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substrate Product List and Ranking from 548 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  4. 4 沖電気工業 産業営業本部　産業営業統括室 Tokyo//Information and Communications
  5. 5 null/null
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substrate Product ranking

Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
This ranking is based on the number of page views on our site.

  1. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社　和歌山
  2. Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  3. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  4. 4 Low thermal expansion zero alloy material LEX ZERO. JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
  5. 4 PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.

substrate Product List

1651～1665 item / All 1843 items

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Liquid Flow Sensor Evaluation Kit 'EK-SLF3S-0600F'

Liquid Flow Sensor Evaluation Kit 'EK-SLF3S-0600F'

Response speed < 20ms! Maximum flow rate is 2000ul/min for aqueous and hydrocarbon systems.

We would like to introduce our liquid flow sensor evaluation kit, 'EK-SLF3S-0600F'. The maximum flow rate is 2000ul/min (for aqueous and hydrocarbon fluids), with a response time of <20ms. The interface (connector) is I2C (6-pin Molex). Please feel free to contact us if you have any inquiries. 【Included Items】 ■ SLF3S-0600F ×1 ■ SLF3x mounting clamp ×1 ■ SCC1-USB sensor cable ×1 ■ Adapter cable for connecting from 6-pin connector to SCC1-USB sensor cable ×1 ■ 6-pin ribbon cable ×1 ■ Basic fitting set ■ Quick start guide *For more details, please download the PDF or feel free to contact us.

  • Flow Sensor
  • Evaluation Board

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[Development Case] Control Board for LED Near Ultraviolet Irradiation Device - [EOL Support]

[Development Case] Control Board for LED Near Ultraviolet Irradiation Device - [EOL Support]

Replacement design of embedded systems - Transition to a high-functionality microcontroller 1Chip that achieves stable supply and cost reduction.

By adopting overseas microcontrollers and FPGAs, we have implemented alternative board designs that achieve stable supply and high performance for customers facing increased component procurement risks due to changes in the global situation. While maintaining the conventional configuration, we have replaced it with a high-functionality microcontroller from a domestic manufacturer, eliminating the need for complex circuit designs and FPGA circuits. This allows us to break free from dependence on overseas components and significantly reduce component supply risks. Furthermore, by simplifying design changes and management burdens, we have achieved improved productivity and reduced total costs. We have realized stable supply to end users while enhancing product safety and market competitiveness through a consistent development process. Design engineers, procurement, and production management can solve on-site challenges and improve operational efficiency through our replacement design examples. Please feel free to contact us!

  • Embedded system design service
  • Microcomputer
  • Embedded Board Computers

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[Example] RS232C to RS422 conversion board for currency exchange machines [EOL support]

[Example] RS232C to RS422 conversion board for currency exchange machines [EOL support]

Replacement Design for Embedded Systems - How to Expand Device Lineup by Maintaining Size and Signal Conversion -

With the expansion of the lineup of currency exchange machines, it became necessary to convert the existing RS232C signals to RS422 signals. However, due to constraints in the device housing, changing the board size was not possible. Therefore, we faced the challenge of improving signal conversion performance while maintaining the existing design by adding an RS422 conversion circuit to the current RS232C board. Our company first conducted detailed hearings with customers to optimize the circuit of the existing board, and then, after confirming the operation with a prototype RS422 conversion board, established a design that could be integrated without changing the board size. Furthermore, in addition to evaluating the board alone, we conducted verification of its incorporation into the device and confirmed that there were no issues with all specified operations. This enabled us to achieve the continued use of the existing design and high-reliability signal conversion, responding to the expansion of the currency exchange machine lineup. We would like design engineers, procurement, and production management to consider this case as an optimal solution that enhances product performance, production stability, and cost efficiency while overcoming the constraints of the device housing.

  • Embedded system design service
  • EMS
  • Communications

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Special printed circuit board manufacturing - thick copper foil substrate (high current substrate)

Special printed circuit board manufacturing - thick copper foil substrate (high current substrate)

By using a special manufacturing method, it is possible to produce substrates with a copper thickness of up to 400μ.

When a standard thickness of 18μ copper foil carries a large current, it can generate high heat and, in some cases, may even break, which is very dangerous. Such substrates can be addressed by increasing the thickness of the copper foil, and K2 Corporation can manufacture substrates with thicknesses ranging from 35μ to 105μ using standard substrate manufacturing methods. Furthermore, by employing special manufacturing techniques, it is possible to produce substrates with a maximum copper foil thickness of 400μ. For more details, please contact us or refer to our catalog.

  • Printed Circuit Board

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Latest comprehensive catalog of a substrate specialty manufacturer 【*Includes 3 case studies!】

Latest comprehensive catalog of a substrate specialty manufacturer 【*Includes 3 case studies!】

What is the secret behind achieving ultra-short delivery times for special substrates? Limited free sample giveaway!

