Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.
1036～1050 item / All 1843 items
For high-frequency applications, from design to manufacturing and component assembly of printed circuit boards. High-speed FPGA boards ensure stable operation.
If you are experiencing issues such as instability caused by the printed circuit board, please feel free to consult us. So far, all designs from our company have been operating stably.
Support for miniaturization and modularization of circuit implementation boards using bare chip implementation, from concept to prototype to mass production!
We pursue micro-joining technology for bare chip mounting and inter-board connections, supporting the creation and realization of high-value-added products and the enhancement of global competitiveness. From concept to development design, prototyping, evaluation, analysis, and small to medium-scale mass production, we provide a one-stop service at our in-house factory (clean room class: 100 to 1000). We will realize bare chip mounting, which has been difficult to implement cost-effectively for small-scale production, through our module technology and manufacturing capabilities. **Benefits of Bare Chip Mounting** - **Increased Added Value** → Miniaturization and thinning expand product applications and create new markets. → Incorporating semiconductor backend processes enhances manufacturing added value. - **Improved Cost Competitiveness** → Miniaturization and standardization improve production efficiency and reduce material costs. → Compared to miniaturization through System on Chip (SoC), development costs can be reduced to about one-tenth. - **Enhanced Performance** → The elimination of secondary wiring in semiconductor packages significantly shortens wiring length, improving performance degradation due to wiring loss. - **Environmental Considerations** → Reducing the number of materials used can decrease waste.
A flexible fabric ribbon sensor incorporates "piezoelectric sensors" and "capacitive sensors." Dual sensing enhances detection accuracy and creates added value.
The "PICLIA Piezo Cable Sensor" and "Capacitive Sensor" are integrated into a single fabric-like ribbon. This flexible and soft ribbon sensor offers high durability and can perform dual sensing with two types of sensor outputs. It can be utilized in applications for monitoring and health monitoring in areas such as "wearable devices, medical and nursing care, automotive, toilets, railways and aircraft, cinemas and amusement facilities." 【Features】 ◆ Flexible and soft "fabric-like ribbon sensor" ⇒ Provides a comfortable touch even when directly contacted, while maintaining high durability in actual use. ◆ Built-in "piezoelectric sensor" and "capacitive sensor" ⇒ Enhanced detection accuracy through composite sensing and creation of added value. ◆ "Piezoelectric sensor"… detects biological information (heart rate, respiration, body movement), etc. ⇒ Vital sensing is possible even through clothing, with a differential response (responds only when "changes" occur). ◆ "Capacitive sensor"… detects the presence of objects through changes in capacitance. ⇒ Capable of distinguishing between people and objects. ◆ No power supply needed for the sensors, as they generate power through self-generation ⇒ low power consumption.
We will respond with a consistent system from upstream circuits and software design to circuit board manufacturing!
Nihon Circuit Co., Ltd. will assist you from the development of prototype products to mass production design and manufacturing. Depending on your requirements, we can develop system design, circuit design, PCB design, PCB manufacturing, mechanical, structural, and enclosure design and manufacturing, embedded software and applications, FPGA programming, as well as evaluation and inspection all in-house. Additionally, even in the absence of specifications, we can consider product specifications based on images (such as block diagrams or sketches). 【Features】 ■ Capable of mixed design of digital and analog circuits ■ A consistent system that covers everything from upstream circuit and software design to PCB manufacturing ■ Experience in designing high-frequency (tens of GHz) PCBs ■ Able to accommodate various PCB specifications and production quantities from a single prototype design and manufacturing to mass production design and manufacturing ■ We can also handle partial requests such as development (HW, SW), PCB design, and manufacturing only *For more details, please refer to the PDF materials or feel free to contact us.
Laser processing capability, loss improvement through wire length reduction, and heat dissipation improvement by direct mounting of copper plates.
Taclum PLUS, provided by Taconic (USA), is a PTFE substrate for MMIC implementation.
Flexible printed circuit board
Flexible printed circuit boards (FPC) using liquid crystal polymer (LCP) as an insulating material. Excellent high-frequency characteristics and dimensional stability, achieving precise characteristic impedance matching in FPC. ● Achieving Gbps-level high-speed transmission By adopting LCP as the insulating substrate, it offers a flat low dielectric constant, low dielectric loss tangent, and low moisture absorption across a wide frequency range, resulting in low transmission loss and high dimensional stability. Achieving Gbps-level high-speed transmission. ● Achieving low EMI Low EMI is realized through precise characteristic impedance matching enabled by fine pattern formation technology and high dimensional stability. ● Adoption of the "Bump Build-Up Method" By using conductive bumps as interlayer connection materials in the "Bump Build-Up Method," drilling and plating processes are unnecessary, achieving cost reduction and precise characteristic impedance matching. ● Use of halogen-free materials Adoption of halogen-free materials with consideration for environmental conservation. ● Expansion into various applications Excellent flexibility allows for secondary processing such as bending and electronic component mounting. Proven performance as high-speed differential transmission standard cables such as LVDS, HDMI, and PCI Express.
High quality, short delivery time, low cost
Specialized in hole drilling with drills, contour processing with routers, and fine hole processing with lasers.
