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substrate Product List and Ranking from 548 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  4. 4 沖電気工業 産業営業本部　産業営業統括室 Tokyo//Information and Communications
  5. 5 null/null
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substrate Product ranking

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社　和歌山
  2. Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  3. All LCP Flexible Printed Circuit Board (FPC) 山下マテリアル
  4. 4 Electronic Component Reel Management System "Smart Reel Rack" JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrate Product List

1156～1170 item / All 1843 items

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Liquid Flow Sensor Evaluation Kit 'EK-SLI-1000'

Liquid Flow Sensor Evaluation Kit 'EK-SLI-1000'

IP65 waterproof and dust resistant! Maximum flow rate is 1ml/min (aqueous) and 10ml/min (hydrocarbon).

We would like to introduce our liquid flow sensor evaluation kit, 'EK-SLI-1000'. It features IP65 waterproof and dust resistance, with a maximum flow rate of 1ml/min (aqueous) and 10ml/min (hydrocarbon). The interfaces (connectors) available are RS485, I2C, USB, or analog (4-pin M8). Please feel free to contact us if you have any inquiries. 【Included Items】 ■ SLI-1000 ×1 ■ SCC1-USB sensor cable ×1 ■ SCC1-Analog sensor cable ×1 ■ Basic fitting set ■ Quick start guide *For more details, please download the PDF or feel free to contact us.

  • Flow Sensor
  • Evaluation Board

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Liquid Flow Sensor Evaluation Kit 'EK-LD20-2600B'

Liquid Flow Sensor Evaluation Kit 'EK-LD20-2600B'

The interface (connector) is I2C! Maximum flow rate 1000ml/h (aqueous), bamboo joint.

We would like to introduce our liquid flow sensor evaluation kit, 'EK-LD20-2600B'. It is a disposable biomedical product with a maximum flow rate of 1000 ml/h (aqueous) and a bamboo shoot connector. The interface (connector) is I2C, and an SCC1-USB sensor cable is required separately. 【Included Items】 ■ LD20-2600B ×3 ■ Base Station ×3 ■ Quick Start Guide *For more details, please download the PDF or feel free to contact us.

  • Flow Sensor
  • Evaluation Board

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Liquid Flow Sensor Evaluation Kit 'EK-SLF3C-1300F'

Liquid Flow Sensor Evaluation Kit 'EK-SLF3C-1300F'

Fluid control and system reliability are achieved, leading to a dramatic improvement in performance and end-user satisfaction!

We would like to introduce our liquid flow sensor evaluation kit, 'EK-SLF3C-1300F'. The "SLF3S-1300F" combines our long-standing excellent track record in low flow and minimum flow sensing with a thoroughly optimized mechanical design, elevating its already well-established functionality to a higher level in terms of price-to-performance ratio. This sensor provides the highest level of safety, stability, and long-term reliability across a wide range of fields, including diagnostics, analytical equipment, and life sciences. 【Features of SLF3S-1300F】 ■ Optimizes costs by simplifying design based on CMOSens Technology without sacrificing fluid, electrical, or mechanical connections. ■ Offers outstanding chemical resistance and excellent media compatibility. ■ Monitors the operation of the entire system and detects common failure modes. *For more details, please download the PDF or feel free to contact us.

  • Flow Sensor
  • Evaluation Board

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Ain Corporation "Business Introduction"

Ain Corporation "Business Introduction"

Leave it to us for heat management substrates and high-frequency wiring boards!

Ain Corporation is a company primarily engaged in the sale of printed circuit boards, ceramic inks, and chemical industrial products. We provide a consistent product development process from design to production. We handle a wide range of high-performance substrates, such as "ceramics" and "VCM," which achieve excellent through-hole performance and bonding strength with low resistance values. 【Business Activities】 ■ Design, manufacturing, and sales of printed circuit boards ■ Manufacturing and sales of information control devices ■ Manufacturing, sales, and rental of printed circuit board manufacturing machinery and equipment ■ Sales of chemical industrial products *For more details, please download the PDF or feel free to contact us.

  • Other electronic parts

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Metal base wiring board

Metal base wiring board

High thermal conductivity and low thermal expansion base wiring board! Custom specifications can also be discussed.

