List of Sputtering Equipment products
- classification：Sputtering Equipment
46～90 item / All 218 items
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
You can download a free booklet that introduces the uses, structures, and examples of various types of frames.
- Other machine tools
- Solar power generator
- Other energy equipment
High-rate and high-quality film formation of dielectric and ferromagnetic materials.
- Sputtering Equipment
We will exhibit at the MEMS Engineer Forum 2025.
The MEMS Engineer Forum is a unique forum operated primarily by engineers among the key players in MEMS technology, which is considered a key technology of the 21st century. At this forum, where MEMS researchers, developers, and engineers from around the world gather, we will introduce and showcase the Remote Plasma Ion Beam Sputtering System manufactured by Plasma Quest Ltd. This is an excellent opportunity to see cutting-edge technologies related to MEMS, not only from our exhibition but also from others. We cordially invite you to attend. Venue: International Fashion Center Hall 1-6-1 Yokogawa, Sumida-ku, Tokyo 130-0015, Japan Access: https://www.tokyo-kfc.co.jp/access/ Exhibited Product: Remote Plasma Ion Beam Sputtering System by Plasma Quest Ltd. https://mono.ipros.com/product/detail/2001148974 https://www.plasmaquest.com/
For engineers in the wear-resistant coating industry! Precise control of film stress.
- Sputtering Equipment
Difficult materials, various substrate shapes, and applications! Capable of accommodating a very wide range of substrate sizes.
- Sputtering Equipment
We propose value-added products with antibacterial and deodorizing properties through vacuum sputtering processing on fibers and films.
- Sputtering Equipment
A high ion current helicon plasma ion source PVD module that achieves directional film formation and enables reactive sputtering.
- Sputtering Equipment
- Plasma Generator
High-performance, high-quality magnetron sputtering cathodes! Sales, repair, and maintenance services are also available.
- Sputtering Equipment
- Vacuum Equipment
- Other metal materials
The Spatakaso Sword Service Center has been established.
Starting in April 2024, we will establish a service center for inspection and repair of the "Magnetron Sputter Cathode" manufactured by Angstrome Science in the United States. The new service center will be equipped with clean room facilities, vacuum leak checkers, and various inspection instruments to ensure comprehensive maintenance. All work will be supervised and guided by qualified personnel who have completed training at Angstrome Science, providing services similar to those in the United States. Until now, we have primarily focused on repairs due to malfunctions, but with the opening of the service center, we will also be able to offer regular maintenance. We will conduct periodic inspections of the cathodes to support operations without downtime.
Using sputtering technology in a medium vacuum environment, we have developed the world's first plating seed layer formation technology through direct copper deposition! Achieving productivity beyond ...
- Sputtering Equipment
Various high-precision pressure sensors necessary for flow control in semiconductor manufacturing equipment. Customization of modules is also possible.
- Semiconductor inspection/test equipment
- Etching Equipment
- Sputtering Equipment
Would you like to introduce the pressure controller PACE for measurement testing/line inspection of semiconductor manufacturing equipment and MEMS pressure sensors?
- Semiconductor inspection/test equipment
- Etching Equipment
- Sputtering Equipment
Would you like to introduce the PACE series for pressure calibration testing on the manufacturing line? It is also possible to reduce production costs!
- Etching Equipment
- Sputtering Equipment
- Pressure
Electrode formation processes and mounting processes for various devices such as LEDs, LDs, and FETs are possible.
- LED Module
- Sputtering Equipment
- Wafer processing/polishing equipment
![Production achievements [2] / Semic...](https://image.mono.ipros.com/public/product/image/ee9/2000412310/IPROS09238320213951143733.jpeg?w=280&h=280){kind=small}
Shortest half-day estimate / From metal parts to resin products, we introduce components related to semiconductor manufacturing equipment based on our track record!
- Sputtering Equipment
[Design/Customization] Winding Machine
We only accepted customization and modification design of the equipment. Customer / Precision Machinery Parts Manufacturer End User / Electronic Equipment Manufacturer Request Details / Modification design using existing equipment Main Specifications Transporting small lithium-ion battery components / Cutting from transport fixtures Reel taping / Laser marking / Reel winding Equipment Dimensions / W3,500mm × D1,200mm × H1,000mm This time, we only undertook the mechanical and equipment design. We were responsible for the mechanical design of the work transport fixture supply section, the work cutting / extraction / feeding section, and the reel winding section. The customer handled parts procurement, assembly, and other aspects outside of mechanical design. We also accept design-only projects. We can flexibly respond to customer requests, whether for custom equipment or, as in this case, using existing equipment. Our greatest strength is our ability to provide a one-stop service for the entire process from design to installation in equipment and fixture manufacturing. Please feel free to share any concerns related to equipment and fixtures, such as transport, robotics, and production facilities.
