ジェーイーエル List of Products and Services

The "STWCR4000 Series" is a waterproof robot with a 4-axis cylindrical coordinate twin-arm design, compatible with 300mm wafers and featuring an inversion and edge grip function. The arm section is coated with Teflon to ensure corrosion resistance, and the joint sections of the arms use V seals for waterproofing. With an IP64 protection rating, it is suitable for transporting wafers in acidic and alkaline environments during the LSI manufacturing process. 【Features】 ■ Compatible with 300mm wafers, inversion and edge grip function ■ Arm section ensures corrosion resistance with Teflon coating ■ V seals used in the waterproof structure of the arm joints ■ Twin-arm design allows for reduced wafer exchange time ■ Ideal for transporting wafers in acidic and alkaline environments *For more details, please refer to the PDF materials or feel free to contact us.

• Transport and handling robots

The SSY-20010 is an automatic transfer system that safely and reliably transports thin wafers within a protos carrier. It can automatically transfer between protos carriers and cassettes without causing damage, and it is equipped with a Bernoulli chuck, making it suitable for thin wafers. Additionally, it can automatically identify wafers and protos spacers (interlayer paper) and recognizes the height of the workpiece automatically. 【Features】 - Safely and reliably transports thin wafers within the protos carrier - Can automatically transfer between protos carriers and cassettes without damage - Equipped with a Bernoulli chuck, suitable for thin wafers - Capable of automatic identification of wafers and protos spacers (interlayer paper) - Automatically recognizes the height of the workpiece *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements

The "STCR4000S Series" is a four-axis cylindrical coordinate clean robot designed for super clean rooms. With its two arms, it enables quick wafer exchanges. It is suitable for wafer transport within semiconductor manufacturing equipment and inspection devices. We also offer a variety of clean robots, so please feel free to consult with us. 【Features】 ■ Arm variations can be selected from 100mm and above ■ Z-axis variations can be selected from 200mm and above ■ Load capacity is 3kgf or less based on the third joint of the arm ■ Adoption of twin arms reduces wafer exchange time ■ Base type and flange type can be selected according to the equipment layout *For more details, please refer to the catalog or feel free to contact us.

• Inspection robot

The "SCR3000CS Series" is a three-axis cylindrical coordinate clean robot designed for super clean rooms. It is suitable for wafer transport within semiconductor equipment and inspection devices, and can accommodate optimal chucks tailored to the transported items and equipment layout. Additionally, our company offers a variety of clean robots, so please feel free to consult us. 【Features】 - Arm variations: 100mm, 130mm, 160mm, 200mm - Z-axis variations: selectable from 200mm onwards - Maximum load capacity: 3kgf or less based on the third joint of the arm - Equipped with operation monitoring - Control methods: RS232C and parallel photo I/O *For more details, please refer to the catalog or feel free to contact us.

• Other conveying devices
• Other factory equipment and parts

The "SSCR3115S series" is a three-axis cylindrical coordinate clean robot designed for super clean rooms. It allows for a compact device layout. Additionally, due to its small footprint and lightweight design, it is ideal for transporting small wafers inside semiconductor manufacturing equipment, inspection equipment, and LED manufacturing equipment. We also offer a variety of clean robots, so please feel free to consult us. 【Features】 - Maximum load capacity is 0.2 kgf or less at the third joint of the arm (work only) - Equipped with a motion monitor - Control methods include RS232C and parallel photo I/O - All axes use two-phase stepping motors - High-speed and high-precision wafer transport through S-curve acceleration and deceleration control *For more details, please refer to the catalog or feel free to contact us.

• Other conveying devices
• Other factory equipment and parts

The "SSCR2090S Series" is a two-axis cylindrical coordinate clean robot designed for super clean rooms. With its compact footprint and lightweight design, it is suitable for small wafer transport within semiconductor manufacturing equipment, inspection equipment, and LED manufacturing equipment, allowing for a more compact equipment layout. We also offer a variety of clean robots, so please feel free to consult us. 【Features】 - Load capacity is 0.1 kgf or less (work only) when converted to the third joint of the arm - Equipped with operation monitoring - Control method is RS232C and parallel photo I/O - All axes use two-phase stepping motors - High-speed and high-precision wafer transport through S-curve acceleration and deceleration control *For more details, please refer to the catalog or feel free to contact us.

