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substrate Product List and Ranking from 548 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  4. 4 沖電気工業 産業営業本部　産業営業統括室 Tokyo//Information and Communications
  5. 5 null/null
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substrate Product ranking

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社　和歌山
  2. Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  3. All LCP Flexible Printed Circuit Board (FPC) 山下マテリアル
  4. 4 Electronic Component Reel Management System "Smart Reel Rack" JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrate Product List

1366～1380 item / All 1843 items

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Printed circuit board

Printed circuit board

We will advance the development of manufacturing technologies aimed at pursuing new added value, with manufacturing technology as the core.

Our company will continue to develop manufacturing technologies aimed at pursuing new added value, centered around the manufacturing technology of "printed circuit boards" that we have cultivated so far. In particular, we believe that the increasingly noted "printed electronics technology" has a high affinity with the molded parts and composite products we handle, and we are advancing research on new materials and consideration of manufacturing methods. *For more details, please refer to the PDF materials or feel free to contact us.

  • Contract manufacturing
  • Printed Circuit Board
  • Circuit board design and manufacturing

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[Development Case of Electronic Equipment Design] Digital Video Signal Conversion Board for Aircraft

[Development Case of Electronic Equipment Design] Digital Video Signal Conversion Board for Aircraft

Avionics quality and design know-how! Leave high-speed signal waveforms to us!

At the request of a manufacturer of video systems for private jets, we conducted electronic circuit design and prototype evaluation for a digital video signal conversion control board. While there are now commercially available products with similar functions, there were none at that time, and it was developed to meet the stringent quality standards for aircraft. Our company has a long history of dispatching engineers to the design and development sites of major manufacturers of electronic equipment (avionics) for aircraft, and we possess a wealth of knowledge. [Overview] ■ Developed to meet the stringent quality standards for aircraft *For more details, please refer to the PDF document or feel free to contact us.

  • Mechanical Design

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Membrane display

Membrane display

Compared to conventional units, it is possible to achieve a thinner design and cost reduction!

The "Membrane Display" achieves a slim design with a total thickness of 3mm thanks to the original 7-segment display! Since it is our original product, stable supply is possible. The original 7-segment display comes in two sizes: 10mm and 8mm character heights. Additionally, by using our original tact switch, you can achieve a click feel even with embossed designs such as oval or rectangular shapes. 【Features】 - Lighted keys are also possible with the original tact key - Specifications (design, number of 7-segment digits, illumination color, brightness, click feel, etc.) can be freely selected For more details, please refer to the PDF document or feel free to contact us.

  • LCD display

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Leave everything from substrate development to implementation and product assembly to us!

Leave everything from substrate development to implementation and product assembly to us!

Leave the contract manufacturing of control boards to Nippo, specializing in software, hardware, and network technology! We accept ODM board development.

We provide a comprehensive service from printed circuit board design, embedded software development, sheet metal and mechanical design, to network device development. You can entrust us with everything from board development to implementation and product assembly. 【Specialized Technologies】 ■ Embedded control boards ■ Gas combustion boards ■ RS485/422 to LAN conversion boards ■ Temperature and humidity sensors ■ Control panels ■ Ultrasonic humidifiers ■ IoT devices ■ Cloud services … and more *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • EMS

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[Factory Introduction Video] Integrated Domestic Production from Circuit Board Development to Manufacturing!

[Factory Introduction Video] Integrated Domestic Production from Circuit Board Development to Manufacturing!

Attention design and development personnel! Introducing the circuit board assembly line and assembly process at the Nippo Shimane Factory!

At the Nippo Shimane Factory, we conduct integrated production from design to manufacturing, inspection, and shipping. You can rely on us for everything from development and prototyping to mass production. 【Nippo's Strengths】 ■ Production System We possess equipment such as chip mounters, automatic insertion machines, fracturers, and automatic soldering baths. We have strengthened our manufacturing facilities to accommodate the miniaturization and high density of electronic components, allowing us to smoothly handle a variety of productions in lots of 100 to 1000 units. ■ Assembly Work Assembly around the circuit board, electrical wiring, and sensor assembly are carried out by certified skilled workers following established procedures. We perform checks between each process to maintain and manage quality. ■ Parts Procurement We utilize a production management system to handle parts ordering, delivery dates, and inventory management. The inbound and outbound operations of parts stored in the warehouse are managed and stored with barcodes assigned to each part. ■ Inspection and Quality Assurance We use image inspection equipment to check for abnormalities in each soldering area. We conduct a double-check with automatic inspection devices and human eyes, striving for thorough quality control and continuous improvement of defect rates. *For more details, please refer to the related links or feel free to contact us.

