Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.
991～1005 item / All 1843 items
Metal core substrate with excellent heat dissipation and heat resistance.
By machining the substrate to expose the metal core and directly mounting heat dissipation components such as heat sinks, it is possible to efficiently release the heat from components that operate at high temperatures to the outside.
EL light-emitting display technology
【Features】 This is a light-emitting display substrate directly formed with inorganic EL elements (Electro Luminescence) on a substrate. The thickness of the display section is formed to be less than 0.1mm, achieving an ultra-thin design by making the printed circuit board thinner. While the brightness is not particularly high, it allows for soft lighting information in dark places. It can convey various messages without disrupting the mood in places like movie theaters and bars. 【Applications】 ● Blinking animations ● Mood clocks ● Dot matrix displays ● 7-segment displays 〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓 For more details, please refer to "Contact Us" and "Catalog Download." 〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓
Glass substrate
【Features】 The glass substrate not only has excellent transparency but also exhibits minimal warping and dimensional changes, resulting in superior flatness. It has high stability in material coefficients such as dielectric constant, excellent chemical resistance and heat dissipation, and is a cost-effective and easy-to-handle product that offers high precision and performance compared to ceramic substrates. Additionally, by using thin-film metal formation technology for circuit formation, not only the substrate but also the circuit itself achieves high smoothness, making it optimal for high-frequency signal transmission. For these reasons, our company believes that glass substrates are the leading candidates for next-generation high-performance substrates. 〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓 For more details, please refer to "Contact Us" and "Catalog Download." 〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓
Industry first! We can manufacture bendable metal substrates!
Curved lighting substrates, LED lighting, and light source substrates that match the casing and design are optimal. It is possible to bend a single substrate to fit the curves of automotive and scooter turn signals and tail lamps. The basic specifications as a heat dissipation substrate are equivalent to those of standard aluminum substrates, with the added performance of being bendable, making it the latest metal substrate.
This is a high heat dissipation, high insulation metal substrate that achieves "thin film high insulation" by applying a 20μ thick layer of Nippon Paint's "Insulid" using ED electrophoretic coating.
Insulreed is applied to the base metal plate during the bath to form an electroplated coating, creating an insulation layer. The 20μ thick Insulreed insulation layer has an insulation performance of over 5kV and is the highest specification resin layer for thin film high insulation. On top of the insulation layer, circuits can be low-temperature fired with a highly conductive paste, allowing all processes to be completed through printing. Since it does not require treatment with strong acids or strong alkalis involved in substrate manufacturing, it is possible to directly print circuits onto die-cast molded products or heat sinks exceeding 200mm in height as an integrated heat dissipation substrate. As everything is manufactured using printing methods, it is also an eco-friendly substrate that is gentle on the environment.
A DBC alternative substrate ideal for applications such as power device circuit boards and high-brightness LED boards!
The substrate is a metal base substrate made of high heat-resistant and high thermal conductivity resin. It is mainly used for power device circuit substrates and high-brightness LED substrates. The substrate consists of copper foil with a thickness of 18μm to 800μm, an insulating layer, and a base metal. 【Features】 ■ Uses high heat-resistant and high thermal conductivity resin ■ Suitable for power devices *For more details, please refer to the catalog or feel free to contact us.
Metal materials can be selected from aluminum and copper! Utilizing thermal conductivity to enhance thermal diffusion.
A "metal substrate" is a printed circuit board that enhances thermal diffusion by utilizing the thermal conductivity of metal. Metal materials can be selected from aluminum or copper, and when using a copper core substrate, through-hole conduction with the copper core is also possible, allowing for applications such as ground and thermal conduction through-holes. As a common heat dissipation method, metal base substrates dissipate heat through the base metal on the back via heat sinks or enclosures, while metal core substrates can be mounted on the circuit side of the board or machined to expose the base metal, allowing contact with heat sinks or enclosures for heat dissipation. 【Features】 ■ Enhances thermal diffusion by utilizing the thermal conductivity of metal ■ Two types: metal base substrate and metal core substrate ■ Metal materials can be selected from aluminum or copper ■ Through-hole conduction with the copper core is possible when using a copper core substrate *For more details, please refer to the PDF document or feel free to contact us.
We will solve all the problems related to the decrease in reflectivity due to aging degradation and countermeasures against sulfide!
The "Mirror Surface Cavity Substrate" is a substrate that achieves sulfurization countermeasures and high reflectivity. It eliminates the need for silver plating, preventing the occurrence of reflectivity reduction due to sulfurization. Furthermore, the circuit improves bonding performance through gold plating, achieving a stable reflectivity of 95%. 【Features】 ■ Achieves sulfurization countermeasures and high reflectivity ■ No need for silver plating ■ No occurrence of reflectivity reduction due to sulfurization ■ Improved bonding performance through gold plating in the circuit ■ Stable reflectivity of 95% *For more details, please refer to the PDF document or feel free to contact us.
