Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.
1171～1185 item / All 1843 items
We provide custom structure MBE/MOCVD epitaxial growth on compound semiconductor epitaxial InP substrates.
We provide custom structure MOCVD epitaxial growth on InP substrates ranging from 2 inches to 4 inches. We offer comprehensive services for InP epitaxial substrates to companies, universities, and scientific research institutions, including epitaxial structure design, epitaxial materials, and testing analysis.
![[Example] Module production using a small CMOS image sensor](https://image.mono.ipros.com/public/product/image/1be/2001010839/IPROS31911419374192082684.jpeg?w=280&h=280)
Soldering a separate board to a CMOS-equipped board! A successful example of achieving special product specifications.
We would like to introduce a case study on module production using a small CMOS image sensor. The customer had the challenge of wanting to fit a very small image sensor into a space of □1.5mm and a length of 5mm or less, aiming for device miniaturization. Since bending the module can easily cause cracks, the CMOS mounting section and the ceramic capacitor mounting section were placed on separate substrates and later soldered together. This approach allowed for a reduction in size compared to previous models while also achieving strength at the joint, significantly reducing the occurrence of cracks at the joints. 【Case Overview】 ■ Mounting Method: Soldering ■ Substrate Size ・Φ1.35mm×0.2mm ・2mm×1mm×0.2mm ■ Substrate Material: Glass epoxy substrate ■ Lot Size: 5 to 10 units *For more details, please refer to the PDF document or feel free to contact us.
![[Case Study] Improvement of Heat Dissipation and Bonding Strength of Substrates by Reducing Voids](https://image.mono.ipros.com/public/product/image/b2c/2001010844/IPROS46839266335862517870.jpeg?w=280&h=280)
Mounting the chip while scrubbing during solder melting! Examples of increased bonding strength and thermal conductivity.
We would like to introduce a case study on improving the heat dissipation and bonding strength of substrates through void reduction. To efficiently transfer the temperature during chip operation, we received an inquiry about using a high thermal conductivity material for the bonding between the plate and the base plate. By using a high thermal conductivity adhesive sheet, we improved the thermal conductivity. Additionally, by scrubbing the chip during solder melting, we successfully reduced the voids that were present inside the solder during the initial melting. 【Case Overview】 ■ Mounting Method: Flip Chip Mounting ■ Substrate Size: Plate 25mm x 25mm x 3mm, Base Plate 40mm x 40mm x 3mm ■ Substrate Material: Both the plate and base plate are aluminum (with Ni plating treatment on the entire surface) ■ Lot Quantity: A few pieces (for sampling) ■ Delivery Time: 1.5 months including preliminary evaluation *For more details, please refer to the PDF document or feel free to contact us.
Free samples available! This product is made from polyethylene as the raw material.
F Package flexibly responds to changes in the environment, aims for harmony with society, and works on creating rich communities. Please feel free to consult us regarding the design, processing, and sales of packaging materials, package production, cutting, etc. Additionally, we can also cut materials such as urethane foam and expanded polystyrene. Miramat is a product made from polyethylene as the raw material.
We provide quick and short-term services for small-scale and prototype printed circuit board design and development.
Expect More. Pay Less. With over 30 years of experience, FINPO ELECTRONIC is a rare presence in the Taiwanese PCB industry. We offer quick and short-term services for small quantities and prototypes, from design to development of printed circuit boards. We can accommodate a wide range of needs and have numerous achievements with major companies, from Japan's large firms H and T to major companies in Europe and the United States. Please feel free to contact us.
![High Current Flexible Circuit Board [*FPC Technology Catalog Available]](https://image.mono.ipros.com/public/product/image/c7d/2000477292/IPROS51770483967615096271.png?w=280&h=280)
Slim shape compatible with high current. Can be curved, suitable for integration into narrow spaces. An alternative to busbars and harnesses.
