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substrate Product List and Ranking from 580 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Sep 16, 2026～Oct 13, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 16, 2026～Oct 13, 2026
This ranking is based on the number of page views on our site.

  1. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  2. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  3. スクリーンプロセス Kanagawa//others
  4. 4 プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  5. 5 沖電気工業 産業営業本部　産業営業統括室 Tokyo//Information and Communications
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substrate Product ranking

Last Updated： Aggregation Period:Sep 16, 2026～Oct 13, 2026
This ranking is based on the number of page views on our site.

  1. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  2. Electronic equipment development and production ユメックス
  3. PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
  4. 4 Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  5. 5 Integrated in-house support for shaping, processing, and firing! Contract processing of ceramics. マルワイ矢野製陶所

substrate Product List

1651～1680 item / All 1963 items

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Technical advantages of Senin Technologies

Technical advantages of Senin Technologies

There are two types of construction methods! The diverse molding materials are characterized by their strength and applications for three-dimensional wiring.

Our company fully supports all the peripheral technologies that are essential for expanding the possibilities of three-dimensional MID, as stated by the German 3D MID Research Association on social media. Our strengths lie in high-precision and mass-production suitable technologies, with 2 types of construction methods (including proprietary development techniques like two-shot). We offer diverse construction methods, enabling three-dimensional component mounting, further implementation of three-dimensional MID products, strength in three-dimensional wiring, and applications to products such as high-frequency and semiconductors. 【Features】 ■ Diverse construction methods ■ Three-dimensional component mounting and further implementation of three-dimensional MID products ■ Strength of three-dimensional wiring ■ Applications to products such as high-frequency and semiconductors ■ Various molding materials according to application *For more details, please download the PDF or feel free to contact us.

  • Other electronic parts
  • substrate

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Kuramoto Manufacturing Co., Ltd.

Kuramoto Manufacturing Co., Ltd.

Development, manufacturing, and sales of glass substrates for flat panel displays (FPD).

We are the only manufacturer in Japan capable of mass production with a one-stop service, possessing nano-level ultra-precision surface processing technologies such as "cutting," "polishing," and "film formation" for glass substrates used in flat panel displays (FPD) including TFT LCDs, STN LCDs, TN LCDs, and EL displays. Company PR (Sales Points, Highlighted Technologies, etc.) KURAMOTO's core nano-level technologies of "cutting," "polishing," and "film formation" have played a significant role in the development of FPDs over the past 40 years since their inception. We will continue to evolve these technologies and create and provide unique value that only KURAMOTO can offer.

  • others
  • substrate

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Geomatec Co., Ltd. Kanenari Factory

Geomatec Co., Ltd. Kanenari Factory

Substrate for flat panel displays

Manufacture and sale of substrates for flat panel displays (substrates for liquid crystal displays, substrates for EL, substrates for touch panels), components for optical devices, optical system components for solid lasers, and other vacuum deposition products. Company PR (Sales Points, Highlighted Technologies, etc.) - At Geomatec, we select the best combination from various conditions such as types of processed substrates, deposition materials, and processing technologies. We also consider the pre-treatment of substrates and processes after deposition, providing the best possible state. Additionally, we can accommodate your needs from prototype and product development to mass production, offering products starting from one piece or one unit. If you are looking to transition to mass production in the future, we process using the same equipment that will be used for mass production, ensuring that you achieve the same product characteristics after the transition. - We respond to your requests for thin film products from prototyping to mass production.

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  • substrate

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8-module compatible multi-communication integrated carrier board

8-module compatible multi-communication integrated carrier board

Accelerating and densifying defense avionics integration.

This is a PCI Express-compatible multiprotocol communication carrier board that can accommodate up to 8 modules. It consolidates various avionics communications onto a single board, streamlining evaluation and integration with high-speed data transfer. 【Features】 ■ High expansion configuration with up to 8 modules ■ Reduces CPU load with DMA support ■ APIs available for Windows/Linux *For more details, please download the PDF or feel free to contact us.

  • Company：MAXET
  • Price：Other
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  • substrate

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Conduction Cooling XMC Multi-Bus Integrated Board

Conduction Cooling XMC Multi-Bus Integrated Board

Consolidating multiple communications with XMC for harsh environments.

