プラズマ・サーモ・ジャパン List of Products and Services

We offer an "Ion Assist Sputtering Deposition System (PVD)" that can handle everything from research and development to small-scale production. This system can be applied to a wide range of fields, including semiconductor devices, nanotechnology, ferroelectric and ferromagnetic thin films, and superconducting thin films. In particular, as an alternative technology to bias sputtering, it achieves dense and highly adherent thin film deposition, making it easy to control film stress. Furthermore, it supports high-temperature deposition up to a maximum substrate temperature of 800°C, and deposition on insulating substrates is also possible. 【Features】 - Provides dense and highly adherent thin films due to the high-temperature substrate heating mechanism and ion assist effect. - Wafer carrier with excellent thermal conductivity. - Supports alloy deposition and deposition of oxides and nitrides via reactive sputtering. - Uses an end-hole type (Kaufman type) ion source with strong directionality and concentrated ion energy bandwidth. - Accommodates lab-scale to small-scale production, delivering thin films with excellent density and adhesion. *For more details, please feel free to contact us.

• Sputtering Equipment

We would like to introduce our "RIE Dry Etching Equipment for Photomasks." By adopting a "shuttle" as the carrier for photomasks, it is possible to process various sizes of photomasks simply by replacing the "shuttle," without the need to change the hard wafer. We offer both open load and load lock types, and with the load lock type, it is possible to etch MoSi, Cr, and Ta materials in a single chamber. 【Features】 ■ Compact design ■ Easy cleaning of the reactor interior through plasma cleaning ■ Use of liners to prevent contamination within the reactor chamber ■ Easy to remove due to the plug-in design *For more details, please download the PDF (English version) or feel free to contact us.

• Etching Equipment

Plasma Thermo Japan Co., Ltd. will exhibit at the technical exhibition corner of the "MEMS Engineer Forum 2025" held at the International Fashion Center Building (KFC Hall) in Ryogoku, Tokyo. <Exhibition Contents> 1. Low-temperature, low-damage etching and cleaning equipment using high-density radicals The patented HDRF technology (High Density Radical Flux) eliminates the causes of yield reduction in MEMS. 2. Processing technology essential for future high-frequency devices and high-speed optical modulation waveguide processing (Ion Beam Etching) Ion beam etching suitable for processing multilayer structures. The tilt mechanism of the wafer stage allows for adjustment of side wall angles. 3. Plasma etching and film deposition equipment suitable for batch processing of compound semiconductors Multiple wafers can be loaded onto a "shuttle" (wafer carrier) for batch processing. This equipment is suitable for small-scale production. We sincerely look forward to your visit. *You can download the equipment catalog. *Please feel free to contact us for more details.

• Etching Equipment

Plasma Thermo Japan Co., Ltd. will be exhibiting at "Semicon Japan 2024" held at Tokyo Big Sight. Our company specializes in plasma technology, handling etching, deposition, cleaning equipment, ALD-like deposition equipment, ion beam equipment, PVD equipment, and RTP equipment. We also offer batch-type sputtering equipment and electron beam evaporation equipment, enabling us to propose solutions for various applications. In the seminar held at our booth, we plan to introduce new technologies that enable low-temperature removal of polymers and HDI resist using HDRF-high-density radicals, as well as new technologies for ALD-like deposition with the deposition rate of KBOUS FAST-CVD. We look forward to your visit. 【Event Overview】 ■ Dates: December 11 (Wed) - 13 (Fri), 2024, 10:00 - 17:00 ■ Venue: Tokyo Big Sight, East Hall 4, Booth 4032 ■ Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 ■ Nearest Stations: - Rinkai Line, Kokusai-Tenjijo Station (approximately 7 minutes on foot) - Yurikamome, Tokyo Big Sight Station (approximately 3 minutes on foot) *For more details, please refer to the related links or feel free to contact us.

