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substrate Product List and Ranking from 561 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Jan 14, 2026~Feb 10, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Jan 14, 2026~Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社 和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  4. 4 JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  5. 5 共栄電資 Tokyo//Electronic Components and Semiconductors

substrate Product ranking

Last Updated: Aggregation Period:Jan 14, 2026~Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. [Exhibition Report] We exhibited at NEPCON Japan 2026! 太洋テクノレックス 本社 和歌山
  2. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社 和歌山
  3. [Notice_26.2] Regarding the Publication of Our Articles - Related to Space Business - 太洋テクノレックス 本社 和歌山
  4. 4 High-strength alumina substrate for thin films JAPAN FINE CERAMICS CO., LTD. (JFC) Tokyo Sales Office
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrate Product List

1621~1650 item / All 1884 items

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Short delivery time, high quality, low price! Printed circuit board prototyping service *Documentation available

[Materials Available] We will solve your problems! Introduction of printed circuit board prototyping service examples!

"Sarolution" specializes in prototype printed circuit boards, characterized by "short delivery times," "high quality," and "low prices." By limiting the specifications of the circuit boards, we have achieved a low-cost service. We have also established a short delivery service system required for development prototypes. All data checks are conducted in-house, and we generally accept the boards, perform random checks, and then ship them. We also ensure a comprehensive support system after delivery. 【Must-read for those with the following concerns】 - I have an interesting product idea, but my budget is limited... - I need to create a prototype quickly to bring it to market... - I want to try using overseas circuit boards, but I don't have any connections... - Domestic prototype circuit board services have various restrictions... 【Features of Sarolution】 - We can accommodate even one board. Delivery times as short as 2 days! - No initial costs! Shipping included! - You can choose the specifications! - Supports various data formats! Panel editing is also available! *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • substrate

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AD7172CM(4)

It is a 24-bit AD converter board.

This is a 24-bit AD converter board using a super low noise AD converter IC. It connects to a computer via USB. There are 4 input channels, and the input voltage range is 0V to +5V. The analog input circuit and the USB connection circuit are isolated.

  • Other measurement, recording and measuring instruments
  • substrate

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Glass substrate

We manufacture various glass substrates such as soda glass, borosilicate glass, and quartz.

We will manufacture items in your desired size using materials such as soda glass, Eagle XG, Tempax, B270 (whiteboard), and quartz.

  • Glassware and containers
  • substrate

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Glass capillary tube

We manufacture glass capillaries in various sizes.

We have inexpensive BC glass capillaries (grade 2 hard glass) and Pyrex equivalent (grade 1 hard glass) capillaries that can accommodate your desired outer and inner diameters. - For experimental and research equipment. - As parts for machinery, etc. They are being used.

  • Glassware and containers
  • substrate

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Densitron QVGA LCD LED backlight power supply board

This is the original LED backlight power supply board from Kenic System.

The "KSLBC-3(D2)" is an LED backlight power supply board for QVGA LCDs manufactured by Densitron. 【Features】 - It can be easily configured with a general-purpose microcontroller for ON/OFF and brightness adjustment. - It uses a device with built-in overvoltage protection, so even if the LED is disconnected, the device is protected. - It is compact and lightweight, measuring 67×20mm.

  • controller
  • substrate

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Low-damage processing and polishing processes and evaluation of SiC and GaN wafer substrates.

Latest polishing technology for various GaN/SiC related materials with high hardness and brittleness.

★What does the future hold for technologies that support large-diameter processing and mass production techniques? ★We will also introduce the characteristics of the residual processing altered layer remaining during SiC wafer processing, its impact on subsequent processes, and analysis techniques for the altered layer. ★We are currently conducting a pre-content request service! We welcome your practical challenges! 【Venue】 Tekno Kawasaki, 5th Floor, 5th Training Room【Kanagawa, Kawasaki】 【Date and Time】 September 17, 2013 (Tuesday) 11:00-15:45 【Instructors】 Part 1: Dr. Tomohisa Kato, Team Leader and Senior Researcher, Advanced Power Electronics Research Center, National Institute of Advanced Industrial Science and Technology (AIST) Here is the homepage of the Advanced Power Electronics Research Center. Part 2: Representative from Namiki Precision Jewel Co., Ltd., NJC Technology Research Institute Part 3: Professor Kazuto Yamauchi, Graduate School of Engineering, Osaka University

  • Company:AndTech
  • Price:10,000 yen-100,000 yen
  • Technical Seminar
  • substrate

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[Information] President's Blog December 2020

It provides a detailed explanation of "What is a Smith chart?" using diagrams and photos!

