Power supply board
Power supply board
We have experience in supporting various power supply boards. We can offer suggestions such as high thermal conductivity copper inlays, thermal analysis, and thick copper boards.
- Company:アーセルデザイン
- Price:Other
Last Updated: Aggregation Period:Aug 27, 2025~Sep 23, 2025
This ranking is based on the number of page views on our site.
Last Updated: Aggregation Period:Aug 27, 2025~Sep 23, 2025
This ranking is based on the number of page views on our site.
Last Updated: Aggregation Period:Aug 27, 2025~Sep 23, 2025
This ranking is based on the number of page views on our site.
1546~1560 item / All 1853 items
Power supply board
We have experience in supporting various power supply boards. We can offer suggestions such as high thermal conductivity copper inlays, thermal analysis, and thick copper boards.
Flexible circuit board
We can accommodate everything from single-sided flexible printed circuit boards to multi-layer flexible printed circuit boards, including assembly.
BGA conversion board
In cases where you want to replace a BGA, it is possible to create a conversion board and design a BGA board that mounts a different BGA on the board.
Analog circuit board
We have a wide variety of analog circuit board design support available.
Through-hole resin-filled substrate
This is a method of placing through vias on the pads of electronic components and filling the vias with paste to eliminate issues during the mounting of electronic components. It is effective in high-density designs and may be less expensive than IVH or build methods. It is used for narrow-pitch BGAs and similar components.
Back drill substrate
To eliminate stubs in high-speed signals, we will remove the unnecessary plating of the VIA using back drilling.
Copper-based substrate
You can achieve an even greater heat dissipation effect. We can provide a quote including manufacturing as well.
Analog circuit board
We have a wide variety of analog circuit board design options available.
Narrow pitch BGA substrate (0.25mm/0.3mm/0.4mm, etc.)
We have a wealth of experience in designing narrow pitch BGA mounted boards. Regarding board manufacturing, we will select and propose manufacturers that are capable of production.
By injecting urethane resin into cases, dust, dirt, and water are shut out! This processing technology contributes to the waterproofing, dustproofing, and seismic resistance of printed circuit boards.
Resin potting is a processing technology that allows for the injection of urethane resin into cases, effectively shutting out dust, dirt, and water. Since the circuit board is fixed in place, it can be protected from vibrations. This contributes to the waterproofing, long life, and earthquake resistance of the mounted circuit board. 【Advantages of Resin Potting】 - No worries about dust or dirt adhering to the circuit board - Excellent waterproofing and moisture resistance - Strong against vibrations and impacts as the case can be filled and fixed with resin - Can extend the component replacement cycle, proving effective for products aimed at overseas markets - Prototyping is possible We will carry out work according to your requirements, so please feel free to contact us. *For more details, please refer to the PDF document or feel free to contact us.
Protects the circuit board from external humidity, rain, and wind! A black resin potting with a high hardness of 76 that does not stress the circuit board!
If waterproofing is necessary, if you want to protect the circuit board from vibrations, or if you are concerned about the reduced lifespan of the mounted circuit board due to dirt, resin potting is recommended. Among them, black potting has a high hardness of 76, but it is a processing method that contributes to waterproofing (equivalent to IP67), dustproofing, and explosion-proofing without putting stress on the circuit board. 【Features of Black Potting】 ■ High hardness of 76, but does not stress the circuit board ■ Excellent waterproofing (equivalent to IP67), dustproofing, explosion-proofing, and earthquake resistance ■ No limits on the work size for resin potting Regardless of the size of the circuit board, feel free to consult us, and prototype support is also possible. *For more details, please refer to the PDF document or feel free to contact us.
We will guide you through the roles, performance, and features of each process and equipment, as well as a tour of the printed circuit board manufacturing factory!
We are offering a "WEB Factory Tour Proposal." In the initial company introduction, we will provide an overview of our company, its features, and usability. During the subsequent factory tour, we will explain the roles, performance, and features of each process and equipment (with documentation), and conduct a live video tour of the printed circuit board manufacturing factory, followed by a Q&A session. 【Schedule Image (Tentative)】 ■ Date: **Month** **Day**, 2022 13:30 - 15:00 ■ Location: WEB ■ Company Introduction: 13:30 - 13:50 ■ Factory Tour: 13:50 - 14:50 (Guided by documentation and live video) ■ Q&A Session: 14:50 - 15:00 *For more details, please feel free to contact us.
Ensure that the plain has a secured return path, a large opening, and check for any gaps!
We would like to introduce "EMC," which is a key aspect of our design. Check the component placement to ensure that the crystal is not located at the edge of the board, that the filter circuit is near the external IF, and that the damping resistor is placed close to the output pin. Also, verify the position of the termination resistor and the placement of the bypass capacitor. For wiring, confirm that high-speed signal lines are not routed to the edge of the board, and route high-speed signals and bus lines as much as possible in the inner layers. 【Features】 ■ Plain ■ Component placement ■ Wiring *For more details, please feel free to contact us.
As a substrate manufacturer, we can design with manufacturing standards in mind!
We would like to introduce our design department structure. We can handle customer projects in various fields such as high-speed digital, analog, power supply, and antennas (design provided by the customer). By using characteristic impedance calculation tools and feedback from the manufacturing department, we can achieve highly accurate impedance matching design. 【Features】 ■ Capable of handling customer projects in various fields such as high-speed digital, analog, power supply, and antennas (design provided by the customer) ■ As a circuit board manufacturer, we can design with manufacturing standards in mind ■ Capable of impedance matching design ■ For large-scale circuit boards or projects requiring simulation, we collaborate with partner companies *For more details, please feel free to contact us.
Of course, short delivery times in manufacturing quickly resolve evaluation-related issues.
Priken takes pride in being among the top class for short manufacturing lead times, but we are fully committed to resolving our customers' issues as quickly as possible. We propose "jigs" that reduce the effort required for prototype evaluation and consider schedules to meet desired delivery dates, achieving short lead times. We aim for not only manufacturing speed but also proposals for efficient development without waste. 【Features】 ■ Proposing evaluation jigs to shorten work lead times ■ Reducing effort and shortening lead times by simplifying request materials ■ Proposing short lead times while considering the client's methods *For more details, please download the PDF or feel free to contact us.