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substrate Product List and Ranking from 548 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  4. 4 沖電気工業 産業営業本部　産業営業統括室 Tokyo//Information and Communications
  5. 5 null/null
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substrate Product ranking

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社　和歌山
  2. Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  3. All LCP Flexible Printed Circuit Board (FPC) 山下マテリアル
  4. 4 Electronic Component Reel Management System "Smart Reel Rack" JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrate Product List

1126～1140 item / All 1843 items

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Copper core substrate

Copper core substrate

Introducing our product lineup, which covers everything from printed circuit board design and manufacturing to component assembly and assembly.

The "Copper Core Substrate" is a product handled by Arrow Industry Co., Ltd. Our company is capable of creating products that meet customer needs due to our in-house integrated production of printed circuit boards (substrates). Furthermore, we collaborate with local companies to provide services from printed circuit board design and manufacturing to component mounting and assembly. 【Our Features】 ■ In-house integrated production of printed circuit boards (substrates) ■ Collaboration with local companies ■ Services from printed circuit board design and manufacturing to component mounting and assembly ■ Proposals and provision of products tailored to customer needs *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Other machine elements

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Copper bump substrate

Copper bump substrate

Introducing our product lineup, which covers everything from printed circuit board design and manufacturing to component assembly and assembly.

The "Copper Bump Substrate" is a product handled by Arrow Industry Co., Ltd. Our company is capable of creating products that meet customer needs due to our in-house integrated production of printed circuit boards (substrates). Furthermore, we collaborate with local companies to provide services ranging from printed circuit board design and manufacturing to component mounting and assembly. 【Our Features】 ■ In-house integrated production of printed circuit boards (substrates) ■ Collaboration with local companies ■ Services from printed circuit board design and manufacturing to component mounting and assembly ■ Proposals and provision of products tailored to customer needs *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Other machine elements

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High Current Compatible Board

High Current Compatible Board

We propose suitable heat dissipation measures for devices that carry large currents! Introducing a substrate compatible with large currents!

The "High Current Compatible Substrate" is a metal substrate designed to accommodate high-output devices by incorporating thick copper foil into the heat dissipation characteristics of a metal base substrate. We propose suitable heat dissipation measures for devices that carry high currents. 【Features】 ■ Incorporates thick copper foil into the heat dissipation characteristics of the metal base substrate ■ Proposes suitable heat dissipation measures for devices that carry high currents *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Other machine elements

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Water-cooled flow circuit board

Water-cooled flow circuit board

Effective for thermal management of low energy conversion efficiency devices like UV LEDs! Water-cooled flow circuit substrate.

The "Water-Cooled Flow Path Circuit Board" is a product handled by Arrow Industries, which manufactures and sells substrates for industrial equipment, semiconductor bare chip mounting, and consumer electronics. It directly bonds a water-cooled unit to a metal base substrate, effectively addressing heat issues for low energy conversion efficiency devices such as UV LEDs. 【Features】 ■ Directly bonds a water-cooled unit to a metal base substrate ■ Effectively addresses heat issues for low energy conversion efficiency devices such as UV LEDs *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Other machine elements

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Multilayer metal base substrate

Multilayer metal base substrate

Introducing a multilayer metal base substrate that supports high-density wiring!

The "Multi-layer Metal Base Substrate" is a product handled by Arrow Industries, which manufactures and sells substrates for industrial equipment, semiconductor bare chip mounting, and consumer electronics. By laminating double-sided printed circuit boards and multi-layer printed circuit boards onto a metal surface with an insulating layer or a high thermal conductivity insulating sheet, it enables higher density wiring and component mounting compared to single-sided metal base substrates. 【Features】 ■ Metal substrate compatible with high-density wiring *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Other machine elements

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Metal (copper, aluminum) bump substrate

Metal (copper, aluminum) bump substrate

Direct heat dissipation from the LED's neutral terminal! A substrate with a structure that efficiently releases heat.

The "Metal (Copper, Aluminum) Bump Substrate" is a product handled by Arrow Industries, which manufactures and sells substrates for industrial equipment, semiconductor bare chip mounting, and consumer electronics. It features a structure that directly connects the heat dissipation fins of UV LEDs, high-brightness LEDs, and high-power semiconductors to the metal bump section, allowing heat to escape efficiently. 【Features】 ■ Direct heat dissipation from the neutral electrode of the LED ■ Structure that efficiently dissipates heat *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Other machine elements

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Metal base single-sided board

Metal base single-sided board

Introducing a printed circuit board with an insulating layer on a metal surface, copper foil arranged, and circuits formed on top!

The "metal base single-sided substrate" is a printed circuit board that has an insulating layer and copper foil on a metal surface, with circuits formed on top of it. The insulating layer includes a glass epoxy prepreg type and a high thermal conductivity insulating sheet tailored to specific applications. It is proposed for thermal management of high-brightness LEDs and high-power semiconductors. 【Features】 ■ Insulating layer and copper foil are arranged on the metal surface, with circuits formed on top ■ The insulating layer includes a glass epoxy prepreg type and a high thermal conductivity insulating sheet tailored to specific applications ■ Proposed for thermal management of high-brightness LEDs and high-power semiconductors *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Other machine elements

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Fuji Print Industry Electronic Equipment Development

Fuji Print Industry Electronic Equipment Development

We have accumulated many achievements.

From the development, design, and manufacturing of electronic devices to product commercialization support and even product evaluation and analysis, Fuji Print Industry plays a role in supporting cutting-edge manufacturing.

