We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for substrate.
ipros is IPROS GMS ・ IPROS One of the largest technical database sites in Japan that collects information on.

substrate Product List and Ranking from 577 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Jul 22, 2026～Aug 18, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jul 22, 2026～Aug 18, 2026
This ranking is based on the number of page views on our site.

  1. スクリーンプロセス Kanagawa//others
  2. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  3. 共立エレックス Saga//Ceramics
  4. 4 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  5. 5 アイン 本社工場 Nagano//Electronic Components and Semiconductors
Go to Company Ranking

substrate Product ranking

Last Updated： Aggregation Period:Jul 22, 2026～Aug 18, 2026
This ranking is based on the number of page views on our site.

  1. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  2. Ceramic substrate for firing setters 共立エレックス
  3. Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  4. 4 PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
  5. 5 Wrist Frequency Correction Vibration Acceleration Effective Value Measuring Instrument 'TVHP-001' 吉川電機製作所

substrate Product List

1621～1650 item / All 1969 items

Displayed results
Composite board thick wiring board "T-SEC-Board"

Composite board thick wiring board "T-SEC-Board"

Increase the number of layers to match the pin count of the mounted components! We can accommodate thick multilayer printed circuit boards.

Introducing the PCI-Express compatible wiring board "T-SEC-Board." In addition to increasing the freedom of characteristic impedance wiring width, the use of inner layer metals (copper, aluminum) is possible. This is a high-function wiring board equipped with multi-pin BGA, which allows for partial control of the board thickness at the terminal connector section. 【Features】 ■ Layer count can be increased according to the number of pins of the mounted components ■ Increased freedom of characteristic impedance wiring width ■ Inner layer copper foil thickness can be increased for heat dissipation purposes ■ Adoption of inner layer metals is possible (improving strength and heat dissipation, etc.) Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Custom and special purpose circuit boards

Custom and special purpose circuit boards

Developed with proven technology over many years! Pre-verification of characteristics through simulation is possible.

We provide printed circuit boards that combine functional materials tailored to various characteristic requirements. We can accommodate industrial applications and small quantities, and pre-validation of characteristics through simulation is possible. Developed with proven technology over many years, we guarantee long-term reliability. 【Features】 ■ Aluminum-based substrate - Achieves high heat dissipation and lightweight design ■ Edge shielded substrate - Suppresses radiated noise by shielding the edges - Adopts the ED method to accommodate special shapes ■ Millimeter-wave substrate - Hybrid structure of low-loss material and FR4 - High-precision patterning *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Substrate lineup

Substrate lineup

Supports specific functional materials such as capacitors and heat dissipation! Balances performance and cost.

We provide printed circuit boards that combine functional materials tailored to various characteristic requirements. By using a hybrid structure of functional materials such as low-loss materials and capacitor materials along with general materials, we achieve a balance between performance and cost. Additionally, we accommodate low-loss materials both domestically and internationally. 【Application Example】 <Embedded Capacitor> ■ Number of Layers: 20 layers ■ Base Material: Faradflex + Megtron6 ■ Application Example: Networks, semiconductor testing *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Copper coin embedded printed circuit board

Copper coin embedded printed circuit board

Improving thermal conductivity by embedding copper coins! Introducing printed circuit boards that efficiently dissipate heat.

To efficiently utilize the thermal conductivity of copper (390 W/m·K) for heat dissipation, we introduce a printed circuit board embedded with copper coins in the heat-generating area. In conventional methods, heat dissipation vias were arranged as much as possible, but due to the inability to increase the cross-sectional area of copper, there were limitations in heat dissipation. In the developed product, the thermal conductivity has been improved by embedding copper coins. 【Comparison of Conductor Cross-sectional Area】 ■ Through Hole (25μm) - φ3.0mm 1 hole: 0.23 mm² - φ8mm area: 1.41 mm² (φ0.4mm TH, 1.0mm pitch, 48 holes) ■ Copper Coin - φ3.0mm 1 hole: 7.07 mm² (approximately 30 times) - φ8mm area: 50.24 mm² (1 hole of φ8mm copper coin) (approximately 35 times) *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High-reliability build-up wiring board

High-reliability build-up wiring board

High board thickness specifications, low dielectric material specifications, stack via specifications, etc.! We can accommodate various specifications.