This is a conduction cooling type XMC avionics communication interface board. It can accommodate up to 8 modules and supports the integration and testing of multi-protocol communication even in harsh environments. 【Features】 ■ High-density configuration of up to 8 modules ■ High-speed data transfer with DMA support ■ Ruggedized/conformal compliant *For more details, please download the PDF or feel free to contact us.

  • Company：MAXET
  • Price：Other
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  • substrate

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3U VPX conduction-cooled multi-communication integrated board

3U VPX conduction-cooled multi-communication integrated board

Implement multi-bus integration into the defense VPX system.

This is a conduction-cooled multi-protocol carrier board in a 3U VPX form factor. It can accommodate up to 4 modules and can be utilized as a high-reliability communication integration platform for defense and aerospace applications. 【Features】 ■ Consolidates multiple standards onto a single VPX board ■ Supports high-speed transfer with DMA ■ Compatible with conduction cooling and ruggedization options *For more details, please download the PDF or feel free to contact us.

  • Company：MAXET
  • Price：Other
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6-channel compatible 1553 high-density PMC communication board

6-channel compatible 1553 high-density PMC communication board

Multi-channel implementation of the 1553 test function in PMC.

This is a MIL-STD-1553 interface board for PMC/ccPMC systems. It supports a maximum configuration of 6 channels and is suitable for 1553 development, testing, and simulation in embedded systems. 【Features】 ■ Up to 6 independent 1553 channels ■ Supports RT simulation, bus monitoring, and error injection ■ Compatible with Windows/Linux/LabVIEW environments *For more details, please download the PDF or feel free to contact us.

  • Company：MAXET
  • Price：Other
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2005 Two-layer FPC/COF Market Demand Outlook and Two-layer CCL Production Trend Analysis

2005 Two-layer FPC/COF Market Demand Outlook and Two-layer CCL Production Trend Analysis

2005 Two-layer FPC/COF Market Demand Outlook and Analysis of Two-layer CCL Production Trends

Focusing on the rapidly growing two-layer FPC, we conducted demand forecasting by application and clarified trends in the market, applications, manufacturers, and types. Additionally, regarding the two-layer CCL, which is facing supply constraints due to a sharp increase in demand, we investigated and analyzed the production status and expansion plans of each two-layer CCL manufacturer to clarify the current supply and demand situation. This provides an outlook on the future of two-layer FPC/CCL.

  • Printed Circuit Board
  • Adhesive tape
  • substrate

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Materials useful for noise countermeasures

Materials useful for noise countermeasures

I hope this helps with your noise problem.

We have prepared materials on general knowledge about noise countermeasures, as well as methods for dealing with specific types of noise such as inverter noise and lightning.

  • power supply
  • substrate

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Are you giving up on repairing a printed circuit board that has been discontinued?

Are you giving up on repairing a printed circuit board that has been discontinued?

Since we handle all processes from parts procurement to implementation in-house, we can reproduce and repair circuit boards with the same functionality!

At PC Electronics, we cover the entire process of electronic components, from product development to rapid parts procurement, printed circuit board manufacturing, circuit design, assembly, production, and quality control. We can respond flexibly from any stage, and we have a track record of delivering prototypes in as little as one week. If you urgently need a prototype of a circuit board but can't find a company to assist you, please feel free to consult with us! Additionally, we can help reduce costs with minimal initial investment. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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USB-AMP Development Case Studies

USB-AMP Development Case Studies

Disaster prevention command system! Achieving interface conversion between USB audio signals and analog audio.

We would like to introduce a case study of the development of "USB-AMP" at our company. This is a board unit that performs interface conversion between the audio signal (USB) of the control device (PC) and analog audio in a disaster prevention command system. Development was carried out utilizing technologies for analog audio signal processing and USB-to-analog conversion. 【Case Overview】 ■ Design Area: Circuit Design Yes, Mechanical Design No, Software Design No ■ Notable Technologies: Analog Audio Signal Processing, USB-to-Analog Conversion ■ Tools Used: D2 CAD *For more details, please download the PDF or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Short delivery time, high quality, low price! Printed circuit board prototyping service *Documentation available

Short delivery time, high quality, low price! Printed circuit board prototyping service *Documentation available

[Materials Available] We will solve your problems! Introduction of printed circuit board prototyping service examples!