• Other conveying devices
• Other factory equipment and parts

The "SCR3100S-PM series" is a three-axis cylindrical coordinate clean robot designed for super clean rooms. Its small footprint makes it suitable for transporting small-diameter wafers within semiconductor manufacturing equipment and inspection devices, allowing for a more compact equipment layout. We also offer a variety of clean robots, so please feel free to consult with us. 【Features】 - Arm variation: 100mm - Z-axis variation: 200mm and 300mm - Load capacity: 0.5kgf or less at the third joint of the arm - Base type and flange type can be selected according to the equipment layout - Equipped with a motion monitor *For more details, please refer to the catalog or feel free to contact us.

• Other conveying devices
• Other factory equipment and parts

The "STWHR4156 series" is a waterproof twin-arm 4-axis cylindrical coordinate clean robot. It is suitable for wafer transport in an acidic and alkaline mist atmosphere during the LSI manufacturing process. We also offer a variety of clean robots, so please feel free to consult us. 【Features】 ■ Arm variation is 156mm ■ Z-axis variation is 200mm and 300mm ■ Load capacity is 3kgf or less when calculated at the third joint of the arm ■ The arm section is coated with Teflon to ensure corrosion resistance ■ The arm joint section uses V-seals for waterproofing *For more details, please refer to the catalog or feel free to contact us.

• Other conveying devices
• Other factory equipment and parts

The "SWHR3156 series" is a waterproof clean robot with a 3-axis cylindrical coordinate system, equipped with a flip and edge grip function, compatible with 300mm wafers. It has an IP64 protection rating and is suitable for wafer transport in acidic and alkaline atmospheres during the LSI manufacturing process. We also offer a variety of clean robots, so please feel free to consult us. 【Features】 - Arm variation: 156mm - Z-axis variation: 200mm and 300mm - Load capacity: 3kgf or less, calculated at the third joint of the arm - The arm section is coated with Teflon for corrosion resistance - The arm joint structure uses V seals for waterproofing *For more details, please refer to the catalog or feel free to contact us.

• Other conveying devices
• Other factory equipment and parts

The "STHR4000 Series" is a four-axis cylindrical coordinate clean robot designed for super clean rooms. Equipped with two arms, it enables quick wafer exchanges and is primarily suitable for wafer transport within semiconductor manufacturing equipment and inspection devices. Additionally, our company offers a variety of clean robots, so please feel free to consult us. 【Features】 - Arm variations available in two sizes: 95mm and 156mm - Z-axis variations available in 200mm and 300mm - Load capacity is 3kgf or less when calculated at the third joint of the arm - Adoption of twin arms reduces wafer exchange time - Base type and flange type can be selected according to the equipment layout *For more details, please refer to the catalog or feel free to contact us.

• Other conveying devices
• Other factory equipment and parts

The "SHR3000 Series" is a three-axis cylindrical coordinate clean robot designed for super clean rooms. It is optimal for wafer transport within semiconductor manufacturing equipment and inspection devices. Additionally, it can accommodate optimal chucks tailored to the transported items and equipment layout. We also offer a variety of clean robots, so please feel free to consult us. 【Features】 - Arm variations can be selected from 100mm - Z-axis variations are available in 200mm and 300mm - Load capacity is 3kgf or less when calculated at the third joint of the arm - Base type and flange type can be selected according to the equipment layout - Equipped with a motion monitor *For more details, please refer to the catalog or feel free to contact us.

• Other conveying devices
• Other factory equipment and parts

The "Bernoulli Tweezers" are lightweight and compact tweezers that can hold thin wafers using the Bernoulli effect. The flexible tip allows for not only flat placement but also the retrieval and storage of wafers from wafer cases and cassettes. Additionally, they can accommodate various special workpieces, not just wafers. 【Features】 ■ Can hold workpieces without suction due to the cyclone effect ■ Reduces impact on workpieces during holding and does not require a holding guide ■ Adjustable to any angle preferred by the operator thanks to the use of a flexible tube *For more details, please refer to the catalog or feel free to contact us.