We offer build-up wiring boards that support high density and high reliability. We can accommodate various specifications, including 0.4mm pitch, high board thickness, low dielectric material, stacked via specifications, and large interlayer thickness (100-120um). We deliver printed circuit boards with specific functions added for each application, from pattern design to manufacturing in a consistent system. Please feel free to consult us when you need assistance. *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High-speed high-frequency compatible printed circuit board

High-speed high-frequency compatible printed circuit board

For those who want to use materials suitable for their products. We propose optimal materials (low dielectric, tangent materials) based on measured data!

In high-speed, high-frequency compatible printed circuit boards, we will assist in the development of printed circuit boards aimed at 25Gbps to 100Gbps. We solve customer issues such as "I want to reduce transmission loss and delay time" and "I want to use materials suitable for the product." We will propose suitable materials (low dielectric, low loss tangent) based on measured data. 【Features】 ■ Proposal of suitable materials (low dielectric, low loss tangent) based on measured data ■ Support from the design stage with pre-simulation (single-ended, differential) ■ Proposals based on measured values of material transmission characteristics (loss, delay) ■ Proposal of composite structure circuit boards using high-frequency materials and FR-4 *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High-density compatible printed circuit board

High-density compatible printed circuit board

We can propose specifications tailored to your needs! We provide printed circuit boards with structures customized for your applications.

We provide printed circuit boards with structures tailored to your applications. Increased wiring density for inner and outer layers → Build-up printed circuit boards Implementation of blind vias to prevent solder blowout → Pad-on-hole structure printed circuit boards Pitch of 0.65mm or less → Build-up or pad-on-hole structure printed circuit boards We can propose specifications according to your needs. Please feel free to consult us. 【Usage Scenarios】 ■ By Product / Minimum Through-Hole Pitch - Probe Card: 0.65mm - CSP Main Image: 0.40mm - Performance Board: 0.50mm - Burn-in Board: 0.40mm *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
[Use Case] Supporting IoT integration through wiring wearable devices into clothing.

[Use Case] Supporting IoT integration through wiring wearable devices into clothing.

The conductor resistance value is low, and the change in conductor resistance during expansion and contraction is small! Suitable for applications that were difficult to apply in the past!

We would like to introduce a case where our EMS (design and manufacturing contract services) supported the IoT integration of clothing through the wiring of wearable devices. The customer's challenge was to improve the performance and quality of their own wearable devices. By using copper foil for the circuit conductors, we achieve low conductor resistance and minimal changes in resistance during stretching. This feature allows for wide application in areas that were previously difficult to implement. [Challenges] ■ Desire to improve the performance and quality of their own wearable devices ■ Traditional flexible substrates have issues with lack of elasticity ■ Unable to realize the desired wearable device *For more details, please refer to the PDF document or feel free to contact us.

  • Piezoelectric Devices
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Simulation-based substrate design

Simulation-based substrate design

The appropriateness of the design will be quantitatively assessed through simulation.

At Oki Electric Industry, we support efficient manufacturing by verifying design validity during the development stage. By conducting functional verification before actual production, we reduce cut-and-try efforts. We provide support from identifying causes to planning countermeasures and confirming their effectiveness. We solve issues such as "not functioning" and "taking time for countermeasures" through simulations at the circuit board design stage. 【Features】 ■ Reduces cut-and-try efforts through functional verification before actual production ■ Quantitatively assesses design validity through simulations ■ Supports from cause identification to countermeasure planning and effectiveness confirmation *For more details, please refer to the PDF materials or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Space and defense application printed circuit boards

Space and defense application printed circuit boards

We supply printed circuit boards for space and defense applications, such as copper coin substrates.