• Etching Equipment

The "TFE New Ion Beam Sputtering Series" is a research and development system for small-scale production with a variety of functions, particularly a sputtering solution for ferromagnetic films and solid electrolytes that allows for the formation of ferromagnetic thin films, such as MTJ devices, without plasma damage. Additionally, it is an ion beam sputtering device that achieves good film thickness distribution for solid fuel cell electrolytes. Furthermore, it is a sputtering device that offers the option of manual or automatic load lock, and features complete automatic control via PLC and PC, as well as remote control via the internet. 【Features】 ■ A plasma damage-free process applicable for the deposition of thin films for ferromagnetic elements (MTJ) ■ Excellent film thickness uniformity for solid fuel cell electrolytes (can be equipped with a glove box) ■ Outstanding film thickness uniformity (<2%: 3σ, 200mm wafer) *For more details, please feel free to contact us.

• Sputtering Equipment

"ECLIPSE" is a sputtering device using a side sputtering method for front and backside metallization, as well as for the deposition of dielectrics and piezoelectric materials. It also features a uniquely developed transport mechanism that accommodates ultra-thin wafers and fragile substrates. This device is recommended for engineers facing challenges with continuous deposition and wafer transport in sputtering processes such as backside metallization and under bump metal. 【Features】 ■ Non-contact wafer transport mechanism ■ Compatible with production 150mm wafers (wafer thickness: 250μm) ■ Also compatible with production 100mm wafers (wafer thickness: 130μm) ■ Wafer self-centering capability *For more details, please feel free to contact us.

• Sputtering Equipment

The "TFE News Sputtering Series" is a research and development as well as small-scale production system with a variety of functions. It is a compact sputtering device capable of high-temperature film deposition of metal films and dielectric films for nanomaterials such as metal nanoparticles, nanowires, and nanosheets, with temperatures up to 800°C. Additionally, it offers the option of manual or automatic load lock, and features complete automatic control via PLC and PC, as well as remote control over the internet. This sputtering device is recommended for engineers seeking high substrate heating temperatures (maximum heating temperature: 800°C) for thin film deposition of nanomaterials. 【Features】 ■ Suitable for thin film deposition of nanomaterials (metal nanoparticles, nanowires, nanosheets, materials for nanoelectronics) ■ Capable of 800°C substrate heating, which is difficult with other devices ■ Cost-effective sputtering with substrate rotation *For more details, please feel free to contact us.

• Sputtering Equipment

The high-density radical cleaning process can completely remove residues such as photoresist and polymers without damaging delicate devices or complex structures. Furthermore, for fine structures such as medical implants, our unique plasma source using remote plasma allows for the removal of residues that could not be completely eliminated by wet processes. Additionally, processing can be performed at both high and low temperatures for complex shapes using high-density radical flux. 【Features】 ■ Flexible processing over a wide temperature range ■ High selectivity and uniformity in the process ■ Capability to completely clean samples with complex shapes *For more details, please feel free to contact us.

• Other contract services

The "TFE BH/BV Batch Type Sputtering Series" offers a vertical transport method with extremely low particle deposition on substrates and a horizontal transport method with excellent maintenance capabilities. It achieves precise control of film thickness through high-speed scanning of substrates directly beneath each cathode, providing a sputtering solution for aerospace engineering and medical applications, all while maintaining an inline approach. Additionally, it allows for the selection of high-rate DC magnetrons for metals, RF magnetrons for oxides, and dual-cathode AC sputtering, enabling high-throughput production of high-end functional films. This is highly recommended for engineers seeking high-throughput film deposition using high-end batch equipment. 【Features】 ■ Good film thickness distribution through the swinging of the substrate holder (palette) ■ Cleaning process enabled by an RF etching chamber ■ Expandability of the sputtering process with DC substrate bias (optional) *For more details, please feel free to contact us.

