ジャパンクリエイト List of Products and Services

The "Load Lock Type Sputtering Device" is compatible with moving magnets and allows for full-area erosion. Equipped with our unique sputter cathode and rapid temperature rise and fall substrate heating mechanism, it achieves a substrate temperature of 900°C. With plasma analysis and feedback control through a light emission analysis system, it enables high-speed and stable reactive sputtering film formation. 【Features】 ■ Equipped with our unique sputter cathode ■ Compatible with moving magnets and allows for full-area erosion ■ Equipped with our unique rapid temperature rise and fall substrate heating mechanism, achieving a substrate temperature of 900°C ■ Enables high-speed and stable reactive sputtering film formation ■ Also supports low-temperature processes such as lift-off *For more details, please refer to the PDF document or feel free to contact us.

• Sputtering Equipment

The "Multi-Target Sputtering System" is equipped with up to four sputter cathodes, enabling the deposition of layered films such as metal films and oxide films. It is also compatible with combinations of CVD chambers, evaporation chambers, plasma cleaning chambers, etc. Additionally, it features a three-axis mechanism (elevation, revolution, rotation) on the substrate stage to achieve a uniform film thickness distribution. 【Features】 ■ Equipped with our proprietary sputter cathodes ■ Incorporates our unique rapid elevation and heating mechanism for substrates, achieving substrate temperatures of 900°C ■ Capable of mounting up to four sputter cathodes for the deposition of layered films such as metal films and oxide films ■ Supports tray transport ■ Compatible with combinations of CVD chambers, evaporation chambers, plasma cleaning chambers, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Sputtering Equipment

This product is a device that applies our specialized sputtering technology to form films on various three-dimensional shapes made of metal, ceramics, and resin. It can be used for applications such as cosmetics, electronic components, battery parts, and the development of high-performance materials. In addition, we can propose various devices for miniaturization/large-scale production, CVD/various plasma treatments, and barrel/drum types. 【Features】 ■ Space-saving ■ Large capacity ■ Equipped with a unique sputter cathode ■ Screw-type stirring mechanism *For more details, please refer to the PDF materials or feel free to contact us.

• Sputtering Equipment

The "Sputtering Device for Three-Dimensional Objects" is equipped with our proprietary sputter cathode. It features a 4-axis mechanism (elevation, revolution, rotation, tilt) on the work stage, achieving high coverage in the deposition of three-dimensional objects. It also includes a heating mechanism and bias power supply, enabling reverse sputtering, high-temperature sputtering, and film stress control. It can accommodate up to three sputter cathodes, allowing for the layered deposition of metal films, oxide films, and more. 【Features】 - Equipped with our proprietary sputter cathode - 4-axis mechanism on the work stage achieves high coverage in the deposition of three-dimensional objects - Can accommodate up to three sputter cathodes for layered deposition of metal films, oxide films, etc. - Custom orders can also be manufactured - Sample processing is conducted using a demonstration machine *For more details, please refer to the PDF document or feel free to contact us.

• Sputtering Equipment

The "piezoelectric film formation sputtering device" is a product that enables continuous film formation from a single crystal epitaxial buffer layer to a piezoelectric film. Through plasma analysis and feedback control using a plasma emission monitor, it allows for fast and stable reactive sputtering, as well as the detection of elements that contribute to the degradation of piezoelectric properties. It is equipped with our unique rapid heating and cooling substrate heating mechanism, achieving a substrate temperature of 900°C. *For more details, please refer to the PDF materials or feel free to contact us.

