ケイ・オール List of Products and Services

With over 30 years of experience in the industry, K-All has consistently been involved in PCB assembly and has numerous achievements in reballing and reworking high-difficulty "underfill BGA." We provide a clear explanation of the fundamental knowledge of PCB assembly! We explain various terms, including "BGA," "CSP," "spectroscopic analysis equipment," "Vickers hardness," and "flow characteristics." We encourage you to read it. **Contents (partial)** ■ ABC: BGA/CSP/DIP/IPC standards/JIS standards/LGA ■ A section: Printability/Whisker/Wafer Level CSP/Liquid Phase Line Temperature ■ K section: PCB cleaning/Capillary Ball/Aggregation Force/Eutectic Solder ■ S section: Side Ball/Oxides/Initial Wettability/Squeegee ■ T section: Heat Resistance/Chip Stand/Claw/De-wetting/Dispenser ■ N section: Lead-free/Wettability/Adhesive Retention Time *For more details, please refer to the PDF document or feel free to contact us.*

• Printed Circuit Board

"Solder resist" is an insulating film approximately 30μm thick that is applied to the surface of printed circuit boards, and it is often simply referred to as "resist." The colors known are green, blue, red, yellow, black, and white. The prevalence of green is commonly attributed to the fact that patterns are more visible and easier on the eyes of inspectors. One of the purposes of applying this resist is to "prevent solder adhesion to unnecessary areas (to prevent solder from adhering to unintended places)," but this perspective is from the viewpoint of the applicator. In this blog, we introduce "solder resist" from the design and implementation perspective. *For more detailed content of the blog, you can view it through the related links. Please feel free to contact us for more information.

• paint

This time, we will introduce examples of defects found in X-ray inspections. For each defect, we will also explain the state before implementation and provide photos taken with a microscope. Our company also offers "inspection only" services using X-ray and microscopes. We can inspect not only BGA but also QFN, CSP, LGA, etc., and we can accommodate even a single piece, so please feel free to consult with us. You can view detailed information through the related links, so please take a look. 【Examples of defects in X-ray inspections】 ■ Solder shorts ■ Ball dropouts ■ Ball defects ■ Solder flow (shorts) *For more details, please refer to the PDF materials or feel free to contact us.

• Contract manufacturing

When we talk about "high-difficulty BGA rework," what kind of content do you imagine? Underfill, high-layer-count PCBs, jumpers from all BGA pins, and so on—these are things that are visually recognizable as "difficult." However, there are also aspects that are not easily understood just by appearance. One of these is "BGA rework on PCBs that are prone to warping (distortion)." Our company employs various methods to suppress warping, but there are some PCBs that are not easily managed, leading to ongoing struggles. This time, we have recreated the condition of a BGA when warping occurs. You can view the detailed content through the related links, so please take a look. *For more details, please refer to the PDF materials or feel free to contact us.

• Other semiconductors

Due to the current social situation, many people may be struggling with "the delivery times for semiconductor ICs." At K-All, we offer a 'Component Reconditioning Service' that may help break this situation. We accept requests without limiting the quantity. From small lot reconditioning of a minimum of one piece to large lot reinstallation, please leave it to us. You can view the detailed information through the related link, so please take a look. 【Component Reconditioning Service Details】 ■ Removal of specific components from your existing circuit boards ■ Solder removal work on the removed components ■ Reinstallation onto a different circuit board *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductors

At K-All, we have accumulated various work methods and technical research, enabling rework operations even on devices coated with various underfill materials! Using techniques such as replacement, re-implementation, re-balling, re-heating, underfill filling, BGA jumpers, and POP implementation for BGA, LGA, QFN, etc., we solve various issues related to circuit boards and devices. In this document, we present technical materials regarding BGA rework technology. Hardened underfill materials seal the BGA, significantly improving strength and effectiveness; however, rework tasks such as removal and component replacement become more challenging than standard rework processes. Our company has been working diligently to ensure that rework operations can be performed even on devices coated with various underfill materials. [Features of Underfill] - Uses a one-component heat-curing epoxy resin - Can reduce external stress - Prevents stress concentration on the connection surface of solder balls - Widely used in mobile devices, including mobile phones *For more details, please contact us or download the catalog!

