エイ・エス・エイ・ピイ List of Products and Services

This product is an automatic batch equal magnification exposure device (mask aligner) equipped with a UV-LED light source. One of our features is that it allows for fully non-contact automatic parallel adjustment of the stage and mask for the photomask and wafer. By incorporating a super-precision UVW drive stage and performing high-performance image processing, the alignment of the photomask and wafer is also carried out accurately. It supports exposure methods including proximity, soft, and hard contact. We offer a lineup that matches production volume, from manual machines to fully automatic machines, and since we handle everything from design to manufacturing and sales in-house, we have achieved low prices. 【Features】 ■ Compatible with i-line (365nm) and H-line (405nm)! (Please consult us for g-line) ■ Non-contact parallel alignment and exposure of photomask and wafer ■ Auto-alignment function ■ Easy setup change and compatible with multiple substrate sizes ■ Space-saving & easy maintenance ■ Achieves low cost and compact design, suitable for small-batch production of various types ■ Equipped with a super-precision UVW stage *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

No need for setup changes due to different wafer sizes, leading to increased productivity! There is a strong demand for different inch sizes depending on the type of product, and a desire to handle larger wafer sizes in the future. Therefore, we offer a lift-off device that can process multiple sizes without the need for setup changes. 【Examples of compatible multiple sizes】 "2-3", "2-4", "3-4", "4-6", "6-8" inches 【Also compatible with thin wafers!】 We often hear concerns that high-pressure jets might break thin wafers (substrates). Our company has a proven track record of lift-off with GaAs wafers of 120um thickness (pressure 3MPa). Pressure adjustments can be freely made depending on the device. 【Benefits of no setup changes for multiple wafer sizes】 ■ Reduced downtime and high operational efficiency ■ Prevents damage to equipment and devices due to adjustment errors after setup changes ■ Reduces processing recipe selection errors with automatic wafer size recognition ■ Burr removal ■ No reattachment of metal Please consider a demonstration first!

• Resist Device

Complete removal of stubborn resist that has become difficult to remove with a combination of a leaf-type device for DIP-level swelling and ultra-high pressure jet! ● Stubborn resist can be removed with repeated processing of swelling and high-pressure jet! - Resist that has become difficult to remove after high-temperature baking - Resist after dry etching - Resist deep within fine patterns Additionally, there is no issue with burrs or metal reattachment that can occur with DIP processing! This ultra-high pressure jet lift-off device is ideal for patterning thick films such as thick metal and oxide films that are difficult to etch. ● Compatible with thin wafers! We often hear concerns that high-pressure jets might break thin wafers (substrates). We have a track record of lift-off with GaAs at a thickness of 120um (pressure 3MPa). Pressure adjustments can be freely made depending on the device. 【Features】 ■ Swelling comparable to DIP! ■ Ultra-high pressure jet with MAX 20MPa ■ Repeated processing of swelling and ultra-high pressure jet possible! ■ Burr removal ■ No metal reattachment ■ Usable for cleaning resist, polymers, and masks Please consider a demo first!

• Resist Device

This is a super high-pressure jet lift-off device suitable for the difficult patterning of thick films, such as metal and oxide films, that are challenging to etch. Super high-pressure jet lift-off can effectively remove resist that has become difficult to remove due to heat or plasma! In the past, it was easily removed using the DIP process, but it has gradually become harder to remove... In response to the voices of such users, the super high-pressure jet lift-off device was developed! 【Features】 ■ Sprays a super high-pressure jet of up to 20 MPa ■ Removes burrs during lift-off ■ No re-adhesion of metal! ■ No risk of breaking even with thin wafers ■ Can also be used for cleaning resist, polymers, and masks ■ Chemical recycling system (optional) Some companies refer to increasing the pressure of a two-fluid spray as a high-pressure jet, but our super high-pressure jet operates at an impressive 20 MPa! Depending on how it is used, it can even etch glass. Of course, when used correctly in combination with our spin technology, stubborn resist can be easily removed. Additionally, there are no issues with burrs or re-adhesion of metal that can occur with DIP processing! Please consider a demonstration first!

• Resist Device

Introducing a manual lift-off device that excels in research and development applications! It can shorten long processes, such as lift-off using ultrasound or spray after soaking overnight in acetone or a dedicated stripping solution. By utilizing our unique special nozzle with high-pressure jets, we achieve high-speed processing and strong stripping power with sheet processing, while also reducing the amount of chemical solution used. Furthermore, we have examples where the combination of our unique temperature control swelling and high-pressure jets has reduced processing time from 24 hours to just 3 minutes! In addition to metal and oxide film stripping, it can also be used as a cleaning device for resist, polymers, and masks, capable of stripping stubborn resist after thermal treatment or dry etching. Moreover, there are no issues with burrs or metal reattachment that can occur with DIP processing. This high-pressure jet lift-off device is ideal for patterning thick films, such as thick metal and oxide films, which are difficult to etch. 【Features】 ■ High-pressure jet capable of processing in a short time with a maximum of 20 MPa ■ Removal of burrs during lift-off ■ No metal reattachment ■ Resist stripping is also possible ■ Reduction of scratches with a unique recipe ■ Chemical recycling system (optional) Please consider a demo first!