Shortest half-day estimate / We have accepted the production of equipment parts made of aluminum material.
- Sputtering Equipment
We will be exhibiting at the International Frontier Industry Messe 2021.
We are pleased to announce that we will be exhibiting at the "International Frontier Industry Messe 2021" on September 2nd (Thursday) and 3rd (Friday). 【Exhibition Booth Location】 D-63 (Hall 2) "International Frontier Industry Messe 2021" ________________ 〈Dates〉 September 2nd (Thursday) and 3rd (Friday) 〈Location〉 Kobe International Exhibition Hall 1 and 2 This is one of the largest comprehensive industrial exhibitions in Western Japan, focusing on the introduction of advanced technologies and product displays that serve as a foundation for new business creation, as well as facilitating technical exchanges and business matching. ______________________________________________________ At this exhibition, the organizers will implement measures to prevent the spread of COVID-19. Additionally, our staff will conduct health management through temperature checks, wear masks at all times, ensure thorough hand sanitization, and maintain social distancing during customer interactions as part of our infection prevention measures. Admission is free. We sincerely look forward to your visit. We will continue to strive to meet your expectations, and we kindly ask for your continued support. Thank you very much.
This processing requires a significant amount of positioning. We maintain a guarantee of ±0.05.
- Sputtering Equipment
A new PVD device proposed by a company that knows Endura inside and out.
- Sputtering Equipment
Equipped with three sources of cathodes in a compact tabletop size. It is also possible to produce insulating thin films, oxide, and nitride thin films.
- Sputtering Equipment
Information on major suppliers! Sputtering target market and supply chain.
- Sputtering Equipment
Introduction of various experimental devices for research and development in semiconductors, electronic devices, fuel cells, displays, and thin film experiments.
- Sputtering Equipment
- Evaporation Equipment
- Annealing furnace
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
Composite thin film experimental device nanoPVD-ST15A capable of mixed installation of vacuum deposition (metal and organic deposition sources) and sputtering cathodes.
- Sputtering Equipment
- Evaporation Equipment
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
![[Hot Stage] Ultra High Temperature ...](https://image.mono.ipros.com/public/product/image/671/2000002653/IPROS21404174246949592221.png?w=280&h=280){kind=small}
An ultra-high temperature substrate heating stage that allows for substrate elevation, rotation, and RF/DC substrate bias all in one device! 'All-In-One' component.
- Sputtering Equipment
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
High-efficiency magnetron sputtering cathode compatible with RF, DC, and pulse DC for depositing metals and insulators without impurities. It also excels in maintainability.
- Sputtering Equipment
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
Sputter Cathode and Co-evaporation Source Mixed Thin Film Experimental Device: Metal deposition, organic deposition, and sputter cathode installed in a compact frame.
- Sputtering Equipment
- Evaporation Equipment
- Annealing furnace
【MiniLab】 Evaporation/Sputtering Dual Chamber System
Two thin film experimental devices are connected by a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected via the load lock. With Moorfield's unique load lock system, connections to the process chamber on the left, right, and rear are also possible (see photo below). 1. MiniLab-E080A (Evaporation Device) - EB evaporation: 7cc crucible x 6 - Resistance heating evaporation x 2 - Organic evaporation limit x 2 2. MiniLab-S060A (Sputtering Device) - Φ2" Magnetron cathode x 4 for simultaneous sputtering - Compatible with both DC and RF power supplies 3. Load Lock Chamber - Plasma etching stage In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC substrate bias stage," and the company's unique "soft etching" technology allows for a <30W low-power, damage-free plasma etching stage. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of Teflon substrates. (*This can also be installed in the main chamber stage.)
Suitable for the film formation of nanomaterials (metal nanoparticles, nanowires, nanosheets, materials for nanoelectronics)!
- Sputtering Equipment
High-end sputtering process for optical films used in aerospace engineering and medical/bio applications is possible!
- Sputtering Equipment
Ion beam sputtering equipment for research and development as well as small-scale production!
- Sputtering Equipment
DC pulse sputtering is possible (reactive sputtering of insulating films using conductive targets)!