Low thermal expansion iron-based substrates can be manufactured! We support everything from quick-turn prototypes to mass production.
The "iron-based substrate" is an optimal substrate for preventing solder cracks in ceramic packages and other applications due to its low thermal expansion. Iron-based substrates with low thermal expansion can be manufactured. The metal part features an 8μ high thermal conductivity resin coating on both sides, significantly improving voltage resistance and rust prevention. We can accommodate everything from short lead-time prototypes to mass production, so please feel free to contact us. 【Features】 ■ Iron-based substrates with low thermal expansion can be manufactured ■ Insulation layer: Thermal conductivity 2W/mk ■ Base metal: Iron PCM (pre-coated metal) adopted ■ Ideal for preventing solder cracks in ceramic packages and other applications ■ Support from short lead-time prototypes to mass production *For more details, please refer to the PDF document or feel free to contact us.
Simple Cable Checker: A checker specialized for testing crimp-type flat cables. *Focused only on necessary functions to achieve a low price.
A cable checker that simplifies inspections such as checking the connections of pressure-welded cables and harnesses. We keep the price down by narrowing down the compatible connectors. It is intended for use as a simple harness checker. Existing harness checkers are multifunctional but expensive, and many responsible individuals may find it troublesome to purchase due to unnecessary connectors or functions. In such cases, this harness checker allows for efficient checks with only the minimum necessary functions. *The types of connectors can be changed according to your preferences, so please feel free to contact us. *Currently, the market circulation of electronic components has worsened, affecting the production of our products. We are producing as components become available, but depending on the situation, there may be no clear timeline for delivery. We apologize for the inconvenience and ask for your understanding when making inquiries.
Flexible printed circuit boards with high quality and technology achieved at low prices through guidance from a Japanese team.
Strict calibration of equipment and completion of UL certification for materials. Suzhou Zhengxin Electronic Technology Co., Ltd. maximizes the above features to provide customers with both "Japanese standard" quality and responsiveness, as well as "Chinese standard" pricing. ＝＝＝＝＝You can also view samples of FPC in the electronic book below＝＝＝＝＝
This is a convenient printed circuit board! (Can be used for DIY amplifiers, etc.)
○ Ideal for situations such as "a little gain is lacking" or "wanting to convert impedance due to equipment constraints" in the production of measurement and control devices and systems. High-performance operational amplifiers that meet these demands. ○ Four types of lineup according to application: ・T-AMP01/T-AMP01B Typical amplifier circuit board using a single OPAMP stage. ・T-AMP02/T-AMP02B Typical amplifier circuit board using a two-stage OPAMP. ○ Custom-made options are also available.
This is a convenient printed circuit board! (Can be used for DIY amplifiers, etc.)
○ Ideal for situations such as "a bit more gain is needed" or "want to convert impedance due to equipment constraints" in the production of measurement and control devices and systems. High-performance operational amplifiers that meet these requirements. ○ Three types of lineup according to application: [T-AMP03] Amplifier circuit board with output buffer for output current enhancement. [T-AMP04] OPAMP single-stage amplifier circuit, dual-channel board. [T-AMP05] Amplifier circuit board with input buffer for increased input resistance and reduced noise. ○ Board dimensions: 74×43×1.6mm ○ Mounting holes: φ3.4×6 ○ Mounting hole pitch: 54×33mm ○ Custom-made options are also available.
This is a convenient printed circuit board! (Can be used for DIY amplifiers, etc.)
○ Ideal for situations such as "a little gain is lacking" or "I want to change the impedance due to equipment constraints" in the production of measurement and control devices and systems. High-performance operational amplifiers that meet these requirements. ○ Two types available according to application: [T-AMP08] 12dB or 18dB/OCT LPF or HPF board [T-AMP-PS] Power supply board ○ Board dimensions: 90 (or 74) × 43 × 1.6 mm Mounting holes: Φ3.2 × 6 Mounting hole pitch: 54 × 33 mm, etc. ○ Custom-made options are also available.
Easily, quickly, and at low cost, anyone can create implementation jigs! Strongly supports reducing manufacturing costs and shortening delivery times.
"Meister" is a manufacturing system for assembly jigs that strongly supports the reduction of lead times and costs in the jig creation process. By collaborating with "MeisterCAM," it enables in-house production of high-precision jigs with easy operation. It achieves in-house production of jig manufacturing, which is required for high precision, ease of operation, and applicability in production sites, while reducing assembly costs. Additionally, we will be exhibiting at the 38th "Internepcon Japan Electronics Manufacturing and Assembly Exhibition" held at Tokyo Big Sight. We sincerely look forward to your visit. 【Features】 ■ In-house production of assembly jigs and parts ■ Abundant processing materials ■ High safety and clean environment ■ Quick creation of processing data *For more details, please refer to the PDF materials or feel free to contact us.