• Circuit board design and manufacturing

In times of need, our employees will work together to meet the desired delivery date. Flexibility in technology and quality response is essential for prototype implementation. This is a service we want to offer to those who are facing concerns such as, "We have a very tight deadline for our implementation project, but there are no manufacturers willing to take it on." When time is short, Keio will be here to help. [Examples] ■ The prototype boards produced by another company failed twice, leaving almost no lead time for implementation. ■ The pad sizes of the components do not match the board. *For more details, please refer to the PDF document or feel free to contact us.

• Contract manufacturing

We save our customers' important circuit boards through high-difficulty special modifications and achieve shortened delivery times, providing results that exceed simple board remakes. This is a service we would like to offer to those who have concerns such as, "I want to swap patterns for testing but want to keep costs down." With over 25 years of know-how, we can handle BGA jumpers and more. 【Examples】 ■ I don't have time to revise, so I want to make it work somehow with BGA jumpers. ■ I want to create an IC checker with PC⇔USB connection specifications. ■ I mistakenly swapped the patterns of the BGA pin by pin, so I want all pins wired with jumpers from the BGA. *For more details, please refer to the PDF document or feel free to contact us.

• Contract manufacturing

Rework technology is a point of pride for K-Oll. We are continuously honing our skills to handle high-difficulty components, which have seen an increase in implementation due to the miniaturization and high density of parts in recent years. This service is aimed at those who have concerns such as "I want to remove it, but the difficulty is high, and I am looking for a company that can rework high-difficulty components." 【Examples】 ■ I selected a BGA with a narrow pitch but am struggling to implement it. ■ A prototype board for SMT products with shield terminals (CN/LGA) is not functioning at all, and I want to replace the CN and reuse the LGA. *For more details, please refer to the PDF document or feel free to contact us.

• Contract manufacturing

For the implementation of special substrates and components for which no spares can be prepared, prior arrangements are extremely important. We propose suitable solutions regarding temperature conditions and implementation methods. In particular, we have accumulated know-how on profiles suitable for various types of substrates. Leave the implementation of difficult substrates, such as high-layer, high-current substrates, flexible substrates, and aluminum substrates, to us. 【Examples】 ■ Struggling with the implementation of thick substrates ■ Wanting to implement on an extra-large substrate (external dimensions 1m square) that cannot be fed into a reflow or mounter *For more details, please refer to the PDF materials or feel free to contact us.

• Contract manufacturing

"BGA jumper wires" refer to modification work that is carried out to correct or repair wiring when there has been a mistake in the pattern at the BGA location mounted on the circuit board, or for purposes such as circuit changes. Kei-All is actively engaged in many high-difficulty tasks, including investigating and analyzing individual terminals of BGA and CSP, and assisting in correcting patterns by connecting wiring between terminals and from terminals to other components. [Features] ■ BGA jumper capable up to 0.4mm pitch ■ Wiring possible from underneath the BGA, allowing for pattern swapping and signal verification ■ Can be mounted on the circuit board even with wiring from the BGA *For more details, please refer to the PDF document or feel free to contact us.

• Contract manufacturing

POP (Package On Package) is a technology that increases integration density by stacking IC packages that were previously arranged in a two-dimensional layout on a circuit board. It is primarily used in industries that manufacture mobile devices such as mobile phones, portable music players, and car navigation systems, where high-density implementation is required. By adopting a stacked structure for the packages, it allows for the combination of packages with different functions. 【Features】 ■ Reduces the occupied area of the package after implementation ■ Enables the combination of packages with different functions by using a stacked structure ■ Minimizes wiring between packages, reducing the impact of reflections and noise, and our company also supports POP configurations with three or more layers *For more details, please refer to the PDF materials or feel free to contact us.

• Contract manufacturing

Kei-Oll has numerous achievements in reballing and reworking with high-difficulty "BGA with underfill." Additionally, we can handle a wide range of micro sizes below 5×5mm and ball pitches from 1.27mm to 0.25mm, and we are capable of reballing for irregular and special pitch arrangements. We can assist in removing and reballing devices that are hard to obtain from other boards for implementation, especially when strict deadlines need to be met. 【Features】 ■ Two types of reballing technology (Capable of ball mounting using cream solder printing methods and dedicated flux application methods) ■ Supports micro-sized packages down to 5×5mm ■ Can accommodate changes in solder conditions (Composition changes from lead-free solder to eutectic solder are also possible) ■ Supports a wide range of pitches, including special pitches (Capable of handling ball pitches from 1.27mm to 0.25mm) *For details, please download the PDF or contact us.

