Extend equipment lifespan! By processing difficult-to-cut materials with high precision and improving dimensional accuracy, wear is reduced!
Due to the current global semiconductor shortage, the demand for semiconductor manufacturing equipment is also increasing. In semiconductor manufacturing equipment, precision and durability are required to produce semiconductors without any defects.
As a result, many parts of semiconductor manufacturing equipment are made of difficult-to-machine materials and are valuable, making it quite challenging to replace these parts.
Therefore, by using grinding processes to achieve high precision even with difficult-to-machine materials, dimensional accuracy can be improved, reducing wear and preventing deterioration of the parts. Why not reconsider your processing methods and extend the equipment's lifespan through grinding?
**Effects of Grinding Processing:**
- **Increased Equipment Lifespan**
- Grinding the target parts improves dimensional accuracy.
- A smoother surface reduces unnecessary wear, leading to an extended equipment lifespan.
- **High Dimensional Accuracy Processing**
- The amount of material removed per processing is minimal, allowing for high precision even with difficult-to-machine materials.
- The use of grinding machines enables surface processing at the micrometer level.
*For more details, please refer to the PDF document or feel free to contact us.*
![[Ultrasonic Processing Example] Tempax Glass (Groove Processing)](https://image.mono.ipros.com/public/product/image/f05/2000415603/IPROS12014704033587978000.jpg?w=280&h=280)