• Resist Device

This is a device that automatically transports, lifts off, and rinses just by setting the wafer (substrate). The lift-off process removes burrs with a high-pressure jet from the ASAP special nozzle and performs metal separation. Although it cannot be set with a cassette (carrier), unlike manual processes, it automatically transports each wafer, eliminating concerns about eccentricity or positional misalignment! With dry-in and dry-out processing, operators do not have to worry about chemical residue. The greatest advantage of lift-off is that thick metal can be blown away instantly with a high-pressure jet, making lift-off possible! Our biggest advantage is the combination of temperature-controlled stripping solution and high-pressure jet, which can also strip difficult-to-remove resist. Processes that involve brush cleaning or applying pressure for stripping can be easily replaced with high-pressure jets. [Features] - High-pressure jet lift-off up to 20 MPa - Removal of burrs during lift-off - No reattachment - Combination of temperature control and high-pressure jet - Recycling system for temperature-controlled chemicals (optional) Please feel free to try it out with a free demo!

• Resist Device

Our scrubber equipment utilizes a high-pressure jet with our unique special nozzles, achieving high-speed processing and high cleaning power through sheet processing, while also reducing the amount of chemical solution used. The nozzles can be selected from various methods, including high-pressure jet, two-fluid spray, and one-fluid spray, and combinations of these methods are also possible. We have a proven track record not only in wafer cleaning but also in photo mask cleaning. Additionally, there is no re-adhesion of particles, which is a common issue with DIP processing. The cleaning solution used is pure water, but organic solvents such as NMP can also be selected depending on the specifications. 【Features】 ■ High cleaning power with high-pressure jet method ■ Options for two-fluid and one-fluid spray nozzles! ■ Combinations of high-pressure jet with two-fluid and one-fluid sprays are also selectable ■ No particle re-adhesion *Please feel free to contact us for more details.

• Other semiconductor manufacturing equipment

This product is an automatic sorting device that removes wafers from the loader carrier, reads the characters printed on the silicon wafer, aligns the position of the alignment mark, and then returns the wafers to the unloader carrier. Since we handle everything from design to manufacturing and sales in-house, we have achieved a low price! 【Features】 ■ Achieves low price ■ Compatible with 2 to 8 inches ■ Reduced footprint (space-saving) *For more details, please feel free to contact us.

• Other semiconductor manufacturing equipment

This product is a semi-automatic double-sided simultaneous exposure device. The removal and loading from the wafer carrier is done using a belt system. The mask and wafer come into contact and are exposed simultaneously. There are two exposure modes selectable via recipes: a fast exposure mode without alignment and an alignment exposure mode where the alignment of the wafer and mask is performed manually. Utilizing the features of the belt transport system, the fast exposure mode allows for high throughput processing. The alignment of the upper and lower masks, as well as the mask-wafer alignment, is done with the same I.F., ensuring that operations do not become complicated. Additionally, changing the mask is also easy. Since we handle everything from design to manufacturing and sales in-house, we have achieved low prices. 【Features】 ■ Simultaneous double-sided exposure ■ Fast exposure mode, alignment exposure mode ■ Easy setup change, compatible with multiple substrate sizes ■ Space-saving & easy maintenance ■ Achieves low cost and compact design, suitable for small-batch production of various types ■ Belt transport system *For more details, please refer to the PDF document or feel free to contact us.

• others

This product is a device that automatically performs spin coating, batch exposure, and development processing. It can be equipped with HMDS treatment, baking, and cooling functions. This device has been made possible because our company handles everything from design to manufacturing and sales, offering a lineup of photolithography equipment including coaters, aligners, and developers. The supported resists include positive and negative resists, polyimide, and various other chemicals have been successfully used. We also have extensive experience in transporting a wide range of substrates such as Si (silicon), GaAs, InP, GaN, SiC, sapphire, ceramics, and SiO2 (glass). The exposure process can be equipped with an auto-alignment function, making it ideal for positive-negative inversion processes as well. 【Features】 ■ Automatic batch processing of photolithography steps ■ Achieves low cost ■ Compatible with low to high viscosity (1.7cP to 10000cP) ■ Supports sizes from 2 to 6 inches, with proven capability for 4-inch ■ Automatic recognition of wafer sizes ■ Proven results with a variety of chemicals ■ Reduced footprint (space-saving) ■ Numerous options for resist reduction ■ Each process can operate independently ■ Auto-alignment function *For more details, please refer to the PDF document or feel free to contact us.

