and writing SPD from DIMM/SODIMM on a Windows PC.
● Down-cutting method using high-performance electroplated diamond wire ● No slurry required due to fixed abrasives
A simple structure with high versatility! It adopts a unique plasma control method.
This is an MBE device compatible with compact sizes (1 inch to 2 inches).
By adopting a pencil-type nozzle, it is possible to precisely process fine details!
Supports 2-axis and 3-axis specifications! Equipped with a user-friendly touchscreen control panel!
Supports multiple main shafts! Promises machine performance and long trouble-free operation!
Optimal for use in a vacuum environment where oil cannot be used.
It is used in a wide range of industries such as machinery, semiconductor and LCD manufacturing equipment, industrial robots, medical and welfare, transportation equipment, construction, and aerospace!
Introducing the comprehensive catalog of the pioneer of laminators, the MCK Laminator!
Compact etching machine that is suitable for narrow spaces, allows for customizable settings based on usage, and achieves short delivery times.
Buff polishing machine with a transmission device that can be adjusted to the appropriate rotation speed for the type and size of the buff!
Easy to operate for anyone! A compact, space-saving centerless grinding machine.
Single items, small lots, lathe processing, precision cutting [Leave cost reduction to Firiru Co., Ltd.]
For now, this! You can understand it in just 5 swipes! The basics of photomasks that beginners can’t ask about anymore!
Two types are available: dry type that does not use water and wet type that processes while applying cutting fluid.
Compatible with substrates up to 8 inches and supports semi-auto alignment exposure equipment.
We deliver products that make life simpler and more comfortable.
We propose a solution for pressure relief valves related to semiconductor chemical supply in a new form! It can be selected for a wide range of applications.
Recommended for those who get scratches on chips with metal collets and feel that rubber collets lack strength.
Goodbye, dents. By replacing spot welding with fiber laser welding, it is possible to achieve such beautiful welds that finishing of dents is unnecessary!
Sample polishing machine specifically for hand grinding!
Just gently insert the work! We will fulfill your wish to easily polish it.
Equipped with a comprehensive inspection feature! It is possible to check the quality before and after bonding.
The transfer from the wafer maker's carrier to the process carrier can be easily done manually.
We specialize in flat grinding processes, focusing on surface grinding and rotary grinding.
Free circular coating with a unique slit die! A new product has arrived to replace the Spiral Coater!
Introducing customizable press devices for various applications such as lamination, bonding, and impregnation!
With a thermal conductivity more than 20 times that of air, it absorbs heat from heating elements! We design and manufacture heat sinks tailored to your needs based on application, shape, size, and material!
[Parts Repair/Repair/Reimplementation] Stable and safe rework operations, standard solder and lead-free solder, compatible with large and small circuit boards, large and small devices!
We would like to introduce the general delivery times for printed circuit board manufacturing by Shinko Photo Service.
A Z-axis is provided, employing a mechanism that does not damage the workpiece! Polishing can be done with a soft touch.
ACF thermal bonding equipment that supports a wide range of processes from R&D to mass production.
The O-ring cherry seal is molded from various materials including FKM-70 (4 types D / fluororubber) and is available in a wide range of sizes.
Heat-resistant trivalent fluorine rubber (high temperature resistance: 250°C) material with O-ring cherry seal.
Achieved 1% precision head control through inkjet DPN discharge control.