• Contract manufacturing

To maintain the quality of products that cannot be visually inspected after reflow, we conduct checks using 'X-ray inspection.' In pursuit of high quality, we have established detailed inspection standards. These are critical items that determine the quality of the products. We perform inspections on all components that cannot be visually inspected, such as BGA, QFN, SON, DFN, LGA, and connectors. 【Features】 ■ Achieves high resolution and high density analysis capabilities with the X-ray TV inspection device (Softex WORK-LEADER 90). ■ Detailed inspection standards are set in pursuit of high quality. ■ Critical items that determine the quality of the products. *For more details, please refer to the PDF document or feel free to contact us.

• Contract manufacturing

BGA is mounted on the printed circuit board by solder balls. Due to weak connection strength, there may be cases where the reliability of the connection cannot be maintained due to the detachment of the BGA or the occurrence of cracks at the solder joints in response to external stresses such as impact or bending. To address such issues and improve connection reliability, a sealing resin called underfill is used in the gap between the component and the board. 【Features】 ■ Uses a one-component heat-curing epoxy resin ■ Can reduce external stresses ■ Prevents concentration of stress at the connection surfaces of the solder balls ■ Widely used in mobile devices such as mobile phones and music players *For more details, please refer to the PDF document or feel free to contact us.

• Contract manufacturing

At Kei All, we can utilize our achievements and experience with LGA just like we do with BGA, allowing us to perform removal, installation, replacement, and modification. However, BGA and LGA are similar yet distinct, and it is precisely because we understand the characteristics of LGA that we can carry out rework tasks. If you are experiencing issues such as "frequent shorts in LGA assembly" or "wanting to reball LGA to convert it to BGA," please feel free to consult with us. If you have any problems with LGA, we will resolve them using our past achievements and know-how. 【Features】 ■ Addressing various issues with reliable technology ■ Rework capability allows for recovery in case of emergencies ■ Comprehensive inspection, starting with the first board, followed by the assembly and rework of the remaining boards *For more details, please refer to the PDF document or feel free to contact us.

• Contract manufacturing

"BGA rework" refers to the process of partially heating BGA devices on completed circuit boards using specialized rework machines, tailored to specific needs. At K-All, we can handle both eutectic and lead-free soldering, and we have received positive feedback from many customers. We can perform work tailored to customer requests and the condition and symptoms of the circuit board. 【Features】 ■ Stable cleaning operations for circuit boards and removed devices ■ Cream solder supply (printing and coating) technology ■ Support for 0402 chips and micro-sized packages ■ Compatibility with large and multilayer circuit boards ■ Ability to accommodate a wide range of pitches, including special pitches *For more details, please refer to the PDF materials or feel free to contact us.

• Contract manufacturing

At K-Oll, we conduct "circuit board manufacturing" through our partner companies. Orders are placed according to each company's strengths and customer requests, such as low cost and short delivery times. We propose suitable manufacturing plans taking into account the schedule for repeat production. We have a wide range of partners, from flexible board manufacturers that excel in small-lot prototypes to those capable of mass production. 【Features】 ■ Numerous partner companies through our network since establishment ■ Orders placed according to each company's strengths and customer requests, such as low cost and short delivery times ■ We propose suitable manufacturing plans considering the schedule for repeat production *For more details, please refer to the PDF document or feel free to contact us.

• Contract manufacturing

At K-All, which has an in-house design team, our specialists quickly and accurately respond to customer requests with accumulated expertise. Circuit design focuses on circuit tracing, while PCB design covers a wide range from single-sided boards to build-up boards. We also conduct simulations, primarily focusing on signal quality analysis and delay analysis, and we propose topologies. 【Features】 ■ Design that incorporates feedback from implementation know-how ■ Designs tailored for prototypes and mass production, respectively ■ Support from component selection to procurement ■ Suggestions for alternatives for hard-to-obtain components ■ Electrical testing is also conducted to provide higher quality products ■ Circuit design is accepted starting from circuit tracing *For more details, please refer to the PDF materials or feel free to contact us.