• Coater

The product is equipped with spin coating, HMDS treatment, baking, and cooling functions. Since we handle everything from design to manufacturing and sales in-house, we have achieved low prices! We have a proven track record with a variety of chemicals including positive-negative resist, polyimide, SOG, wax, and silicone. We also have extensive experience in transporting various substrates such as Si (silicon), GaAs, InP, GaN, SiC, sapphire, and SiO2 (glass). We have numerous achievements in transporting thin substrates like GaAs (thickness 150um), InP (thickness 150um), and LT (thickness 120um)! 【Features】 ■ No setup change required, capable of processing wafers in 2 sizes. ■ Achieves low prices. ■ Capable of handling low to high viscosity (1.7cP to 10000cP). ■ Compatible with 2 to 12-inch wafers. ■ Automatic wafer size recognition. ■ Proven track record with a variety of chemicals. ■ Reduced footprint (space-saving). ■ Numerous options for resist reduction. ■ Lineup tailored to production volume. *For more details, please refer to the PDF document or feel free to contact us.

• Coater

The product is an automatic batch equal exposure mask alignment device. It can accommodate two sizes of wafers: φ3, 4 inches and φ4, 6 inches. Switching between sizes is very simple; just replace three components. No fine adjustments of the transport robot are necessary. Furthermore, it performs fully non-contact automatic parallel adjustment of the photomask and wafer, significantly reducing setup time in the manufacturing process. Equipped with a super-precise UVW drive stage and high-performance image processing, it accurately aligns the photomask and wafer. It supports both soft and hard contact. With a lineup tailored to production volume, ranging from manual machines to fully automatic machines, we achieve low prices by handling everything from design to manufacturing and sales in-house. 【Features】 ■ Supports multiple substrate sizes ■ Easy setup change ■ Fully non-contact parallel alignment and exposure of photomask and wafer ■ Auto-alignment function ■ Space-saving and easy maintenance ■ Achieves low price and compact design, suitable for small-batch production of various types ■ Equipped with a super-precise UVW stage *For more details, please refer to the PDF document or feel free to contact us.

• others

The product is equipped with spin coating, HMDS treatment, baking, and cooling functions. Since we handle everything from design to manufacturing and sales in-house, we have achieved low prices! We have a proven track record with a variety of chemicals including positive-negative resist, polyimide, SOG, wax, and silicone. We also have extensive experience in transporting various substrates such as Si (silicon), GaAs, InP, GaN, SiC, sapphire, and ceramic, as well as SiO2 (glass). We have numerous achievements in transporting thin substrates and square substrates, such as GaAs (thickness 150um), InP (thickness 150um), and LT (thickness 120um)! 【Features】 ■ Achieves low prices ■ Capable of handling low to high viscosity (1.7cP to 10000cP) ■ Uniform film distribution through a rotating cup coating method ■ Compatible with 2 to 12 inches ■ Capable of processing multiple types of wafers (compatible with 3, 4, and 5 inches) ■ Automatic recognition of wafer size ■ Proven track record with a variety of chemicals ■ Reduced footprint (space-saving) ■ Numerous options for resist reduction ■ Lineup tailored to production volume *For more details, please refer to the PDF document or feel free to contact us.

• Coater

This product is a manual batch equal exposure mask alignment device. It is a device that sets the substrate on the exposure stage and performs exposure. The wafer is manually set onto the exposure stage. The tedious alignment of the photomask and wafer, as well as gap adjustments, are done automatically. Additionally, by incorporating a super-precision UVW drive stage and performing high-performance image processing, the alignment of the photomask and wafer is carried out accurately. It supports both soft and hard contact. With a lineup tailored to production volume, ranging from manual to fully automatic machines, we achieve low prices by handling everything from design to manufacturing and sales in-house. Custom orders for special substrates are also accepted. 【Features】 - Complete non-contact alignment and exposure of photomask and wafer - Equipped with auto-alignment function - Easy setup changes, compatible with multiple substrate sizes - Suitable for small-batch production, research, and development - Space-saving and easy maintenance - Achieves low price and compact design - Equipped with super-precision UVW stage - Custom orders for special substrates available *For more details, please refer to the PDF document or feel free to contact us.