- Sputtering Equipment
We apply hard DLC (diamond-like carbon) through sputtering, suitable for medical supplies and automotive parts! *Demo tests are currently being conducted.
- Sputtering Equipment
DLC film formation (film quality: ta-C domain, surface roughness Ra 0.16 nm, transmittance: 88%) achieved through sputtering, which has had many challenges in the past.
- Sputtering Equipment
It is a device that can be transitioned from a pilot line to a mass production line.
- Sputtering Equipment
There are five expansion slots, allowing for additional installation of sputter chambers, deposition devices, glove boxes, etc.
- Sputtering Equipment
Reduce damage to the substrate by over 60%! Improve film formation speed while maintaining low damage characteristics.
- Sputtering Equipment
Announcement of Exhibition at Kansai Metal Japan by Keihin Ramtech
We sincerely thank you for your continued patronage. We are pleased to announce that, following last October, our company will be exhibiting at Kansai Metal Japan held in Osaka. We will showcase the upgraded technologies and lineup of Ramtech, which have been enhanced to withstand the challenges posed by the new coronavirus. We kindly ask for your consideration in visiting us. We look forward to seeing you there.
Ideal for experiments, research, evaluation, and prototype production! Achieving high-speed, high-precision, low-damage vacuum deposition on flat substrates such as glass and metal!
- Sputtering Equipment
Leave the manufacturing of semiconductor sputtering targets to us.
- Sputtering Equipment
![[Example of Use] Sputtering Target ...](https://image.mono.ipros.com/public/product/image/f42/2000180520/IPROS14162266355367390576.jpeg?w=280&h=280){kind=small}
You are using SiC/Si composite materials as the target material.
- Sputtering Equipment
- Other metal materials
- Fine Ceramics
Remote source ion beam sputtering device manufacturer for remote plasma sources.
- Sputtering Equipment
Information on commissioned test film formation services (test film formation of high-quality reaction films, etc.)
Research on Co-sputtering of different materials, such as ferromagnetic targets and metal and ceramic targets, which are considered difficult to film using conventional sputtering devices. We strongly support advanced material research and process development, including the deposition of AlScN, which is attracting attention for next-generation MEMS applications. This is a groundbreaking technology that uses a helicon ion source as a plasma source, accelerating high-density ions obtained from it by applying a bias voltage to the target. Since it is an ion beam-type deposition method using a remote plasma system, stable film formation can be achieved even with ferromagnetic and dielectric targets, which are challenging for magnetron sputtering devices. By individually controlling the ion source and target application, it is possible to accommodate a wide range of deposition conditions while also achieving high deposition rates. Independent gas supply near the target and substrate allows for the deposition of various multilayer thin films, including oxide and nitride films. Since the substrate surface is not exposed to plasma, it is possible to maintain a low temperature during film formation.
High-throughput roll-to-roll sputtering equipment for the manufacture of FCCL (Flexible Copper Clad Laminate).
- Sputtering Equipment
FHR Star.100-Tetra Co is a very compact sputtering device designed for MEMS and high-performance optical products.
- Sputtering Equipment
Production ion beam milling equipment that achieves high rate and high reliability.
- Sputtering Equipment
The "FHR.Star.600-EOSS" is a high-performance magnetron sputtering device developed for precise optical filter film deposition.
- Sputtering Equipment
Highly acclaimed high-precision optical filter deposition magnetron sputtering device
This is a device specialized in optical thin films, such as high-performance optical filters that require multilayering and high reproducibility, particularly for applications like LiDAR, which are expected to see significant demand in the future. It demonstrates strong capabilities for high-quality and stable production. - Film formation that eliminates the influence of film quality changes due to target consumption using a cylindrical cathode. - Stable film formation of oxide films achieved by incorporating a reactive ion source. - Film formation of a wide range of multilayer films enabled by the installation of up to four cathodes.
High-spec compact coater compatible with various metals such as Ni, Cr, W, Ti, and Al!
- Sputtering Equipment
This is an ion coater ideal for full coating of large samples. Models are available for sizes ranging from 4 to 8 inches.
- Sputtering Equipment
Customizable to fit experimental purposes. Small RF sputtering device.
- Sputtering Equipment
Fully automatic ion coater suitable for sample preparation for SEM.
- Sputtering Equipment
Full automatic sputter coater with magnetron cathode to reduce ion damage.
- Sputtering Equipment