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substrate Product List and Ranking from 548 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  4. 4 沖電気工業 産業営業本部　産業営業統括室 Tokyo//Information and Communications
  5. 5 null/null
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substrate Product ranking

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社　和歌山
  2. Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  3. All LCP Flexible Printed Circuit Board (FPC) 山下マテリアル
  4. 4 Electronic Component Reel Management System "Smart Reel Rack" JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrate Product List

1021～1035 item / All 1843 items

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Flexible Printed Circuit (FPC) Catalog

Flexible Printed Circuit (FPC) Catalog

A wide range of products including single-sided FPC, double-sided FPC, and flex-rigid are featured.

The "Flexible Printed Circuit (FPC) Catalog" is a catalog that widely introduces high-quality FPC products nurtured by Okiden Cable in a clean environment. The feature of Okiden Cable's Roll to Roll (RtoR) line is its ability to handle both single-sided and double-sided FPCs. All equipment is installed in a clean room with management considerations for dust prevention. [Contents] ■ Okiden Cable's FPC Product Concept ■ Areas of Achievement ■ Process Overview ■ What is a Flexible Printed Circuit (FPC)? ■ Product Introduction *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Flexible Printed Circuit Board (FPC) "Long-Length High-Speed Transmission FPC"

Flexible Printed Circuit Board (FPC) "Long-Length High-Speed Transmission FPC"

Achieves a transmission distance more than three times that of a typical high-speed transmission FPC!

The "Long-Length High-Speed Transmission FPC" is a flexible printed circuit board (FPC) that enables the transmission of high-speed signals over long distances, achieved through the fusion of our long-length technology and high-speed transmission technology. It can be used for high-speed signal transmission wiring in large equipment and is also adopted in astronomical observation devices. 【Features】 ■ Transmission distance is more than three times that of typical high-speed transmission FPCs. ■ Enables long-length high-speed transmission comparable to cables while maintaining the thinness and lightness of FPCs. ■ By using low-breakage materials and unique pattern design, it can transmit up to 1 meter under the "USB3.0" standard. ■ Supports measurement of various transmission characteristics such as characteristic impedance, loss, and crosstalk. *For more details, please refer to the PDF document or feel free to contact us.

  • Wiring materials

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Multilayer Flexible Printed Circuit (Multilayer FPC) "Ultra-thin Flexible Multilayer FPC"

Multilayer Flexible Printed Circuit (Multilayer FPC) "Ultra-thin Flexible Multilayer FPC"

Achieving a 40% reduction in thickness! Introducing a flexible, low-rebound, and excellent multilayer flexible substrate.

The "Ultra-thin Flexible Multi-layer FPC" is a multi-layer flexible substrate that achieves a thinner profile while maintaining the same wiring density as standard multi-layer FPCs. It enables bending wiring in narrow spaces, which was previously difficult, contributing to the ongoing lightweight and compact development of digital electronic devices. It can be applied to wearable devices used in various fields, including mobile devices, medical and nursing care, robotics, sports, and healthcare. 【Features】 ■ Achieves a 40% reduction in thickness ■ Uses polyimide as the substrate, ensuring sufficient reliability while being thin ■ Excellent embedability due to its thin, flexible, and low-rebound characteristics *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Flexible Printed Circuit (FPC) "Transparent FPC"

Flexible Printed Circuit (FPC) "Transparent FPC"

Introducing a flexible printed circuit board (FPC) that balances transparency and solderability!

"Transparent FPC" is a flexible printed circuit board (FPC) that excels in transparency and heat resistance, using transparent polyimide film as its substrate. We have worked on developing an FPC that achieves both high heat resistance and transparency by adopting a highly heat-resistant transparent polyimide film, thereby solving the issues of warping and dimensional changes caused by heat during reflow. As a result, it can be applied to various fields such as wearable devices and medical equipment, which prioritize design. [Features] - Uses highly heat-resistant transparent polyimide film - Can utilize the existing design rules of conventional FPCs - Proposes new wiring styles in fields such as medical, lighting, and industrial equipment *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Printed Circuit Board Manufacturing - Build-Up Boards

Printed Circuit Board Manufacturing - Build-Up Boards

We achieve miniaturization, slimness, and high functionality of electronic devices with Kyoden's build-up substrates!

Compatible with ultra-thin build-up layer filled vias. Achieves equivalent filling properties even with build-up layers of different thicknesses. Supports thin plate formation and substrate property requirements with a highly flexible layer configuration. Compatible with 5-layer builds, full stack, and any layer. Kyoden's short delivery times also apply to build-up processes! We can deliver 1-2-1 (4-layer board) in as little as 2 days. 【Features】 ● Smaller substrate size ● Strong against noise ● Capable of carrying large currents ● High design flexibility *For more details, please download the PDF or contact us!

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  • Printed Circuit Board

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Kyoden Co., Ltd. Business Introduction

Kyoden Co., Ltd. Business Introduction

Kyoden Group that "shapes ideas."

At Kyoden Group, we solve various product development challenges faced by our customers through a fully in-house integrated approach. By providing consistent support from the development stage for custom parts that make up products such as circuit boards, enclosures, and mechanical components, we pursue added value for products and offer a "fully in-house one-stop solution" that is unmatched by other companies. For more details, please contact us or download the catalog.