This document summarizes the president's blog of Wave Technology Co., Ltd., a "development design promotion business" that addresses the shortage of engineers, from December 4, 2020, to December 17, 2020. Starting with the announcement of the exhibition participation on December 4, 2020, "Following up on the previous announcement of our exhibition," and introducing "What is a Smith chart?" on December 8, 2020. In addition, we have published a wealth of useful information related to products and industries. Please take a moment to read it. [Contents] ■ December 4, 2020: Following up on the previous announcement of our exhibition participation. ~ Virtual Exhibition HYOGO! ~ ■ December 8, 2020: What is a Smith chart? ~ Let's visualize the Smith chart ~ ■ December 17, 2020: It's not just for engineers. Sales training can also be rapidly learned with Tech Sherpa. *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services
  • Embedded system design service
  • Circuit board design and manufacturing
  • substrate

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[Data] Shirutoku Report No. 10 #Metal Enclosure

How is a metal casing made? A brief introduction to processing methods and design techniques.

★★Shirutoku Report: Useful Information You Can Benefit From★★ Without further ado, I will talk about the metal enclosures I am currently involved in developing. There are various processing methods for creating metal enclosures, and the design approach changes depending on the processing method. This report briefly introduces the representative processing methods and design approaches for metal enclosures. [Contents] ■ Press bending processing ■ Deep drawing processing ■ Die casting *For more details, please refer to the PDF document or feel free to contact us.

  • Mold Design
  • Processing Contract
  • substrate

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[Information] Shirutoku Report No. 20 #Tips for Reducing PCB Costs

It is also possible to reduce high manufacturing initial costs! Here are some tips for reducing the cost of printed circuit boards.

★★Shirutoku Report: Useful Information You Should Know★★ Printed circuit boards (PCBs) are relatively expensive components among electronic devices, and depending on the quality of the design, the use of the board may change, which can impact costs. You might consider searching for inexpensive PCB manufacturers overseas and adopting them, but the factors that significantly affect the cost of printed circuit boards are "board structure/layer count" and "board size." This report focuses on "board size" and introduces tips for reducing PCB costs. [Contents] ■ Tips for Reducing Costs Based on Board Size *For more details, please refer to the PDF document or feel free to contact us.*

  • Printed Circuit Board
  • substrate

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[Information] Shirutoku Report No. 95 # Effective Components for Noise Countermeasures

I will talk about the noise countermeasures in the evaluation of power converters!

★★Shirutoku Report: Useful Information You Can Benefit From★★ The current task is the evaluation of "power conditioners" (hereinafter referred to as power conditioners). When we talk about "evaluation of power conditioners," there are various types of evaluations, but this time I would like to discuss the noise countermeasures implemented in our recent work. Please take a moment to read it. [Contents] ■ Causes of Noise Generation ■ Noise Countermeasure Component "Core (Core Material of the Coil)" *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • substrate

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Transparent substrate "SPET"

Due to its reflow heat resistance of 180°C and high-temperature storage resistance of 120°C, it is suitable for soldering electronic components.

"SPET" is a highly heat-resistant and low-resistance transparent substrate that, despite being PET, enhances LED driving, increases the sensitivity of electrostatic switches, and improves antenna characteristics. The total light transmittance of the substrate is 90.0%, with a haze of 0.8, and it features fine wiring that is difficult to see. Additionally, the sheet resistance of the conductor is 0.95 mΩ/□, and the conductor thickness is 18 μm, making it suitable for use as a substrate. [Features] ■ High transparency substrate ■ Low resistance conductor ■ High heat-resistant substrate *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • substrate

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What is SPET?