• Sputtering Equipment

The "Piezoelectric Film Formation Sputtering Device" is a product capable of detecting elements that contribute to the reduction of piezoelectric properties, thanks to the incorporation of a plasma emission monitor. It allows for continuous film formation from a single crystal epitaxial buffer layer to the piezoelectric film. Additionally, high-speed and stable reactive sputter deposition is possible through plasma analysis and feedback control using a luminescence analysis system. Equipped with our unique rapid temperature rise and fall substrate heating mechanism, it achieves a substrate temperature of 900°C. 【Features】 ■ Deposition structure that maximizes the axis length contributing to piezoelectricity ■ Equipped with our proprietary sputter cathode ■ Compatible with moving magnets, allowing for full-area erosion ■ Tray transport compatibility ■ Combinations with CVD chambers, deposition chambers, plasma cleaning chambers, etc., are also supported *For more details, please refer to the PDF document or feel free to contact us.

• Sputtering Equipment

The "Oxide/Nitride Plasma CVD Equipment" achieves low stress, high hardness, and high insulation through a dual-frequency independent application method. Significant particle reduction and improved productivity are achieved through a radical plasma cleaning system. We can also manufacture multi-chamber specifications and various custom designs, so please feel free to contact us when needed. 【Features】 ■ Achieves low stress, high hardness, and high insulation through a dual-frequency independent application method ■ Excellent film thickness distribution and reproducibility ■ Reduction of metal contamination through special surface treatment ■ Control of a wide range of film properties ■ Abundant accumulated data *For more details, please refer to the PDF document or feel free to contact us.

• CVD Equipment

This product is a film deposition device specialized for DLC coating on "PET bottles," which are commonly used as resin container materials, utilizing the plasma CVD process technology that our company excels in. By applying a sub-micron order DLC thin film coating to the inner surface of PET bottles, it contributes to preventing flavor deterioration due to oxidation of the contents, preventing the leaching of carbonated components, and reducing logistics costs through container weight reduction. 【Features】 - Various equipment configurations can be proposed based on the required production quantity. - Coating is possible for containers up to 3L. - Please consult us regarding containers larger than 3L. - Please consult us regarding resin materials other than PET. - Please consult us regarding metal materials. *For more details, please refer to the PDF document or feel free to contact us.

• CVD Equipment

The "Plasma CVD Equipment for Three-Dimensional Objects" has a wealth of accumulated data and employs a unique plasma control method. The chamber volume is 1m3. It features a simple structure with high versatility, capable of multi-stage bulk processing. We can also manufacture multi-chamber specifications and various custom orders, so please feel free to contact us when needed. 【Features】 ■ Chamber volume: 1m3 ■ Unique plasma control method ■ Capable of multi-stage bulk processing ■ Simple structure with high versatility ■ Can deposit films on various product materials *For more details, please refer to the PDF document or feel free to contact us.

• CVD Equipment

The "Epitaxial-EB Deposition Device" is a product suitable for single crystal film formation of metal films and oxide films through an epitaxial promotion mechanism. It achieves excellent film thickness distribution and reproducibility through substrate rotation, and the maintenance of the chamber is easy. It also supports the lift-off process and reduces particles through appropriate surface treatment. Multi-chamber specifications and batch types can also be manufactured. 【Features】 ■ Oxidation-promoting gas introduction mechanism ■ Material oxidation prevention mechanism ■ Capable of high-temperature processes up to 900°C ■ Supports high vacuum processes with a load-lock system ■ Compatible with lift-off processes ■ Supports tray transport *For more details, please refer to the PDF document or feel free to contact us.

• Evaporation Equipment

The "Ashing Device" is a mass production equipment capable of fully automated continuous processing of substrates up to a maximum of 12 inches in diameter. It is a versatile device that enables etching, ashing, and ion cleaning by switching gas types and plasma modes. 【Features】 ■ Switchable between RIE mode and DP mode ■ Reduced metal contamination through special surface treatment ■ Compact footprint ■ Independent application of two frequencies ■ Ultra-low temperature cooling stage Multi-chamber specifications, as well as custom designs for square substrates, can also be manufactured. *Please also refer to the PDF materials. *Feel free to contact us.