• others

【Features】 ■ Achieves low price ■ Supports low to high viscosity (1.7cP to 10000cP) ■ Compatible with sizes from 2 to 12 inches ■ Capable of processing multiple wafer sizes (e.g., compatible with 3, 4, 5 inches and 8, 12 inches) ■ Automatic wafer size recognition system ■ Proven performance with a variety of chemicals ■ Reduced footprint (space-saving) ■ Numerous options available with resist reduction ■ Lineup tailored to production volume 【ASAP Coater/Developer Functions】 ● Spin coating ● HMDS treatment ● Baking ● Cooling ● Developing ● Rinsing We have achieved low prices by handling everything from design to manufacturing and sales in-house! 【ASAP Features and Achievements】 ● Proven use of a variety of chemicals including positive and negative resists, polyimide, SOG, WAX, silicone, etc. ● Extensive experience in substrate transport including Si (silicon), GaAs, InP, GaN, SiC, sapphire, ceramics, SiO2 (glass), etc. ● Numerous transport achievements with thin substrates such as GaAs (thickness 150um), InP (thickness 150um), LT (thickness 120um)! *For more details, please refer to the PDF document or feel free to contact us.

• Coater
• Resist Device
• Other semiconductor manufacturing equipment

This product is a semi-automatic batch equal exposure mask alignment device. It sets one substrate at a time and automatically performs transportation and exposure after the substrate is set. It conducts fully non-contact automatic parallel adjustment between the photomask and the wafer. The cumbersome task of manually adjusting the gap is completely unnecessary. Additionally, by equipping a super-precise UVW drive stage and performing high-performance image processing, it accurately aligns the photomask and the wafer. It supports both soft and hard contact. With a lineup tailored to production volume, ranging from manual machines to fully automatic machines, we achieve low prices by handling everything from design to manufacturing and sales in-house. Custom orders for special substrates are also accepted. 【Features】 ■ Fully non-contact parallel alignment and exposure of photomask and wafer ■ Equipped with auto-alignment function ■ Easy setup change, compatible with multiple substrate sizes ■ Suitable for small-batch production, research, and development ■ Space-saving and easy maintenance ■ Achieves low price and compact design ■ Equipped with super-precise UVW stage ■ Custom orders for special substrates available *For more details, please refer to the PDF document or feel free to contact us.

• others

The product is an auto batch equal magnification exposure mask alignment device. It performs automatic parallel adjustment of the photomask and wafer in a completely non-contact manner. Equipped with a super-precise UVW drive stage and high-performance image processing, it accurately aligns the photomask and wafer. It supports both soft and hard contact. With a lineup tailored to production volume, ranging from manual machines to fully automatic machines, we achieve low prices by handling everything from design to manufacturing and sales in-house. 【Features】 ■ Complete non-contact parallel alignment and exposure of photomask and wafer ■ Auto alignment function ■ Easy setup changes, compatible with multiple substrate sizes ■ Space-saving and easy maintenance ■ Achieves low cost and compact design, suitable for small-batch production of various types ■ Equipped with a super-precise UVW stage *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment
• Photomask

【Features】 ■ High throughput with belt conveyance (high processing capacity) ■ Capable of transporting warped wafers! ■ Achieves low cost ■ Automatic wafer size recognition system ■ Proven performance with a variety of chemicals ■ Reduced footprint ■ Many options with minimal resist ■ Lineup tailored to production volume Achieve high throughput without using robots! This is a spin coater with belt conveyance. Due to the track system (belt conveyance), transporting warped wafers is not a problem. While robots offer high flexibility in transport flow, if the coating and baking processes follow a fixed transport flow, large-scale processing is possible by using a parallel transport system (suitable for mass production). This product is equipped with spin coating, HMDS treatment, baking, and cooling functions. We offer a lineup tailored to production volume even for fully automatic machines. By handling everything from design to manufacturing and sales in-house, we have achieved low prices. We have proven performance with a variety of chemicals such as polyimide, SOG, WAX, and silicone. *For more details, please refer to the PDF document or feel free to contact us.

• Coater

The development is performed by pooling the developer solution on the wafer in a batch process. Unlike the dip method, each wafer is developed individually, resulting in very high reproducibility of the process. By optimizing the amount of chemical used, it leads to a reduction in the amount of developer solution used. We can accommodate requests for pooling methods, from shower types to straight nozzles. It also features a shaking function during static development! (It moves the liquid by repeating low rotation and stopping.) The batch process includes development, rinsing, baking, and cooling functions. We design, manufacture, and sell according to customer needs and production volumes. We have a proven track record with various chemicals, including TMAH. 【Features】 ■ High reproducibility of development results ■ Reduction in chemical usage ■ Automatic wafer size recognition ■ Proven track record with various chemicals ■ Reduced footprint ■ Design tailored to production volume We have a permanent demo setup, so please consider a demonstration!