The "metal base wiring board" is a high thermal conductivity wiring board that accommodates everything from standard aluminum base boards to copper base boards and custom specifications. We have various stock of aluminum and copper bases in a laminated structure, allowing for short delivery times. Additionally, we can accommodate special specifications (structure and materials) as per your requests. 【Features】 ■ High thermal conductivity ■ Short delivery times available ■ Special specifications can also be discussed *For more details, please download the PDF or feel free to contact us.

  • Other semiconductors
  • Printed Circuit Board
  • Other electronic parts

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Printed Circuit Board Assembly

Printed Circuit Board Assembly

We accept orders regardless of quantity! Comprehensive support from design to implementation of printed circuit boards!

We can accept component mounting on printed circuit boards regardless of quantity. We offer a consistent response from design and manufacturing of printed circuit boards to component procurement and component mounting. (Some processes are outsourced.) We can also respond to requests for assembly, adjustment, and inspection, so please feel free to consult with us. 【Features】 ■ Integrated system from design and manufacturing to component procurement and component mounting *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board

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AMB substrate

AMB substrate

High insulation, heat dissipation, and reliability! Thick copper ceramic substrates for power devices.

The "AMB substrate" is a substrate that joins thick copper to ceramics using the AMB (Active Metal Brazing) method. It is a thick copper ceramic substrate for power devices that has high insulation, heat dissipation, and reliability. 【Specifications】 ■ Base material: Silicon nitride (Si₃N₄) 　　　　Aluminum nitride (AlN) 　　　　Alumina (Al₂O₃) ■ Conductor thickness: 300 to 1000 μm *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board

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Through Hole Filling

Through Hole Filling

Superior electrical and thermal properties due to special copper plating! Introducing the filling of DPC substrates.

"Through hole filling" refers to the process of filling holes in ceramic substrates that excel in electrical (low resistance) and thermal (high thermal conductivity) properties due to special copper plating. We will introduce hole filling for diameters of Φ0.1 mm, as well as Φ0.15 mm and Φ0.2 mm, with photos. *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board

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Thick copper wiring board

Thick copper wiring board

A wiring board that enables miniaturization and cost reduction through the substrate of high current circuits.

The "thick copper wiring board" is a wiring board that uses copper plates in the wiring layer to respond to the "high current" demands of the electronics industry. By creating a substrate for high current circuits, it enables miniaturization and cost reduction. 【Features】 ■ Responds to the "high current" demands of the electronics industry ■ Uses copper plates in the wiring layer ■ Miniaturization ■ Cost reduction *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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UV LED, power LED, thermal management substrate for LD *Implementation example materials will be provided.

UV LED, power LED, thermal management substrate for LD *Implementation example materials will be provided.

Heat countermeasures, from proposal and design of metal-based special substrates to implementation, all in one go. Introducing our track record of adoption!

When designing modules that use high-power optical semiconductors, such as UV LEDs, a suitable wiring board for implementation is necessary. Our company proposes appropriate wiring boards considering various materials and structures for each requirement. We can also handle the design and manufacturing of wiring boards, as well as the modularization (implementation). ★ You can view detailed materials summarizing photos, structural diagrams, cross-sections, and achievements of "Thermal Countermeasures and Wiring Boards" from the "PDF Download." 【Contents】 ■ DPC Boards (Boards using plating methods) Comparison with thick film and thin film methods is also explained. ■ Copper Base Wiring Boards with Posts (High Thermal Conductivity Wiring Boards) Directly conducts heat from heat-generating components to the base material. ■ Metal Base Wiring Boards (High Thermal Conductivity Wiring Boards) Supports everything from standard aluminum base boards to copper base and custom specifications. ■ Ultraviolet High Reflective Film A film that can be applied to the surfaces of ceramics and metals, excellent in insulation, heat resistance, and ultraviolet resistance, reflecting even in the ultraviolet range. ■ Overview of EMS Services ■ List of Equipment from Partner Companies for Implementation

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  • Circuit board design and manufacturing

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Design, manufacturing, and sales of high-frequency substrates *Flexible response to special processing as well.