Our "High Current Flexible Wiring Board" is a product designed for high current wiring, intended as a substitute for busbars and harnesses. By forming a copper foil layer with a conductor thickness of 75 to 90 μm, it is possible to carry higher currents than standard flexible printed wiring boards. The substrate uses polyimide film, and soft resist ink is used as the insulating material, allowing for flexibility, which makes it suitable for installation in tight spaces. 【Features】 ■ Capable of carrying high currents ■ Can be installed and bent in narrow spaces ■ Compatible with through-hole components and surface-mounted components ■ Can integrate connections between substrates, contributing to a reduction in assembly labor *For more details, please refer to the PDF document. Feel free to contact us with any inquiries.
Can be used with bent shapes and supports high-speed transmission! Ideal for integration in tight spaces. Integration of connections between circuit boards is also possible. *There is a video that explains it in 2 minutes!
The "Card Edge Compatible Multi-Layer Flexible Printed Circuit Board (FPC)" provided by our company is a multi-layer flexible circuit board designed to accommodate card edge connectors with double-sided contacts. By reducing the connection points between printed circuit boards and flexible circuit boards, a stable impedance line is formed, which is expected to improve signal integrity at high frequencies of 10 GHz and above. The substrate uses polyimide film, and soft resist ink is used as the insulating material, allowing for flexibility, making it suitable for installation in tight spaces. 【Features】 ■ A partially bendable structure that has similar functionality to rigid-flex boards, enabling the formation of highly reliable vias. ■ A structure that integrates flexible and rigid parts without connection points or via transitions, allowing for the formation of stable impedance lines. ■ High-density wiring is possible with 100μm pitch wiring and vias with a land diameter of 300μm or less. ■ Integration of connections between boards contributes to a reduction in assembly labor. *For more details, please refer to the PDF materials. Feel free to contact us with any inquiries.
Space-saving is possible! Suitable for high-resolution imaging diagnostic devices that require miniaturization.
The "4-layer blind via filled blind via flexible printed circuit board" is a multilayer FPC that enables high-density wiring while achieving miniaturization, lightweight, and thinness. It applies filled plating to blind vias, allowing for the creation of pads for component mounting on the vias. It possesses bending performance that rigid boards do not have. It is suitable for high-resolution imaging diagnostic devices, including endoscopes and catheters, where miniaturization is required. 【Features】 ■ Blind vias can be filled with plating on a 4-layer flexible board ■ Space-saving is possible as components can be mounted on top of the vias ■ It can be made lighter compared to rigid boards *For more details, please refer to the PDF document or feel free to contact us.
Compared to polyimide, it has low dielectric constant, low dielectric loss tangent, and low water absorption, resulting in excellent high-frequency transmission characteristics! It also has long-term heat resistance of 240°C.
The "High-Temperature Durable and Oil-Resistant Flexible Printed Circuit Board (FPC)" made entirely of LCP substrate excels in long-term heat resistance and passes the flexibility test (AB test) equivalent to MOT 180°C required by UL standards. Additionally, it has better high-frequency transmission characteristics due to its low dielectric constant, low dielectric loss, and low water absorption compared to polyimide. In the oil resistance test, there were almost no changes in conduction resistance and appearance before and after the test, and the conductor peel-off test also met the standard values. 【Features】 ■ Uses liquid crystal polymer (LCP) for the base and cover materials ■ Has long-term heat resistance of 240°C ■ Exhibits oil resistance against engine oil, brake pedals, and ATF *For more details, please refer to the PDF document or feel free to contact us.
Passed long-term heat resistance test at 200℃ for 1000 hours! High-temperature durable flexible substrate with insulation characteristics exceeding JIS standards.