• Resist Device

This is a developing device that uses a two-fluid spray method to mix and discharge N2 and developer solution. By changing the pressure of N2, the discharge pressure of the spray can be adjusted. You can choose from a wide range of spray discharge patterns, such as increasing the liquid pressure for high-pressure discharge or reducing the liquid volume to create a fine mist for a softer discharge. The spray nozzle can be freely selected in various shapes such as fan-shaped or circular, as well as the distribution, spread angle, and range. We offer a lineup that matches production volume, from manual to fully automatic machines, and since we handle everything from design to manufacturing and sales in-house, we have achieved low prices. We have a proven track record with various chemicals, including TMAH. 【Features】 ■ Equipped with a two-fluid spray! (Paddle can also be used) ■ Automatic wafer size recognition function ■ Proven track record with various chemicals ■ Compact design ■ Lineup tailored to production volume We have a permanent demo setup, so please consider scheduling a demonstration!

• Resist Device

It is a single-fluid spray-type developing device. Since the spray is generated by the pressure of the developing solution, mist from the spray is less likely to scatter, and it can also speed up the developing process. It is optimal for developing large substrates and thick films. The spray nozzle can be freely selected in terms of shape (such as fan-shaped or circular), distribution, spreading angle, and range. This product is equipped with developing, baking, and cooling functions in a sheet-fed format. With a lineup tailored to production volume, ranging from manual machines to fully automatic machines, we have achieved low prices by handling everything from design to manufacturing and sales in-house. We have a proven track record with a variety of chemicals, including TMAH. 【Features】 ■ Equipped with single-fluid spray (can be used in conjunction with paddles) ■ Automatic wafer size recognition ■ Reduced footprint ■ Lineup tailored to production volume We have a demo setup available, so please consider scheduling a demonstration!

• Resist Device

Equipped with sheet-type development, full exposure (inverted exposure, image reversal), baking, and cooling functions. An important PEB that determines the angle of the reverse taper using lift-off resist. Our proprietary program stabilizes the reverse taper angle! Additionally, using it for baking after exposing negative resist achieves a stable process. With a lineup tailored to production volume, from manual machines to fully automatic machines, we have realized low prices by handling everything from design to manufacturing and sales in-house. We have a proven track record with a variety of chemicals such as TMAH, colin aqueous solution, and Na2CO3. We also have numerous achievements with thin wafers (such as wafer thickness of 150um), so please feel free to consult us. 【Features】 ■ Stability of reverse taper angle through PEB ■ Automatic wafer size recognition function ■ Compatible with paddle, single-fluid spray, and dual-fluid spray ■ Reduced footprint ■ Lineup tailored to production volume We also have demo equipment available, so please consider scheduling a demonstration!

• Resist Device

This product is a manual sheet-type developing machine. It features a compact design that combines the chemical solution box and processing cup into one unit. We design, manufacture, and sell manual machines tailored to our customers' needs. It is used not only for research and development purposes but also by customers handling small quantities of diverse products. We have a proven track record with various chemicals, including TMAH. 【Features】 ■ Achieves low cost ■ Compact! ■ Options for paddle, single fluid spray, and dual fluid spray ■ Proven performance with a variety of chemicals *For more details, please refer to the PDF document or feel free to contact us.

• Resist Device

This product is equipped with a sheet-fed development, baking, and cooling unit. It is recommended for customers who have a production volume that is not high enough to introduce an automatic machine, but cannot adopt a manual machine due to labor issues! We design and manufacture semi-automatic machines tailored to your needs, so if you are having trouble introducing new equipment, please consider us! We have a proven track record with various chemicals such as TMAH. 【Features】 ■ Automatic transport function ■ Achieves low cost ■ Proven track record with various chemicals ■ Reduced footprint *Please feel free to contact us for more details.

• Resist Device

This is a sheet-type photoresist developing system. It can accommodate various developing processes such as paddle development and spray development (single fluid, dual fluid). We have numerous achievements with thin wafers and square substrates! Additionally, it can handle a wide range from thick film resist development to fine pattern development. Our product features sheet-type development, baking, and cooling functions (optional: full exposure unit). We offer a lineup tailored to production volume, from manual machines to fully automatic machines, and since we handle everything from design to manufacturing and sales in-house, we achieve low prices. We have a proven track record with a variety of chemicals, including TMAH (tetramethylammonium hydroxide), sodium carbonate, and choline aqueous solution. 【Features】 ■ Stable developing process! ■ Low price ■ Automatic wafer size recognition ■ Proven track record with various chemicals ■ Compact design tailored to specifications! ■ Equipment lineup according to production volume We have a permanent demonstration setup, so please consider a demo.

• Resist Device

The corner substrate can be uniformly coated in various shapes such as square and rectangular. Additionally, with our rotary cup-type spin coater, you can achieve uniform coating without worrying about certain height differences (many successful cases with high viscosity!). This product is equipped with spin coating, HMDS treatment, baking, and cooling functions. We offer a lineup tailored to production volume, from manual machines to fully automatic machines, and since we handle everything from design to manufacturing and sales in-house, we have achieved low prices. We have a proven track record with a variety of chemicals, including polyimide, SOG, WAX, and silicone. 【Features】 ■ Achieves low prices ■ Automatic wafer size recognition system ■ Proven track record with various chemicals ■ Reduced footprint ■ Many options with minimal resist ■ Lineup tailored to production volume *For more details, please refer to the PDF document or feel free to contact us.