• Etching Equipment
• Ashing device

The "Vacuum Heating Drying Oven" has 30 types of automatic drying process recipes. The operating temperature range is up to 450°C. It can be used for vacuum drying of sputter targets, vacuum parts, and fixtures. Custom orders are also available, so please feel free to contact us when needed. 【Features】 ■ Operating temperature range: up to 450°C ■ Achievable pressure: 10Pa ■ Automatic drying process recipes: 30 types ■ Sample shelves: 2 tiers ■ Custom orders are also available *For more details, please refer to the PDF document or feel free to contact us.

• Drying Equipment
• Industrial Furnace
• Vacuum Equipment

The "Carbon Nanotube Synthesis Device" achieves excellent substrate temperature distribution and gas flow methods. It enables fully automated CNT synthesis. It is equipped with a substrate plasma cleaning system. We can also manufacture multi-chamber specifications and various custom orders, so please feel free to contact us when needed. 【Features】 ■ Fully automated CNT synthesis ■ Equipped with a substrate plasma cleaning system ■ Achieves excellent substrate temperature distribution and gas flow methods ■ Achieves excellent film thickness distribution and reproducibility ■ Abundant accumulated data *For more details, please refer to the PDF document or feel free to contact us.

• Other machine tools
• Other assembly machines

The "Organic EL Deposition Device" is a multi-chamber system suitable for device and material development. It is capable of processing from pre-treatment to film formation and sealing without exposure to the atmosphere. Depending on the purpose, you can freely choose from a plasma cleaning chamber, organic deposition chamber, electrode deposition chamber, sealing chamber, etc. 【Features】 ■ Supports substrate sizes up to 300mm ■ Deposition cells can be selected from various materials and sizes ■ Can be combined with CVD chambers, sputtering chambers, etc. ■ Custom orders can also be manufactured ■ Sample processing is conducted using a demo machine *For more details, please refer to the PDF document or feel free to contact us.

• Evaporation Equipment

The "Pressure RTA Device" is a product that can handle processes from vacuum to pressurization (0.9 MPaG). The heating source is a halogen lamp, and the heating rate can reach up to 150°C/sec, achieving excellent substrate temperature distribution and gas flow methods. This device can be used for applications such as semiconductors, MEMS, and electronic components, enabling high-speed thermal oxidation, crystallization, and annealing treatments on the substrate surface. 【Features】 ■ Reduces element loss specific to the heating process ■ Capable of handling processes from vacuum to pressurization (0.9 MPaG) ■ Enables high-speed thermal oxidation, crystallization, and annealing treatments on the substrate surface ■ Achieves excellent substrate temperature distribution and gas flow methods ■ Compatible with tray transport ■ Multi-chamber specifications can also be manufactured *For more details, please refer to the PDF document or feel free to contact us.

• Heating device
• Annealing furnace

The "DLC Coating Device" has a wealth of accumulated data, achieving excellent film thickness distribution and reproducibility. The film formation sources can be selected from RF plasma CVD method and ionized deposition method. It can be used for semiconductors, electronic components, optical components, automotive parts, and more. Additionally, multi-chamber specifications and various custom-made options can be produced. Please feel free to contact us when you need assistance. 【Features】 ■ Film formation sources can be selected from RF plasma CVD method and ionized deposition method ■ Substrate heating sources can be selected from water-cooled and heated types ■ Achieves excellent film thickness distribution and reproducibility ■ Capable of film formation on various substrate materials ■ Extensive control over film properties *For more details, please refer to the PDF materials or feel free to contact us.

• Painting Machine

The "Dry Etching Equipment" is a mass production device capable of fully automatic continuous processing of substrates up to φ12 inches. It features a dual-frequency independent application method that reduces metal contamination through special surface treatment. We also offer multi-chamber specifications and various custom-made options. This versatile device enables etching, ashing, and ion cleaning by switching gas types and plasma modes. 【Features】 ■ Switchable between RIE mode and DP mode ■ Reduction of metal contamination through special surface treatment ■ Compact footprint ■ Dual-frequency independent application method ■ Ultra-low temperature cooling stage *For more details, please refer to the PDF materials or feel free to contact us.