Oki Electric Industry supplies printed circuit boards for space and defense applications. Printed circuit boards that withstand harsh operating environments are a testament to the high reliability of our products. 【Main Products】 ■ Flex-rigid substrates ■ Thick copper substrates ■ Copper coin substrates ■ Various multilayer rigid substrates *For more details, please feel free to contact us.

  • Wiring materials
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Flexible Printed Circuit (FPC) Comprehensive Catalog

Flexible Printed Circuit (FPC) Comprehensive Catalog

A large number of flexible circuit boards that are thin and lightweight, making them excellent for space-saving solutions!

This catalog features a wide range of "Flexible Printed Circuits (FPC)" that our company handles. We offer products such as "High-Flex FPC," which demonstrates excellent bending performance even in narrow spaces, "Self-Supporting Sliding FPC," which can slide and bend while remaining upright in the air, and "Power FPC," which can handle high currents. 【Contents】 ■ FPC Product Concepts ■ Areas of Achievement ■ Process Overview ■ What is a Flexible Printed Circuit (FPC)? ■ Product Introduction *For more details, please refer to the PDF document or feel free to contact us.

  • cable
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
2025 Edition of China Automation Market Analysis

2025 Edition of China Automation Market Analysis

A clear visualization of the overall market in 2025 using numbers and graphs.

Basic Data for Understanding the Movements of the Chinese Market Organizing Product Trends and Industry-Specific Adoption Status in the Automation Field This document consolidates the latest trends in control devices and FA equipment, as well as trends across a wide range of categories including robots, motion, HMI, and industrial software. It organizes growth rates and market shares by product and industry, providing content that will be useful for future market strategies. For manufacturers, trading companies, and system integrators that have already entered or are considering entering the Chinese market, this can serve as a foundational resource for understanding the local market structure and competitive trends. It captures the realities of price competition and differentiation directions, reflecting real changes in the industry through data. [Contents (excerpt)] ■ Overall growth rate and forecast of the Chinese automation market ■ Market size trends by product category (PLC, HMI, robots, etc.) ■ Adoption status by industry (automotive, chemicals, mining, food, etc.) ■ Differences in growth between OEM and project-based markets and areas of focus *Additionally, we offer a variety of reports specialized in various product categories and industries. *Please first check the PDF document.

  • others
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Sales of reused FA equipment (second-hand goods)

Sales of reused FA equipment (second-hand goods)

If you are having trouble procuring FA equipment that has been discontinued, leave it to us.

Our company handles the procurement and sale of discontinued FA equipment. FA equipment examples: motors, PLCs, inverters, servo amplifiers, actuators, and many others. 【Sales of FA Equipment】 ■ Capable of responding to both domestic and overseas manufacturers We have a wide procurement network, primarily focused on the domestic market as well as the Americas, Europe, Oceania, and Asia, allowing us to source products that other companies may have declined, regardless of the manufacturer. ■ Prompt response Requests made by 5 PM on the same day will receive investigation results via email or phone on the same day or the following business day. ■ Shipment after pre-inspection Products delivered will be inspected by our company or our procurement partners before shipment. ■ Assurance with warranty All products come with a warranty for a certain period. If a defect is returned within the warranty period, we will provide a replacement (equivalent product) or a refund. We also handle repairs, so please consider us if you have any defective items. *For more details, please download the PDF or feel free to contact us.

  • Other FA equipment
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Flexible printed circuit board

Flexible printed circuit board

We respond to any customer requests with flexibility. We accommodate small and medium lots as well as prototypes.

We manufacture flexible printed circuit boards (FPC) tailored to our customers' needs with a diverse range of materials, configurations, and lineups. We are happy to accept orders for just one piece or a single process, and we also provide fine-pitch FPCs with a mass production base for small to medium lots, such as L/S = 50/50μm. Leveraging the surface treatment technology we have built over many years, we respond to our customers' diverse requests under thorough process management. 【Four Reasons to Choose Us】 ■ Years of expertise ■ Support for small and medium lots and prototypes ■ Proven track record of safety and reliability ■ Planning and proposal services available *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
A paper substrate is capable of deformation such as "folding and bending."