"Sarolution" specializes in prototype printed circuit boards, characterized by "short delivery times," "high quality," and "low prices." By limiting the specifications of the circuit boards, we have achieved a low-cost service. We have also established a short delivery service system required for development prototypes. All data checks are conducted in-house, and we generally accept the boards, perform random checks, and then ship them. We also ensure a comprehensive support system after delivery. 【Must-read for those with the following concerns】 - I have an interesting product idea, but my budget is limited... - I need to create a prototype quickly to bring it to market... - I want to try using overseas circuit boards, but I don't have any connections... - Domestic prototype circuit board services have various restrictions... 【Features of Sarolution】 - We can accommodate even one board. Delivery times as short as 2 days! - No initial costs! Shipping included! - You can choose the specifications! - Supports various data formats! Panel editing is also available! *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • substrate

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AD7172CM(4)

AD7172CM(4)

It is a 24-bit AD converter board.

This is a 24-bit AD converter board using a super low noise AD converter IC. It connects to a computer via USB. There are 4 input channels, and the input voltage range is 0V to +5V. The analog input circuit and the USB connection circuit are isolated.

  • Other measurement, recording and measuring instruments
  • substrate

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Quartz substrate for semiconductor lithography

Quartz substrate for semiconductor lithography

End face grinding, bevel grinding, and other round polishing support! Compatible with 6 inches.

In the semiconductor lithography industry, high-precision pattern transfer is required. In particular, the quality of quartz substrates during the exposure process significantly affects device performance. Distortion and surface unevenness of the substrates can reduce pattern accuracy and lead to lower yields. Our quartz substrates are compatible with notch processing and olifura processing, and can also accommodate edge polishing and bevel polishing, enabling high-precision lithography processes. 【Usage Scenarios】 - Mask substrates in the lithography process - Wafer manufacturing processes - Various optical components 【Benefits of Implementation】 - Achievement of high-precision pattern transfer - Contribution to yield improvement - Adaptability to diverse processing needs

  • Processing Contract
  • substrate

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Quartz substrate for optical lenses

Quartz substrate for optical lenses

Perfect for lens processing! Leave the precision machining of quartz substrates to us.

In the optical lens industry, high transmittance and precise shapes are required. The performance of the lens is greatly influenced by the quality of the substrate, and even slight distortions or surface roughness can degrade optical performance. Our quartz substrates can be processed to meet customer needs, including notch processing and olifura processing. 【Usage Scenarios】 - Optical lenses - Various filters - Prisms 【Benefits of Implementation】 - Enables high-precision lens processing - Improves optical characteristics - Accommodates diverse shapes

  • Processing Contract
  • substrate

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Quartz substrate for lasers

Quartz substrate for lasers

Ideal for laser mirrors! Achieving high-precision optical performance through precision processing.

In the laser industry, high-quality mirror substrates are required to optimize the reflection and transmission characteristics of laser light. Particularly in high-power lasers and precision optical systems, the accuracy of the substrate significantly affects the performance of the laser. Distortion and surface roughness of the substrate can lead to attenuation of the laser light and a decrease in beam quality. Our quartz substrates can be processed to meet customer needs, including edge polishing and bevel polishing. They achieve high optical characteristics and durability, contributing to the performance enhancement of laser systems. 【Application Scenes】 - Laser oscillators - Laser processing machines - Optical experiments 【Effects of Implementation】 - Improvement of laser light reflectivity and transmittance - Enhancement of beam quality - Increased stability of laser systems

  • Processing Contract
  • substrate

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Quartz substrate for research institutions

Quartz substrate for research institutions

Perfect for experimental purposes! Leave the precision processing of quartz substrates to us.

In experiments conducted at research institutions, high-precision quartz substrates are required. Particularly in optical experiments and precision measurements, the quality of the substrate significantly affects the experimental results. We accommodate various processing methods such as edge polishing and bevel polishing to meet the needs of experiments. Our products can be customized to customer specifications, including notch processing and olifura processing. 【Usage Scenarios】 - Optical experiments - Precision measurements - Various experimental substrates 【Benefits of Implementation】 - Improved experimental accuracy - Adaptation to diverse experiments - Provision of high-quality substrates

  • Processing Contract
  • substrate

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Glass substrate

Glass substrate

We manufacture various glass substrates such as soda glass, borosilicate glass, and quartz.