• Coater

This device allows for automatic processing of both sides of a wafer with just a single setup. Coating is performed on one side at a time, but using a flipping unit, resist is applied to both sides by the time the automatic operation is complete. The processing is carried out using optimized transport procedures for coating, baking, and flipping to ensure that wafer processing is not rate-limiting. It can accommodate both positive and negative resists, ranging from low to high viscosity. This product is equipped with spin coating, HMDS treatment, baking, and cooling functions. Since we handle everything from design to manufacturing and sales in-house, we have achieved a low price. We have a proven track record with a variety of chemicals, including polyimide, SOG, WAX, and silicone. 【Features】 ■ Achieves low cost ■ Automatically recognizes wafer size for processing ■ Proven track record with a variety of chemicals ■ Reduced footprint ■ Numerous options with minimal resist ■ Lineup tailored to production volume *For more details, please refer to the PDF document or feel free to contact us.

• Coater

The product is equipped with sheet-type development, front exposure (reverse exposure), baking, and cooling functions. We offer a lineup tailored to production volume, ranging from manual machines to fully automatic machines, and since we handle everything from design to manufacturing and sales in-house, we have achieved low prices. We have a proven track record with a variety of chemicals, including TMAH. 【Features】 ■ Achieves low prices ■ Automatic size recognition ■ Proven track record with a variety of chemicals ■ Reduced footprint ■ Lineup tailored to production volume *For more details, please refer to the PDF document or feel free to contact us.

• Resist Device

Devices that can accommodate two or more wafer sizes can be produced without any setup changes. Examples of achievements: ■ 2/3/4 inch compatible devices ■ 4/5 inch compatible devices ■ 4/6 inch compatible devices ■ 6/8 inch compatible devices ■ 8/12 inch compatible devices Since it also varies depending on wafer weight and material, please feel free to consult us first. If you consider installing one dedicated device for each of the two wafer sizes, the installation area will effectively be halved! Of course, spin coating, HMDS treatment, baking, and cooling functions are standard features. We offer a lineup tailored to production volume, from manual machines to fully automatic machines, and since we handle everything from design to manufacturing and sales in-house, we have achieved low prices. 【Features】 ■ Compatibility with multiple inch size wafers (no setup changes) ■ Automatic operation with automatic wafer size recognition ■ Achieved low prices ■ Proven results with a variety of chemicals ■ Reduced footprint ■ Numerous options with resist reduction ■ Lineup tailored to production volume *For more details, please refer to the PDF materials or feel free to contact us.

• Coater

What concerns us about thin wafers are breakage during transport and in-plane uniformity after coating. We have confidence in transporting thin and fragile wafers, as evidenced by our track record in manufacturing wafer transport devices (wafer sorters). We can accommodate a wide range of substrates including GaAs, LT (lithium tantalate), glass (quartz), GaN, sapphire, Si, and ceramics. Additionally, thin wafers tend to have variability in in-plane uniformity during coating, but this can be significantly improved by innovating the chuck and other components. Our product comes standard with spin coating, HMDS treatment, baking, and cooling functions. Depending on customer requirements and production volume, we can adjust the number of units and offer options from manual machines to fully automated systems. Since we handle everything from design to manufacturing and sales in-house, we have achieved low prices. 【Features】 ■ Robot compatible with thin wafers ■ Chuck compatible with thin wafers ■ Achieves low prices ■ Automatic recognition of wafer sizes ■ Proven performance with a variety of chemicals ■ Reduced footprint ■ Numerous options with minimal resist ■ Lineup tailored to production volume *For more details, please refer to the PDF document or feel free to contact us.

• Coater

The rotating cup-type spin coater can significantly reduce the amount of high-viscosity materials (such as polyimide and high-viscosity resist) used! Thanks to our patented technology, we have successfully reduced usage by evenly spreading the minimum amount of liquid at low rotation speeds. The extent of reduction varies depending on the liquid, but we have achieved reductions of 30% to 70% in usage. We offer a lineup ranging from manual machines to fully automatic machines to match production volumes. Since we handle everything from design to manufacturing and sales in-house, we have achieved improved customization and lower prices. We have a proven track record with a variety of liquids, including polyimide, SOG, WAX, and silicone. We have permanent demo equipment available, so if you're interested, please request a demo or contact us. 【Features】 ■ Achieves low prices ■ High customization ■ Automatic size recognition ■ Proven track record with a variety of liquids ■ Reduced footprint ■ Numerous options for resist reduction ■ Lineup tailored to production volume *For more details, please refer to the PDF materials or feel free to contact us.