At K2, a manufacturer specializing in printed circuit boards, we have all the manufacturing equipment necessary for PCB production fully equipped in-house. By operating this equipment at 100%, we achieve shorter delivery times and lower costs for special PCBs and medium-lot products, which are difficult for prototype manufacturers to handle. We address five key issues in the PCB manufacturing industry: inability to accommodate ultra-short delivery times, excessively high initial costs for flexible PCBs, being turned down for inquiries about special PCB manufacturing, inability to meet short delivery times for medium-lot production, and concerns about PCB quality. *Exclusive to Ipros users! We are currently offering samples of rigid-flex PCBs and double-sided flexible PCBs! Please contact us during this opportunity. (Limited quantities available) [Case Studies] - Resin filling (Pad on Via holes) specification ⇒ Where outsourcing would typically require an extra 3 days, we can accommodate it in 1 day! - Double-sided flexible PCBs ⇒ Achieved shorter delivery times and reduced initial costs by using laser processing instead of molds for shape processing! - 4-layer rigid-flex PCBs (without reinforcement) ⇒ Typically 7 days, expedited response in 6 days! *For more details, please contact us or download our catalog to view.

  • Printed Circuit Board

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We do not refuse! Responding to various circuit boards with short delivery times! *Exhibiting at Nepcon.

We do not refuse! Responding to various circuit boards with short delivery times! *Exhibiting at Nepcon.

Various types of substrates can be manufactured, including rigid substrates, flexible substrates, build-up substrates, rigid-flex substrates, and special substrates!

K2 has all the necessary equipment for circuit board manufacturing in-house, allowing us to complete all processes without relying on outsourcing. K2 does not turn down requests for specialized circuit board manufacturing, even those that require high processing technology and precision. For complex projects that have been rejected by other companies, we leverage our established track record and know-how to find unique solutions. 【Features】 ◆ Flexible response to detailed customer requests ◆ Thorough data checks contribute to reduced lead times and costs ◆ Short lead times achievable through in-house integrated production and strict deadline management *For more details, please refer to our materials. Feel free to contact us. 【Exhibition Information】 We will be exhibiting at Nepcon Japan from January 22 (Wednesday) to January 24 (Friday), 2025! Booth: East Hall 2 E10-36. We look forward to your visit!

  • Printed Circuit Board

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Technical Introduction: "Improvement of V-Cut Position Accuracy (High-Density and Precision Processing Technology)"

Technical Introduction: "Improvement of V-Cut Position Accuracy (High-Density and Precision Processing Technology)"

Introducing technology for improving V-cut position accuracy! High-precision V-cut method using CCD.

At Sato-Sen Co., Ltd., we have achieved a positional accuracy of ±50μm through improvements in V-cut and pattern positioning. The pattern formation is made possible by the LDI (Laser Direct Imaging) method, and the V-cut is achieved using a high-precision V-cut method with CCD. We enhance hole position accuracy with ultra-high-speed micro-diameter drill machines, form high-density circuits (L/S = 30/30) with LDI, and provide high-density multilayer printed circuit boards with stable quality using X-ray reference drilling equipment and X-ray measuring machines. 【Features】 ○ We offer multilayer printed circuit boards → High density, IVH, BVH, and build-up with design flexibility ○ Flat plugs (pad-on-via) allow for mounting on through-holes ○ Landless through-holes enable compatibility with narrow pitch patterns ○ Ultra-fine printing is possible (1 character: vertical 0.28 × horizontal 0.15 mm) Please contact us for more details.

  • Printed Circuit Board

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Technical Introduction: "Zaguri (COB Technology)"

Technical Introduction: "Zaguri (COB Technology)"

Introducing the boring technique! It is possible to perform boring to lower the height of the LSI.

Sato-sen Co., Ltd.'s router machines are equipped with Z-axis sensors that measure the thickness of the board and perform machining from the top surface, enabling high-precision counterboring. This allows for the embedding of LSI through cavity processing for die bonding. 【COB Technology Features】 ○ Providing reliable and stable COBs → Strict quality control by experienced engineers from a company that has emerged from the plating industry ○ Proven track record from COB development to mass production ○ Even when leads cannot be drawn due to gold plating for electro-bonding in design, unique lead-free electro-bonding gold plating is possible ○ Equipped with bonding machines and pull-cut testers in-house, ensuring a quality assurance system through various chemical analyses, SEM, etc. For more details, please contact us.

  • Printed Circuit Board

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Technical Introduction: "LED Brightness (High Brightness and Heat Dissipation Technology)"

Technical Introduction: "LED Brightness (High Brightness and Heat Dissipation Technology)"

Introducing LED brightness enhancement technology! It enables improved reflectivity and reduced junction temperature.

At Sato-Sen Co., Ltd., we have methods to improve the brightness of LEDs. One method involves enhancing the reflectivity, which can be achieved through the substrate, plating, and solder resist. Another method is to lower the junction temperature of the LED, which can be accomplished through pattern design, selection of heat dissipation materials, and setting conductor thickness. Additionally, it is also possible to improve brightness with our unique substrate shape. 【Features】 - Outer shape processing can be done through V-cut, routing, and press processing. - Thermal vias filled with copper paste allow for heat dissipation through through-holes. - Heat dissipation can also be achieved with heat sink pins inserted into through-holes. For more details, please contact us.