The "Long-term High-Temperature Durable Flexible Circuit Board" is an FPC that achieves long-term heat resistance without the use of epoxy-based adhesives, making it suitable for harsh conditions in high-temperature environments. Even after undergoing our unique long-term high-temperature test conditions of 200°C for 1000 hours, the insulation resistance, continuity resistance change rate, and dielectric strength meet the JIS passing standards. 【Main Features】 1. Achieves high-temperature durability with a structure that does not use epoxy-based adhesives. 2. Heat resistance suitable for long-term use in high-temperature environments. 3. Insulation properties are maintained even after the long-term high-temperature test of 200°C for 1000 hours. For more details, please refer to the PDF document or feel free to contact us.
Supports high-speed transmission up to 15GHz! We have combined the high-speed transmission connectors from Irisoh Electronics with our flexible substrates.
The "Flexible substrate compatible with high-speed transmission connectors" combines the high-speed transmission connectors from Irisoh Electronics, [IMSA-11600S-30Y900 and IMSA-11501S-30Y900], with our YFC series (LVDS type microstrip line) RFM. By integrating them, it supports high-speed transmission up to 15GHz. 【Features】 ■ The LVDS-compatible FPC has been slotted. ■ It is easy to bend and can also be twisted for use. *For more details, please refer to the PDF document or feel free to contact us.
It can suppress discoloration during heating. Here are the test results using a double-sided panel.
The "High Heat Resistant Radiation Flexible Printed Circuit Board (FPC)" is an FPC that uses Okitsumo's heat-resistant solder resist "TAINEX." TAINEX is suitable for high-temperature environments up to 150°C and suppresses discoloration during heating. It also achieves radiation heat dissipation, and in our heat dissipation experiments, when combined with a thermal conduction layer, it has been shown to maintain temperatures more than 30 degrees lower compared to typical resist specifications for FPCs. *This result is based on tests conducted on double-sided boards. 【Features】 ■ FPC using Okitsumo's heat-resistant solder resist "TAINEX" ■ Thermal measures: Achieves a radiation rate of over 90% *For more details, please refer to the PDF document or feel free to contact us.
When you want to implement high-density wiring with over 200 pins in a limited space! It can be bent for use, allowing for high-density wiring in a compact space.
The "High-Density High-Multilayer Flexible Circuit Board" is an FPC developed for devices that require many signals. Despite having a 12-layer structure, it achieves a thickness of less than 1mm. The cable section can be bent for use, enabling high-density wiring in compact spaces. 【Features】 ■ The harness section can be bent for use. ■ Ideal for applying high-density wiring with over 200 pins in limited spaces. *For more details, please refer to the PDF document or feel free to contact us.
Widely used as alternatives for fine coaxial cables, wire harnesses, and cables for medical devices. The spacing and width of the slits can be specified!
The "slit flexible substrate" is a flexible substrate with excellent bendability that has been processed with slits, allowing for "twisting" and "torquing." It is widely used as an alternative to fine coaxial cables, wire harnesses, and cables for medical devices, and since the spacing and width of the slits can be specified, it offers greater freedom for customers. 【Features】 ■ A bendable cable flexible substrate with 0mm slits processed between patterns ■ Can be used with "twisting" and "torquing" compared to conventional products ■ The spacing and width of the slits can be specified *For more details, please refer to the PDF materials or feel free to contact us.
For the electrical wiring in the engine room and the gasoline tank meter! Compared to glass epoxy substrates, it has a lower coefficient of thermal expansion and stronger resistance to heat.
The "metal-based heat dissipation substrate" is a substrate that improves heat dissipation through thermal conduction, alleviating thermal issues. There are applications in high-brightness LED lighting (for vehicles and floodlights), as well as in automotive electrical components, ECUs, EPS, and DC/DC converters. Compared to standard glass epoxy substrates, it has a lower thermal expansion coefficient and greater resistance to heat. 【Features】 ■ A substrate that improves heat dissipation through thermal conduction by using metal as the base ■ Compared to standard glass epoxy substrates, it has a lower thermal expansion coefficient and greater resistance to heat *For more details, please refer to the PDF materials or feel free to contact us.