• tool
• Other tools and equipment

This is a four-axis horizontal multi-joint clean robot for super clean rooms that supports wafer sizes from 2 inches to 300 mm, achieving low cost, high-speed transport, and no loss of synchronization. It can transport to parallel-arranged cassettes without a travel axis. The chuck moves linearly relative to the cassette, allowing for transport using edge grip and corner substrate transport without a travel axis. It is compatible with various wafer sizes. It employs closed-loop control that does not lose synchronization even under rapid load fluctuations or sudden acceleration, further enhancing the robot's reliability. Equipped with an absolute encoder, it can determine its current position and reduce the time required for operation after returning to the origin. It features a mechanical multi-turn absolute sensor that does not require a battery. It is compatible with conventional machines (mounting compatibility and performance compatibility), allowing for easy replacement. The robot can handle two FOUPs on its own. Depending on the equipment layout, it is possible to choose a fixation method for either base type or flange type. A Bernoulli chuck can be installed (optional).

• Other semiconductor manufacturing equipment

It is suitable for transporting wafers with warping and those that leak with a suction chuck. This is a chuck for transporting wafers that can make contact with the back surface of the outer circumference and the edge. It utilizes a tapered guide to hold the wafer within a certain range by its own weight. Transporting wafers with contact restrictions from the outer circumference at an affordable price. By adding an optional substrate presence sensor, it allows for confirmation of the presence of the wafer (when used in the atmosphere).

• Other semiconductor manufacturing equipment
• Other semiconductor manufacturing equipment

It is suitable for transporting wafers with warping, as well as wafers that leak with suction chucks and thin wafers. The chuck body is made of high-purity alumina ceramics, and only the workpiece suction surface uses porous ceramics. With an average pore diameter of 20μm, it can distribute the suction pressure concentrated in the grooves, which are typically about 1.5mm deep in conventional suction surfaces, thereby minimizing deformation of thin workpieces during suction. Mesh particle sizes can be selected from grades #100, #220, and #400. A conductive Teflon coating treatment can also be applied to the workpiece suction surface.

• Other semiconductor manufacturing equipment

This is a Bernoulli chuck that accommodates warped wafers and thin wafers, offering excellent cost performance. It can be mounted on any type of robot in our atmospheric environment transport robots. We conduct verification using sample wafers and design to accommodate various sizes, warp amounts, and wafer thicknesses based on the customer's desired shape. The Bernoulli force attracts the workpiece to the substrate. To prevent shifting during transport, guides at the edge limit displacement. It levitates without contact except at the edges. One chuck is designed for one size of wafer. Since the attracting force is due to Bernoulli, it applies force over a wider area than vacuum suction chucks, making it effective for thin wafers. Additionally, it is non-contact on both sides, making it effective for wafers that cannot be contacted.

• Other semiconductor manufacturing equipment

This is a Bernoulli chuck that accommodates warped and thin wafers, offering excellent cost performance. It can be mounted on any type of robot in our atmospheric environment transport robots. We conduct verification using sample wafers and design to accommodate various sizes, warpage amounts, and wafer thicknesses based on the customer's desired shape. The Bernoulli effect is used to suction the workpiece against the substrate. To prevent shifting during transport, it is held in place by the frictional force of friction rubber. The chuck side makes contact, but it can be used interchangeably for different wafer sizes (note that this may not be possible depending on the combination), allowing for a thinner chuck compared to non-contact types. Since the suction is based on Bernoulli's principle, it applies force over a wider area than vacuum suction chucks, making it effective for thin wafers.

• Other semiconductor manufacturing equipment

Since the wafer can be centered during transport, it is suitable for transporting to stages such as drop-in stages. The front and rear directions of the wafer are guided and held by an air cylinder. The wafer is held by clamping the outer circumference without contacting the back surface. By clamping the outer circumference, centering of the wafer is possible. High-speed transport is achievable. The presence or absence of the wafer can be confirmed by the amount of movement of the guide.

• Other semiconductor manufacturing equipment

This is the SWCR series of waterproof 3-axis cylindrical coordinate robots (compatible with 300mm wafers, featuring inversion and edge grip functions). It can transport wafers in environments where water is present or where wafers are wet. It is capable of wafer transport in environments where humans cannot enter and touch the wafers due to the presence of chemical liquids. It has an IP64 protection rating and is suitable for wafer transport in acidic and alkaline atmospheres during the LSI manufacturing process. The arm section ensures corrosion resistance through Teflon coating. The arm joint section uses a V-seal for waterproofing. The joints of the components are sealed with a Viton gasket. The Z-axis section employs a bellows for waterproofing. It is equipped with an operation monitor. Control method: RS232C and parallel photo I/O. All axes use 2-phase stepping motors. Wafer transport is performed at high speed and high precision through S-curve acceleration and deceleration control. Wafer holding methods include vacuum suction, drop-in, and edge grip chuck. It can accommodate optimal chucks tailored to the transported objects and equipment layout.