  • Printed Circuit Board

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Technical Introduction: "Implementation Technology"

Technical Introduction: "Implementation Technology"

Introducing the implementation technology of printed circuit boards! Measures against poor solder wetting during assembly.

At Sato-Sen Co., Ltd., we are implementing pattern designs that are easy to assemble at the design stage as a measure to improve yield in general printed circuit board assembly. Additionally, to enhance yield in flip chip assembly, we are forming dams using film solder resist, which is effective in preventing solder shorts at C4 and ensuring package parallelism. [Factors Contributing to Poor Solder Wetting] - The increase in alloy layers with lead-free solder, and the presence of black pads due to the nickel layer in flash gold plating are considered potential causes. ⇒ In lead-free solder, managing the composition and temperature of the solder bath is crucial. ⇒ For flash gold plating, proper management of the pre-treatment and nickel bath solution is essential. For more details, please contact us.

  • Printed Circuit Board

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Integrated in-house support for shaping, processing, and firing! Contract processing of ceramics.

Integrated in-house support for shaping, processing, and firing! Contract processing of ceramics.

Pre-sintering processing is also possible! We have a proven track record in a variety of ceramic processing, including alumina, zirconia, and 99.8% high-purity fused silica molded products.

Our company offers "ceramics contract processing," where we handle molding, processing, and firing in-house. We can process various ceramics such as alumina, zirconia, and magnesia. In addition to post-firing processing, we also perform pre-firing processing, which helps prevent cracking and chipping due to thermal expansion and post-molding processing. Currently, we are offering a comprehensive catalog of ceramic products! It includes a wide range of ceramic products, starting from dense products like alumina and zirconia to 99.8% high-purity fused silica molded items. Furthermore, the catalog provides information on the types of ceramics, purity, and characteristics based on molding methods, making it useful for property comparison and selection! 【Points for Choosing Maruwai】 ◆ All contract molding, processing, and firing are handled in-house ◆ High purity with excellent heat resistance and thermal shock resistance ◆ Superior durability ◆ Capable of accommodating various shapes from large to small ◆ Wide-ranging support for pressing, CIP, casting, extrusion molding, and machining ◆ We also develop raw materials in-house, allowing us to propose suitable materials based on applications and needs *Please view the Maruwai Ceramics Comprehensive Catalog PDF available for download.

  • Ceramics

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Face's Wisdom Bag: "Points to Note When Releasing Materials (3)"

Face's Wisdom Bag: "Points to Note When Releasing Materials (3)"

We will propose points of caution and countermeasures from the perspective of the manufacturing site regarding material shipment.

This item introduces precautions for parts shipping (parts packaging) and examples that may lead to manufacturing defects. *For more details, please refer to the PDF document or feel free to contact us.

  • EMS

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BeagleBone Black PoE/PSE board

BeagleBone Black PoE/PSE board

You will be able to use PoE devices such as network cameras in a solar/battery environment.

Texas Instruments Linux/ARM system: By using the BeagleBone Black board in conjunction with the battery charger circuit board OELBBBPWR01, it becomes possible to utilize PoE devices such as network cameras in solar/battery environments. This device (OELBBBPoE01) provides the functionality of PSE (Power Sourcing Equipment) for PoE (Power over Ethernet).

  • Embedded Board Computers

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Solar/Battery Charger Board for BeagleBone Black

Solar/Battery Charger Board for BeagleBone Black

The BeagleBone Black can be used in indoor and outdoor areas without power supply. It is convenient when used in conjunction with a mobile router.

This product is a battery charger circuit board for operating the Texas Instruments Linux/ARM system: BeagleBone Black board with battery/solar power. It is convenient to use this product (OELBBBPWR01) in conjunction with a mobile router and LAN hub. It enables a cable-free operation of the BeagleBone Black without the need for power lines or communication lines, allowing for use in areas without electricity. By combining this product with the BeagleBone Black, various IoT devices can be easily and inexpensively realized. Please mount this product (OELBBBPWR01) on the 46-pin expansion connector of the BeagleBone Black board. Additionally, you can charge a mobile phone from this product via the Micro USB connector (5V). By using this product, you can charge a mobile phone from a battery or solar panel during a disaster.

  • Embedded Board Computers
  • Other embedded systems (software and hardware)
  • Other environmental analysis equipment

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High-strength alumina substrate for thin films

High-strength alumina substrate for thin films

Ideal for thin film circuit formation! JFC's unique alumina substrate with high strength, high purity, and excellent planar smoothness.

The high-strength alumina substrates for thin films manufactured by our company feature a dense and smooth surface achieved through the use of fine and uniform raw powder, making them suitable for the formation of fine thin film circuits. Due to their high purity and bending strength, they are resistant to cracking even when the substrates are made thin, and they excel in handling, contributing to the miniaturization and thinning of the substrates. They are increasingly being adopted for temperature sensors and chip resistors.

  • High frequency/microwave parts
  • Fine Ceramics

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