A paper substrate is capable of deformation such as "folding and bending."

Would you like to expand the possibilities of product ideas for decoration using paper-based materials?

A paper circuit board is one that has a silver pattern printed directly on the paper itself, with components mounted on top of it. Paper circuit boards are thin and flexible, allowing for deformation such as "folding and bending," making them suitable for various applications, including products that can be attached to interiors or given as gifts. Post-assembly forming processes are also easy, and circuits can be cut by hand. Website "Paper Circuit Board Mounting" https://www.johnan.com/dms/mounting/paper/ 【Examples】 Products featuring LED components attached to origami and fans. <Presented in a video!> This video clearly demonstrates the flexibility of paper circuit boards. (Approximately 1 minute and 30 seconds) ~I tried folding a paper crane with a paper circuit board~ https://www.youtube.com/watch?v=-5_kg2Uqmrs&t=6s ■Contact Information TEL: 0774-43-1431 Website: https://www.johnan.com/dms/contact/

  • Chip type LED
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Porous Chuck "Porous PE Vacuum Chuck"

Porous Chuck "Porous PE Vacuum Chuck"

A low-cost porous chuck compared to ceramic and metal material products! It has excellent wear resistance and is soft, making it difficult to put stress on the work being held!

We would like to introduce the "Porous PE Vacuum Chuck" that we handle. It is low-cost compared to ceramic and metal material products, and when clogging occurs in the porous material, it can be easily replaced with a spare part. Additionally, when using porous materials with an average air pore diameter of less than 5μm, partial adsorption is possible, and it is not only excellent in wear resistance but also soft, making it difficult to put stress on the workpiece being adsorbed. 【Features】 - Low-cost compared to ceramic and metal material products - Approximately 80% lighter than ceramic and metal material products - Easy to replace with a spare part when clogging occurs in the porous material - Partial adsorption is possible when using porous materials with an average air pore diameter of less than 5μm - Excellent wear resistance and soft, making it difficult to put stress on the workpiece being adsorbed *For more details, please refer to the PDF document or feel free to contact us.

  • Sealing
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Connector for board-to-board (FPC) connections | FB35AA series

Connector for board-to-board (FPC) connections | FB35AA series

Connector with a height of 0.8mm, 0.35mm pitch, compact, low profile, and narrow pitch.

The FB35AA series connector is designed for connecting PCBs to FPCs with a 0.35mm pitch, a mating height of 0.8mm, and a depth of 1.8mm. It adopts a metal cap method where the metal is integrally molded at the plug end, providing a robust structure that enhances strength against damage in case of misalignment. 【Features】 - The adoption of the metal cap method achieves a robust structure. - The tabs can carry up to 3A as power contacts, allowing for a reduction in the number of contact pins and contributing to space-saving. - It features a highly reliable two-point contact structure. - A recess is provided in the plug contact to improve the click feel and extraction force during insertion. *For more details, please refer to the PDF materials or feel free to contact us.*

  • Automotive Connectors
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Connector for board-to-board (FPC) connection | FB35AT5 series

Connector for board-to-board (FPC) connection | FB35AT5 series

Connector with a height of 0.5mm, 0.35mm pitch, compact, ultra-low profile, and narrow pitch.

The FB35AT5 series connector is a connector for board-to-board (FPC) connections with a pitch of 0.35mm, a mating height of 0.5mm, and a depth of 1.65mm. 【Features】 ■ Pitch of 0.35mm, product width of 1.65mm, mating height of 0.5mm ■ Number of contacts available: 8 contacts ■ Adoption of a metal cap design for a robust structure ■ Metal placed in the center of the receptacle connector: further strength enhancement through an inner metal armor structure ■ The metal cap can carry up to 3A as a power contact → achieving space-saving due to reduced number of contact pins ■ Highly reliable two-point contact structure ■ Plug contact recess structure: improves the click feel and extraction force during mating *For more details, please refer to the PDF document or feel free to contact us.