  • Other machine elements

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Component-integrated board SIMPACT [Reducing dead space for miniaturization!]

Component-integrated board SIMPACT [Reducing dead space for miniaturization!]

Support available from just one piece! A component-integrated board that reduces dead space and achieves miniaturization! Ideal for the miniaturization and integration of printed circuit boards!

Recently, in response to the miniaturization and high density of electronic devices, there is a demand for the miniaturization and integration of printed circuit boards. The technology of embedded substrate, which reduces the surface area for component mounting by embedding components within the circuit board and minimizing dead space, is being sought after. SIMPACT is accepting orders for prototypes of embedded substrates. Please feel free to inquire from just one piece. 【Features】 ■ Components can be mounted at low temperatures and in a short time ■ Reduced load on components due to a dry process that eliminates the need for drilling and copper plating after mounting ■ Technology that connects wiring between different layers at arbitrary positions, enabling the shortest possible wiring formation ■ Vertical embedding allows for the embedding of many chips *For details, please request materials or view the PDF data from the download.

  • Printed Circuit Board

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Printed circuit board "aluminum substrate"

Printed circuit board "aluminum substrate"

Excellent heat dissipation and heat resistance! A substrate that can also be specified with high thermal conductivity type.

Aluminum substrates have excellent heat dissipation and heat resistance that far surpass the commonly used substrate materials FR-4 and CEM-3. Recently, there has been a significant increase in substrates equipped with high-power LEDs. At Fuji Print Industry, we can create single-sided substrates with a pattern formed by laminating an insulating layer and copper foil on an aluminum-based material, as well as double-sided substrates with a core of aluminum, where an insulating layer and copper foil are laminated to create through holes and form patterns. 【Features】 ○ Excellent heat dissipation ○ Excellent thermal conductivity For more details, please contact us or download the catalog.

  • Printed Circuit Board

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Analog/Digital Application Technology Products Control Sequencer Servo

Analog/Digital Application Technology Products Control Sequencer Servo

The sequencer board of KAIKEN that leads the era.

A control board for machine embedding aimed at a wide range of applications. It is designed to minimize wiring compared to conventional control devices and is equipped with highly versatile I/O options.

  • Other process controls

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Meito Electric Industry Aluminum Substrate (MX Series)

Meito Electric Industry Aluminum Substrate (MX Series)

This substrate is laminated and bonded with an insulating sheet of high thermal conductivity between an aluminum plate and copper foil.

Using this substrate is suitable for applications of printed circuit boards that require heat dissipation due to high current handling and the heat generated by electronic components.

  • LED Module

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Lightweight Conductor High Heat Dissipation Substrate "L&H Board"

Lightweight Conductor High Heat Dissipation Substrate "L&H Board"

Achieving lighter weight and higher heat dissipation! Lightweight conductor high heat dissipation substrate using aluminum.

The "L&H Board (Light body and high Heat radiation Board)" is a substrate that achieves lightweight and high heat dissipation by using aluminum. By employing metal conductors, direct soldering for component mounting is possible. It is suitable for applications such as high-brightness LED mounting substrates, automotive substrates (HCV/EV vehicle power substrates), high-current power substrates, various inverter substrates, high-frequency substrates, and solar power generation substrates. 【Features】 - Ensures strong adhesion through proprietary technology - Thickness of core aluminum material and surface aluminum material can be changed - Insulation layers can use both epoxy resin and special resin - Custom manufacturing available according to your needs For more details, please contact us or download the catalog.

  • Printed Circuit Board
  • Circuit board design and manufacturing

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Meito Electric Co., Ltd. Company Profile

Meito Electric Co., Ltd. Company Profile

High technology supporting the industrial society! Meito Electric Co., Ltd. plays a part in that.

Meito Electric Co., Ltd. is involved in the electric and electronic machinery and equipment automotive manufacturing industry, which has undergone significant and diverse transformations. The printed circuit boards and other products handled by Meito Electric have also made great advancements in technology, quality, and quantity. Since its establishment, the company's philosophy in manufacturing has been to "create the best possible products" and to adhere to "quality-oriented" management, which has led to the accumulation of trust from our business partners and stable transactions to this day. 【Business Activities】 - Manufacturing, processing, and sales of printed circuit boards and nameplates - Processing and sales of electrical insulation materials, plastic molded products, and various related materials - Press processing and sales of general metal materials - Processing, assembly, and sales of electrical machinery, automotive parts, and other related components - Manufacturing of precision press molds and jigs, among others For more details, please contact us or download our catalog.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Contract measurement

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Heat dissipation (special) substrate for LED

Heat dissipation (special) substrate for LED

Heat-dissipating substrates and special substrates available! We develop products tailored to our customers' needs together.

Meito Electric Co., Ltd. is engaged in the development of LED products that are attracting attention as environmentally friendly lighting for the Earth. We offer not only LED lighting suitable for a wide range of applications, such as illuminated signs and indirect lighting for stores, but also various customized LEDs. Additionally, leveraging our expertise in circuit board manufacturing, we also design and manufacture metal heat dissipation substrates. Our company handles heat dissipation substrates, including metal base substrates (such as aluminum base substrates and copper base substrates), as well as substrates for special applications. We are committed to developing products in collaboration with our customers to meet their needs. For more details, please refer to our catalog or feel free to contact us.

  • Circuit board design and manufacturing
  • LED Module

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