• Sputtering Equipment

"QuaZar" is a damage-free ion beam deposition solution that enables a precise thin film deposition application through a large-area ion source and advanced motion control. The extension of maintenance cycles, including the application of our uniquely developed Marathon-grids technology, is a crucial factor for production and can also be installed in your existing systems. The target is sputtered by an ion beam with the set energy, allowing for a wide process window. 【Features】 ■ REDEP breaker that prevents short circuits in the ion source using RF shunting ■ Auxiliary electrode system that prevents anode loss in the ion source ■ Adoption of a virtual shutter that eliminates the need for a mechanical shutter, reducing particles ■ Dual PBN (optional) that integrates two neutralizers *For more details, please feel free to contact us.

• others

"QuaZar" is an etching processing technology that enables vertical etching capability, which is difficult to achieve with plasma etching, in the etching process of hard-to-etch materials such as ferroelectric PZT, thanks to its large-area ion source and advanced motion control. By adopting a unique Ion Source, Marathon Grids, and optional Dual PBN, it triples the MTBM compared to conventional products (and can also be installed in existing equipment from other companies). Additionally, the REDEP Breaker and AUXILIARY Electrode prevent RF shunting and anode disappearance. 【Features】 ■ In PZT etching applications, etch stop is possible with noble metal electrode layers without EPD (with no deposition on sidewalls and a smooth surface). ■ The selectivity of photoresist in PZT etching improves from 0.6:1 with inert IBE to 1.1:1 with RIBE. ■ The etching speed for PZT improves from about 20 nm/min with inert IBE to about 30 nm/min with RIBE. *For more details, please feel free to contact us.

• others

The "Corial Shuttleline Series for Failure Analysis" is a failure analysis device capable of selectively removing not only the insulating layers of semiconductor ICs but also the metal layers. It features a small footprint and is a cost-effective failure analysis system. To maintain electrical characteristics, it provides highly precise etching processes using RIE and ICP-RIE, ranging from multi-level deprocessing that does not etch the metal layers to damage-free processes with high selectivity, including metal etching. The failure analysis solution can analyze die packages and full wafers up to 200mm. 【Features】 ■ Does not etch metal layers to maintain electrical characteristics ■ High selectivity processes including metal etching from multi-level deprocessing ■ Reduces analysis time from 1 to 5 days with wet etching to just 1 to 2 hours *For more details, please feel free to contact us.

• Other analyses

The "Shuttleline200 Series" is a flexible and multipurpose platform for etching and PECVD applications. By adopting a unique shuttle concept, it enables handling of samples in various sizes, from small pieces to full wafers, providing a multipurpose etching and deposition solution. It also allows for plasma processing technologies such as RIE, ICP, PECVD, and ICP-CVD, offering suitable processing for R&D applications and small-scale production. Specifically, it can perform etching and deposition for a wide range of markets, including failure analysis, MEMS, optical MEMS, advanced packaging, and processes for power semiconductors. 【Features】 ■ Easily adaptable to a wide variety of substrate shapes and sizes due to the unique shuttle concept. ■ User-friendly equipment with a wealth of options and high upgradeability. ■ Multipurpose capability to meet advanced and specific requirements such as RIE and ICP etching. *For more details, please feel free to contact us.

• others

"KOBUS-F.A.S.T" is a solution that achieves high-quality thin film deposition processing, not only through the F.A.S.T process that balances the coverage of ALD and the deposition rate of PECVD but also enables ALD deposition. It is used for applications involving base layer SiO2, barrier layer TiO2, and metal layers Cu, Co, or transparent conductive ZnOx with ALD and F.A.S.T high-rate deposition while maintaining good coverage. This is recommended for engineers who are exploring methods to improve deposition speed while maintaining film quality and coverage in ALD deposition. 【Features】 ■ A process that balances the coverage of ALD and the deposition rate of PECVD ■ ALD deposition is also possible with this equipment ■ Capable of high-quality deposition of oxides, nitrides, and metals with high deposition rates *For more details, please feel free to contact us.