• Etching Equipment

The "Load Lock Type EB Evaporation Device" achieves excellent film thickness distribution and reproducibility through substrate rotation. It supports high vacuum processes using a load lock system, as well as lift-off processes and tray transport. It is capable of high-temperature processes up to 900°C, and maintenance of the chamber is easy. Please feel free to contact us when needed. 【Features】 ■ Capable of high-temperature processes up to 900°C ■ Achieves excellent film thickness distribution and reproducibility through substrate rotation ■ Supports high vacuum processes with a load lock system ■ Reduces particles through suitable surface treatment ■ Easy maintenance of the chamber *For more details, please refer to the PDF materials or feel free to contact us.

• Evaporation Equipment

The "RTA device" is a product that can handle processes from vacuum to pressurized processes (0.9 MPaG). It enables high-speed thermal oxidation, crystallization, and annealing treatment of the substrate surface. It achieves excellent substrate temperature distribution and gas flow methods. It can be used for semiconductors, as well as MEMS and electronic components. 【Features】 ■ Capable of handling processes from vacuum to pressurized processes (0.9 MPaG) ■ Enables high-speed thermal oxidation, crystallization, and annealing treatment of the substrate surface ■ Achieves excellent substrate temperature distribution and gas flow methods ■ Compatible with tray transport ■ Customizable for multi-chamber specifications and various made-to-order designs *For more details, please refer to the PDF document or feel free to contact us.

• Annealing furnace
• Heating device

We would like to introduce the custom manufacturing achievements of Japan Create Co., Ltd. regarding "sputtering equipment." We have a track record that includes "ultra-high temperature sputtering equipment for thin film MEMS," "sputtering equipment with GB for organic EL," and "IBS equipment for research and development." We are conducting sample processing with a demo machine. Please feel free to contact us when needed. 【Manufacturing Achievements (Excerpt)】 ■ Ultra-high temperature sputtering equipment for thin film MEMS ■ Batch-type sputtering equipment for thin film MEMS ■ Multi-component composite sputtering equipment ■ Sputtering equipment with GB for organic EL ■ Load-lock type binary sputtering equipment *For more details, please refer to the PDF document or feel free to contact us.

• Sputtering Equipment

We would like to introduce the custom manufacturing achievements of Japan Create Co., Ltd. regarding "CVD equipment." We have a track record that includes "Plasma CVD equipment for solar cells," "Plasma CVD equipment for three-dimensional objects," "Plasma CVD equipment for metal containers," and "ICP-type MOCVD equipment." Sample processing is being conducted using demo units. Please feel free to contact us if you have any inquiries. 【Manufacturing Achievements (Excerpt)】 ■ Plasma CVD equipment for solar cells ■ Plasma CVD equipment for three-dimensional objects ■ Research and development load-lock type plasma CVD equipment ■ Plasma CVD equipment for metal containers ■ Plasma CVD equipment for medical containers *For more details, please refer to the PDF materials or feel free to contact us.

• CVD Equipment

We would like to introduce the custom manufacturing achievements of Japan Create Co., Ltd. regarding "deposition devices." We have a track record of "two-stage composite Pt deposition devices," "lubrication deposition devices for HDD media research and development," and "load-lock type high vacuum ultra-high temperature EB deposition devices." Sample processing is being conducted using demo equipment. Please feel free to contact us when needed. 【Manufacturing Achievements】 ■ Two-stage composite Pt deposition device ■ Lubrication deposition device for HDD media research and development ■ Load-lock type high vacuum ultra-high temperature EB deposition device *For more details, please refer to the PDF materials or feel free to contact us.