Tightly laminated resist, copper foil, adhesive layer, and PET! Introducing our transparent substrate.

"SPET" is a single-sided substrate made by laminating copper foil onto a PET base material. The base material thickness is 100μm/188μm, and the copper foil thickness is 12μm/18μm. It is a product that is tightly laminated with resist, copper foil, adhesive layer, and PET. Additionally, we also offer "SPET-MM," which has wiring that is nearly invisible. Please feel free to contact us when you need assistance. 【Features】 ■ High transparency flexible substrate ■ Low-resistance conductor due to copper foil lamination ■ Compatible with low-temperature soldering (180°C) *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • substrate

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[Introduction to the Fair Process] Manufacturing/Assembly/Inspection/Packaging

The product, along with the instruction manual, is placed in a dedicated individual box and shipped directly to the customer's specified factory! Electrical testing can also be performed.

At Fair Co., Ltd., we perform harness processing, sheet metal assembly, and circuit board installation, among other tasks. We can also program and conduct electrical inspections, and in cases of high production volume, we create dedicated jigs to enhance production efficiency. Additionally, we handle projects that involve placing instruction manuals in dedicated packaging boxes along with the products and shipping them directly to the customer's specified factory. 【Other Process Examples (Excerpt)】 ■ Product Planning ■ CPU Firmware Design ■ Circuit Board Pattern Design ■ Component Procurement ■ Component Mounting *For more details, please refer to the related links or feel free to contact us.

  • Other contract services
  • substrate

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Printed circuit board design high-frequency board

We accept artwork design for various types of boards, including high-frequency impedance control boards and power supply boards.

We specialize in the design of impedance control PCBs, with proven experience in high-frequency boards ranging from 10GHz to 40GHz and high-speed transmission boards from 40Gbps to 100Gbps. Additionally, we consider various aspects from PCB manufacturing to component mounting and propose the optimal layout.

  • others
  • substrate

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Rigid flex circuit impedance

We also accept prototyping and small lot production of rigid-flex PCBs from AW design at our array.

By combining rigid substrates with bendable flexible substrates, various layouts become possible.

  • Prototype Services
  • others
  • substrate

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Flexible printed circuit board (FPC) impedance control

Impedance control of flexible substrates and UL certification can be achieved with short lead times and small lot production.

We can respond to circuit board manufacturing and component assembly in just one working day at the shortest. Additionally, we manufacture high-performance flexible circuit boards with impedance control during the artwork design phase. We can also accommodate small lot production. Please feel free to consult with us.

  • others
  • Prototype Services
  • substrate

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Flexible printed circuit board (FPC) [Solving the issues in the prototype development of flexible printed circuit boards!]

Solving the issues of prototype development for flexible PCBs with many limitations! We manufacture high-performance flexible PCBs!

We can respond to circuit board manufacturing and component mounting in as little as one working day each. Additionally, we manufacture high-performance flexible circuit boards with impedance control during artwork design. We also accommodate small lot production. 【We can also support the following specifications】 ■ Component mounting FPC (double-sided mounting, lead-free mounting, mounter/reflow, bare chip mounting) ■ Bonding processing with other boards using ACF (FPC + FPC, FPC + PBC, FPC + glass substrate, etc.) ■ Multi-layer FPC (supports 3 to 6 layers; double-sided mounting is also possible) ■ Fine pitch FPC (single-sided board... minimum L/S 12/30μm; double-sided board... minimum L/S 25/50μm) *For details, please request materials or view the PDF data from the download.

  • others
  • substrate

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Tokaishin'e Electronics Industry Multi-layer Circuit Board

We have a variety of products available to meet the diverse needs of our customers.

It is a substrate with copper foil on both sides and inside of a glass epoxy insulating board.

  • Other services
  • substrate

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Daichang Electronics Flex-Rigid Circuit Boards

We aim to be a company where everyone can thrive and enjoy their work.