• others

We would like to introduce our thin film PECVD and dry etching equipment, the "SHUTTLELINE(R)" and the compact 300 & 500 series compatible with batch processes. Film deposition is done using PECVD, while etching is performed using RIE, ICP, and ICP-RIE. By utilizing a unique wafer stage, it is possible to batch process from 1 to a maximum of 27 pieces for 2-inch wafers, for example. These systems can be used from development to mass production. 【Features】 ■ The PECVD deposition equipment features a compact chamber design and incorporates automatic cleaning, maximizing throughput. ■ The etching equipment is said to reduce operational costs, making it popular among many micro LED manufacturers. ■ It accommodates various wafer sizes and shapes, including wafer pieces and full wafers, and thanks to the shuttle system (wafer stage), no hardware changes are needed for different sample sizes. *For more details, please feel free to contact us.

• Etching Equipment

We would like to introduce our "Ion Beam Etching (IBE) and Deposition Equipment (IBD)." We offer a lineup ranging from standard entry models to high-end models capable of precise control over film thickness uniformity and other parameters. We can accommodate special specifications such as glove box attachments for research and development in both corporate and academic settings. Additionally, we support everything from lab-scale R&D to mass production, enabling etching processes for difficult materials and deposition focusing on uniformity and film thickness distribution for various materials equipped with a dual ion gun system. 【Features】 - We can propose models tailored to your performance requirements, from standard entry models to high-end classes capable of precise control over film quality. - We can accommodate special specifications, including glove box connections, for research applications in R&D and academia. - Film thickness uniformity of less than 0.6% (3σ) has been achieved on 200mm wafers. *For more details, please feel free to contact us.

• Etching Equipment

The "SHUTTLELINE(R) series" is a flexible semiconductor manufacturing device that supports PECVD and dry etching for thin film deposition and failure analysis processes. It is compatible with RIE/ICP-RIE and PECVD/ICP-CVD, and is a compact device that can be used for various applications with a range of options. It is recommended for companies and academia that need a compact lab-scale device for R&D or laboratories, or for those looking for a device that can perform both film deposition and etching in one unit. 【Features】 ■ High-precision, damage-free etching process ■ Supports various wafer sizes and shapes, including dies, packaged dies, wafer pieces, and full wafers ■ The shuttle system eliminates the need for hardware changes for different sample sizes ■ Multi-functional support for film deposition/etching in one unit ■ Proven adoption worldwide, with local support through Plasma-Therm LLC's global network *For more details, please feel free to contact us.

• Other semiconductor manufacturing equipment

We offer a "custom-made sputtering deposition system (PVD)" that can handle everything from research and prototyping to mass production. We support coating for decorative and surface protection purposes, as well as research and development to mass production of thin film devices such as flexible electronics, optical communication technologies, thin film solar cells, and batteries. We can assemble the system according to your needs, including sample size, deposition target materials, and batch processes. 【Features】 - Unique technology that accommodates all metal and oxide targets - Wafer sizes from 1mm x 1mm to 300mm x 560mm, with thicknesses up to 25mm - No need for hardware or software changes for deposition on different sizes - Thin Film Equipment recommended by research institutions across Europe *You can download the English version of the materials. For more details, please feel free to contact us.

• Sputtering Equipment

The "HEATPULSE" is a high-speed heating treatment (RTP/RTA) device capable of SiC wafer annealing without the need for a susceptor. Thanks to our unique technology, high-temperature processes are also made more efficient. This device is suitable for power device-related applications, as well as other semiconductor industries, or for those requiring high-temperature rapid heating treatment. 【Features】 ■ Achieves SiC annealing without a susceptor through unique technology ■ Approximately 1.5 times higher throughput and improved process flexibility due to enhanced purge efficiency and heating rate (compared to our susceptor-equipped devices) ■ The new model supports a two-chamber configuration, allowing for future upgrades from single to double chamber ■ Plasma-Therm's proprietary user-friendly control system "Cortex" *For more details, please refer to the related links or feel free to contact us.

• Heating device

The "Plasma POD Series" is a small and compact tabletop etching and deposition device. It is recommended for those who have limited installation space and are considering the introduction of an etching and deposition device at a low cost. Please feel free to contact us if you have any inquiries. 【Features】 ■ Maximum device size: 80cm x 80cm x 80cm (height) ■ Easy operation with a touch panel * You can download the English version of the catalog. * For more details, please feel free to contact us.