• Other semiconductor manufacturing equipment

It can transport wafers in environments where water is present or in wet conditions. It is capable of transporting wafers in environments where people cannot enter and touch the wafers due to chemicals. It is suitable for transporting wafers in acidic and alkaline mist atmospheres during the LSI manufacturing process. The arm section ensures corrosion resistance with a Teflon coating. The arm joint section uses a V-seal for waterproofing. The joints of the components are sealed with a Viton packing. The Z-axis section can also accommodate a bellows for waterproofing. The adoption of a twin arm reduces wafer exchange time. It is equipped with an operation monitor. Control method: RS232C and parallel photo I/O. All axes use two-phase stepping motors. The S-curve acceleration and deceleration control allows for high-speed and high-precision wafer transport. Wafer holding methods include vacuum suction, drop-in, and edge grip chucks. It can accommodate optimal chucks tailored to the transported items and equipment layout.

• Other semiconductor manufacturing equipment

It can be used for high-speed transport of 450mm wafers. By using a traveling axis, we propose strokes according to the number of ports in the cassette. Adopting AC servo motors, it transports at high speed and high precision through optimized motion trajectories. Bernoulli chucks can be installed (optional). The Z-axis (elevation axis) can accommodate up to 500mm. By employing a traveling axis, it can access 4 FOUPs (450mm wafers) at high speed. Load capacity: Equivalent to 5kgf at the third joint of the arm (including chuck and workpiece). The use of a twin arm reduces wafer exchange time. The wall-mounted traveling axis achieves a low pass line. It is equipped with a motion monitor. Control method: RS232C and parallel photo I/O. S-curve acceleration and deceleration control allows for high-speed, high-precision transport of wafers. It can accommodate optimal chucks tailored to the transported items and equipment layout. Chuck materials can be various, including CFRP, aluminum, and ceramics. It uses AC servo motors with built-in absolute encoders on all axes.

• Other semiconductor manufacturing equipment

The wafer transport system, featuring a new transport method for LED applications, enables automatic supply and retrieval of wafers to and from a multiple wafer processing susceptor tray. It is equipped with aligners for both wafers and susceptors, allowing for the alignment of wafer orientation and the centering and indexing of the susceptors.

• Other semiconductor manufacturing equipment

The 300mm wafers are taken out from the FOUP cassette and sorted. The sorting patterns can be set arbitrarily, allowing for sorting that meets customer specifications. In addition to sorting, it can also be used as a loader/unloader for the equipment. By equipping a horizontal multi-axis robot (GCR4210-500-AM), it can access four cassettes without a travel axis. The adoption of a Z-axis stroke of 500mm allows for the placement of cassettes in two vertical tiers. By equipping the robot with an inversion axis, it can transport wafers without contacting the processing surface, even in the case of bottom-side processing. A mapping sensor is installed in the wrist block to detect wafers inside the cassette. The opening and closing doors are equipped with open/close detection sensors, and they are locked during robot operation for safety considerations. A glass (transparent work) compatible aligner is included (SAL3361GR). The integration with the customer's equipment can be modified as needed (HOST communication will be handled separately). Customization according to customer specifications is possible.

• Other semiconductor manufacturing equipment

Supports transportation requiring wafer positioning in semiconductor manufacturing equipment and inspection devices. Achieves a compact footprint for small-diameter wafers. Centers small-diameter wafers and positions the orientation flat and notch quickly and accurately.

• Other semiconductor manufacturing equipment

Equipped with a 3-position dead man's switch. Easy to operate for teaching, one-handed design. Lightweight at 500g (excluding cable). Features a self-diagnosis function for the push button through internal software.

• Other semiconductor manufacturing equipment

Compact and lightweight: Achieved a 50% reduction in volume compared to conventional products. High-speed inversion: Achieved a 20% increase in speed compared to conventional products (for 300mm wafers). (For small wafers, achieved a 50% increase in speed.) Low vibration: Realized low vibration through newly developed motor drivers and control methods. Compatible with various wafer holding methods such as vacuum suction, edge clips, and Bernoulli.