• Evaporation Equipment

We would like to introduce the custom manufacturing achievements of Japan Create Co., Ltd. regarding "Dry Etching Equipment." We have a track record of "ICP Etching Equipment for Research and Development," "ICP Plasma Etching Equipment," "XeF2 Etching Equipment," and "Batch-type Ashing Equipment." Sample processing is being conducted using demo units. Please feel free to contact us when needed. 【Manufacturing Achievements】 ■ ICP Etching Equipment for Research and Development ■ ICP Plasma Etching Equipment ■ XeF2 Etching Equipment ■ Batch-type Ashing Equipment *For more details, please refer to the PDF materials or feel free to contact us.

• Etching Equipment

We would like to introduce the custom manufacturing achievements of Japan Create Co., Ltd. in "various vacuum devices." We have a track record that includes "annealing equipment for research and development," "batch-type plasma treatment equipment," "ultra-low temperature film deposition experimental equipment," and "exhaust gas switching equipment." We are conducting sample processing with demo units. Please feel free to contact us if you have any inquiries. 【Manufacturing Achievements (Excerpt)】 ■ Annealing equipment for research and development ■ Batch-type plasma treatment equipment ■ ZnS treatment equipment ■ Ultra-low temperature film deposition experimental equipment ■ Ultra-high vacuum chamber for analysis * For more details, please refer to the PDF materials or feel free to contact us.

• Vacuum Equipment

Our company has established a consistent production system that covers everything from development to material procurement, processing, assembly, and quality assurance, and we accept custom orders for equipment from various companies. "If only I could design something like this..." "I want to improve work efficiency..." "I want to reduce labor costs..." If you have any concerns, please feel free to consult with us first. We are confident in our quality control and support system. Additionally, we conduct sample processing with demo machines, so please do not hesitate to contact us when needed. 【Production Achievements (Excerpt)】 ■ Ultra-high temperature sputtering equipment for thin-film MEMS ■ Batch-type sputtering equipment for thin-film MEMS ■ Multi-composite sputtering equipment ■ Sputtering equipment with GB for organic EL ■ Load-lock type binary sputtering equipment *For more details, please refer to the PDF materials or feel free to contact us.

• Sputtering Equipment

The cassette-less automatic cleaning device is a precision cleaning processing device that performs a consistent process from workpiece input to drying. The equipment can be selected with a cassette-less, boat transport method, and various designs can be manufactured according to user specifications. For more details, please contact us.

• Other semiconductor manufacturing equipment

This machine is a dip-type single-sheet processing machine that vertically lifts the workpiece in the loader section and performs each processing step with a transport robot. After the final cleaning is completed, the workpiece is returned horizontally by the inversion mechanism, and spin drying is performed. It is a cassette-to-cassette cleaning machine. For more details, please contact us.

• Other semiconductor manufacturing equipment

The sheet-type automatic cleaning device is a cleaning device that addresses spray-type cross-contamination in a sheet format. It is provided with cleaning methods tailored to various processes (hoop compatibility available). For more details, please contact us.

• Other semiconductor manufacturing equipment

The 300mm wafer automatic cleaning device is a cassette-type batch cleaning system. It can accommodate up to Φ300. For more details, please contact us.

• Other semiconductor manufacturing equipment

It is a method for cleaning the wafer surface with a high-pressure jet of pure water in a non-contact manner. 【Features】 ◯ Removal of particles ◯ Removal of particulate contamination ◯ Removal of burrs from the wafer surface

• Wafer processing/polishing equipment
• Wafer

The cassette-less automatic cleaning device is a precision cleaning processing device that performs a consistent process from workpiece input to drying. The equipment can be selected with a cassette-less, boat transport method, and various designs can be manufactured according to the user's specifications.

• Other semiconductor manufacturing equipment

This machine is an automatic cleaning device that precisely cleans and dries carriers and boxes stored in a basket, transporting them from the loader through each processing stage to the unloader (which also serves as the drying section). For more details, please contact us.

• Other semiconductor manufacturing equipment

The high-performance vacuum spin coater is a device that automatically spin-coats resist liquid onto various substrates. It incorporates technology to control the atmosphere within the chamber to achieve uniform and high-precision coatings. Specifically, it automatically performs functions such as nitrogen replacement, solvent gas introduction, and maintaining a vacuum state. For more details, please contact us or refer to the catalog.