  • IMG_9405.JPG
  • DSC00304.JPG
  • DSC00301.JPG
  • 基板加修-2.JPG
  • 基板－部品挿入.JPG
  • DSC_0061.JPG
  • 組立-6.JPG
  • 梱包-2.JPG
  • Circuit board design and manufacturing

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Technical Data: Types and Characteristics of Printed Circuit Boards

Technical Data: Types and Characteristics of Printed Circuit Boards

What role does a printed circuit board play? Let's explain its types and characteristics! If you're looking for printed circuit board development, leave it to Nippo!

A printed wiring board (or raw board, substrate) refers to a board or sheet with a surface, or a surface and internal connections made with conductive wiring. When various electronic components are mounted on this, giving it the functionality of an electronic circuit, it is called a printed circuit board (assembled substrate). The collective term for these is "printed circuit board." It serves the functions of connection and insulation, as well as supporting components, playing a crucial role in electronic devices. This document explains the types and characteristics of "printed wiring boards." *For more details, please download the PDF or feel free to contact us. ~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Nippo offers various printed circuit board development options! Please feel free to contact us. ~~~~~~~~~~~~~~~~~~~~~~~~~~~~

  • Circuit board design and manufacturing

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[Column] Introduction to the Basics of Printed Circuit Board Design and Manufacturing

[Column] Introduction to the Basics of Printed Circuit Board Design and Manufacturing

Introducing the essential knowledge of printed circuit boards, which are indispensable for products that use electronic components! Leave the design and development of circuit boards to Nippo!

A printed circuit board (PCB) is a general term for a "printed circuit board" that has electronic components such as ICs and resistors mounted on an insulating printed wiring board. Its main role is to provide electrical connections between the electronic components that make up the circuit. By efficiently connecting wiring in one place, it contributes to miniaturization, increased productivity, and cost reduction. There are two main types of printed circuit boards: ◆ Rigid boards These are made using hard insulators such as epoxy resin and are also called rigid substrates. They have the advantage of being strong, making it easier to mount electronic components. ◆ Flexible boards These are characterized by being thin and flexible, as they use plastic film as the substrate. They are used as connecting cables for movable parts of electronic components and for connections between boards or units. To manufacture a printed circuit board, it is necessary to implement all the electronic components used in the electronic circuit and design the patterns through which current will flow to connect each electronic component (artwork). Nippo offers a wide range of services, from the design of electrical and electronic circuits to the design of printed circuit boards and the construction of control systems. Please feel free to consult with us.

  • Printed Circuit Board

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[Column] What are Gerber Data and BOM? About Their Roles and Relationships

[Column] What are Gerber Data and BOM? About Their Roles and Relationships

What is the Gerber data necessary for circuit board manufacturing? Introducing its role, format, and creation process! Leave the implementation and assembly of circuit boards to Nippo!

Gerber data refers to the standard format design data used during circuit board manufacturing. Its main role is to convey the layout information of the circuit board, indicating wiring patterns, pad positions, and the arrangement of vias (through holes) to ensure that manufacturing machines can process it accurately. On the other hand, a BOM (Bill of Materials) is a data list that compiles all the component information to be mounted on the circuit board, accurately conveying details such as component types, part numbers, quantities, and placement information. When outsourcing circuit board assembly, it is important to check the Gerber data requirements in advance and prepare an accurate BOM. Since Gerber data communicates the design information of the circuit board and the BOM details the electronic components to be mounted, ensuring consistency between the two leads to smooth production and cost reduction. If you are considering outsourcing circuit board assembly and manufacturing, please feel free to contact us. We will provide proposals tailored to your needs.

  • Circuit board design and manufacturing

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Tokyo Machine and Tool Co., Ltd. Business Introduction

Tokyo Machine and Tool Co., Ltd. Business Introduction

We handle processing machines and carbide tools for printed circuit boards from various companies.