• Etching Equipment

With our product 'Corial D250L/Kayen HDRF', the application of plasma technology in the fields of bio and medical is possible. It forms passivation films for body-embedded sensors and medical devices. We can also handle surface decontamination of complex-shaped ceramic and metal implants. 【Features of Passivation Films】 ■ Currently, we can form the following four types of films that are attracting attention in the industry: - a-SiC:H (robust film) - a-C:H (inert and wear-resistant film) - SiN (stress and robustness control film) - SiO2: BioMEMS (low stress and high dielectric breakdown film) *For more details, please feel free to contact us.

• Plasma surface treatment equipment

"QuaZar" is an etching and deposition device that achieves process results in challenging etching processes and thin film formation applications through a large-area ion source and advanced motion control. The Marathon grids technology of this product is a key element and can be installed in your existing systems. Many customers around the world have successfully improved the performance of their existing equipment with grid technology, extending its lifespan by more than double. 【Features】 ■ Uniformity <2% 3σ (200mm wafer), with scanning motion achieving <0.6% 3σ ■ Ion Source, Marathon Grid, and Dual PBN have doubled the MTBM compared to conventional systems and can be equipped on existing devices from other manufacturers ■ Clustering with our PVD, CVD, etc. is possible ■ 150mm, 200mm *For more details, please feel free to contact us.

• Etching Equipment

We handle plasma etching equipment for semiconductor failure analysis. From multi-level deprocessing that does not etch the metal layer to maintain electrical characteristics, to processes with high selectivity and no damage, including metal etching, our RIE and ICP-RIE FA solutions can be used for samples of dies, package dies, and wafers up to 200 mm. Please feel free to contact us when you need assistance. 【Features】 ■ Capable of processing dies, package dies, and 200 mm wafers ■ Accumulated process know-how prevents over-etching ■ Compact footprint and cost-effective system * You can download the English version of the catalog. * For more details, please refer to the PDF materials or feel free to contact us.

• Semiconductor inspection/test equipment

The "plasma processing equipment" is a plasma etching and deposition device for optical compound semiconductors. It is capable of providing systems suitable for various stages from research and development to mass production. Additionally, it is designed to handle a wide range of materials necessary for the manufacturing of optoelectronic devices. Please feel free to contact us when needed. 【Applications】 VCSEL, LED, μLED, Micro Lens, Wave Guide 【Etching】 Sapphire, GaN, GaAs, Si3N4, SiO2, etc. 【Deposition】 nSiO2, Si3N4, a-Si, SiC, etc. *You can download the English version of the catalog. *For more details, please refer to the PDF materials or feel free to contact us.

• Etching Equipment

We would like to introduce our plasma-based atomic layer etching device, the 'Takachi ALE.' The Takachi system enables the ALE process by incorporating an ALE kit. Since etching is performed one atomic layer at a time on the surface, it minimizes damage to the etched object. 【Features】 ■ Equipped with an ALE kit, enabling the ALE process ■ Etches one atomic layer at a time on the surface ■ Minimizes damage to the etched object *You can download the English version of the catalog. *For more details, please refer to the PDF materials or feel free to contact us.

• Etching Equipment

We would like to introduce "HDRF," which is handled by Plasma Therm Japan Co., Ltd. It removes photoresist and organic polymer residues at low temperatures, which is particularly important during the device manufacturing stages of MEMS, LEDs, and advanced packaging. Please feel free to contact us if you have any inquiries. 【Features】 ■ Temperature - Low temp: 50℃ to 150℃ - High rate: 150℃ to 250℃ ■ Wafer: 2" to 8" * You can download the English version of the catalog. * For more details, please refer to the PDF materials or feel free to contact us.

• Other physicochemical equipment

We would like to introduce the "Takachi ICP Cryo," which we handle. It is used in etching processes that require higher anisotropy and selectivity. 【Features】 ■ Temperature range: -150℃ to +350℃ ■ Wafer size: 2" to 8" * You can download the English version of the catalog. * For more details, please refer to the PDF document or feel free to contact us.