• Contract manufacturing

At Kei All, we have been primarily engaged in the prototyping, repair, and modification of circuit boards since our founding. We can handle essential tasks such as pattern cutting and jumpers for circuit modifications, as well as the installation and replacement of components that are thought to be impossible with a soldering iron. We can also repair circuit board foot patterns, allowing even boards that were thought to be beyond repair to be revived. We have received a great deal of trust and achievements from many customers. Before giving up on a circuit board, please consult with us first. 【Features】 ■ Short delivery times available ■ Problem-solving with extensive experience and reliable technical skills ■ Rich track record in both eutectic and lead-free soldering ■ Collaboration with the design group for the production of conversion boards and more ■ Please consult us about projects that other companies have declined as "impossible" *For more details, please refer to the PDF materials or feel free to contact us.

• Contract manufacturing

We perform accurate "manual placement" using our unique K-OHL drawings. Implementation of components from 0402 chips to QFPs, connectors, and BGAs is also possible. We have numerous achievements in aerospace and defense-related fields. Depending on the soldering conditions, we identify not only the workbench but also tools, and carry out work in an organized environment. 【Features】 ■ Support from a single piece ■ Manual placement possible with a dispenser even without a metal mask ■ Various components, including BGAs, can be manually placed using rework machines ■ Implementation is possible even without mounting data ■ Suitable for loose components ■ Manual placement on flexible substrates is also possible *For more details, please refer to the PDF document or feel free to contact us.

• Contract manufacturing

The printed circuit board assembly is divided into various processes, but at our company, we can respond with a one-stop service, of course, and we are capable of handling any stage or process at any time. With the technical skills we have cultivated since our founding, we can accommodate "hand soldering" for small components, as well as "press-fit" using specialized tools, "shipping inspection (using inspection machines)," and "underfill removal and application." Please feel free to contact us when you need our services. 【Examples of Contracted Processes (Excerpt)】 ■ Hand soldering ■ Hand placement ■ Mounter ■ Modification ■ Correction *For more details, please refer to the PDF document or feel free to contact us.

• Contract manufacturing

In the "Pre-shipment Inspection," we conduct inspections of assembly, soldering, appearance, and modifications based on IPC-A-610 Class 2 (assembly standards). For assembly inspection, we use appearance inspection equipment. We program the NG items for the target components and conduct inspections for all pins within approximately 5 seconds. Components are registered in a library for each customer, so if the same components are used in different projects, we can achieve the same quality finish. 【Features】 ■ Manufacturing is carried out consistently from the production process to the inspection process using "tact diagrams." ■ Solder inspections are conducted visually at all points. ■ We have a wide range of inspection equipment available. *For more details, please refer to the PDF document or feel free to contact us.

• Contract manufacturing

The features of K-All's "Mounter Implementation" are its ability to specialize in prototype production. In the case of prototype implementation, there may be instances where parts are inevitably supplied as cut or loose components. Our company can handle work with a mounter starting from just one piece, even with cut or loose supplies. 【Features】 ■ Capable of handling from one piece to medium lot and mass production ■ Efficient implementation suitable for various conditions ■ Capable of accommodating various types such as new package types, flexible substrates, and multilayer boards ■ Suitable mounter support ■ Difficult-to-obtain parts can be added later ■ Free provision of CR stock during prototyping *For more details, please refer to the PDF document or feel free to contact us.

• Contract manufacturing

We respond to various needs for "manual assembly" at K-All, with highly qualified technicians performing the work responsibly. We can also handle special materials such as flexible substrates and those with high heat dissipation, including aluminum and ceramics. Additionally, we can accommodate a wide range of components, from 0.4mm pitch connectors and QFPs to microchips. You can also rely on us for reflow-incompatible components, including PWBs larger than 500mm, with a thickness of over 4mm, as well as components with varying heights and heat resistance. 【Features】 - Capable of manual assembly for 0201 chips - Manual soldering for connectors and QFPs with a narrow pitch of 0.4mm - Capable of manual assembly for high-difficulty components - Manual assembly for flexible substrates is also possible - Supports both eutectic solder and lead-free solder *For more details, please refer to the PDF materials or feel free to contact us.