Tokyo Machine and Tool Co., Ltd. provides customers with machinery and tools for cutting, drilling, shaping, inspecting, exposing, and processing jigs for printed circuit boards, as well as peripheral devices and consumables. We also offer proposals for modifications and after-sales services to enhance the functionality of existing machines, improve production efficiency, and prevent defects. 【Product Line】 ■ Processing machines for printed circuit boards ■ Tools, peripheral devices, consumables, etc. *For more details, please download the PDF or feel free to contact us.

  • Other processing machines

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Support for high-speed and large-capacity transmission.

Support for high-speed and large-capacity transmission.

For 5G/6G! We will realize products that support advanced high-speed transmission technology.

We would like to introduce our support for high-speed and large-capacity transmission. We have developed products that are compatible with advanced high-speed transmission technologies for 5G/6G. We provide support for solving challenges related to the development of advanced high-frequency application substrates. Additionally, our "high-frequency printed circuit boards" can be tailored to meet your needs through the adoption of new high-frequency materials, joint evaluations, and the use of LP foils and low-dielectric glass materials. 【Features of High-Frequency Printed Circuit Boards】 ■ Proposals tailored to your needs ■ Surface treatment transmission LOSS evaluation ■ Analysis, evaluation, and deployment of finished products *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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[Information] Introduction to Printed Circuit Boards for Space Use

[Information] Introduction to Printed Circuit Boards for Space Use

Acquisition of certification for all types of space-use printed circuit boards for the Japan Aerospace Exploration Agency! Various types are listed.

This document introduces the certification specifications for Annexes A, B, D, E, F, G, and H of the Japan Aerospace Exploration Agency (JAXA). It includes glass cloth substrate wiring boards, fine-pitch wiring boards, and flexible wiring boards. We provide detailed information on maximum layer counts, board thickness, conductor pressure, minimum drill diameters, and more, so please take a moment to read through it. 【Contents (partial)】 ■ Annex A: Glass cloth substrate wiring boards ■ Annex B: Fine-pitch wiring boards ■ Annex D: Flexible wiring boards ■ Annex E: Flex-rigid wiring boards ■ Annex F: Low thermal expansion wiring boards with CIC *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Support for high current, high voltage, and high heat dissipation specifications.

Support for high current, high voltage, and high heat dissipation specifications.

Multi-layer structure with conductor thickness of up to 500μm! We propose an optimal heat dissipation structure.

Our company solves issues related to high current, high voltage, and heat dissipation through a special structure. We are capable of conducting high current (up to 400A) tests and manufacturing metal (with AL2.5mm) products. Additionally, we propose multi-layer structures with conductor thicknesses of up to 500μm and suitable heat dissipation designs. We address concerns such as the labor-intensive assembly of busbars and issues caused by warping of printed circuit boards due to heat. [For such concerns] ■ I want to carry high current ■ The assembly of busbars is labor-intensive ■ Issues caused by warping of printed circuit boards due to heat ■ High heat density, making heat dissipation difficult *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Support for high-density build-up structures

Support for high-density build-up structures

High-density wiring is now possible, enhancing design flexibility! Compatible with various specifications.

We would like to introduce our support for high-density build-up structures. High-density wiring has become possible, enhancing design flexibility. With LVH connections, high-speed wiring without via stubs is achievable. We support specifications such as narrow pitch compatibility and high-frequency compatibility (application of low dielectric materials, application of VLP copper foil, characteristic impedance matching, and improved characteristics for high-frequency applications). 【Supported Specifications】 ■ Narrow pitch compatibility ■ High-frequency compatibility (application of low dielectric materials, application of VLP copper foil, characteristic impedance matching & improved characteristics) ■ Thick copper foil specifications ■ Mixed IVH & LVH *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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φ520mm - Large Printed Circuit Board Manufacturing Technology

φ520mm - Large Printed Circuit Board Manufacturing Technology

Achieving high multi-layer printed circuit boards exceeding 500mm size! The maximum product size is 558×643mm.

We would like to introduce our "φ520mm - Large Printed Circuit Board Manufacturing Technology." We have achieved high multilayer printed circuit boards exceeding the 500mm size. Our high-precision lamination technology allows for narrow pitch specifications with a 0.5mm pitch. Main applications include semiconductor tester boards, load boards, probe cards, etc. Please feel free to contact us if you have any inquiries. 【Features】 ■ Maximum product size: 558×643mm ■ Maximum board thickness: 7.6mm (up to 96 layers with sequential structure possible) ■ High-precision lamination technology enables narrow pitch specifications with a 0.5mm pitch *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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