• Coater

We have numerous achievements in applying high-viscosity photoresists and polyimide! This product is equipped with spin coating, HMDS treatment, baking, and cooling functions. It is also compatible with bellows pumps and syringes! We design and manufacture from manual machines to fully automatic machines according to the customer's production volume. We have a proven track record with various chemicals such as polyimide, SOG, WAX, and silicone. 【Features】 ■ High uniformity even with high-viscosity coatings (single coat) ■ Achieves low cost ■ Automatic size recognition ■ Proven track record with a variety of chemicals ■ Reduced footprint ■ Many options with minimal resist ■ Lineup tailored to production volume *For more details, please refer to the PDF document or feel free to contact us.

• Coater

Our equipment can process substrates, such as those coated with roll coaters or spray coaters, using spin coating! It is a rotary cup-type coating device that can apply spin coating on elongated rectangular substrates, square-like substrates, substrates with steps, and thick films (patented). We offer a lineup tailored to production volume, ranging from manual machines to fully automatic machines. Since we handle everything from design to manufacturing and sales in-house, we have achieved low prices. We have a proven track record with a variety of chemicals, including polyimide, SOG, WAX, and silicone. 【Features】 ■ Achieves low prices ■ Patented rotary cup coating method ■ Proven track record with a variety of chemicals ■ Reduced footprint ■ Numerous options with minimal resist ■ Lineup tailored to production volume *For more details, please refer to the PDF materials or feel free to contact us.

• Coater

We have strengths in the application of high-viscosity resist! For example, we can achieve an in-plane uniformity of ±5% or better even with resists over 400 cP (φ300mm wafer). Our patented ASAP (A.S.A.P.) rotating cup method allows for uniform and high-quality thick film application (Patent No. 3821468). This product is equipped with spin coating, HMDS treatment, baking, and cooling functions. We offer a lineup tailored to production volume, ranging from manual machines to fully automatic machines, and since we handle everything from design to manufacturing and sales in-house, we can offer low prices. We have a proven track record with a variety of chemicals, including polyimide, SOG, WAX, and silicone. 【Features】 ■ Achieves low prices ■ Automatic wafer size detection function ■ Proven track record with various chemicals ■ Reduced footprint ■ Numerous options with low resist usage ■ Lineup tailored to production volume * For more details, please refer to the PDF document or feel free to contact us. We also have demo equipment available, so if you're interested, please consider a free demo!

• Coater

The product is equipped with spin coating, HMDS treatment, high-temperature baking (MAX 400℃), low-temperature baking (MAX 200℃), and cooling functions. Step baking is also possible with the combination of low-temperature and high-temperature baking. High-temperature baking is possible after spin coating with chemicals other than resist! Additionally, we have a proven track record with various chemicals including positive resist, negative resist, polyimide (PI), silicone, SOG, WAX, and many others! We also have extensive experience in substrate transport for various materials such as silicon (Si), sapphire, ceramic, LT, GaAs, InP, GaN, SiC, and SiO2 (glass). Rest assured with thin substrates like GaAs (thickness 150um), InP (thickness 150um), and LT (thickness 120um)! 【Features and Strengths】 ■ Achieves affordable pricing ■ Automatic wafer size detection function ■ Equipped with automatic wafer detection function (mapping) ■ Compatible with wafer sizes from 2 to 12 inches ■ Supports low to high viscosity (1.7cP to 10000cP) ■ Proven track record with a variety of chemicals ■ Reduction of footprint (space-saving) ■ Numerous options available with resist reduction *For more details, please refer to the PDF document or feel free to contact us.

• Coater

This product is equipped with spin coating, HMDS treatment, baking, and cooling functions. Since we handle everything from design to manufacturing and sales in-house, we have achieved a low price for the equipment♪ This is an ideal manual device for customers who find it difficult to purchase an automatic machine or for those who do not need an automatic machine for small lots. Unlike tabletop types, it allows for resist application equivalent to that of an automatic machine, so when transitioning to an automatic machine, there is no need to establish new process conditions, and the same recipe can be used! It has a proven track record with a variety of chemicals including positive and negative resists, polyimide, SOG, wax, and silicone. There is also a significant track record of substrate transport with various materials such as Si (silicon), GaAs, InP, GaN, SiC, sapphire, ceramics, and SiO2 (glass)! 【Features】 ■ Achieves low cost with a manual resist coater ■ Compatible with substrates from 2 to 12 inches ■ Supports low to high viscosity (1.7cP to 10000cP) ■ Proven track record with a variety of chemicals ■ Reduced footprint (space-saving) ■ Numerous options for resist reduction *For more details, please refer to the PDF document or feel free to contact us.