  • Other electronic measuring instruments

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FPGA board development and manufacturing solutions

FPGA board development and manufacturing solutions

Support for the development and manufacturing of various boards utilizing FPGAs! Supporting each development phase.

Our company supports various development phases such as circuit design, AW, SI/PI, component procurement, and enclosure design. Utilizing our own PCB manufacturing and assembly factories, we can provide total support, including the production phase. 【Features】 ■ Proposals aimed at improving reliability - Adoption of back drilling methods - Utilization of test coupons ■ Integrated production at our own factories *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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Verification of 0603/0402 capacitor mounting on lead-free leveler substrate.

Verification of 0603/0402 capacitor mounting on lead-free leveler substrate.

By setting the appropriate pad dimensions, it is possible to support small-sized chip mounting!

Multilayer ceramic capacitors (MLCCs) are facing a challenging situation in procurement due to increased demand from smartphones and a rapid rise in automotive demand. In this tight supply-demand environment, MLCC manufacturers are promoting a shift from larger sizes (1608 and above) to smaller sizes (0603 and 0402) to increase supply capacity. This document introduces the "Verification of 0603/0402 Capacitor Mounting on Lead-Free Leveler Boards." We encourage you to read it! *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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"0201" SMD chip compatible 6-layer (2-2-2) build-up substrate

"0201" SMD chip compatible 6-layer (2-2-2) build-up substrate

Corresponding to the 'density' of components! High-frequency build-up substrate.

What supports KyoDen's narrow adjacent mounting technology is not just the mounting technology itself. It is unique to KyoDen that we can also offer solutions from substrate manufacturing technology, design, and analysis.

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  • Printed Circuit Board

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We undertake everything from printed circuit board production and prototyping to mass production!

We undertake everything from printed circuit board production and prototyping to mass production!

Quality is our top priority!

Before the factory shipment of printed circuit boards, we conduct pre-shipment inspections of all printed circuit boards at Core System Co. to ensure high and stable quality of the products delivered to customers.

  • Contract manufacturing

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Electroless copper plating equipment for semiconductor and printed circuit board horizontal manufacturing.

Electroless copper plating equipment for semiconductor and printed circuit board horizontal manufacturing.

Supports everything from single-sided substrates to flexible substrates using Roll to Roll!

This is a machine for electroless copper plating for substrate manufacturing. With optimal spray configuration, uniform plating can be achieved even inside blind vias and high aspect ratio through holes. Since it operates with horizontal transport, automation is possible from input to output. 【Features】 ◆ Plating is possible without the need for electrical conductivity, even on non-conductive materials. ◆ When combined with our various products, circuit widths can be minimized to 25μm. = For more details, please contact us =

  • Other surface treatment equipment
  • Other machine tools

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Mounting Machine "RX-8" (SMT Surface Mount Machine)

Mounting Machine "RX-8" (SMT Surface Mount Machine)

A high-speed modular mounter that achieves a throughput of 100,000 CPH! It offers top-class area productivity with a dual-head mounter!

The SMT (Surface Mount Technology) high-speed compact modular mounter 'RX-8' boasts a maximum throughput of 100,000 CPH and features a compact design of 998mm. Equipped with a high-precision planet head, it is perfect for the production of ultra-small chip components and small ICs, as well as products that require high-density mounting and precision, such as LED edge lights. 【Features】 - The 998mm compact design achieves high-efficiency production with class-leading area efficiency. - Compatible with 0201 chips and flexible substrates. - Capable of detecting front-and-back inversion, chip standing inspection, and component presence detection. - Automatic suction position correction function automatically adjusts and corrects the suction position of components. *For more details, please refer to the PDF document or feel free to contact us.

  • Mounter

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High-frequency substrate "Caflon"

High-frequency substrate "Caflon"

A super low loss of 0.00045 can be achieved at 18GHz.

Polifron Corporation has developed high-frequency substrates that utilize the properties of PTFE through its unique technology. This high electrical characteristic cannot be achieved with other substrates. By using high-purity PTFE with a dielectric constant of "2.1" as the dielectric material, an ultra-low loss of 0.00045 at 18GHz can be realized. 【Features】 ○ Ultra Low Loss ○ Very Low Dk ○ Isotropic Properties For more details, please contact us or download the catalog. *This catalog is in English.

  • Printed Circuit Board

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Control board Input/Output Universal IHP/04011ASS

Control board Input/Output Universal IHP/04011ASS

A universal card is provided so that you can freely create circuits and conduct experiments.

Create and experiment with circuits freely! Universal prototype board equipped with a 3.3V power circuit. ■□■Features■□■ ■ The onboard 3.3V power supply allows you to immediately configure 3.3V circuits. ■ Compact card size (50mm x 30mm) *excluding connectors ■ General-purpose 2.54mm pitch 0.8mm through-holes (18 columns, 9 rows) ■ 5V input → equipped with a 3.3V power circuit ■ Adopts Mi II wiring system * A crimping punch is required for connections with this product. ■ For other functions and details, please download the catalog or contact us.

  • Printed Circuit Board

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