Design, manufacturing, and sales of high-frequency substrates *Flexible response to special processing as well.

Compatible with various materials including fluororesin circuit boards, alumina, and high dielectric ceramics.

Our company designs, manufactures, and sells "high-frequency substrates" using various high-frequency substrate materials, tailored to performance, cost, and delivery time. The materials include fluoropolymer materials and ceramics such as alumina and aluminum nitride. We can also provide laminated substrates combining fluoropolymer substrates with standard FR-4 substrates, as well as copper-based fluoropolymer substrates with higher thermal conductivity. Additionally, we are flexible in accommodating special processing (treatments) such as "cavity structure formation," "counterbore and irregular router processing," "through-hole filling processing," and "electroplating, electroless plating." 【Examples of Achievements】 ■ Substrates for VSAT BUC and LNB (microwave) ■ Substrates for millimeter-wave radar and antennas ■ Substrates for Doppler sensors ■ Substrates for high-frequency power amplifiers ■ Optical transmission/reception units (TOSA/ROSA) *For more details, please refer to the materials. Feel free to contact us with any inquiries.

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  • Circuit board design and manufacturing

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Metal core printed circuit board

Metal core printed circuit board

We also support special processing such as ZAGRI processing, tap hole processing, and countersunk screw hole processing!

The "Metal Core Wiring Board" is a double-sided high thermal conductivity wiring board that uses metal as the core material. It supports high thermal conductive materials up to 10 W/m·K and low elastic materials (to reduce solder cracking), as well as "special insulation layers," "multilayer," "special processing," and "special materials." 【Specifications】 ■ Aluminum Core Wiring Board Insulation Layer - Thermal Conductivity: 5.0 W/m·K - Thickness: 120 μm - Young's Modulus: 33 GPa - Copper Plate Thickness: (0.2～) 0.5/1.0/1.5/2.0(～3.0) mm - Foil Thickness: 35/70(～200) μm *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Design and manufacturing of high-frequency substrates capable of heat management.

Design and manufacturing of high-frequency substrates capable of heat management.

For applications requiring heat dissipation measures and heat resistance. Compatible with various materials such as copper and ceramics.

Our company specializes in the design and manufacturing of high-frequency substrates that meet various needs such as "high thermal conductivity," "high strength," and "miniaturization." In applications where heat dissipation measures are particularly required, such as high-speed wireless communication, we can design to conduct heat from heat-generating components to copper-based substrates via through-holes rather than through insulation layers. [Proposal Examples] ■ High thermal conductivity 　→ Copper-based fluoropolymer substrates ■ Low loss & high thermal conductivity 　→ DPC substrates (ceramic wiring substrates using plating methods) ■ Miniaturization (RF section, control section separation) 　→ Bonding of fluoropolymer substrates and FR-4 substrates *For more details, please refer to the materials. Feel free to contact us with any inquiries.

  • Circuit board design and manufacturing

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*Technical materials are being presented! Gain knowledge! 'AMB PCB Design Rules'*

*Technical materials are being presented! Gain knowledge! 'AMB PCB Design Rules'*

Essential for acquiring knowledge in substrate design! Clearly presented with diagrams and tables, including ceramic types and thickness, product flatness (warpage), and pattern dimension accuracy!

This document introduces the AMB substrate design rules. It clearly presents information on ceramic types and thicknesses, layer composition, work sizes, product sizes, and prohibited areas for patterns on the product's outer perimeter, along with diagrams and tables. We encourage you to read it. 【Contents (excerpt)】 ■ Ceramic types and thicknesses ■ Copper thickness ■ Layer composition ■ Work sizes and product sizes ■ Product outer dimension tolerances ■ Prohibited areas for patterns on the product's outer perimeter *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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Quartz glass optical substrate

Quartz glass optical substrate

Ultra-thin, high transmittance, very transparent quartz glass optical substrate.

Quartz glass optical substrate Wafer: Maximum 6 Inch diameter 300mm, thickness: 0.5mm and above Square: Within 300*300mm, thickness: 0.5mm and above Flatness: 0.01mm We will challenge at a low cost.

  • Company：ルータ
  • Price：Less than 10,000 yen
  • Glass

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