• Coater

This product is equipped with spin coating, HMDS treatment, baking, and cooling functions. Since we handle everything from design to manufacturing and sales in-house, we have realized the production of semi-automatic machines at low prices for customers who cannot afford to buy fully automatic machines or for those who do not need a fully automatic machine for small lots! We have a proven track record with a variety of chemicals including positive-negative resists, polyimides, SOG, wax, and silicones. We also have extensive experience in substrate transport for various materials such as Si (silicon), GaAs, InP, GaN, SiC, sapphire, and ceramics, as well as SiO2 (glass). 【Features】 ■ Achieves low cost with semi-automatic resist coating machines ■ Compatible with substrates from 2 to 12 inches ■ Supports low to high viscosity (1.7cP to 10000cP) ■ Proven track record with a variety of chemicals ■ Reduced footprint (space-saving) ■ Numerous options for resist reduction *For more details, please refer to the PDF document or feel free to contact us.

• Coater

This is a fully automated resist coating device using robot transport. It features high uniformity, reduced chemical usage, and the ability to use multiple chemicals. We can customize it to meet specifications for low to high viscosity resists. We have a proven track record with a variety of chemicals, including positive and negative resists, polyimide, SOG, wax, and silicone. We also have extensive experience in transporting various substrates such as Si (silicon), GaAs, InP, GaN, SiC, sapphire, ceramics, and SiO2 (glass). We have numerous achievements in transporting thin substrates like GaAs (thickness 150um), InP (thickness 150um), and LT (thickness 120um)! Since we handle everything from design to manufacturing and sales in-house, we have achieved low prices! 【Features】 - High uniformity of film thickness distribution through the spin process - Compatible with wafer sizes from 2 to 12 inches - Supports low to high viscosity (1.7cP to 10000cP) - Automatic wafer size detection function - Proven track record with a variety of chemicals - Reduced footprint (space-saving) - Numerous options for resist reduction - Lineup tailored to production volume We have a demo setup available, so please consider scheduling a demonstration first!

• Coater

This catalog provides information on products handled by A.S.A.P. Corporation. It features the "Automatic Resist Coating Device" equipped with a center 4-axis robot, as well as the "Mask Aligner" and "Automatic Lift-Off Device." Sample testing is available for all devices, so please feel free to contact us anytime. 【Contents】 ■ Product lineup ■ Reference appearance diagrams ■ Sales and service locations ■ Business locations *For more details, please refer to the PDF document or feel free to contact us.

• Resist Device

The "AMA6000" is an automatic batch equal exposure mask alignment device. The ASAP mask aligner manages the gap between the mask and the wafer in a completely non-contact manner. While it can operate in non-contact mode, it also supports soft and hard contact. It achieves low cost, compact size, and easy operation. 【Features】 ■ Parallel exposure in complete non-contact ■ Space-saving & easy maintenance ■ Auto alignment ■ Achieves low cost and compact design, suitable for small-batch production of various types *For more details, please refer to the PDF document or feel free to contact us.

• others

Physical and chemical W (double) effect lift-off! What is W effect lift-off? - Delamination using high-pressure jets (MAX 20MPa) with our unique special nozzle for physical force - Delamination using organic solvents such as NMP and DMSO for chemical force Additionally, it achieves high-speed processing, high delamination power, and high stability with sheet processing, while also reducing the amount of chemical solution used. It can also be used as a cleaning device for resist, polymers, and masks, capable of delaminating stubborn resist after thermal treatment or dry etching. Moreover, there is no re-adhesion of burrs or metals, which is a problem in DIP processing. This high-pressure jet lift-off device is suitable for patterning thick films that are difficult to etch, such as thick metal and oxide films. 【Features】 ■ Amazing delamination capability with W (double) effect lift-off! ■ Process stability with sheet-type processing ■ Removal of burrs during lift-off ■ No re-adhesion ■ Temperature-controlled chemical recycling system (optional) *For more details, please refer to the catalog or feel free to contact us.

• Resist Device
• Other semiconductor manufacturing equipment

【Features】 - Control of the discharge amount of expensive liquid using a high-precision pump - Cup structure for uniform application (sealed type, rotating cup type) - Expertise in the process of spreading with a small amount - Optionally equipped with a cylinder-compatible dispenser for small-scale production - EBR (Edge Rinse) function, which is challenging with high-viscosity materials This is a device for spin coating high-viscosity polyimide. It is equipped with a pump suitable for high viscosity and a liquid temperature control system, ensuring uniform application of high-viscosity polyimide. To accommodate the usage and storage temperatures of polyimide, we also have a proven track record of dispenser-type spin coaters compatible with cylinders. The rotating cup-type spin coater, which enables reduction of application amount and uniform thick films, is recommended for expensive high-viscosity polyimide. *For more details, please refer to the PDF document or feel free to contact us.

• Coater