The business environment surrounding our company has become characterized by significant changes akin to turbulence. In order to achieve sustainable development without being swayed by economic trends, we will take the initiative to lead change and proactively embrace challenges.

  • Other network tools
  • substrate

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Daichang Electronics Build-Up Multilayer Circuit Board

We aim to be a company where everyone can thrive and enjoy their work.

The business environment surrounding our company has become characterized by significant changes akin to turbulence. In order to achieve sustainable development without being swayed by economic trends, we will take the initiative to lead change and proactively embrace challenges.

  • Other network tools
  • substrate

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Small lot for development! For automotive and power supply use. Thick copper substrate (high current substrate).

With a maximum copper thickness of 400μm, it is suitable for heat dissipation measures and power supply for power devices! It can also be formed on substrates such as transformers and motors.

Meito Electric's "Thick Copper Substrate (High Current Substrate)" is suitable for heat dissipation and current supply in heating devices used in automotive and power supply applications. By increasing the conductor (copper) thickness compared to the conventional 35μm, power circuits and control circuits can be formed on the same substrate. The creation of thick copper coil patterns allows for the construction of transformer circuits and motor circuits on the substrate. 【Substrate Specifications】 ■ Outer layer copper foil thickness: 70μm to 200μm ■ Inner layer copper foil thickness: 70μm to 400μm ■ High thermal conductivity resin: up to 8W/mK ■ Bonding: High thermal conductivity resin and copper, etc. ■ Number of layers: Proven from 2 layers to 10 layers (specifications to be discussed) ■ Copper plate: C1020 (oxygen-free) or C1100 (tough pitch) *For detailed information, please download the PDF or feel free to contact us.

  • Contract manufacturing
  • substrate

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High performance enhancement of thin film circuit boards for semiconductors.

Thin film circuit boards support the high performance of semiconductors.

In the semiconductor industry, as devices become more high-performance, substrates that allow for heat dissipation and high-density mounting are in demand. Particularly in the mounting of laser diodes and LEDs, fine circuit patterns and high thermal conductivity are crucial. Inappropriate substrates can lead to decreased device performance and shortened lifespan. Our thin-film circuit substrates apply film formation and thin-film processing technologies to achieve highly precise fine circuit patterns and excellent thermal conductivity. 【Application Scenes】 Laser Diode (LD) mounting substrates Light Emitting Diode (LED) mounting substrates Photodiode (PD) mounting substrates Optical communication (FTTx, data centers, mobile base stations) 【Benefits of Introduction】 Contributes to high performance of devices Achieves high reliability Contributes to miniaturization and high-density mounting of products

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  • Circuit board design and manufacturing
  • substrate

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Thin film circuit board for medical devices

Thin film circuit boards that contribute to the miniaturization of medical devices.

In the medical device industry, there is a demand for miniaturization and high-precision components. In particular, miniaturizing parts is a crucial challenge in order to pack many functions into limited space. Our thin-film circuit boards contribute to solving this challenge in the design of medical devices that require small, precise, and high-accuracy components. 【Application Scenes】 - Endoscopes - Portable diagnostic devices - Biometric sensors 【Benefits of Implementation】 - Miniaturization of devices - High-density mounting - High reliability

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  • Circuit board design and manufacturing
  • substrate

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Thin Film Circuit Board for Aerospace Applications

Thin film circuit boards that achieve weight reduction and high performance.

In the aerospace industry, reducing the weight of aircraft is essential for improving fuel efficiency and performance. Particularly for electronic devices used in outer space or harsh environments, there is a demand for high reliability and durability while being compact and lightweight. Thin-film circuit boards have been developed to meet these requirements. 【Application Scenarios】 - Electronic devices for aircraft and spacecraft - Satellite-mounted equipment - Drones 【Benefits of Implementation】 - Improved fuel efficiency through weight reduction - Effective use of space through miniaturization - Increased longevity of devices due to high reliability

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  • Circuit board design and manufacturing
  • substrate

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