• Other semiconductor manufacturing equipment

Compact and lightweight design Stepping motor: Compatible with unipolar and bipolar Control interface available in two types: Serial and parallel IN 8Bit OUT 8Bit (I/O expansion possible) Operation achieves high speed and smooth motion through S-curve acceleration and deceleration control Easy teaching enabled by teaching box Flexible implementation of complex operations possible through composite commands

• Other semiconductor manufacturing equipment

It is suitable for transporting 300mm wafer sizes (random access compatible). It is widely used in atmospheric environment robots and holds the back surface of the workpiece by vacuum suction (negative pressure). By applying a conductive Teflon coating to the chuck surface, it prevents the transported workpieces from damage and scratches caused by static electricity.

• Other semiconductor manufacturing equipment

Contributes to failure analysis through video and communication log records 180 seconds before and after a trouble occurs. Capable of continuously recording images from up to 4 cameras. Cameras can be freely installed. Records the past 48 hours.

• Other semiconductor manufacturing equipment

Transport is possible in sterile rooms and clean environments such as medical and bio-related facilities. Microplate transport is also possible. The tilt mechanism allows for the tilting of petri dishes, enabling the suction of culture media and other liquids. Transport units can be attached to our various robots (this specification is designed for mounting on horizontal multi-joint robots).

• Other semiconductor manufacturing equipment

Industry's smallest class, enabling miniaturization of equipment. Our standard vacuum robot: 65% footprint (φ95mm), 75% reduction in volume. Arbitrary reach distance can be set by combining arms.

• Other semiconductor manufacturing equipment

Industry's smallest class, enabling miniaturization of equipment. Our standard atmospheric robot: 75% footprint reduction (□115x130mm), 80% volume reduction. Arbitrary reach distance settings are possible through arm combinations.

• Other semiconductor manufacturing equipment

The tilt mechanism allows for smooth cassette transport without wafer misalignment, and it can be customized to accommodate various cassette specifications. It is compatible with both batch and branch processing equipment.

• Other semiconductor manufacturing equipment

Protos, automatic transfer between cassettes without damage Equipped with a Bernoulli chuck, compatible with thin wafers Automatic identification of wafers and Protos spacers Automatic recognition of work height Customizable for multiple cassettes and various inch sizes

• Other semiconductor manufacturing equipment

Industry's smallest class, enabling device miniaturization Our standard atmospheric aligner: 80% footprint reduction (□85x100mm), 80% volume reduction Contributes to a variety of transport scenarios through combinations Compatible with transparent and translucent materials respectively

• Other semiconductor manufacturing equipment

A compact tabletop system that integrates the wafer inspection stage and the transport section. It features a long-stroke design with an X-axis of 190mm and a Y-axis of 200mm, allowing for wafer rotation operations at any position using a knob at hand. The transport robot has two chucks and can complete the wafer exchange operation to the inspection stage in a short time. The combination of the robot and the drop-in alignment stage achieves a low-cost, space-saving, and high-functionality system.

• Other semiconductor manufacturing equipment

High-speed and high-precision positioning based on the outer circumference of a 450mm silicon wafer and the T7 code or notch. Utilizes a uniquely developed image sensor, with a motor driver and controller built into the main unit. Compatible with changes in spindle shape and material. Control method: RS232C and parallel photo I/O. A type that can accommodate both 450mm and 300mm wafers can also be manufactured. A version with a Z-axis capable of wafer re-gripping operation can also be produced.

• Other semiconductor manufacturing equipment

This is a 4-axis cylindrical coordinate clean robot designed for super clean rooms. It is a new type of twin-arm robot compatible with 2-inch to 300mm wafers, achieving low cost, high-speed transport, and no loss of steps. It employs closed-loop control that does not lose steps even under rapid load fluctuations or sudden acceleration, further enhancing the robot's reliability. By incorporating an absolute encoder, it can grasp its current position and reduce the time required for operation after returning to the origin. It is equipped with a mechanical multi-turn absolute sensor that does not require a battery. It is compatible with conventional models (mounting compatibility and performance compatibility), allowing for easy replacement. The high rigidity arm has a third joint equivalent to 3 kgf (including wrist block, chuck, and workpiece). Arm variations include: 100mm, 130mm, 160mm, and 200mm. Depending on the device layout, it is possible to choose the mounting method for base type or flange type devices. A Bernoulli chuck can be installed (optional).