We will manufacture items in your desired size using materials such as soda glass, Eagle XG, Tempax, B270 (whiteboard), and quartz.

  • Glassware and containers
  • substrate

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Glass capillary tube

Glass capillary tube

We manufacture glass capillaries in various sizes.

We have inexpensive BC glass capillaries (grade 2 hard glass) and Pyrex equivalent (grade 1 hard glass) capillaries that can accommodate your desired outer and inner diameters. - For experimental and research equipment. - As parts for machinery, etc. They are being used.

  • Glassware and containers
  • substrate

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Densitron QVGA LCD LED backlight power supply board

Densitron QVGA LCD LED backlight power supply board

This is the original LED backlight power supply board from Kenic System.

The "KSLBC-3(D2)" is an LED backlight power supply board for QVGA LCDs manufactured by Densitron. 【Features】 - It can be easily configured with a general-purpose microcontroller for ON/OFF and brightness adjustment. - It uses a device with built-in overvoltage protection, so even if the LED is disconnected, the device is protected. - It is compact and lightweight, measuring 67×20mm.

  • controller
  • substrate

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Low-damage processing and polishing processes and evaluation of SiC and GaN wafer substrates.

Low-damage processing and polishing processes and evaluation of SiC and GaN wafer substrates.

Latest polishing technology for various GaN/SiC related materials with high hardness and brittleness.

★What does the future hold for technologies that support large-diameter processing and mass production techniques? ★We will also introduce the characteristics of the residual processing altered layer remaining during SiC wafer processing, its impact on subsequent processes, and analysis techniques for the altered layer. ★We are currently conducting a pre-content request service! We welcome your practical challenges! 【Venue】 Tekno Kawasaki, 5th Floor, 5th Training Room【Kanagawa, Kawasaki】 【Date and Time】 September 17, 2013 (Tuesday) 11:00-15:45 【Instructors】 Part 1: Dr. Tomohisa Kato, Team Leader and Senior Researcher, Advanced Power Electronics Research Center, National Institute of Advanced Industrial Science and Technology (AIST) Here is the homepage of the Advanced Power Electronics Research Center. Part 2: Representative from Namiki Precision Jewel Co., Ltd., NJC Technology Research Institute Part 3: Professor Kazuto Yamauchi, Graduate School of Engineering, Osaka University

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar
  • substrate

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[Information] President's Blog December 2020

[Information] President's Blog December 2020

It provides a detailed explanation of "What is a Smith chart?" using diagrams and photos!

This document summarizes the president's blog of Wave Technology Co., Ltd., a "development design promotion business" that addresses the shortage of engineers, from December 4, 2020, to December 17, 2020. Starting with the announcement of the exhibition participation on December 4, 2020, "Following up on the previous announcement of our exhibition," and introducing "What is a Smith chart?" on December 8, 2020. In addition, we have published a wealth of useful information related to products and industries. Please take a moment to read it. [Contents] ■ December 4, 2020: Following up on the previous announcement of our exhibition participation. ~ Virtual Exhibition HYOGO! ~ ■ December 8, 2020: What is a Smith chart? ~ Let's visualize the Smith chart ~ ■ December 17, 2020: It's not just for engineers. Sales training can also be rapidly learned with Tech Sherpa. *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services
  • Embedded system design service
  • Circuit board design and manufacturing
  • substrate

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[Data] Shirutoku Report No. 10 #Metal Enclosure

[Data] Shirutoku Report No. 10 #Metal Enclosure

How is a metal casing made? A brief introduction to processing methods and design techniques.

★★Shirutoku Report: Useful Information You Can Benefit From★★ Without further ado, I will talk about the metal enclosures I am currently involved in developing. There are various processing methods for creating metal enclosures, and the design approach changes depending on the processing method. This report briefly introduces the representative processing methods and design approaches for metal enclosures. [Contents] ■ Press bending processing ■ Deep drawing processing ■ Die casting *For more details, please refer to the PDF document or feel free to contact us.

  • Mold Design
  • Processing Contract
  • substrate

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