• Coater
• Other semiconductor manufacturing equipment

The spray-type wafer etching device performs a series of cleaning and etching processes, followed by pure water treatment and drying. For more details, please contact us or refer to the catalog.

• Etching Equipment

This machine is a device for cleaning and etching wafers. After pre-treatment in a cassette, automatic etching is performed in a dedicated barrel. For more details, please contact us.

• Etching Equipment

This machine is a device that performs high-speed wafer etching processing. The wafers are loaded into a dedicated barrel for processing. For more details, please contact us.

• Etching Equipment

The automatic photoresist device is a machine that automatically performs resist spin coating, vacuum baking, alignment, and spray development from cassette to cassette. Of course, process selection is also possible. The loader and unloader can be operated by one operator from the same side. A multi-joint robot is used for transportation between processes. This machine is suitable for 200mm square substrates or φ300mm substrates. For more details, please contact us.

• Other semiconductor manufacturing equipment

The automatic resist spin coater is a cassette-to-cassette automatic spin coater that coats resist and then also performs the baking process automatically. The processing area is arranged in a U-shape, allowing one operator to work on both the loader and unloader from the same side. A multi-joint robot is used for transportation between processes. This machine is suitable for target workpieces ranging from 2" square to 5" square substrates or φ2" to φ5" substrates. For more details, please contact us.

• Other semiconductor manufacturing equipment
• Coater

The JASC-200 model is an automatic spin coater for cassette-to-cassette processing, which coats the resist and then automatically performs the baking process. The processing steps are arranged in a U-shape, allowing a single operator to work on the same side for loading and unloading. A multi-joint robot is used for transportation between processes. This machine is suitable for target workpieces ranging from 2" square to 5" square substrates or φ2" to φ5" substrates. For more details, please contact us or refer to the catalog.

• Coater
• Other semiconductor manufacturing equipment

This machine is a semi-automatic device that manually attaches a basket with cassettes to a hanger, transports it in an arc from the processing tank to the rinsing tank, and processes wafers. For more details, please contact us.

• Etching Equipment

The high-performance vacuum spin coater is a device that automatically spin coats resist liquid onto various substrates. It incorporates technology to control the atmosphere within the chamber, allowing for uniform and high-precision coatings. In other words, it automatically performs functions such as nitrogen replacement, solvent gas introduction, and maintaining a vacuum state. For more details, please contact us.

• Other semiconductor manufacturing equipment
• Coater

The MSC-300 model is a manual tabletop spin coater with a dispenser that supports substrates ranging from φ2" to φ6". It is equipped with two dispense arms for automatic application. Condition settings are performed via a touch panel on the operation panel. Each processing mode is displayed on the touch panel during operation. For more details, please contact us or refer to the catalog.

• Coater
• Other semiconductor manufacturing equipment

The MSC-500 model is a tabletop manual spin coater compatible with 300mm square glass substrates. Condition settings are performed via the touch panel on the control panel. Each processing mode is displayed on the touch panel during operation. For more details, please contact us or refer to the catalog.

• Coater
• Other semiconductor manufacturing equipment

The tabletop manual spin coater is a manual type compatible with 300mm square glass substrates. Condition settings are made via the touch panel on the operation panel. Each processing mode is displayed on the touch panel during operation. For more details, please contact us.

• Other semiconductor manufacturing equipment
• Coater

The automatic photoresist coating device automatically performs resist spin coating, vacuum baking, alignment, and spray development from cassette to cassette. Of course, you can also select the processes. The loader and unloader can be operated by one operator from the same side. A multi-joint robot is used for transportation between processes. This machine is suitable for 200mm square substrates or φ300mm substrates. For more details, please contact us or refer to the catalog.

• Coater
• Other semiconductor manufacturing equipment