• Contract manufacturing

"Prototyping and Implementation" refers to the stage before mass production, where small to medium quantities are produced. During this phase, we confirm electrical compatibility and functionality, and sometimes make specification changes, which can be seen as the "preparation" for a safer transition to mass production. ■Advantages By conducting performance evaluations before mass production implementation, we can avoid unexpected issues during mass production and prevent significant modifications in advance, thus mitigating impacts on schedules and costs. By adapting to the situation and conducting "prototypes of prototypes" or "prototypes of prototypes of prototypes," we can enhance the effectiveness of this process. ■Disadvantages It may be necessary to purchase cut parts or individual components, which can be overly cumbersome. In factories that are engaged in mass production, there may not be enough processes available to dedicate to low-quantity prototype boards. *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

●In an Era of Difficulty in Procuring Semiconductor Devices In recent years, it has become well-known that components such as semiconductor devices and connectors are difficult to procure due to issues like material shortages. There have been reports indicating that procurement can take several years, and we have heard the lamentations from our customers. At K-All, with 30 years of experience since our founding, we can safely remove necessary components from existing circuit boards thanks to our continuously refined assembly and rework technology! This enables us to procure hard-to-find components in a short time and at low cost! We offer a service that provides benefits to our customers. *For more details, please contact us or download the catalog!*

• Other semiconductors

We can collaborate using underfill BGA rework technology. We can handle everything from the removal of underfill and coated components (such as BGA and CSP) to reballing, replacement, and reinstallation. The cured underfill material seals the BGA, significantly improving its strength compared to standard BGAs, and while its effectiveness is tremendous, the rework tasks such as removal or component replacement are more challenging than typical rework processes. At K-All, we have worked on methods and technical research to ensure that rework can be performed even on devices with various underfill materials applied. We can handle everything from component removal to reballing and replacement reinstallation. Rework and reballing are also possible for BGAs and CSPs that have undergone underfill and coating treatment. We can replace solder balls on BGAs and CSPs from lead-free to eutectic. We maintain over 5,000 types of masks for rework. ● For more details, please download the catalog or contact us.

• others

We have accumulated cutting-edge technology in the prototyping, modification, and rework of printed circuit boards, fully supporting product development for manufacturers and design companies! <Our Services/Features> ● Prototyping - We can accommodate various requests from mounting machine assembly to manual placement. - We can handle even single-piece machine assembly. - We can implement under both eutectic and lead-free conditions. ● Pattern Design - We have a dedicated development and design team with specialized expertise in-house. - Supported CAD: CADLUS ONE, Zuken CR-5000 BD, ALTIUM DESIGNER, etc. ● Modification and Rework - We can replace even a single chip. - We support BGA/LGA/QFN rework, reballing, and reassembly. - We can replace chips as small as 0.2mm x 0.1mm. - Semiconductor reuse: we can remove necessary components from existing boards for reuse. ● Component Inventory and Procurement - We procure appropriately through routes from several dozen companies. - We provide commonly used components for prototyping free of charge. → Capacitors: MURATA size (1608/1005) → Resistors: KOA size (1608/1005)

• Circuit board processing machine

● We will create the shape that the customer desires. We will create various jigs and substrates tailored to the customer's requests! Even for special substrates, Keio can manufacture them, so we will design substrates that can be produced while having preliminary discussions in-house. ● For more details, please download the catalog or contact us.

• Printed Circuit Board

In K-All's special modifications, we save our customers' important circuit boards through challenging and specialized modifications such as jumpers from the inner layers of the substrate and jumpers from LGA, achieving shorter delivery times and providing results that exceed simple circuit board remakes. Just like with regular pattern cuts and jumpers, we can also perform jumpers and pattern cuts for BGA and LGA. In most cases, this can be done at a lower cost and with a shorter lead time compared to circuit board revisions, so please don't hesitate to consult us. 【Features】 ○ Save important circuit boards with challenging special modifications ○ Achieve shorter delivery times ○ Provide results that exceed simple circuit board remakes For more details, please contact us or download the catalog.