  • Automotive Connectors
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Connector for board-to-board (FPC) connection | FB3BA5 series

Connector for board-to-board (FPC) connection | FB3BA5 series

Height of 0.5mm, 0.3mm pitch, ultra-low profile and ultra-compact connector in the smallest class in the industry.

The FB3BA5 series connector is a board-to-board (FPC) connector with a 0.3mm pitch, a mating height of 0.5mm, and a depth of 1.55mm. 【Features】 ■ Pitch: 0.3mm, Mating height: 0.5mm, Product width: 1.55mm ■ Number of pins available: 24, 36 pins ■ Adoption of a metal cap design for a robust structure ■ The metal cap can carry up to 3.0A as a power contact ■ Metal is placed in the center of the receptacle connector: enhanced strength due to the inner metal armor structure ■ Reliable two-point contact structure ■ Achieves a good click feel during mating and improved extraction force *For more details, please refer to the PDF document or feel free to contact us.

  • Automotive Connectors
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Connector for board-to-board (FPC) connection | FB35AT8 series

Connector for board-to-board (FPC) connection | FB35AT8 series

Connector with a height of 0.8mm, 0.35mm pitch, compact, low profile, and narrow pitch.

The FB35AT8 series connector is a connector for board-to-board (FPC) connections with a pitch of 0.35mm, a mating height of 0.8mm, and a depth of 1.65mm. 【Features】 ■ Pitch of 0.35mm, product width of 1.65mm, mating height of 0.8mm ■ Available core counts: 12 and 16 cores ■ Adoption of a metal cap design for a robust structure ■ Metal placed in the center of the receptacle connector: further strength enhancement with an inner metal armor structure ■ The metal cap can carry up to 3A as a power contact → realization of space-saving due to reduced contact core count ■ Highly reliable two-point contact structure ■ Plug contact recess structure: improved click feel and extraction force during mating *For more details, please refer to the PDF document or feel free to contact us.

  • Automotive Connectors
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Membrane fine line printing

Membrane fine line printing

Invisible circuit wiring smartly replaces expensive transparent conductive films for applications such as illuminated capacitive touch sensors.

Ultra-fine Circuit This is a flexible printed circuit board formed using gravure offset printing technology. 【Features】 ■ Lower resistance compared to ITO film. ■ Superior bendability compared to ITO film. ■ Can be used as a transparent electrode due to mesh formation. ■ Enables high-density wiring. ■ Frame circuits and transparent electrodes (mesh electrodes) can be formed in the same process. 【Applications】 Electrodes for illuminated electrostatic touch keys. *For more details, please refer to the PDF document or feel free to contact us.

  • switch
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Membrane rubber implementation

Membrane rubber implementation

Reliability born from years of experience. We provide high-quality wiring modules for keyboards with proven know-how.

【Features】 ■ Supports high switch stroke. ■ High key durability. ■ High mounting position accuracy (maximum ±0.2mm). 【Applications】 Flexible printed circuit board for switches with a click feel. *For more details, please refer to the PDF document or feel free to contact us.

  • switch
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Relay fuse substrate (custom design) / junction substrate

Relay fuse substrate (custom design) / junction substrate

High reliability through press-fit technology (solder-free mounting)! Various housings can also be proposed.

We would like to introduce our "Relay and Fuse Circuit Boards (Custom Designed) / Junction Boards" that we handle. By replacing electrical wiring with a custom-designed circuit board, we reduce the amount of harness used. Our unique solid press-fit method achieves low resistance. Additionally, we offer flexible designs according to the required specifications. We can accommodate various shapes of circuit boards, and both surface mount and through-hole mounting are possible. Please feel free to contact us when you need assistance. 【Features】 ■Reduction of wiring materials ■Miniaturization and weight reduction of the overall system ■Prevention of wiring errors during assembly ■Significant reduction in assembly work hours *For more details, please download the PDF or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Copper pin insertion board "S-MIT"

Copper pin insertion board "S-MIT"

I excel at pinpoint heat dissipation.