![[LED] Lens Diffusion Plate: Manufacturing Method of LSD and Types of Substrates](https://image.mono.ipros.com/public/product/image/7bb/2000810468/IPROS82068504221028439862.png?w=280&h=280)
Lens diffusion plates can be manufactured using various methods! Introducing a variety of manufacturing techniques!
Lens diffusion plates can be manufactured using various methods, but the most common method is the "roll-to-roll" process. This method offers many advantages such as uniform film thickness, high-precision transfer, and high-speed processing, making it stable and cost-effective. We introduce various manufacturing methods, starting with the "roll-to-roll" process. Please take a moment to read through it. [Contents] ■ Lens diffusion plates: Manufacturing methods and types of substrates for LSD *For more details, please refer to the PDF document or feel free to contact us.
Introducing an experimental verification on "how much difference substrate patterning makes in thermally demanding circuits!"
An important factor in machine design, circuit design, and substrate design is "controlling heat." The heat dissipation path, from the perspective of thermal resistance, is significantly large, as heat conducted from components to the substrate wiring is transmitted into the air. With the recent trend of high-density integration of components and miniaturization of devices, the importance of measures through substrate patterning has been increasing. Here, we will introduce specific thermal countermeasures based on verification experiments regarding "how much difference substrate patterning can make in thermally demanding circuits." *For detailed content of the article, please refer to the related links. For more information, feel free to contact us.*
Many production achievements and a rich lineup! We also accommodate small quantities and short delivery times.
"High-frequency substrates" are one of the areas in which our company excels, and we have a wealth of production experience. We offer a wide range of low dielectric constant and low loss materials that are essential for substrates transmitting GHz band and Gbps high-speed signals. We can accommodate small production quantities and respond with short lead times, so please feel free to consult with us. 【Materials we handle (example)】 ■R-5775 (MEGTRON6) ■CCL-HL950SK TypeSK ■MCL-LX-67Y ■NPC-F220 ■CGP-500 ■CS-3376B *For more details, please refer to the related links or feel free to contact us.
A case where we made proposals primarily to satisfy functionality, performance, and safety!
We would like to introduce a case where we conducted the artwork and manufacturing of a high-voltage circuit board. We received an inquiry from a customer developing a high-voltage circuit board for the first time, and we proposed the circuit board design values primarily from our side. In this case, there were no clearly defined standards to comply with, so we made proposals to satisfy functionality, performance, and safety, and after adjustments with the customer, we finalized the specifications. 【Outline Specifications】 ■ Output: Maximum AC/DC 5kV ■ Insulation Design: Between other blocks = AC2kV Between Low Voltage block and High Voltage block = AC4kV (to the extent possible) *For more details, please refer to the related links or feel free to contact us.
![[Artwork Design/Circuit Board Design Work] Motor Driver, Sensing Circuit Board](https://image.mono.ipros.com/public/product/image/aeb/2001537736/IPROS14740514585844209651.png?w=280&h=280)
Supports IMX series CMOS image sensor evaluation IF boards and QSFP 40Gbps optical transceiver modules!
Our company has a track record in artwork design and PCB design work for robot motor drivers and sensing boards. We can accommodate requests such as transitioning from an old PCB (QFP) to a new PCB (BGA) while keeping the number of layers and dimensions the same as the current design, and we can also handle the implementation of paired chips and the mounting of optical lenses within budget. Please feel free to contact us when you need our services. 【Overview of Achievements in Robot Motor Drivers and Sensing Boards】 ■ Gate driver chip compatible with 3-phase brushless motors ■ High-voltage MOSFET driving at 48V, with current sensing and overcurrent monitoring using a 16-bit ADC ■ PWM frequency of 100 kHz, with a measured driving current of 2A ■ Microcontroller, serial bus, GPIO, level shifter ■ Designed to be more compact than previous PCBs, with heat dissipation measures and improved stability of the serial bus operation *For more details, please download the PDF or feel free to contact us.
Fine pitch, fine pattern, slim type! Dramatically improved wiring flexibility.
We handle suitable "build-up substrates" for interposers. The minimum line and space are L/S = 20/20μm. It supports LVH diameter/land diameter = 60/90μm with an LVH pitch of 150μm. Using a core of 25μm and prepreg of 20μm allows for thin board construction. 【Application Areas】 ■ Wireless modules ■ Interposers ■ Smartphones ■ Tablet devices ■ Digital cameras ■ Communication base stations *For more details, please download the PDF or feel free to contact us.
A "trump card" for miniaturization and low profile! Applicable to digital cameras, robots, and more.
We would like to introduce our "Rigid Flexible Circuit Boards." Traditionally, connections were made using B to B connectors, but with the rigid-flex design, both the area and height have been reduced to less than half. These can be applied in fields such as automotive, tablet devices, smartphones, and medical equipment. 【Board Specifications】 ■ 8-layer through-hole board (Rigid Flexible Circuit Board) ■ Board thickness t = 0.7mm ■ Flexible part thickness t = 0.28mm ■ Minimum L/S: 0.1/0.1mm ■ Minimum Via: hole diameter 0.25mm ■ Land diameter surface layer 0.45mm, inner layer 0.5mm *For more details, please download the PDF or feel free to contact us.