• Other surface treatment equipment

The "200FA/200R/200I" is a defect analysis device for semiconductor chips and wafers. Through the delamination process, it is possible to remove unnecessary areas and analyze the causes of defects. 【Features】 ■ Selectable delamination technologies (RIE, HCD, ICPRIE) ■ Flexibility in sample shapes (die, package die, wafer fragments, full wafers) ■ Flexibility in transport (direct load, pre-load shuttle, pre-load shuttle with load lock) * You can download the English version of the catalog. * For more details, please refer to the PDF materials or feel free to contact us.

• Other analyses

The "210D model" is a film deposition device using Inductively Coupled Plasma (ICP). By replacing hardware on-site, it can be used as an inductively coupled plasma etching device in just a few minutes of work. With a compact body and a variety of options, it supports various applications such as thin film deposition and trench patterning. 【Features】 ■ Can be used as plasma CVD and RIE with simple hardware replacement ■ Approximately 30% smaller footprint compared to industry standards ■ Easy to operate with an intuitive graphic interface ■ Custom specifications can be accommodated upon request *For more details, please feel free to contact us.

• Etching Equipment

The "MDS-100/MDS-300" is a plasma dicing device that utilizes inductively coupled technology, enabling stable and uniform continuous processing of 25 wafers with high-output plasma. It allows processing while maintaining high uniformity without causing damage to the wafers, similar to that caused by saws or lasers. Using the Bosch process with a high-speed gas switching system, it achieves excellent sidewall shape and processing of free shapes, providing superior dicing strength compared to existing methods. 【Features】 ■ Contributes to improved die quality, yield, and freedom of die shape with excellent processing capability ■ Supports multiple wafer sizes (MDS-100: φ4" to 8", MDS-300: φ8" to 12") ■ Dicing using Bosch process with inductively coupled plasma ■ Achieves fast and stable step switching through a high-speed gas switching system ■ Allows setting of parameter morphing and its fluctuation trends *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment

We would like to introduce our "Corial 200 Series." This research and development equipment utilizes a common platform and can be configured as RIE, ICP, ICP+RIE, ICP-CVD, or PECVD depending on the application. Wafer sizes are 50mm, 100mm, 150mm, and 200mm. 【Features】 ■ Utilizes a common platform ■ RIE, ICP, ICP+RIE, ICP-CVD, or PECVD equipment ■ Designed for research and development ■ Wafer sizes are 50mm, 100mm, 150mm, and 200mm * You can download the English version of the catalog. * For more details, please refer to the PDF document or feel free to contact us.

• Etching Equipment

We would like to introduce our ion beam etching and deposition system, 'QuaZar(TM)'. With a large-area ion source and advanced motion control, it achieves high throughput. In particular, the Marathon(TM) grid allows for excellent uniformity over a long period compared to conventional methods. 【Specifications】 ■ Ion beam system ■ Process temperature: -40℃ to +60℃ ■ Tilt angle: +90 degrees to -80 degrees ■ Load lock or CtoC ■ Wafer sizes: 100mm, 150mm, 200mm * You can download the English version of the catalog. * For more details, please refer to the PDF document or feel free to contact us.

• Etching Equipment

"KOBUS F.A.S.T.(R)" is a plasma deposition device for industrial ALD-level film quality. By utilizing a pulse function, it is possible to produce films equivalent to ALD (Atomic Layer Deposition) in the same processing time as conventional CVD. The process temperature ranges from 80°C to 500°C, with wafer sizes of 150mm and 200mm, and a deposition rate of 0.1nm/min to 500nm/min. 【Specifications】 ■ Process temperature: 80°C to 500°C ■ Wafer sizes: 150mm, 200mm ■ Deposition rate: 0.1nm/min to 500nm/min ■ Aspect ratio ・20:1 * You can download the English version of the catalog. * For more details, please refer to the PDF materials or feel free to contact us.

• Other inspection equipment and devices