• Other contract services

0402 and 0201 chips are components that have a very high difficulty level for modifications, proportional to the space-saving design of the circuit board. At K-All, we are also working on modifications for 0402 and 0201 chips and possess a wealth of know-how and proven results. Manual work can be completed in about one-fifth of the time compared to using rework machines. Additionally, we also design circuit boards equipped with 0402 and 0201 chips, offering designs that are proven to minimize defects. 【Features】 ○ Manual correction of Manhattan and chip misalignment ○ Both eutectic and lead-free options available ○ Extensive know-how and proven results ○ Capable of accurate and rapid responses ○ Work can be completed in a shorter time than with automatic repair machines For more details, please contact us or download the catalog.

• Other contract services

At Kei All, we are capable of handling high-difficulty implementations and reworks. Recently, there has been a significant increase in components such as leads and thermal pads. These types of components can be very difficult to rework due to their shape and the configuration of the circuit board, as they tend to be less susceptible to heat. Rework technology is one of Kei All's proud strengths. We are continuously honing our skills to address high-difficulty components, which have been increasing in number due to the miniaturization and high density of parts. 【Features】 ○ Support for high-density, ultra-miniature components such as small camera modules and fine-pitch 0.3mm devices ○ Capability for high-difficulty implementations and reworks ○ Continuous technical training and skill development For more details, please contact us or download the catalog.

• Other contract services

Kei-Oll's special substrate mounting supports difficult-to-specify substrate implementations such as high-layer, high-current substrates, flexible substrates, and aluminum substrates. For the mounting of special substrates and components for which spares cannot be prepared, prior arrangements are extremely important. We will propose optimal solutions regarding temperature conditions and mounting methods. In particular, we have accumulated know-how on profiles suitable for various types of substrates. 【Features】 ○ Special substrates are our specialty! ○ Supports various substrates → Multi-layer substrates, aluminum core substrates, large substrates, thick substrates, thin substrates, irregularly shaped substrates, etc. ○ Adequate and safe profiles with abundant know-how ○ Proposes optimal solutions regarding temperature conditions and mounting methods For more details, please contact us or download the catalog.

• Other contract services

At K-All, we can handle POP implementation and rework. The PoP technology, which stands for "Package on Package," is a technique that allows for the stacking of ICs and components on top of an IC package. With the technology of POP implementation, BGA implementation with an interposer board is also possible. Compared to jumper wiring, QCD (Quality, Cost, Delivery) is improved. It enables low-cost evaluation and signal conversion for BGA. Through discussions between our customers and K-All's design team, we promise reliable QCD. 【Features】 ○ Capable of POP implementation and rework ○ If there are many correction points, we can propose POP implementation using an interposer board ○ We can consider and propose the merits and demerits of both jumper and interposer board options For more details, please contact us or download the catalog.

• Other contract services

At Kei All, we accept BGA rework even for boards that are not implemented in our own line. If it is at an early stage of the process, rework may be easily performed. We often receive requests for difficult BGA rework and reballing from other assembly companies in the industry. We support "BGA rework and reballing work that cannot afford to fail," especially for high-cost and hard-to-obtain devices. [Features] - Support for device rework - BGA rework compatible For more details, please contact us or download the catalog.

• Other contract services

In the composition change of K-All's solder, we will switch from lead-free balls to eutectic balls. If the solder specifications of the substrate and the solder balls of the BGA differ, unexpected troubles may arise. K-All also conducts work to prevent implementation troubles by removing solder with different specifications and then attaching solder balls that match the specifications. We propose a reliable method while making use of your existing BGA. 【Features】 ○ Specification change from lead-free balls to eutectic balls ○ Preventing implementation troubles in advance through composition changes ○ Proposing a highly reliable method For more details, please contact us or download the catalog.

• Other contract services

At Kei All's EMS service, we provide proposals that satisfy our customers regarding total quality, cost, and delivery time, with a focus on implementation and manufacturing, which we can uniquely offer as an implementation company. We accept contracts for various processes, either as a whole or by individual steps, including PCB design, PCB ordering, component purchasing, metal mask ordering, assembly, simple testing, coating work, X-ray inspection, cleaning (AS-300), underfill application, 0402/0201 chip modification and repair, PCB splitting, assembly testing, retrofitting only, visual inspection only, and pattern modification. 【Features】 ○ EMS compatible ○ One-stop service from design to assembly and integration ○ Support for PCB shape, component placement, and component selection ○ Total support for quality, cost, and delivery time For more details, please contact us or download the catalog.

• Other contract services