• Other semiconductor manufacturing equipment

This is a three-axis cylindrical coordinate clean robot for super clean rooms. It is a new type of single-arm robot compatible with 2-inch to 300mm wafers, achieving low cost, high-speed transport, and no loss of step. It employs closed-loop control that prevents loss of step even under rapid load fluctuations and acceleration, further enhancing the reliability of the robot. By incorporating an absolute encoder, it can grasp its current position and reduce the time required for operation after returning to the origin. It is equipped with a mechanical multi-turn absolute sensor that does not require a battery. It is compatible with conventional models (mounting compatibility and performance compatibility), allowing for easy replacement. The high rigidity arm has a third joint equivalent to 3kgf (including wrist block, chuck, and workpiece). Arm variations: 100mm, 130mm, 160mm, 200mm. Depending on the device layout, it is possible to choose a mounting method for base type or flange type devices. A Bernoulli chuck can be mounted (optional).

• Other semiconductor manufacturing equipment

A new type of aligner compatible with various wafer sizes from 100 to 200 mm. It can perform alignment without being affected by wafer materials such as silicon wafers, silicon wafer BG tape (milky white), transparent, and translucent wafers. Utilizing a uniquely developed image sensor, it incorporates a motor driver and controller within the main unit. It is also possible to change the spindle diameter, shape, and material according to wafer size and material. Bernoulli spindles can also be equipped. Control method: RS232C and parallel photo I/O. It is possible to accommodate notches and orifices that are not specified in SEMI standards. Models with a Z-axis capable of wafer re-gripping operations can also be produced.

• Other semiconductor manufacturing equipment

The "Bernoulli Tweezers" are lightweight, compact tweezers that can hold thin wafers using the Bernoulli effect. Since they do not rely on suction, the risk of wafer damage is minimized. The tips are flexible, allowing for easy placement as well as retrieval and storage from wafer cases and cassettes. Additionally, they can accommodate various special workpieces, not just wafers. 【Features】 ■ Can hold workpieces without suction due to the cyclone effect ■ Contact with the workpiece is made through pads (material: fluororubber), which mitigates impact during holding and eliminates the need for a holding guide ■ The use of flexible tubing allows for adjustment to any angle preferred by the operator 【Lineup】 ○ BRP-01 → A shorter type of tip unit suitable for flat placement and wafer cases ○ BRP-02 → A longer type of tip unit suitable for horizontal cassettes For more details, please contact us or download the catalog.

• Other work tools

The FTVHR4000 series clean robot, compatible with mask and glass substrates and designed for four-axis cylindrical coordinate link-type high vacuum applications, is suitable for transporting mask and glass substrates within LCD manufacturing equipment and inspection devices. It transports glass substrates at high speed and high precision through S-curve acceleration and deceleration control. It can accommodate optimal chucks tailored to the transported items and equipment layout. For more details, please contact us or refer to the catalog.

• Transport and handling robots
• Other industrial robots

The LVHR3000 series vacuum-compatible clean robot with a 3-axis cylindrical coordinate system, designed for glass substrates, is suitable for transporting glass substrates in liquid crystal manufacturing equipment and inspection devices. It transports glass substrates at high speed and high precision through S-curve acceleration and deceleration control. It can accommodate optimal chucks tailored to the transported items and equipment layout. For more details, please contact us or refer to the catalog.

• Transport and handling robots
• Other industrial robots

The LTHR4000 series clean robot with a 4-axis cylindrical coordinate system compatible with glass substrates is suitable for transporting glass substrates in liquid crystal manufacturing equipment and inspection devices. With a Z stroke of over 760mm, the Z-axis is multi-stage, allowing for low pass line configuration. It can accommodate optimal chucks tailored to the transported items and equipment layout. For more details, please contact us or refer to the catalog.

• Transport and handling robots
• Other industrial robots

The LHR3000 series clean robot with a 3-axis cylindrical coordinate system compatible with glass substrates is suitable for transporting glass substrates in liquid crystal manufacturing equipment and inspection devices. With a Z stroke of over 760mm, the Z-axis is multi-stage, allowing for low pass line configuration. It can accommodate optimal chucks tailored to the transported items and equipment layout. For more details, please contact us or refer to the catalog.

• Transport and handling robots
• Other industrial robots