- Utilizing the thermal conductivity properties of copper, heat from the heating components is directly dissipated to the back side. - Copper pins are inserted only in the areas of the components where heat needs to be dissipated, resulting in weight reduction. - This is a substrate with copper pins inserted into a familiar copper-clad laminate.

  • Printed Circuit Board
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Impedance control board

Impedance control board

It is compatible with impedance control for both characteristics and differential.

By adopting the TDR measurement device (manufactured by Agilent Technologies), we can handle not only prototype-level impedance measurements and process capability management for mass-produced products but also impedance measurements alone. With support from the development design stage, we can quickly respond to customer requests and propose optimal specifications.

  • Printed Circuit Board
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Flat plug board (permanent hole-filled board)

Flat plug board (permanent hole-filled board)

Through the screen printing method, any through holes are filled with resin to protect the through holes.

- By finishing the surface smoothly with special polishing, it does not hinder component mounting. - UL certified... Limited to multilayer printed circuit boards (4-layer, 6-layer) (Detailed specifications to be discussed separately).

  • Printed Circuit Board
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
IVH substrate

IVH substrate

The adoption of IVH enables miniaturization and high density.

- You can choose a specification that suits your needs from three options (IVH specification, BVH specification, IVH-BVH combined specification). - With support from the development design stage, we can quickly respond to customer requests and propose the optimal specification.

  • Printed Circuit Board
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Press-fit compatible board

Press-fit compatible board

Proposal for eco-friendly circuit boards using solderless technology.

- The press-fit structure allows for a reduction in labor during the assembly process, and by eliminating soldering, it enables a decrease in energy consumption and manufacturing costs. - It has excellent corrosion resistance and connection stability, making it suitable for products that experience significant changes such as temperature fluctuations and vibrations.

  • Printed Circuit Board
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
PAD ON VIA

PAD ON VIA

Proposal for Optimization of Component Mounting Space

- High-Density Implementation It is suitable for devices and products that require high-density implementation because it can achieve many connections in a limited space. - High-Speed Signal Transmission It is intended for applications that require high-speed signal transmission to shorten the transmission distance and suppress impedance variations. - High Reliability Since the signal layer and connection layer are directly connected, the number of conduction paths is reduced, improving reliability. - Low Power Consumption It also contributes to reducing power consumption, resulting in less power loss due to the efficiency of signal transmission.

  • Printed Circuit Board
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
[Design Development Outsourcing and ODM Examples] Medical Embedded Systems

[Design Development Outsourcing and ODM Examples] Medical Embedded Systems

Examples of manufacturing phases such as substrate assembly, assembly, and inspection handled by our company.

We would like to introduce a case of developing a pressure measurement sensor board used in medical training equipment, including mechanical design for the equipment. We provided comprehensive support not only for the board but also for the mechanical design, including the cover, and were selected as the ODM company that could handle assembly as well. This device is battery-operated, and while there was a request for power saving, we addressed this during the firmware development phase by utilizing the microcontroller's sleep function. The data measured by the pressure sensor is converted to digital format and input into the microcontroller, which then displays it on the LCD panel mounted on the device and transmits it to a smartphone via BLE communication. **Our Proposals and Services** - Mechanical design including the cover - Development of a custom LCD panel according to customer specifications - Support for manufacturing phases such as board assembly and inspection - Comprehensive support from prototype and development stages to mass production *For more details, please refer to the related links or feel free to contact us.*

  • Circuit board design and manufacturing
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Search Keywords Related to substrate

IPROS Services
COPYRIGHT © 2001-2026 IPROS CORPORATION ALL RIGHTS RESERVED.